WO2009143682A1 - Dispositif dissipateur de chaleur pour une carte de circuit imprimé dotée de composants encastrés et procédé de fabrication associé - Google Patents

Dispositif dissipateur de chaleur pour une carte de circuit imprimé dotée de composants encastrés et procédé de fabrication associé Download PDF

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Publication number
WO2009143682A1
WO2009143682A1 PCT/CN2008/073024 CN2008073024W WO2009143682A1 WO 2009143682 A1 WO2009143682 A1 WO 2009143682A1 CN 2008073024 W CN2008073024 W CN 2008073024W WO 2009143682 A1 WO2009143682 A1 WO 2009143682A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
embedded circuit
cooling
heat sink
heat
Prior art date
Application number
PCT/CN2008/073024
Other languages
English (en)
Chinese (zh)
Inventor
陈利民
宗晅
谢德才
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2009143682A1 publication Critical patent/WO2009143682A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Definitions

  • the present invention relates to the field of electronic devices, and in particular, to a device embedded circuit board heat sink and a device embedded circuit board heat sink processing method.
  • High-density integration is one of the development trends of electronic products. Assembling devices in the three-dimensional direction of device-embedded circuit boards to build device-embedded circuit boards has become one of the development directions of the electronics industry in the future. However, when a device, especially a high-power device, is buried in a device-embedded circuit board, the heat dissipation problem of the device becomes an application bottleneck.
  • Embodiments of the present invention provide a device embedded circuit board heat sink and a device embedded circuit board heat sink processing method to solve the problem of heat dissipation of the buried high power device.
  • a device embedded circuit board heat dissipating device comprises a device embedded circuit board, wherein the device embedded circuit board is provided with a device cavity, and the device embedded circuit board is further disposed near the device cavity Cooling tank.
  • a device embedded circuit board heat sink processing method comprising:
  • a heat pipe is laid inside the cooling tank or the cooling tank is formed into a closed pipe capable of circulating a coolant.
  • the beneficial effect of the embodiment of the present invention is that a cooling groove is disposed on an outer surface of the device embedded circuit board device cavity, and the cooling groove is internally provided with a heat pipe or the cooling groove to form a closed pipe capable of circulating a liquid.
  • the heat-dissipating or circulating liquid through the heat pipe takes away the heat of the device to maximize the heat dissipation efficiency and solve the heat dissipation problem of the embedded circuit board of the device.
  • FIG. 1 is a schematic structural diagram of a heat sink device of a first device embedded circuit board according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a second device embedded circuit board heat sink according to an embodiment of the present invention.
  • FIG. 3 is a plan view of a second device embedded circuit board heat sink according to an embodiment of the present invention
  • FIG. 4 is a flow chart of a first device buried circuit board heat sink processing method according to an embodiment of the present invention
  • FIG. 5 is a flow chart of a method for processing a second device embedded circuit board heat sink according to an embodiment of the present invention.
  • Embodiments of the present invention provide a device-embedded device embedded circuit board heat dissipation method and a device embedded circuit board heat dissipation device, wherein a cooling groove is disposed on an outer surface of the device embedded circuit board device cavity, and the cooling is performed.
  • a heat pipe or a cooling groove is formed inside the groove to form a closed pipe capable of circulating a liquid, and the heat dissipation or circulation of the liquid through the heat pipe takes away the heat of the device, thereby maximizing the heat dissipation efficiency and solving the buried device of the device.
  • the heat dissipation problem of the input board is disposed on an outer surface of the device embedded circuit board device cavity, and the cooling is performed.
