WO2009156640A2 - Cellule photovoltaïque et substrat de cellule photovoltaïque - Google Patents
Cellule photovoltaïque et substrat de cellule photovoltaïque Download PDFInfo
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- WO2009156640A2 WO2009156640A2 PCT/FR2009/050984 FR2009050984W WO2009156640A2 WO 2009156640 A2 WO2009156640 A2 WO 2009156640A2 FR 2009050984 W FR2009050984 W FR 2009050984W WO 2009156640 A2 WO2009156640 A2 WO 2009156640A2
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- Prior art keywords
- substrate
- layer
- photovoltaic cell
- oxide
- tin
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- 239000000758 substrate Substances 0.000 title claims abstract description 58
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 40
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000011787 zinc oxide Substances 0.000 claims abstract description 21
- 238000009499 grossing Methods 0.000 claims abstract description 13
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 12
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000002745 absorbent Effects 0.000 claims abstract description 5
- 239000002250 absorbent Substances 0.000 claims abstract description 5
- 239000011521 glass Substances 0.000 claims abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 229910052718 tin Inorganic materials 0.000 claims description 16
- 239000011701 zinc Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 238000004873 anchoring Methods 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 9
- 230000004888 barrier function Effects 0.000 claims description 9
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 7
- 229910052787 antimony Inorganic materials 0.000 claims description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 73
- 238000010438 heat treatment Methods 0.000 description 10
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000010791 quenching Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000171 quenching effect Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 229910001887 tin oxide Inorganic materials 0.000 description 6
- 229910003437 indium oxide Inorganic materials 0.000 description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03925—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIIBVI compound materials, e.g. CdTe, CdS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/073—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising only AIIBVI compound semiconductors, e.g. CdS/CdTe solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
Definitions
- the invention relates to a photovoltaic cell front-face substrate, in particular a transparent glass substrate, and to a photovoltaic cell incorporating such a substrate.
- a photovoltaic photovoltaic material system that generates electrical energy under the effect of incident radiation is positioned between a back-face substrate and a front-face substrate, this front-face substrate being the first substrate which is traversed by the incident radiation before it reaches the photovoltaic material.
- the front-face substrate conventionally comprises, beneath a main surface facing the photovoltaic material, a transparent electrode coating in electrical contact with the photovoltaic material disposed below when considering that the main direction arrival of incident radiation is from above.
- This front face electrode coating is thus, in general, the negative terminal of the solar cell.
- the solar cell also has on the rear-face substrate an electrode coating which then constitutes the positive terminal of the solar cell, but in general, the electrode coating of the back-face substrate is not transparent.
- the material usually used for the transparent electrode coating of the front-face substrate is generally a transparent conductive oxide ("TCO") material, such as for example an indium oxide-based material.
- TCO transparent conductive oxide
- ITO tin
- ZnO: Al zinc oxide doped with aluminum
- ZnO: B doped with boron
- CVD chemical vapor deposition
- PECVD plasma
- vacuum deposition cathodic sputtering
- the TCO-based electrode coating in order to achieve the desired electrical conduction, or rather the desired low resistance, the TCO-based electrode coating must be deposited at a relatively large physical thickness, in the range of 500 to 1000 nm and sometimes even more. expensive in terms of the price of these materials when deposited in thin layers.
- TCO to independently optimize the conductivity of the electrode coating and its transparency.
- the transparent electrode coating consists of a stack of thin layers deposited on a main face of the front face substrate, this coating comprising at least one layer of TCO type based on zinc oxide doped aluminum (ZnO: Al) or tin oxide oxide doped with antimony (SnO2: Sb).
- ZnO zinc oxide doped aluminum
- SnO2 tin oxide oxide doped with antimony
- the main disadvantage of this prior art lies in the fact that the materials are deposited at ambient temperature and by a magnetron sputtering technique and the layers thus obtained are of amorphous nature or less crystallized than the layers obtained by hot deposition, and therefore weakly or moderately electrically conductive. It is therefore necessary to subject them to a heat treatment, for example quench type, to increase the crystallinity of the layer, which also improves the light transmission.
- a zinc stannate buffer layer which is therefore neither part of the TCO electrode coating, nor photovoltaic material.
- This layer also has the disadvantage of being very difficult to deposit by magnetron sputtering techniques, the target incorporating this material being of a low conductive nature.
- the use of this type of insulating target in a "coater" magnetron generates many arcs during spraying, causing numerous defects in the deposited layer.
