WO2009143682A1 - 器件埋入式电路板散热装置及加工方法 - Google Patents

器件埋入式电路板散热装置及加工方法 Download PDF

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Publication number
WO2009143682A1
WO2009143682A1 PCT/CN2008/073024 CN2008073024W WO2009143682A1 WO 2009143682 A1 WO2009143682 A1 WO 2009143682A1 CN 2008073024 W CN2008073024 W CN 2008073024W WO 2009143682 A1 WO2009143682 A1 WO 2009143682A1
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WIPO (PCT)
Prior art keywords
circuit board
embedded circuit
cooling
heat sink
heat
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Application number
PCT/CN2008/073024
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English (en)
French (fr)
Inventor
陈利民
宗晅
谢德才
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华为技术有限公司
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Publication of WO2009143682A1 publication Critical patent/WO2009143682A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Definitions

  • the present invention relates to the field of electronic devices, and in particular, to a device embedded circuit board heat sink and a device embedded circuit board heat sink processing method.
  • High-density integration is one of the development trends of electronic products. Assembling devices in the three-dimensional direction of device-embedded circuit boards to build device-embedded circuit boards has become one of the development directions of the electronics industry in the future. However, when a device, especially a high-power device, is buried in a device-embedded circuit board, the heat dissipation problem of the device becomes an application bottleneck.
  • Embodiments of the present invention provide a device embedded circuit board heat sink and a device embedded circuit board heat sink processing method to solve the problem of heat dissipation of the buried high power device.
  • a device embedded circuit board heat dissipating device comprises a device embedded circuit board, wherein the device embedded circuit board is provided with a device cavity, and the device embedded circuit board is further disposed near the device cavity Cooling tank.
  • a device embedded circuit board heat sink processing method comprising:
  • a heat pipe is laid inside the cooling tank or the cooling tank is formed into a closed pipe capable of circulating a coolant.
  • the beneficial effect of the embodiment of the present invention is that a cooling groove is disposed on an outer surface of the device embedded circuit board device cavity, and the cooling groove is internally provided with a heat pipe or the cooling groove to form a closed pipe capable of circulating a liquid.
  • the heat-dissipating or circulating liquid through the heat pipe takes away the heat of the device to maximize the heat dissipation efficiency and solve the heat dissipation problem of the embedded circuit board of the device.
  • FIG. 1 is a schematic structural diagram of a heat sink device of a first device embedded circuit board according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a second device embedded circuit board heat sink according to an embodiment of the present invention.
  • FIG. 3 is a plan view of a second device embedded circuit board heat sink according to an embodiment of the present invention
  • FIG. 4 is a flow chart of a first device buried circuit board heat sink processing method according to an embodiment of the present invention
  • FIG. 5 is a flow chart of a method for processing a second device embedded circuit board heat sink according to an embodiment of the present invention.
  • Embodiments of the present invention provide a device-embedded device embedded circuit board heat dissipation method and a device embedded circuit board heat dissipation device, wherein a cooling groove is disposed on an outer surface of the device embedded circuit board device cavity, and the cooling is performed.
  • a heat pipe or a cooling groove is formed inside the groove to form a closed pipe capable of circulating a liquid, and the heat dissipation or circulation of the liquid through the heat pipe takes away the heat of the device, thereby maximizing the heat dissipation efficiency and solving the buried device of the device.
  • the heat dissipation problem of the input board is disposed on an outer surface of the device embedded circuit board device cavity, and the cooling is performed.
  • a heat pipe or a cooling groove is formed inside the groove to form a closed pipe capable of circulating a liquid, and the heat dissipation or circulation of the liquid through the heat pipe takes away the heat of the device, thereby maximizing the heat dissipation efficiency and solving the buried
  • the device embedded circuit board heat sink device of the embodiment includes a device embedded circuit board 10, and is disposed in the a device cavity 11 inside the device embedded circuit board 10, an electronic device 12 encapsulated in the device cavity 11, an electrical connection with the electronic device 12, and an interface exposed to the surface of the device embedded circuit board A leg 13 and at least one cooling slot 14 disposed inside the device embedded circuit board 10.