  • a heat pipe or a cooling groove is formed inside the groove to form a closed pipe capable of circulating a liquid, and the heat dissipation or circulation of the liquid through the heat pipe takes away the heat of the device, thereby maximizing the heat dissipation efficiency and solving the buried
  • the device embedded circuit board heat sink device of the embodiment includes a device embedded circuit board 10, and is disposed in the a device cavity 11 inside the device embedded circuit board 10, an electronic device 12 encapsulated in the device cavity 11, an electrical connection with the electronic device 12, and an interface exposed to the surface of the device embedded circuit board A leg 13 and at least one cooling slot 14 disposed inside the device embedded circuit board 10.
  • the device embedded circuit board 10 is provided with an intermediate layer 101, the intermediate layer 101 is made of a heat conductive material, and the device cavity 11 and the cooling channel 14 are partially or completely disposed in the In the intermediate layer 101, heat conduction is facilitated.
  • the cooling bath 14 is adjacent to the device chamber 11 and has at least one heat pipe 15 disposed therein.
  • the periphery of the at least one heat pipe 15 is filled with a heat conductive material.
  • the heat pipe 15 may be rigid or flexible or semi-flexible.
  • the cross-sectional shape of the cooling groove 14 is circular.
  • the cooling groove 14 may also have a U shape or the like to surround the device that needs heat dissipation. Improve the heat dissipation effect.
  • the device embedded circuit board heat dissipating device lays a heat pipe around the electronic device inside the device embedded circuit board, and dissipates heat through the heat pipe, thereby well solving the heat dissipation of the device embedded circuit board.
  • the bottleneck problem since the heat pipe can be laid around the electronic device 12, the heat emitted by the electronic device 12 can be absorbed in all directions, and a good heat dissipation effect is produced.
  • FIG. 2 and FIG. 3 are schematic and plan views of a device-embedded circuit board heat sink according to a second embodiment of the present invention.
  • the device embedded circuit board heat sink of the present embodiment includes a device embedded circuit board 20, a device cavity 21 disposed inside the device buried circuit board 20, and an electronic device encapsulated in the device cavity 21. 22.
  • a pin 23 electrically connected to the electronic device 22 and exposed to a surface of the device embedded circuit board, and at least one cooling slot 24 disposed inside the device embedded circuit board 20.
  • the device embedded circuit board 20 is provided with an intermediate layer 201, the intermediate layer 201 is made of a heat conductive material, and the device cavity 21 and the cooling groove 24 are partially or completely placed In the middle layer 201, in order to facilitate the conduction of heat.
  • the device-embedded circuit board heat sink of the present embodiment is different from the device-embedded circuit board heat sink of the first embodiment in that: the cooling bath 24 is provided with a cooling liquid for absorbing the electronic device 22 to be distributed. The heat coming out.
  • the cooling bath 24 has an inlet 31 and an outlet 32 which extend through the entire device buried circuit board, and the cooling tank 24 may have a plurality of inlets or outlets.
  • the device-embedded circuit board heat sink of this embodiment may be provided with a power device, such as a water pump, to realize the flow and heat exchange of the coolant in the cooling bath 24 through the inlet 31 and the outlet 32.
  • the surface of the cooling bath 21 of the present embodiment is coated with a separating layer 25, so that the cooling bath 24 has better liquid permeability and thermal conductivity.
  • the separating layer 25 may be a metal layer, and the metal layer may pass the chemical. Depositing, plating, etc.
  • the device is embedded in the circuit board, and the cooling groove 24 has a square shape in cross section.
  • the cross-sectional shape of the cooling groove 24 it is also possible to set the cross-sectional shape of the cooling groove 24 to other special shapes such as a U shape to surround the electronic device 22 requiring heat dissipation for better heat dissipation.
  • the embodiment of the invention further provides a method for processing a device-embedded circuit board heat dissipation device.