- An important object of the invention is to enable the charge transport between the electrode coating and the photovoltaic material, in particular based on cadmium, to be easily controlled and that the efficiency of the cell can consequently be improved.
- Another important goal is also to achieve a thin film-based transparent electrode coating which is simple to make and the cheapest possible to manufacture industrially.
- the object of the invention is therefore, in its broadest sense, a photovoltaic cell with an absorbent photovoltaic material, in particular based on cadmium, said cell comprising a front-face substrate, in particular a transparent glass substrate, comprising on a main surface a coating.
- transparent electrode consisting of a stack of thin layers comprising at least one transparent conductive layer, in particular based on optionally doped zinc oxide, and at least one electrically conducting smoothing layer.
- the transparent conductive layer is based on zinc oxide, optionally doped, in particular based on aluminum, or boron, or titanium, or indium, or vanadium.
- the transparent conductive layer is deposited on an anchoring layer, intended to promote the adequate crystalline orientation of the conductive layer deposited on it), this anchoring layer is in particular based on zinc and tin mixed oxide or on base of mixed indium tin oxide (ITO).
- the transparent conductive layer is deposited on a layer having a function of chemical barrier to diffusion, and in particular to the diffusion of sodium from the substrate, thus protecting the coating forming the electrode, and more particularly the conductive layer, especially during a possible heat treatment, in particular quenching, the physical thickness of this barrier layer is between 30 and 50 nm.
- the smoothing layer (between the TCO and the photovoltaic material) is preferably based on:
- tin oxide SnO 2 for example SnO 2 ISb or Al,
- Doping refers here to the presence of at least one other metallic element in the layer, in an atomic proportion of metals (or oxygen element) ranging from 0.5 to 10%.
- a mixed oxide is here an oxide of metal elements in which each metal element is present in an atomic proportion of metals (excluding oxygen element) of more than 10%.
- the electrode coating must be transparent. It must thus present, deposited on the substrate, in the wavelength range between
- the substrate coated with the stack acting as electrode coating is not very transparent. It may for example have, before this heat treatment a light transmission in the visible less than 65%, or even less than 50%.
- the heat treatment may result not from quenching, but may be the consequence of a manufacturing step of the photovoltaic cell.
- its manufacturing process requires a hot deposition phase, in a temperature range between 500 and 700 ° C. This thermal contribution during the deposition of the functional layer on the electrode-forming stack is sufficient to induce, within this stack, physico-chemical transformations leading to a modification of the the crystalline structure and consequently to an improvement of the light transmission and the electrical conductivity of the electrode.
- the electrode coating is transparent before heat treatment as it has after the heat treatment, in the wavelength range between 300 and 1200 nm, a minimum average light transmission of 65% or 75% and more preferably 85% or more, especially at least 90%.
- the stack does not have in absolute the best light transmission possible, but has the best possible light transmission in the context of the cell photovoltaic device according to the invention, that is to say in the QE quantum efficiency range of the photovoltaic material in question.
- the quantum efficiency QE is in a known manner the expression of the probability (between 0 and 1) that an incident photon with a wavelength according to the abscissa is transformed into an electron-hole pair .
- the maximum absorption wavelength ⁇ m that is to say the wavelength at which the quantum efficiency is maximum, is of the order of 600 nm for cadmium telluride.
- the transparent conductive layer is preferably deposited in a crystallized form or in an amorphous form but which becomes crystallized after heat treatment, on a thin dielectric layer which
- anchor layer (Then called “anchor layer” because promoting the proper crystalline orientation of the metal layer deposited thereon).
- the transparent conductive layer is thus preferably deposited over one or even directly onto an oxide-based anchor layer, in particular based on zinc oxide or on the basis of mixed zinc oxide. and tin, optionally doped, optionally with aluminum (the doping is understood in a usual way as exposing a presence of the element in an amount of 0.1 to 10% by molar mass of metal element in the layer and the term "base-based” refers in a usual manner to a layer containing predominantly the material, the expression "based on” thus covers the doping of this material by another), or base of zinc oxide and tin oxide, optionally doped one and / or the other.
- the physical thickness (or actual thickness) of the anchoring layer is preferably between 2 and 30 nm and more preferably between 3 and 20 nm.
- This anchoring layer is a material which preferably has a resistivity p (defined by the product of the resistance per square of the layer by its thickness) such that 5 m ⁇ .cm ⁇ p ⁇ 200 ⁇ .cm.
- the stack is generally obtained by a succession of deposits made by a technique using the vacuum such as sputtering possibly assisted by magnetic field.
