WO2009130782A1 - 半導体検出器ブロック及びこれを用いた陽電子断層撮影装置 - Google Patents
半導体検出器ブロック及びこれを用いた陽電子断層撮影装置 Download PDFInfo
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- WO2009130782A1 WO2009130782A1 PCT/JP2008/057968 JP2008057968W WO2009130782A1 WO 2009130782 A1 WO2009130782 A1 WO 2009130782A1 JP 2008057968 W JP2008057968 W JP 2008057968W WO 2009130782 A1 WO2009130782 A1 WO 2009130782A1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 238000002600 positron emission tomography Methods 0.000 title claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 13
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052738 indium Inorganic materials 0.000 claims description 16
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 16
- 229910004613 CdTe Inorganic materials 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 11
- 230000005251 gamma ray Effects 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 abstract 1
- 238000003325 tomography Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 206010028980 Neoplasm Diseases 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 229940079593 drug Drugs 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 201000011510 cancer Diseases 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002547 new drug Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 208000003174 Brain Neoplasms Diseases 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 241000699670 Mus sp. Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009509 drug development Methods 0.000 description 1
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- 230000008029 eradication Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02024—Position sensitive and lateral effect photodetectors; Quadrant photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/242—Stacked detectors, e.g. for depth information
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/247—Detector read-out circuitry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/249—Measuring radiation intensity with semiconductor detectors specially adapted for use in SPECT or PET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
Definitions
- the present invention uses a positron emission tomography apparatus that can administer a drug labeled with a positron emitting nuclide into the body to diagnose cancer and diagnose organs such as the brain, and the development of drugs.
- the present invention relates to a semiconductor detector block used in an experimental positron tomography apparatus and the like, and a positron tomography apparatus using the same.
- the positron emission tomography apparatus uses a positron emitting nuclide, detects two 511 keV gamma rays emitted at an angle of 180 ° when the emitted positron and the electron in the material meet and disappear, and the distribution of the nuclide. Obtain an image.
- scintillators such as BGO, LSO, and GSO are used as ⁇ -ray detectors in positron tomography apparatuses.
- the scintillator detectors are arranged on the circumference to form a gantry. Dozens of scintillators are bundled while being separated from each other by a light shielding wall, and their ends are connected to several photomultiplier tubes.
- the light emitted by the gamma ray detection is received by several photomultiplier tubes, and the scintillator used to determine the gamma ray was determined from the intensity ratio of each light.
- the spatial resolution of a positron tomography apparatus based on this principle is limited to several millimeters.
- the position resolution with respect to the traveling direction of gamma rays strongly depends on the size of the scintillator with respect to the traveling direction, and is usually limited to about 2 mm. Furthermore, since the detection position in the traveling direction of gamma rays cannot be measured directly, scintillators with different scintillation light intensity decay times are arranged in the traveling direction and detected by measuring the decay time of the detected gamma ray light signal. In general, a method of determining the scintillator, that is, determining the position of the gamma ray is taken, and the accuracy of the position determination is limited to several millimeters.
- An object of the present invention is to provide a semiconductor detector block having a simple detector structure and a spatial resolution of 1 mm or less, and a positron emission tomography apparatus including the same.
- the present invention provides the following semiconductor detector block and a positron emission tomography apparatus including the same.
- a semiconductor plate having an electrically conductive resistive electrode on the front surface and an electrically conductive electrode formed on the back surface, and using the ratio of electrical signals from the four corners of the electrically conductive resistive electrode,
- a semiconductor detector block in which a plurality of semiconductor detectors for detecting a detection position two-dimensionally are overlapped so that a gamma ray detection position can be obtained three-dimensionally.
- a positron emission tomography apparatus comprising two or more semiconductor detector blocks according to any one of (1) to (5).
- (7) The positron emission tomography apparatus according to (6), wherein the semiconductor detector block can be moved independently in a radial direction or a facing direction.
- a semiconductor detector block having a simple detector structure and a spatial resolution of 1 mm or less and a positron emission tomography apparatus including the same can be obtained.
- FIG. 4 is a diagram showing a CdTe detector block according to the present invention.
- FIG. 5 is a layout diagram of CdTe detector blocks in a positron emission tomography apparatus with a packing ratio of 100%.
- FIG. 1 shows a semiconductor detector for two-dimensionally detecting a detection position of gamma rays in a semiconductor plate.
- a thin semiconductor crystal plate is made of a CdTe crystal or a BrTl crystal, one surface is an electrically conductive resistive electrode, and the other surface is an electrically conductive electrode.
- the semiconductor detector is provided with terminals at four corners A, B, C, D of the electrically conductive resistive electrode surface, and each is connected to an amplifier circuit. Using the voltages V A , V B , V C and V D generated at the four terminals, the detected positions X and Y of the gamma rays on the semiconductor plate are obtained as a function of V A , V B , V C and V D. .
- one surface is a platinum electrode and the other surface is an indium electrode.
- the indium electrode surface is provided with electric conduction resistance by thinly depositing indium.
- the indium vapor deposition surface of the semiconductor plate has electrical conductivity resistance, and the semiconductor plate operates as a Schottky detector.