  • the method for processing the device-embedded circuit board heat dissipation device includes the following steps:
  • the cooling groove is square in shape close to the shape, and may also have a special shape such as a U shape, so as to surround the electronic device in the device embedded circuit board, thereby improving the heat dissipation effect.
  • the cooling bath can be formed by milling, etching or die stamping, or it can be reserved during the manufacturing process of the device embedded circuit board.
  • the heat pipe may be rigid or flexible or semi-flexible. Further, a plurality of heat pipes can be laid in one cooling tank. The heat pipe can be filled around the heat pipe to facilitate heat transfer.
  • the embodiment of the present invention further provides a second device embedded circuit board heat sink processing method, which is different from the first device buried circuit board heat sink processing method: the second device buried circuit board heat dissipation
  • the device processing method is to inject a circulating liquid into a closed pipe, and the heat of the buried circuit board of the device is carried away by the flowing liquid to realize heat dissipation.
  • the closed pipe mentioned above means that the pipe has no leakage.
  • the cooling groove forming the pipeline capable of circulating the cooling liquid may also be unclosed, for example: the two ends of the pipeline may not be closed; in the case where the pipeline section is large or the space in the up and down direction is large, at both ends It can also be closed.
  • the second device embedded circuit board heat sink processing method includes:
  • the cooling groove is square in shape close to the shape, and may also have a special shape such as a U shape, so as to surround the electronic device in the device embedded circuit board, thereby improving the heat dissipation effect.
  • the cooling bath can be formed by milling, etching or die stamping, or it can be reserved during the manufacturing process of the device embedded circuit board.
  • the cooling slot is provided with at least one outlet and at least one inlet ⁇ on the device embedded circuit board.
  • the "forming the cooling bath” further includes coating the surface of the cooling bath with an insulating layer.
  • the embodiment of the present invention further provides a communication device, where the communication device includes at least one circuit board, and the communication device includes the device embedded circuit board heat dissipation device mentioned in the foregoing embodiment of the present invention, and the device embedded circuit board heat dissipation device Can be set on the board.
  • the method for processing a device embedded circuit board heat sink and a device embedded circuit board heat sink device according to the embodiments of the present invention is described in detail above.
  • the idea according to the embodiment of the present invention is The details of the embodiments and the scope of the application are subject to change.
  • the contents of the embodiments of the present specification are not to be construed as limiting the invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L’invention a pour objet un dispositif dissipateur de chaleur pour une carte de circuit imprimée dotée de composants encastrés et un procédé de fabrication associé. Le dispositif dissipateur de chaleur comprend la carte de circuit imprimé dotée de composants encastrés. Des chambres permettant de recevoir les composants sont formées dans la carte de circuit imprimé. Des rainures de refroidissement sont ménagées à proximité des chambres. Le procédé de fabrication comprend les étapes suivantes : des rainures de refroidissement formées sur la surface des chambres ; des caloducs logés dans les rainures, ou les rainures se présentent sous forme de tuyaux fermés à travers lesquels s’écoule un type de liquide. La chaleur est dissipée par les caloducs ou le liquide en circulation, et l’efficacité de dissipation de la chaleur s’en trouve améliorée.
PCT/CN2008/073024 2008-05-27 2008-11-12 Dispositif dissipateur de chaleur pour une carte de circuit imprimé dotée de composants encastrés et procédé de fabrication associé WO2009143682A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200810097763.7 2008-05-27
CN 200810097763 CN101594739A (zh) 2008-05-27 2008-05-27 器件埋入式电路板散热装置及加工方法

