WO2009150220A1 - Procede de croissance de nitrure d'elements du groupe iii - Google Patents
Procede de croissance de nitrure d'elements du groupe iii Download PDFInfo
- Publication number
- WO2009150220A1 WO2009150220A1 PCT/EP2009/057273 EP2009057273W WO2009150220A1 WO 2009150220 A1 WO2009150220 A1 WO 2009150220A1 EP 2009057273 W EP2009057273 W EP 2009057273W WO 2009150220 A1 WO2009150220 A1 WO 2009150220A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- nitride
- growth
- iii
- deposited
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02414—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
Definitions
- the field of the invention is that of structures intended for applications in optics, optoelectronics or microelectronics.
- the invention relates more particularly to the manufacture of such structures by growth on a substrate of group III nitride films or nano-objects.
- Nitrides of group III elements InN, GaN, AlN
- their alloys and their heterostructures have very interesting properties for applications in electronics and optoelectronics.
- the set (AI 1 GaJn) -N makes it possible to describe the entire electromagnetic spectrum of interest for communication and information processing technologies, from the near infra-red to the ultraviolet-type C. As a result, their optoelectronic applications are larger than those of other families of semiconductor material.
- the forbidden band of the indium nitride InN corresponds to a wavelength of approximately 1.8 ⁇ m, that of the aluminum nitride AIN at 200 nm and that of the gallium nitride GaN at 350 nm. Since it is known to produce alloys whose composition varies continuously between the three binaries In, Al and Ga, where it is also known to assemble these binaries into heterostructures with wells and quantum dots, then we can cover from these materials the telecommunication bands to 1, 3 microns and 1, 5 microns, or make visible light emitting devices (light-emitting diodes, lasers) or realize photodetectors inaveuglables the sun.
- nitrides are also chemically inert, and therefore do not pose the same dangers as arsenic, phosphorus or antimony in terms of pollution. This family of materials thus respects the environmental constraints prescribed during the signing of the Kyoto protocol.
- Indium nitride is among the nitrides of element III the most difficult to synthesize with a crystalline quality compatible with the intended applications.
- the incorporation of indium into the crystalline matrix of the nitride can not effectively be done without generating strong constraints and numerous dislocations of networks with deleterious consequences for any electronic component. It is therefore not possible today to obtain an InN film of sufficient quality, especially in terms of crystallinity, for the intended applications.
- An object of the invention is to allow the synthesis of group III nitride-based films or nano-objects having a crystalline quality superior to that which exists in the state of the art, in order to be able to fully exploit the properties of these materials in an industrial way.
- the invention proposes a method for the growth of element III nitride, in which the growth is carried out on a substrate made of a material able to maintain the same crystalline structure since the nitride growth temperature.
- the substrate being an alloy of the type MVO 4 , where M denotes a transition metal or a group III element, and where V denotes N, P, As or Sb, or an alloy of the type (Si-IV) O 2 , where IV denotes a group IV element other than silicon.
- indium nitride InN is deposited on an AIPO 4 substrate;
- gallium nitride GaN is deposited on a GaPO 4 substrate;
- an alloy consisting of GaN and GaInN is deposited on a GaPO 4 substrate; the growth of the element III nitride on the substrate is carried out by epitaxy; and
- the growth of the element III nitride on the substrate is carried out by spraying.
- the invention relates to a structure for an application in electronics, optics or optoelectronics comprising a nitride element III deposited on a substrate of a material capable of maintaining the same crystalline structure since the temperature element III nitride growth to ambient temperature, the substrate being an MVO 4 alloy, where M is a transition metal or group III element, and V is N, P, As or Sb , or an alloy of the (Si-IV) O 2 type , where IV denotes a Group IV element other than silicon.
- the invention also relates to the components comprising a structure as described above.
- FIG. 1 is an atomic force microscopy image showing the morphology of an AIPO 4 substrate
- FIG. 2 represents an X-ray diffraction spectrum indicating the crystallinity of the AIPO 4 substrate;
- FIG. 3 is an atomic force microscopy image showing the morphology of indium nitride deposited on an AIPO 4 substrate in accordance with the invention
- FIG. 4 represents an X-ray diffraction spectrum indicating the crystallinity of the indium nitride deposited on an AIPO 4 substrate in accordance with the invention
- FIG. 5 represents a fluorescence spectrum indicating the emission of light of the indium nitride deposited on an AIPO 4 substrate in accordance with the invention.
- the invention relates to a method for the growth of element III nitride on a substrate, in which the growth is carried out on a substrate made of a material able to maintain the same crystalline structure since the growth temperature of the nitride of element III to room temperature.
- nitrides of group III elements of the Mendeleev table are in particular aluminum nitride, gallium nitride and indium nitride, as well as mixed nitrides.