  • the device embedded circuit board 10 is provided with an intermediate layer 101, the intermediate layer 101 is made of a heat conductive material, and the device cavity 11 and the cooling channel 14 are partially or completely disposed in the In the intermediate layer 101, heat conduction is facilitated.
  • the cooling bath 14 is adjacent to the device chamber 11 and has at least one heat pipe 15 disposed therein.
  • the periphery of the at least one heat pipe 15 is filled with a heat conductive material.
  • the heat pipe 15 may be rigid or flexible or semi-flexible.
  • the cross-sectional shape of the cooling groove 14 is circular.
  • the cooling groove 14 may also have a U shape or the like to surround the device that needs heat dissipation. Improve the heat dissipation effect.
  • the device embedded circuit board heat dissipating device lays a heat pipe around the electronic device inside the device embedded circuit board, and dissipates heat through the heat pipe, thereby well solving the heat dissipation of the device embedded circuit board.
  • the bottleneck problem since the heat pipe can be laid around the electronic device 12, the heat emitted by the electronic device 12 can be absorbed in all directions, and a good heat dissipation effect is produced.
  • FIG. 2 and FIG. 3 are schematic and plan views of a device-embedded circuit board heat sink according to a second embodiment of the present invention.
  • the device embedded circuit board heat sink of the present embodiment includes a device embedded circuit board 20, a device cavity 21 disposed inside the device buried circuit board 20, and an electronic device encapsulated in the device cavity 21. 22.
  • a pin 23 electrically connected to the electronic device 22 and exposed to a surface of the device embedded circuit board, and at least one cooling slot 24 disposed inside the device embedded circuit board 20.
  • the device embedded circuit board 20 is provided with an intermediate layer 201, the intermediate layer 201 is made of a heat conductive material, and the device cavity 21 and the cooling groove 24 are partially or completely placed In the middle layer 201, in order to facilitate the conduction of heat.
  • the device-embedded circuit board heat sink of the present embodiment is different from the device-embedded circuit board heat sink of the first embodiment in that: the cooling bath 24 is provided with a cooling liquid for absorbing the electronic device 22 to be distributed. The heat coming out.
  • the cooling bath 24 has an inlet 31 and an outlet 32 which extend through the entire device buried circuit board, and the cooling tank 24 may have a plurality of inlets or outlets.
  • the device-embedded circuit board heat sink of this embodiment may be provided with a power device, such as a water pump, to realize the flow and heat exchange of the coolant in the cooling bath 24 through the inlet 31 and the outlet 32.
  • the surface of the cooling bath 21 of the present embodiment is coated with a separating layer 25, so that the cooling bath 24 has better liquid permeability and thermal conductivity.
  • the separating layer 25 may be a metal layer, and the metal layer may pass the chemical. Depositing, plating, etc.
  • the device is embedded in the circuit board, and the cooling groove 24 has a square shape in cross section.
  • the cross-sectional shape of the cooling groove 24 it is also possible to set the cross-sectional shape of the cooling groove 24 to other special shapes such as a U shape to surround the electronic device 22 requiring heat dissipation for better heat dissipation.
  • the embodiment of the invention further provides a method for processing a device-embedded circuit board heat dissipation device.
  • the method for processing the device-embedded circuit board heat dissipation device includes the following steps:
  • the cooling groove is square in shape close to the shape, and may also have a special shape such as a U shape, so as to surround the electronic device in the device embedded circuit board, thereby improving the heat dissipation effect.
  • the cooling bath can be formed by milling, etching or die stamping, or it can be reserved during the manufacturing process of the device embedded circuit board.
  • the heat pipe may be rigid or flexible or semi-flexible. Further, a plurality of heat pipes can be laid in one cooling tank. The heat pipe can be filled around the heat pipe to facilitate heat transfer.
  • the embodiment of the present invention further provides a second device embedded circuit board heat sink processing method, which is different from the first device buried circuit board heat sink processing method: the second device buried circuit board heat dissipation
  • the device processing method is to inject a circulating liquid into a closed pipe, and the heat of the buried circuit board of the device is carried away by the flowing liquid to realize heat dissipation.
  • the closed pipe mentioned above means that the pipe has no leakage.
