Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
  • A47F11/00—Arrangements in shop windows, shop floors or show cases
  • A47F11/06—Means for bringing about special optical effects
  • A47F11/10—Arrangements of light sources
• • A—HUMAN NECESSITIES
  • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
  • A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
  • A47F3/00—Show cases or show cabinets
  • A47F3/001—Devices for lighting, humidifying, heating, ventilation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
  • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
  • B23K35/0233—Sheets, foils
  • B23K35/0238—Sheets, foils layered
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3457—Solder materials or compositions; Methods of application thereof
  • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
  • B23K35/262—Sn as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
  • B23K35/264—Bi as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/3006—Ag as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/3013—Au as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/302—Cu as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/3033—Ni as the principal constituent
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
  • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
  • B23K35/24—Selection of soldering or welding materials proper
  • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
  • B23K35/3053—Fe as the principal constituent
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
  • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/361—Assembling flexible printed circuits with other printed circuits
  • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

• the present invention relates to a method for fixing a component to or in a printed circuit board and / or for connecting individual elements of a printed circuit board, as well as to a use of such a method and to a printed circuit board.
• wire bonding by supplying ultrasound, heat and pressure, a wire formed, for example, of gold or aluminum is connected to a contact pad or a contact point of an electronic component and then to a contact surface to be connected thereto or to a region to be connected to a printed circuit board drawn, where the process of a connection or a bonding, for example by ultrasound, heat and / or pressure is repeated.
• the main drawbacks are a sequential sequence of production of the individual compounds, so that no parallel Leler process can be performed and in particular each contact or each area to be contacted must be made separately, so that the overall result is a complicated process.
• soldering process for example, after an application of Lötpastendepots an arrangement of components or interconnected elements or portions of a circuit board on the arranged Lötpastendepots or -stellen made, followed by heating of the entire assembly, which for example from the components and a Carrier of a part of a printed circuit board to be connected therewith, in a so-called reflow oven, a connection is made by melting the solder paste.
• lead-free solders being duly at least temporarily temperatures over 240 0 C, in particular above 265 0 C necessary, this being a corresponding burden on the printed circuit board or for to be connected to the component sections of the circuit board and respectively to a solution of individual circuit board layers Delamination can result.
• the present invention therefore aims, starting from a method of the type mentioned above, the disadvantages mentioned above with regard to the problems of maintaining a proper contacting or fixing a component on or in a printed circuit board and / or connection of individual elements of a To avoid printed circuit board and in particular a resistant and improved or increased tensile strength having connection or fixing at least one component on or in a printed circuit board and / or between individual elements of a printed circuit board and a printed circuit board with a improved adhesion of individual components and / or subregions to provide.
• a method of the type mentioned above is essentially characterized in that to be joined or juxtaposed areas of a component and / or a circuit board are each provided with at least one solder layer, that the solder layers are contacted with each other and using compared to ambient conditions increased pressure and elevated temperature to form an intermetallic diffusion layer are interconnected.
• solder layers are contacted with each other and under application of increased pressure and elevated temperature under ambient conditions
• Forming an intermetallic diffusion layer can be connected to one another or to one another, forming a proper and high-strength connection between the components to be connected to one another or to one another while forming alloys or connections between the adjacent or contacted solder layers. or elements of a printed circuit board, wherein, compared to known methods, increased tensile strengths and improved resistance to destruction, in particular during use, for example be achieved under changing temperature conditions or -bean- sprays.
• an approximation or vote for example, the thermal expansion coefficients of the materials used can be achieved so that even with fluctuating temperature stresses by adjusting or equalizing the expansion coefficients of the materials used for connection a strong improvement in resistance against deterioration or destruction of the connection can be achieved.
• a diffusion soldering or Schmelzdiffusionslötvons under application of environmental conditions elevated pressure and elevated temperature to form the intermetallic diffusion layer diffuses the materials or components of the contacted solder layers together, so that a high-strength compound by the diffusion of the solder layers into each other or with each other is achievable.
• intermetallic phases or alloys may occur between the materials used to form the intermetallic diffusion layer, it being understood that such diffusion of materials into one another occurs at temperatures well below the melting temperatures of those used for the solder layers, respectively Raw materials, as will be discussed in more detail below.