- Indium nitride is particularly targeted, but the invention is in no way limited to this particular nitride, but instead is intended to extend to other element III nitrides and their heterostructures.
- the term “film” means a continuous layer, preferably a thin layer, of a thickness generally between 1 atomic monolayer and 10 microns.
- the term “nano-object” means an individual structure having at least one nanometric dimension, between 1 and 50 nm.
- the element III nitride which is grown by the method according to the first aspect of the invention may in particular be a film or a nano-object such as a quantum dot.
- the invention thus relates as well to the nitride films of elements III as their heterostructures, wells and quantum dots as well as the objects generally used in photonics: microcavities, photonic membranes textured technologically or during selectively induced growth, photonic crystals produced by three-dimensional cross-growth ("wood stack stacking").
- the substrate used in the context of the invention for the growth of element III nitride is preferably a compound of the family of quartz and berlinite.
- These materials composed of the ordered phase type MVO 4 (where M designates a transition metal or a group III element, and where V denotes N, P, As or Sb) or alloys of the (Si-IV) O 2 type (where IV denotes a group IV element other than silicon), have the advantage of having a higher alpha-beta or alpha-cristobalite phase structure transition temperature than the synthesis temperature of the element III nitride.
- the growth of the element III nitride can then be carried out on a substrate whose crystalline nature is preserved after growth of said nitride when the system is brought back to ambient temperature (operating temperature of the components).
- quartz SiO 2 has a relatively low alpha-beta structural phase transition temperature (573 ° C.). Depending on the type of element III nitride considered, quartz SiO 2 is not likely to maintain the same crystalline structure from the growth temperature of the nitride to room temperature.
- the growth temperature of the element III nitride on a substrate varies according to the nitride.
- the indium nitride InN is thus always deposited at a temperature below its decomposition temperature 600 ° C.
- the GaN gallium nitride is generally deposited at a temperature of about 800 ° C.
- a GaPO 4 substrate appears to be well suited for depositing a GaN film and GaInN-GaN heterostructures which are blue light-emitting diodes, blue compact lasers and transistors.
- an AIPO 4 substrate is suitable for the growth of indium nitride.
- the growth of the element III nitride is carried out by epitaxy.
- the growth can be carried out by molecular beam epitaxy ("MBE"), by epitaxy by metal vapor phase organometallic deposition (“MOVPE”). of the English acronym “MetalOrganic Vapor Phase Epitaxy”), by epitaxy HWE (the acronym for "Hot Wall Epitaxy”), by epitaxy MEE (the English acronym "Migration Enhanced Epitaxy”) .
- the growth of the element III nitride is carried out by sputtering.
- the source materials are evaporated, either thermally or by electron bombardment, and will condense on the surface of the substrate, at low temperature. Due to the moderate temperature of the substrate, the crystalline quality of the deposited material is lower, most of the time it is polycrystalline.
- the surface of the substrate Prior to the growth of element III nitride, the surface of the substrate may be subjected to a surface preparation step to improve its physical properties for growth.
- a surface preparation step to improve its physical properties for growth.
- One or more of the following techniques can be implemented: heat treatment, polishing, chemical etching, or other techniques known to those skilled in the art.
- the invention relates to a structure for an application in electronics, optics or optoelectronics comprising one or more films or one or more nitride nano-objects of element III, carried by a substrate of a material capable of maintaining the same crystalline structure from the growth temperature of the element nitride III to ambient temperature, in particular a substrate of the MVO 4 or (Si-IV) O type 2 as previously described.
- the invention relates to a component for electronics, optics or optoelectronics comprising a structure according to the second aspect of the invention.
- indium nitride is the most difficult material to synthesize materials of the Ml-N family.
- Indium nitride is deposited by epitaxial growth, MOCVD, on an AIPO 4 substrate.
- the growth parameters used are typically a growth temperature of 500 ° C., a pressure in the reactor of 200 mbar and a V / III ratio of about 20,000.
- the value of the molar ratio V / III is strongly correlated with the type of growth reactor used. This molar ratio affects in particular the stoichiometry of the processed material; a molar ratio V / III too low will thus result in films containing indium metal.
- the pressure in the reactor can be chosen between 20 and 1 000 mbar.
- the growth temperature is limited to the range 250 ° C. to 650 ° C., the dissociation temperature of the indium nitride being effectively around 700 ° C.
- FIG. 1 shows the morphology of the AIPO 4 substrate (as observed under an atomic force microscope).
- Figure 2 illustrates the crystallinity of the AIPO 4 substrate (observed by X-ray spectrography, the X axis representing the angular deviation of the incident X-ray beam and the Y axis showing the electromagnetic intensity collected. ).
- FIG. 3 shows the morphology of the indium nitride deposited on the AIPO 4 substrate (observed under an atomic force microscope), in FIG. 4 the crystallinity of this indium nitride (observed by X-ray spectrography). ) and in Figure 5 the fluorescence spectrum of this indium nitride (obtained at 77K).