  • the cooling groove forming the pipeline capable of circulating the cooling liquid may also be unclosed, for example: the two ends of the pipeline may not be closed; in the case where the pipeline section is large or the space in the up and down direction is large, at both ends It can also be closed.
  • the second device embedded circuit board heat sink processing method includes:
  • the cooling groove is square in shape close to the shape, and may also have a special shape such as a U shape, so as to surround the electronic device in the device embedded circuit board, thereby improving the heat dissipation effect.
  • the cooling bath can be formed by milling, etching or die stamping, or it can be reserved during the manufacturing process of the device embedded circuit board.
  • the cooling slot is provided with at least one outlet and at least one inlet ⁇ on the device embedded circuit board.
  • the "forming the cooling bath” further includes coating the surface of the cooling bath with an insulating layer.
  • the embodiment of the present invention further provides a communication device, where the communication device includes at least one circuit board, and the communication device includes the device embedded circuit board heat dissipation device mentioned in the foregoing embodiment of the present invention, and the device embedded circuit board heat dissipation device Can be set on the board.
  • the method for processing a device embedded circuit board heat sink and a device embedded circuit board heat sink device according to the embodiments of the present invention is described in detail above.
  • the idea according to the embodiment of the present invention is The details of the embodiments and the scope of the application are subject to change.
  • the contents of the embodiments of the present specification are not to be construed as limiting the invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

器件埋入式电路板散热装置及加工方法
本申请要求于 2008 年 5 月 27 日提交中国专利局、 申请号为 200810097763.7、 发明名称为 "器件埋入式电路板散热装置及加工方法" 的中 国专利申请的优先权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电子设备领域，特别涉及一种器件埋入式电路板散热装置及器 件埋入式电路板散热装置加工方法。