• the method according to the invention it is proposed to carry out the diffusion soldering process under conditions of pressure and temperature which can also be exposed without impairment to subregions of a printed circuit board and to achieve a proper connection or definition by diffusion of the materials used for the respective solder layer or layers in that the at least one solder layer is formed from an electrically conductive metal selected from the group comprising silver, gold, nickel and copper and / or tin, indium and bismuth.
• the materials mentioned have a corresponding good or high electrical conductivity, which are required to achieve a proper contact between the areas or contact points of a component and / or printed circuit board to be joined together, and moreover ensure that, in particular, at a comparatively low temperature If a corresponding pressure is used for a corresponding period of time, a reliable intermetallic connection can be achieved between the solder layers of the components or elements to be joined together.
• a barrier Layer is applied to the areas of a component and / or a printed circuit board to be joined or fixed to each other. This barrier layer prevents diffusion of the solder materials or of the elements of the resulting intermetallic compound or possibly resulting alloy into the region of the regions or contact points of the component and / or the printed circuit board to be connected to one another or to one another.
• the barrier layer is formed from an electrically conductive metal selected from the group comprising nickel, iron or molybdenum and / or alloys containing nickel and / or iron.
• two different solder layers are respectively applied to an area to be joined or fixed to each other.
• an initiation or initiation of the diffusion process can be made specifically, while a progressive or more advanced compound under formation of an intermetallic diffusion layer controlled or controlled by providing a further solder layer can be achieved.
• the different solder layers can be selected, for example, with regard to their melting temperature, for example, each one solder layer of a material of low melting temperature is set at the top of the areas to be joined, then followed by a solder layer of a material of higher melting temperature and optionally improved or
• a eutectic alloy of the materials used for the solder layer is formed, which has a correspondingly high resistance to destruction of the compound and a correspondingly high and good electrical conductivity for the contacting to be achieved having.
• each at least one solder layer in particular in connection with the production of a printed circuit board of low thickness or layer thickness is proposed according to a further preferred embodiment of the method according to the invention that the at least one solder layer and the barrier layer electrochemically or chemically deposited or applied.
• the at least one solder layer and / or the barrier layer have a thickness of at least 5 nm, in particular at least 100 nm to at most 100 .mu.m, preferably taking into account the achievement of a corresponding, resistant connection or contacting not more than 20 microns.
• Such layer thicknesses or thicknesses of the solder layer or solder layers and / or the barrier layer to be used are usually used in the production of printed circuit boards areas of a layer thickness of individual elements or layers of such a circuit board, so that the contacts to be produced in a simple Way can be integrated into such a circuit board.
• soldering at a pressure of less than 300 bar, in particular less than 250 bar and at temperatures of less than 600 0th C, in particular between 150 0 C and 450 0 C is performed.
• temperatures used for melt diffusion soldering it is immediately apparent that the soldering operation is carried out at temperatures which are in some cases considerably below the melting temperatures of the materials used for the formation of the solder layers.
• the increased pressure and the elevated temperature for a Period of at least 10 minutes, in particular at least 20 minutes and at most 150 minutes, in particular at most 120 minutes applied or applied.
• a plurality of compounds or definitions can be made simultaneously after the application of at least one solder layer and the contacting of the solder layers together, so that in contrast to known techniques, such as For example, a soldering or wire bonding, a parallel or simultaneous implementation of a connecting or fixing process for an optionally very large number of interconnected or to be determined together areas, in particular contact points can be done.
• the method according to the invention can be used particularly preferably for the assembly of electronic components or components on or in a printed circuit board, such components or components being active or passive components, individual components or assemblies.
• the method according to the invention can preferably be used or used for connecting printed circuit board segments or elements, in particular for producing a rigidly flexible printed circuit board.
• Another preferred application or field of application of the method according to the invention is in the production or training of heat dissipation elements in or on a printed circuit board, wherein by arranging solder layers of corresponding materials such heat-dissipating elements, for example, simultaneously with a preparation of a compound or down Components can be made on or in a circuit board or a connection of individual elements of a circuit board with each other.
• a printed circuit board for solving the above-mentioned objects, which is characterized essentially by the fact that together connecting or juxtaposed areas of a component and / or a printed circuit board are each provided with at least one solder layer, that the solder layers are contactable with each other and under application of ambient conditions elevated pressure and elevated temperature with formation of an intermetallic diffusion layer are interconnected.
• the formation of an intermetallic diffusion layer between regions to be connected or contacted, for example contact points thus makes it possible to provide a printed circuit board in which components or elements to be connected to one another are fixed or connected to one another, which ensures high reliability of the connection produced or contacting have.
• FIG. 1A shows, on an enlarged scale, a detailed view of the portion A of FIG. 1;
• FIG. 2 shows, in a representation similar to FIG. 1, a partial view of the printed circuit board with splices for a tempo-rare positioning of the component to be connected to the printed circuit board;