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09761782A EP2304773A1 (fr) | 2008-06-13 | 2009-06-12 | Procede de croissance de nitrure d'elements du groupe iii |
US12/997,796 US20110089537A1 (en) | 2008-06-13 | 2009-06-12 | Growing process for group iii nitride elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0853943 | 2008-06-13 | ||
FR0853943A FR2932608B1 (fr) | 2008-06-13 | 2008-06-13 | Procede de croissance de nitrure d'elements du groupe iii. |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009150220A1 true WO2009150220A1 (fr) | 2009-12-17 |
Family
ID=40418895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2009/057273 WO2009150220A1 (fr) | 2008-06-13 | 2009-06-12 | Procede de croissance de nitrure d'elements du groupe iii |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110089537A1 (fr) |
EP (1) | EP2304773A1 (fr) |
FR (1) | FR2932608B1 (fr) |
WO (1) | WO2009150220A1 (fr) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050239271A1 (en) * | 2004-03-12 | 2005-10-27 | Yamaha Corporation | Heteroepitaxial growth method for gallium nitride |
WO2008057454A2 (fr) * | 2006-11-02 | 2008-05-15 | The Regents Of The University Of California | Croissance et fabrication de films de nitrure d'aluminium autonomes et de densité de dislocation réduite par épitaxie en phase vapeur aux hydrures |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2807909B1 (fr) * | 2000-04-12 | 2006-07-28 | Centre Nat Rech Scient | COUCHE MINCE SEMI-CONDUCTRICE DE GaInN, SON PROCEDE DE PREPARATION; DEL COMPRENANT CETTE COUCHE ET DISPOSITIF D'ECLAIRAGE COMPRENANT CETTE DEL |
DE10108079A1 (de) * | 2000-05-30 | 2002-09-12 | Osram Opto Semiconductors Gmbh | Optisch gepumpte oberflächenemittierende Halbleiterlaservorrichtung und Verfahren zu deren Herstellung |
US6445009B1 (en) * | 2000-08-08 | 2002-09-03 | Centre National De La Recherche Scientifique | Stacking of GaN or GaInN quantum dots on a silicon substrate, their preparation procedure electroluminescent device and lighting device comprising these stackings |
JP3872327B2 (ja) * | 2000-12-04 | 2007-01-24 | 日本碍子株式会社 | 半導体発光素子 |
JP2002222989A (ja) * | 2001-01-26 | 2002-08-09 | Toshiba Corp | 半導体発光素子 |
US6649942B2 (en) * | 2001-05-23 | 2003-11-18 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device |
JP3791765B2 (ja) * | 2001-06-08 | 2006-06-28 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子 |
US7676307B2 (en) * | 2001-11-05 | 2010-03-09 | Ford Global Technologies | System and method for controlling a safety system of a vehicle in response to conditions sensed by tire sensors related applications |
US6966948B2 (en) * | 2003-08-08 | 2005-11-22 | Centre National De La Recherche Scientifique (C.N.R.S.) | Method to manufacture Indium Nitride quantum dots |
US7122827B2 (en) * | 2003-10-15 | 2006-10-17 | General Electric Company | Monolithic light emitting devices based on wide bandgap semiconductor nanostructures and methods for making same |
FR2875333B1 (fr) * | 2004-09-16 | 2006-12-15 | Centre Nat Rech Scient Cnrse | Realisation d'une couche de nitrure d'indium |
US7402831B2 (en) * | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
FR2898434B1 (fr) * | 2006-03-13 | 2008-05-23 | Centre Nat Rech Scient | Diode electroluminescente blanche monolithique |
FR2904008B1 (fr) * | 2006-07-18 | 2009-12-04 | Centre Nat Rech Scient | NOUVEAU PROCEDE POUR LA CROISSANCE DE NITRURES D'ELEMENTS DU GROUPE IIIb. |
FR2908925B1 (fr) * | 2006-11-17 | 2009-02-20 | St Microelectronics Sa | PROCEDE D'INTEGRATION D'UN COMPOSANT DE TYPE III-N, TEL QUE DU GaN, SUR UN SUBSTRAT DE SILICIUM (001) NOMINAL |
KR101002336B1 (ko) * | 2008-02-04 | 2010-12-20 | 엘지디스플레이 주식회사 | 나노 디바이스, 이를 포함하는 트랜지스터, 나노 디바이스및 이를 포함하는 트랜지스터의 제조 방법 |
-
2008
- 2008-06-13 FR FR0853943A patent/FR2932608B1/fr not_active Expired - Fee Related
-
2009
- 2009-06-12 WO PCT/EP2009/057273 patent/WO2009150220A1/fr active Application Filing
- 2009-06-12 EP EP09761782A patent/EP2304773A1/fr not_active Withdrawn