背景技术
高密集成化是电子产品的发展趋势之一，在器件埋入式电路板的三维方向 上组装器件来构建器件埋入式电路板已经成为了未来电子行业的发展方向之 一。 但是当器件、 特别是大功率器件， 埋入器件埋入式电路板当中时， 器件的 散热问题将成为应用瓶颈。
发明内容
本发明实施例提供一种器件埋入式电路板散热装置及器件埋入式电路板 散热装置加工方法， 以解决对埋入的大功率器件进行散热的问题。
本发明实施例所提供的器件埋入式电路板散热装置及器件埋入式电路板 散热装置加工方法实施例是通过以下技术方案实现的：
一种器件埋入式电路板散热装置， 包括器件埋入式电路板， 所述器件埋入 式电路板上设有器件腔，所述器件埋入式电路板于所述器件腔附近还设有冷却 槽。
一种器件埋入式电路板散热装置加工方法， 包括：
在器件埋入式电路板上形成冷却槽；
在所述的冷却槽内部铺设热管或将所述的冷却槽形成能装流通冷却液的 封闭管道。
本发明实施例的有益效果是：在器件埋入式电路板器件腔的外表面设置有 冷却槽，所述的冷却槽内部铺设有热管或所述的冷却槽形成能装流通液体的封 闭管道，通过热管对器件进行散热或流通的液体带走器件的热量， 最大限度地 提高散热效率， 解决器件埋入式电路板的散热问题。
附图说明 图 1 为本发明实施例提供的第一种器件埋入式电路板散热装置的结构示 意图；
图 2 为本发明实施例提供的第二种器件埋入式电路板散热装置的结构示 意图；
图 3为本发明实施例提供的第二种器件埋入式电路板散热装置的平面图； 图 4 为本发明实施例提供的第一种器件埋入式电路板散热装置加工方法 流程图；
图 5 为本发明实施例提供的第二种器件埋入式电路板散热装置加工方法 流程图。
具体实施方式
本发明实施例提供一种器件埋入式器件埋入式电路板散热方法及器件埋 入式电路板散热装置，在器件埋入式电路板器件腔的外表面设置有冷却槽， 所 述的冷却槽内部铺设有热管或所述的冷却槽形成能装流通液体的封闭管道，通 过热管对器件进行散热或流通的液体带走器件的热量，最大限度地提高散热效 率， 解决器件埋入式器件埋入式电路板的散热问题。
下面结合附图详细描述本发明的技术方案。
图 1 为本发明实施例提供的第一种器件埋入式器件埋入式电路板散热装 置， 本实施例的器件埋入式电路板散热装置包括器件埋入式电路板 10、 设于 所述器件埋入式电路板 10内部的器件腔 11、 被封装于所述器件腔 11 内的电 子器件 12、 与所述电子器件 12电性连接且暴露于所述器件埋入式电路板表面 的接脚 13、 以及设于所述器件埋入式电路板 10内部的至少一条冷却槽 14。其 中， 所述器件埋入式电路板 10中设有中间层 101， 所述中间层 101是由导热 材料制成的，且所述器件腔 11和所述冷却槽 14均部分或全部设于所述中间层 101中， 以便于热量的传导。
在本实施例中， 所述冷却槽 14靠近于所述器件腔 11 , 且其内部铺设有至 少一个热管 15。 所述至少一个热管 15的周围填充有导热材料。 更进一步地， 热管 15可以是刚性的， 也可以是柔性或半柔性的。
在本实施例中， 冷却槽 14的截面形状为圆形， 在其他可选择的实施方式 中，所述冷却槽 14亦可为 U形等特殊形状，以将需要散热的器件环绕于其中， 提高散热的效果。
本发明实施例提供的器件埋入式电路板散热装置，在器件埋入式电路板内 部电子器件的周围铺设热管，通过热管对器件进行散热，很好的解决了器件埋 入式电路板的散热的瓶颈问题。 而且， 由于热管可以铺设于电子器件 12的周 围， 可以全方位的吸收电子器件 12散发出的热量， 产生了很好的散热效果。
请参照图 2和图 3 , 图 2和图 3为本发明第二实施例中的器件埋入式电路 板散热装置的示意图和平面图。本实施例的器件埋入式电路板散热装置包括器 件埋入式电路板 20、设于所述器件埋入式电路板 20内部的器件腔 21、被封装 于所述器件腔 21 内的电子器件 22、 与所述电子器件 22电性连接且暴露于所 述器件埋入式电路板表面的接脚 23、 以及设于所述器件埋入式电路板 20内部 的至少一条冷却槽 24。 其中， 所述器件埋入式电路板 20中设有中间层 201， 所述中间层 201是由导热材料制成的，且所述器件腔 21和所述冷却槽 24均部 分或全部置于所述中间层中 201中， 以便于热量的传导。本实施例的器件埋入 式电路板散热装置与第一实施例的器件埋入式电路板散热装置的区别之处在 于： 所述冷却槽 24中装有冷却液， 用于吸收电子器件 22散发出来的热量。
在本实施例中， 冷却槽 24有一个入口 31和一个出口 32， 所述冷却槽 24 贯穿整个器件埋入式电路板， 冷却槽 24也可以有多个入口或出口。 而本实施 例的器件埋入式电路板散热装置上还可装设动力器件， 比如水泵， 来通过所述 入口 31和出口 32实现冷却槽 24中的冷却液的流动和热量交换。