• FIG. FIG. 3 shows the component arranged on the printed circuit board with the intermediary of the adhesive applied according to FIG. 2 before the melt diffusion method is carried out;
• FIG. 4 shows the component fixed to the printed circuit board after the melt diffusion process has been carried out, forming an intermetallic diffusion layer between the solder layers;
• Fig. 5 in a similar to Fig. 1 representation with each other to be joined elements of a particular rigid-flexible circuit board before the connection with each other and after application of a solder layer on the areas to be joined together.
• FIGS. 1 to 4 show different method steps in carrying out the method for fixing a component on or in a printed circuit board.
• FIG. 1 shows that a barrier layer 3 is arranged on this copper layer 2 on a printed circuit board generally designated 1 in the area of contact points each formed by 2, which are formed for example from a copper layer, followed by two layers 4 and 5 are arranged or applied from mutually different solder material.
• the individual layers 7 to 10 are shown slightly separated from one another in the illustration according to FIG. 1A for clarification, with such a separation serving merely to simplify the clarity of the drawing.
• the thicknesses of the individual layers 7 to 10 are merely exemplary and not true to scale, with details of usable, possible ranges of layer thicknesses being discussed in greater detail below.
• the areas of the contact points 2 of the printed circuit board 1 are also formed, so that it can be assumed that in the embodiment shown in FIG. 1, for example, the layers or contact points 2 and 7 are each made of copper are formed, followed by barrier layers 3 and 8 are applied, for example, nickel or are.
• barrier layers 3 and 8 are applied, for example, nickel or are.
• the application of the layers 3, 4 and 5 or 8, 9 and 10 can be carried out by an electrochemical or chemical deposition or application.
• an arrangement or application of the barrier layer 3 and the at least one solder layer 4 and 5 in the region of the contact points 2 on the circuit board 1 takes place, as shown in Fig. 2, an arrangement or application of splices or layers 11, about which, as shown in FIG. 3, subsequently has a temporary fixing or arrangement of the component 6, wherein it can be seen from FIG. 3 that contacting of the solder layers with one another takes place in such a way, in particular the layers 5 and 10, which face each other, directly contact each other.
• an intermetallic diffusion layer 12 is formed, wherein in the case of using silver for the layers 3 and 9 and tin for the layers 5 and 10, this diffusion layer 12 is formed by a eutectic silver-tin alloy which, for example, compared to known connections between contact points of a component 6 and a printed circuit board 1 increased tensile strength of, for example, greater than 1000 N. / mm 2 .
• the thickness of the barrier layers or barrier layers 3 and 8 is hiebei example, between 100 nm to 20 microns.
• the thickness of the solder layers 4 and 5 and 9 and 10 is in a range of about 100 nm to at most 100 microns.
• an application of environmental conditions elevated pressure and elevated temperature wherein for the materials selected in FIGS. 1 to 4 are selected for a period of, for example, at least 15 minutes, in particular about 20 to 120 minutes, wherein a pressure of less than 250 bar and in particular depending on the material used for the printed circuit board 1 as well the component 6 temperatures between 150 0 C and 450 0 C are selected, and this may optionally also be referred to as soft soldering.
• nickel for the barrier layer 3 or 8
• iron or molybdenum and / or nickel and / or iron-containing alloys may be used.
• solder layers 4 and 5 in particular materials or metals with different melting point can be used, wherein the adjoining layers 5 and 10 are formed of a metal lower melting point and thus higher melting, while, for example, the layers 4th and 9 of materials, and in particular metals of, for example, generally increased conductivity, such as gold or copper instead of silver.
• contact points 16 are arranged or indicated, wherein a solder layer 17 is respectively arranged or applied on the contact points 16, which in turn are formed from copper , Similarly, in the region of contact points 18, which in turn may be formed from copper, in each case a solder layer 19 is disposed on the flexible element.
• splices 20 are provided.
• solder layers 17 and 19 After the application of the solder layers 17 and 19, respectively, similar to the embodiment according to FIGS. 1 to 4, a contacting of the solder layers 17, 19, which in turn under application of environmental conditions increased pressure and elevated temperature, an intermetallic diffusion tion layer in the region of the solder layers 17 and 19 is formed, resulting in a high-strength and correspondingly resistant connection of the rigid portions 13th and 14 leads to the flexible portion 15 to form a plurality of connection or contact points.
• the flexible element 15 consists hiebei example, of a flexible core 21, over which a prepreg 22 is arranged with conductor tracks or contacts 23, wherein moreover a shielding layer is indicated by 24.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Mechanical Engineering (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Combinations Of Printed Boards (AREA)

Priority Applications (4)

Applications Claiming Priority (2)

Publications (2)

Family

ID=40846026

Family Applications (1)

Country Status (7)

Cited By (2)

Families Citing this family (17)

Citations (7)

Family Cites Families (6)

• 2008
  • 2008-05-21 AT AT0029308U patent/AT10735U1/de not_active IP Right Cessation
• 2009
  • 2009-05-20 US US12/736,916 patent/US20110067908A1/en not_active Abandoned
  • 2009-05-20 CN CN2009801184071A patent/CN102037793A/zh active Pending
  • 2009-05-20 EP EP09749320A patent/EP2283714A2/de not_active Withdrawn
  • 2009-05-20 WO PCT/AT2009/000210 patent/WO2009140709A2/de active Application Filing
  • 2009-05-20 JP JP2011509813A patent/JP2011521458A/ja active Pending
  • 2009-05-20 KR KR1020107025835A patent/KR20110014598A/ko not_active Application Discontinuation

Patent Citations (8)

Non-Patent Citations (1)

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