- 2009-06-12 US US12/997,796 patent/US20110089537A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050239271A1 (en) * | 2004-03-12 | 2005-10-27 | Yamaha Corporation | Heteroepitaxial growth method for gallium nitride |
WO2008057454A2 (fr) * | 2006-11-02 | 2008-05-15 | The Regents Of The University Of California | Croissance et fabrication de films de nitrure d'aluminium autonomes et de densité de dislocation réduite par épitaxie en phase vapeur aux hydrures |
Non-Patent Citations (1)
Title |
---|
PEDARNIG J ET AL: "Growth and thermal stability of GaPO4 epitaxial thin films", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, vol. 89, no. 24, 13 December 2006 (2006-12-13), pages 241912 - 241912, XP012087591, ISSN: 0003-6951 * |
Also Published As
Publication number | Publication date |
---|---|
US20110089537A1 (en) | 2011-04-21 |
FR2932608B1 (fr) | 2011-04-22 |
EP2304773A1 (fr) | 2011-04-06 |
FR2932608A1 (fr) | 2009-12-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1699951B1 (fr) | Procede de realisation de substrats autosupportes de nitrures d'elements iii par hetero epitaxie sur une couche sacrificielle | |
EP1290721B1 (fr) | Procede de preparation d'une couche de nitrure de gallium | |
EP1525340B1 (fr) | Procede de realisation par epitaxie en phase vapeur d un fil m de nitrure de gallium a faible densite de defaut | |
JP6074359B2 (ja) | Iii−v半導体構造およびiii−v半導体構造を形成する方法 | |
EP3840072A1 (fr) | Procede de fabrication d'une couche de nitrure d'aluminium texture | |
FR3003397A1 (fr) | Structures semi-conductrices dotées de régions actives comprenant de l'INGAN | |
EP2912682B1 (fr) | Procede de fabrication d'une structure semiconductrice | |
EP1476898B1 (fr) | Procede de formation de couche de carbure de silicium ou de nitrure d element iii sur un substrat adapte | |
WO2006032756A1 (fr) | Réalisation d'une couche de nitrure d'indium | |
EP3248212A1 (fr) | Procédé de fabrication d'une structure semi-conductrice à base de nitrures d'éléments iii passivée et une telle structure | |
EP2304773A1 (fr) | Procede de croissance de nitrure d'elements du groupe iii | |
EP4176461A1 (fr) | Substrat semi-conducteur avec couche d'interface nitruree | |
WO2008009805A1 (fr) | Procede pour la croissance de nitrure d' indium | |
EP3420125A1 (fr) | Procédé permettant d'obtenir sur un substrat cristallin une couche semi-polaire de nitrure | |
WO2018091502A1 (fr) | HETEROSTRUCTURES SEMI-CONDUCTRICES AVEC STRUCTURE DE TYPE WURTZITE SUR SUBSTRAT EN ZnO | |
FR2649537A1 (fr) | Dispositif optoelectronique integre incluant une diode photoluminescente | |
EP4104203A1 (fr) | Procede de fabrication de nanostructures de nitrure d'aluminium et de gallium (algan) | |
FR2675948A1 (fr) | Materiaux semi-conducteurs a structure heteroepitaxiee et contrainte controlee, leur mode d'elaboration et leurs applications. | |
FR2972731A1 (fr) | Procédés de formation de matériaux semi-conducteurs iii/iv et structures semi-conductrices formées en utilisant ces procédés |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09761782 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12997796 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009761782 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: BR Ref legal event code: B01E Ref document number: PI0910720 Country of ref document: BR Free format text: IDENTIFIQUE O SIGNATARIO DA PETICAO NO 020100100152 DE 26/10/2010 E COMPROVE, CASO NECESSARIO, QUE TEM PODERES PARA ATUAR EM NOME DO DEPOSITANTE, UMA VEZ QUE BASEADO NO ARTIGO 216 DA LEI 9.279/1996 DE 14/05/1996 (LPI) "OS ATOS PREVISTOS NESTA LEI SERAO PRATICADOS PELAS PARTES OU POR SEUS PROCURADORES, DEVIDAMENTE QUALIFICADOS.". ADEMAIS, APRESENTE A PROCURACAO DO DEPOSITANTE "CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS)", VISTO QUE NAO FOI ENTREGUE TAL DOCUMENTO ATE O MOMENTO. |
|
ENPW | Started to enter national phase and was withdrawn or failed for other reasons |
Ref document number: PI0910720 Country of ref document: BR Free format text: PEDIDO RETIRADO EM RELACAO AO BRASIL POR NAO ATENDER AS DETERMINACOES REFERENTES A ENTRADA DO PEDIDO NA FASE NACIONAL E POR NAO CUMPRIMENTO DA EXIGENCIA FORMULADA NA RPI NO 2389 DE 18/10/2016. |