更进一步地， 本实施例的冷却槽 21 的表面涂有隔离层 25， 使冷却槽 24 具有更好的防止液体渗透性能及导热性能， 隔离层 25可以为金属层， 所述金 属层可以通过化学沉积、 电镀等方式实现。
在本发明的器件埋入式电路板散热装置的第二实施例中器件埋入式电路 板， 冷却槽 24截面形状为方形。 当然， 也可以将冷却槽 24截面形状设置为 U 形等其他特殊形状， 以将需要散热的电子器件 22环绕于其中， 实现更好的散 热效果。
本发明实施例还提供一种器件埋入式电路板散热装置加工方法， 参见图 4， 所述器件埋入式电路板散热装置加工方法包括步骤：
401、 在器件埋入式电路板的中间层中形成冷却槽； 其中， 所述冷却槽靠近于所述的形状为方形， 也可以为 U形等特殊形状， 以将器件埋入式电路板的中的电子器件环绕于其中， 提高散热效果。
所述冷却槽可通过铣、蚀刻或模具冲型来形成，也可以于器件埋入式电路 板制造过程中预留出来。
402、 在所述冷却槽中铺设热管；
其中， 所述热管可以是刚性的， 也可以是柔性或半柔性的。 更进一步， 在 一个冷却槽中可铺设多个热管。 而在热管周围可填充导热材料， 以便于热量的 传导。
本发明实施例还提供第二种器件埋入式电路板散热装置加工方法，与第一 种器件埋入式电路板散热装置加工方法不同的是：所述第二种器件埋入式电路 板散热装置加工方法是在封闭的管道内注入循环流动的液体，通过流动的液体 带走器件埋入式电路板的热量，实现散热。上述封闭的管道是指该管道无渗漏。 将所述的冷却槽形成能装流通冷却液的管道也可以是不封闭的， 例如： 管道的 两端可以不封闭； 在管道截面较大或者上下方向空间较大的情况下，在两端之 间也可以不封闭。参见图 5所示， 所述第二种器件埋入式电路板散热装置加工 方法包括：
501、 在器件埋入式电路板的中间层中形成冷却槽；
其中， 所述冷却槽靠近于所述的形状为方形， 也可以为 U形等特殊形状， 以将器件埋入式电路板的中的电子器件环绕于其中， 提高散热效果。
所述冷却槽可通过铣、蚀刻或模具冲型来形成，也可以于器件埋入式电路 板制造过程中预留出来。
所述冷却槽于所述器件埋入式电路板上设有至少一个出口和至少一个入 α。
更进一步， 所述 "形成冷却槽" 更包括于所述冷却槽表面涂隔离层。
502、 在所述冷却槽中注入冷却液；
503、 通过动力器件驱动所述冷却液于所述冷却槽中循环流动。
本发明实施例还提供一种通信设备，该通信设备包括至少一个电路板，该 通信设备包括本发明实施例前述提及的器件埋入式电路板散热装置，上述器件 埋入式电路板散热装置可以设置在电路板上。 以上对本发明实施例所提供的一种器件埋入式电路板散热装置及器件埋 入式电路板散热装置的加工方法进行了详细介绍， 对于本领域的一般技术人 员 ,依据本发明实施例的思想 ,在具体实施方式及应用范围上均会有改变之处 , 综上所述， 本说明书实施例的内容不应理解为对本发明的限制。

Claims

权 利 要 求
I、 一种器件埋入式电路板散热装置， 其特征在于， 包括器件埋入式电路 板， 所述器件埋入式电路板上设有器件腔， 所述器件埋入式电路板于所述器件 腔附近还设有冷却槽。
2、 如权利要求 1中所述的埋入式电路板散热装置， 其特征在于， 所述器 件腔被所述冷却槽环绕于其中。
3、 如权利要求 1所述的器件埋入式电路板散热装置， 其特征在于， 所述 冷却槽中设有热管。
4、 如权利要求 3所述的器件埋入式电路板散热装置， 其特征在于， 所述 冷却槽中还填充有导热材料。
5、 如权利要求 1所述的器件埋入式电路板散热装置， 其特征在于， 所述 冷却槽中设有冷却液，所述冷却槽于所述器件埋入式电路板上有至少一个入口 和至少一个出口 ,以便于通过动力器件带动所述冷却液于所述冷却槽中循环流 动。
6、 如权利要求 5所述的器件埋入式电路板散热装置， 其特征在于， 其特 征在于， 所述冷却槽的表面涂有隔离层。
7、 一种器件埋入式电路板散热装置加工方法， 其特征在于， 包括： 在器件埋入式电路板上形成冷却槽；
在所述冷却槽内部铺设热管或将所述的冷却槽形成能装流通冷却液的封 闭或者不封闭管道。
8、 如权利要求 7所述的器件埋入式电路板散热装置加工方法， 其特征在 于， 通过动力器件驱动所述冷却液于所述冷却槽中循环流动。
9、 如权利要求 7所述的器件埋入式电路板散热装置加工方法， 其特征在 于， 所述冷却槽的形成方式为铣、 蚀刻或模具冲型方式。
10、如权利要求 Ί所述的器件埋入式电路板散热装置加工方法，其特征在 于， 在所述冷却槽的表面增加隔离层。
I I、 一种通信设备， 包括至少一个电路板， 其特征在于， 包括如权利要求 1至 6任一项所述的器件埋入式电路板散热装置， 所述器件埋入式电路板散热 装置设置在所述电路板上。
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