Publications (1)

Publication Number Publication Date
WO2009143682A1 true WO2009143682A1 (fr) 2009-12-03

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PCT/CN2008/073024 WO2009143682A1 (fr) 2008-05-27 2008-11-12 Dispositif dissipateur de chaleur pour une carte de circuit imprimé dotée de composants encastrés et procédé de fabrication associé

Country Status (2)

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CN (1) CN101594739A (fr)
WO (1) WO2009143682A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2987495A1 (fr) * 2012-02-23 2013-08-30 Thales Sa Canaux de circulation d'un fluide dans une carte imprimee a structure multicouche
EP2985788A1 (fr) * 2014-08-14 2016-02-17 ABB Technology Oy Module semi-conducteur de puissance et procédé de refroidissement d'un module semi-conducteur de puissance
DE102013107787B4 (de) * 2012-07-23 2016-03-24 Infineon Technologies Ag Chipbaugruppe und verfahren zum herstellen einer chipbaugruppe
WO2018001983A1 (fr) * 2016-06-28 2018-01-04 Abb Schweiz Ag Boitier électronique refroidi á composants électroniques de puissance empilés
EP4021151A1 (fr) * 2020-12-23 2022-06-29 Huawei Digital Power Technologies Co., Ltd. Carte de circuit imprimé

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CN204377305U (zh) * 2014-12-16 2015-06-03 中兴通讯股份有限公司 一种散热装置、电路板及终端
CN105848416B (zh) * 2016-03-31 2019-04-26 华为技术有限公司 一种基板及移动终端
CN105873369B (zh) * 2016-05-19 2019-05-31 北京奇虎科技有限公司 一种印制电路板的制作方法和印制电路板
CN106028670B (zh) * 2016-05-25 2019-03-19 北京奇虎科技有限公司 一种在印刷电路板内制造热管的方法
CN106658938B (zh) * 2016-06-24 2019-12-17 奇酷互联网络科技（深圳）有限公司 印刷电路板及其制作方法
CN106061095B (zh) * 2016-06-24 2018-09-18 奇酷互联网络科技（深圳）有限公司 印刷电路板及其制作方法
CN106132099A (zh) * 2016-07-06 2016-11-16 四川海英电子科技有限公司 一种高阶高密度精细线路的蚀刻工艺
CN106163089A (zh) * 2016-07-20 2016-11-23 苏州福莱盈电子有限公司 一种双层通风散热的柔性线路板
CN106163090A (zh) * 2016-07-20 2016-11-23 苏州福莱盈电子有限公司 一种通风散热的线路板
CN105934079A (zh) * 2016-07-20 2016-09-07 苏州福莱盈电子有限公司 一种避免元件过热的柔性线路板
CN105934078A (zh) * 2016-07-20 2016-09-07 苏州福莱盈电子有限公司 一种双面元件散热的柔性线路板
CN106132074A (zh) * 2016-07-20 2016-11-16 苏州福莱盈电子有限公司 一种空管导热的线路板
CN108156752A (zh) * 2018-02-11 2018-06-12 维沃移动通信有限公司 一种电路板、移动终端及电路板的制造方法
CN110113867B (zh) * 2019-05-31 2021-03-02 维沃移动通信有限公司 散热结构及移动终端
US11979977B2 (en) * 2019-08-31 2024-05-07 Qing Ding Precision Electronics (Huaian) Co., Ltd Circuit board with heat dissipation structure and method for manufacturing same
CN110620090A (zh) * 2019-09-20 2019-12-27 宝能汽车有限公司 功率转换器

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2987495A1 (fr) * 2012-02-23 2013-08-30 Thales Sa Canaux de circulation d'un fluide dans une carte imprimee a structure multicouche
DE102013107787B4 (de) * 2012-07-23 2016-03-24 Infineon Technologies Ag Chipbaugruppe und verfahren zum herstellen einer chipbaugruppe
EP2985788A1 (fr) * 2014-08-14 2016-02-17 ABB Technology Oy Module semi-conducteur de puissance et procédé de refroidissement d'un module semi-conducteur de puissance
US9607924B2 (en) 2014-08-14 2017-03-28 Abb Technology Oy Power semiconductor module and method for cooling power semiconductor module
WO2018001983A1 (fr) * 2016-06-28 2018-01-04 Abb Schweiz Ag Boitier électronique refroidi á composants électroniques de puissance empilés
US10699986B2 (en) 2016-06-28 2020-06-30 Abb Schweiz Ag Cooled electronics package with stacked power electronics components
EP4021151A1 (fr) * 2020-12-23 2022-06-29 Huawei Digital Power Technologies Co., Ltd. Carte de circuit imprimé

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