- the smoothing layer above the transparent conductive layer preferably comprises a layer based on a mixed oxide, in particular based on tin oxide, or on indium oxide (In 2 O 3 ) or on mixed oxide, in particular based on mixed oxide of zinc, tin, antimony.
- the physical thickness of this smoothing layer is between 2 and 50 nm.
- surfacing of the transparent conductive layer by filling spaces resulting from the crystallization of the transparent conductive layer the latter also makes it possible to adapt the output work of the electrode.
- This smoothing layer also has a role of electrical insulation between the front electrode and the functional layer, and prevents short circuits between these two layers and is a material which preferably has a resistivity p of a sequence of magnitude greater than the conductive layer such that 5 m ⁇ .cm ⁇ p ⁇ 200 ⁇ .cm.
- the substrate may comprise a coating based on photovoltaic material, especially based on cadmium, above the electrode coating opposite the front face substrate.
- a preferred structure of front-face substrate according to the invention is thus of the type: substrate / electrode coating / smoothing layer / photovoltaic material.
- the photovoltaic material is based on Cadmium, to choose an architectural glazing for vehicle or building applications and resistant to the heat treatment of quenching, called “quenching” or “quenching”.
- All the layers of the electrode coating are preferably deposited by a vacuum deposition technique, but it is not excluded, however, that the first or the first layers of the stack may be deposited by a another technique, for example by a thermal decomposition technique of the pyrolysis or CVD type, optionally under vacuum.
- the electrode coating according to the invention can quite well be used as a backside electrode coating, especially when it is desired that at least a small portion of the incident radiation completely passes through the photovoltaic cell.
- FIG. 1 illustrates a solar cell front face substrate according to a first embodiment of FIG. the invention, coated with a transparent conductive oxide electrode coating;
- FIG. 2 illustrates a solar cell front face substrate according to a second embodiment of the invention, coated with a conductive transparent oxide electrode coating and incorporating an anchoring layer;
- FIG. 3 illustrates a solar cell front face substrate according to a third embodiment of the invention, coated with a conductive transparent oxide electrode coating and incorporating an alkaline barrier layer,
- FIG. 4 illustrates a solar cell front face substrate according to the invention according to a fourth embodiment of the invention, coated with a conductive transparent oxide electrode coating and incorporating both an anchoring layer and a alkali barrier layer,
- FIG. 5 illustrates a sectional diagram of a photovoltaic cell.
- FIG. 1 illustrates a photovoltaic cell front-facing substrate 10 according to the invention with an absorbent photovoltaic material 200, said substrate 10 comprising, on a main surface, a transparent electrode coating 100 consisting of a TCO, otherwise known as a transparent conductive layer.
- a transparent electrode coating 100 consisting of a TCO, otherwise known as a transparent conductive layer.
- the front-face substrate 10 is disposed in the photovoltaic cell such that the front-face substrate 10 is the first substrate crossed by the incident radiation R, before reaching the photovoltaic material 200.
- the substrate 10 furthermore comprises, between the transparent conductive layer 100 and the photovoltaic material 200, a smoothing layer 22.
- FIG. 2 differs from FIG. 1 in that a conductive layer 23 is interposed between the conductive layer 100 and the substrate 10.
- FIG. 3 differs from FIG. 1 in that an alkaline barrier layer 24 is interposed between the conductive layer 100 and the substrate 10.
- FIG. 4 incorporates the provisions of the solutions presented in FIGS. 2 and 3, namely that the transparent conductive layer is deposited on an anchoring layer 23, itself deposited on an alkaline barrier layer 24.
- the conductive layer 100 of a thickness of between 500 and
- 700 nm is based on aluminum doped zinc oxide (ZnO: Al), this layer is deposited on an anchoring layer based on zinc and tin mixed oxide, with a thickness between 2 and 30 nm and more preferably between 3 and 20 nm, for example 7 nm, itself deposited on an alkaline barrier layer 24, for example based on a dielectric material, in particular nitrides, oxides or oxynitrides. silicon, or nitrides, oxides or aluminum oxynitrides, used alone or in mixture, its thickness is between 30 and 50 nm.
- ZnO aluminum doped zinc oxide
- the transparent conductive layer 100 is coated with a smoothing layer 22, for example based on optionally doped tin oxide SnO 2 , for example SnO 2 : Sb or Al, or based on a mixed indium oxide. and tin ITO, based on indium oxide InO x Or based on a mixed oxide of zinc, tin, antimony SnZnSbO x , with a thickness between 5 and 50 nm.
- the functional or photovoltaic layer 200 is based on a tellurium of
- Example 1 corresponds to an electrode structure known from the prior art, it is V (extra clear 3 IDnDySi 3 N 4 (50 nm) / ZnO: Al (600 nm) in a photovoltaic cell based on of Cadmium
- Example 2 corresponds to an electrode structure according to the invention, it is V (extra clear 3 mm) / Si 3 N 4 (50 nm) / SnZnOx: Sb (7 nm) / ZnO: Al ( 600 nm) / SnZnOx: Sb (7nm) in a photovoltaic cell made from Cadmium
- FIG. 5 illustrates a photovoltaic cell 1 in section provided with a front-face substrate 10 according to the invention, through which incident radiation R and a back-face substrate 20 penetrate.
- the photovoltaic material 200 for example of amorphous silicon or of crystalline or microcrystalline silicon or of cadmium telluride or of Copper lndium Diselenide (CuInSe 2 - CIS) or of Copper-Indium-Gallium-Selenium, is located between these two substrates . It consists of a layer of n-doped semiconductor material 220 and a p-doped semiconductor material layer 240, which will produce the electric current.
- the electrode coatings 100, 300 interposed respectively between firstly the front-face substrate 10 and the layer of n-doped semiconductor material 220 and secondly between the p-doped semiconductor material layer 240 and the substrate of FIG. rear face 20 complete the electrical structure.
- the electrode coating 300 may be based on silver or aluminum, or may also consist of a thin film stack comprising at least one metallic functional layer and according to the present invention.
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Abstract
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011512178A JP2011522433A (ja) | 2008-06-02 | 2009-05-27 | 光起電力セルおよび光起電力セル基板 |
EP09769481A EP2286458A2 (fr) | 2008-06-02 | 2009-05-27 | Cellule photovoltaïque et substrat de cellule photovoltaïque |
CN2009801201700A CN102047435A (zh) | 2008-06-02 | 2009-05-27 | 光电池和光电池的基材 |
US12/958,569 US20110139237A1 (en) | 2008-06-02 | 2010-12-02 | Photovoltaic cell, and substrate for same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR0853601 | 2008-06-02 | ||
FR0853601A FR2932009B1 (fr) | 2008-06-02 | 2008-06-02 | Cellule photovoltaique et substrat de cellule photovoltaique |
Related Parent Applications (1)
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US12/171,691 Continuation US20090293945A1 (en) | 2008-06-02 | 2008-07-11 | Photovoltaic cell and photovoltaic cell substrate |
Related Child Applications (1)
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US12/958,569 Continuation US20110139237A1 (en) | 2008-06-02 | 2010-12-02 | Photovoltaic cell, and substrate for same |
Publications (2)
Publication Number | Publication Date |
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WO2009156640A2 true WO2009156640A2 (fr) | 2009-12-30 |
WO2009156640A3 WO2009156640A3 (fr) | 2011-01-06 |
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PCT/FR2009/050984 WO2009156640A2 (fr) | 2008-06-02 | 2009-05-27 | Cellule photovoltaïque et substrat de cellule photovoltaïque |
Country Status (7)
Country | Link |
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US (2) | US20090293945A1 (fr) |
EP (1) | EP2286458A2 (fr) |
JP (1) | JP2011522433A (fr) |
KR (1) | KR20110014168A (fr) |
CN (1) | CN102047435A (fr) |
FR (1) | FR2932009B1 (fr) |
WO (1) | WO2009156640A2 (fr) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2011222687A (ja) * | 2010-04-08 | 2011-11-04 | Tosoh Corp | 太陽電池 |
EP2400556A2 (fr) | 2010-06-25 | 2011-12-28 | Saint-Gobain Glass France | Cellule comprenant un materiau photovoltaïque à base de cadmium |
EP2400555A1 (fr) | 2010-06-25 | 2011-12-28 | Saint-Gobain Glass France | Cellule comprenant un materiau photovoltaïque à base de cadmium |
Also Published As
Publication number | Publication date |
---|---|
KR20110014168A (ko) | 2011-02-10 |
CN102047435A (zh) | 2011-05-04 |
FR2932009B1 (fr) | 2010-09-17 |
JP2011522433A (ja) | 2011-07-28 |
US20110139237A1 (en) | 2011-06-16 |
US20090293945A1 (en) | 2009-12-03 |
FR2932009A1 (fr) | 2009-12-04 |
WO2009156640A3 (fr) | 2011-01-06 |
EP2286458A2 (fr) | 2011-02-23 |
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