- FIG. 2 shows the result of taking two terminals from two of the four corners of the indium electrode surface and one terminal from the platinum electrode surface and irradiating a 1 micron spot size proton beam at 0.5 mm intervals.
- the frequency of Va / (Va + Vb) obtained is shown. From FIG. 2, it was confirmed that a position resolution of 0.2 mm or more was obtained with this semiconductor detector.
- the lower diagram of FIG. 3 is a perspective view of the semiconductor detector block, and the upper diagram of FIG. 3 is a partial sectional view of the upper left portion thereof. Note that peripheral devices such as amplifiers are not shown.
- the semiconductor detector block is formed as follows. The platinum electrode surfaces 2 of the semiconductor plates made of CdTe crystals are pasted together with a paste having electrical conductivity. By laminating this with the very thin insulating thin film 3 alternately and repeatedly, the semiconductor detector made of a thin semiconductor plate (CdTe crystal) having no mechanical strength has high strength and high spatial resolution. A semiconductor detector block capable of measuring the position of the three-dimensionally is formed. Which semiconductor plate of the semiconductor detector block has the gamma ray measured is determined by simultaneous counting of the platinum electrode and the indium resistive electrode.
- the semiconductor detector blocks of 10 mm ⁇ 10 mm ⁇ 18 mm are arranged in several layers and arranged in a circular or opposed manner.
- the semiconductor detector block has a structure that moves in the radial direction or the opposite direction.
- a drug labeled with a positron emitting nuclide is administered to a human or animal, and two gamma rays generated by positron annihilation are counted simultaneously.
- the gamma rays are detected by a semiconductor plate in the semiconductor detector block, and electrons and holes are generated.
- the holes are collected on the platinum cathode and input to the amplifier circuit as a time information signal.
- Electrons collect at the indium anode and flow to the amplifier circuit through the indium resistive electrode surface.
- a signal is generated from an amplifier connected to four terminals at the four corners of the indium resistive electrode surface. From this signal, the gamma ray detection position on the semiconductor plate surface is determined.
- the true detection position is the one closer to the subject.
- the resolution of the semiconductor detector block can be increased as follows. First, the positional relationship between the surface of the subject and the detector block is obtained by irradiating the subject with laser light and measuring the reflection. Next, the semiconductor detector block is brought close to the subject to detect the three-dimensional position of the gamma rays. High sensitivity and high spatial resolution positron emission tomography images can be obtained by making the semiconductor detector blocks move independently and shortening the distance between the semiconductor detector blocks that simultaneously count the object of any shape. . It has been experimentally found that the spatial resolution can be 1 mm or less when the distance between the semiconductor detector blocks is 20 cm or less. The present invention thereby realizes a positron distribution image having a spatial resolution of 1 mm or less.
- the spatial resolution was only about 3 mm. It was possible to reduce the resolution to 1 mm or less by using a semiconductor piece and making it thin. For this reason, not only will it be possible to develop new drug development research using positron emission tomography equipment using mice, but it will also be possible to find 1-mm micro cancers, contributing greatly to the development of new drugs and the eradication of cancer. Expected to do.
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- Life Sciences & Earth Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Nuclear Medicine (AREA)
- Measurement Of Radiation (AREA)
Abstract
Description
(1)表面に電気伝導抵抗性電極、裏面に電気伝導性電極が形成された半導体板からなり、電気伝導抵抗性電極の4隅からの電気信号の比率を用いて半導体板内でのガンマ線の検出位置を2次元的に検出する半導体検出器を複数個重ね合わせ、3次元的にガンマ線の検出位置を求めることができるようにした半導体検出器ブロック。
(2)上記電気伝導抵抗性電極は、半導体板との間でショットキー接合を構成していることを特徴とする(1)に記載の半導体検出器ブロック。
(3)上記電気伝導抵抗性電極、半導体板及び電気伝導性電極の構成材料は、それぞれインジウム、CdTe結晶又はBrTl結晶及び白金であることを特徴とする(1)又は(2)に記載の半導体検出器ブロック。
(4)隣接する半導体検出器の白金電極面同士を電気伝導性を持つペーストで貼り付けるとともにインジウム電極面同士を絶縁膜を介して複数個重ね合わせることを特徴とする(3)に記載の半導体検出器ブロック。
(5)上記電気伝導性電極からの電気信号を同時計数用の時間信号とし、ガンマ線を検出した他の半導体検出器との同時計数の判定に用いることを特徴とする(1)乃至(4)のいずれかに記載の半導体検出器ブロック。
(6)(1)乃至(5)のいずれかに記載の半導体検出器ブロックを2個以上備えた陽電子断層撮影装置。
(7)上記半導体検出器ブロックは、動径方向又は対向方向に独立して移動することができることを特徴とする(6)に記載の陽電子断層撮影装置。
2 白金電気伝導性電極面
3 絶縁薄膜
4 インジウム電気伝導抵抗性電極面端子
5 白金伝導性電極面端子
図1は、半導体板内でのガンマ線の検出位置を2次元的に検出する半導体検出器を示すものである。
図1において、薄い半導体結晶板は、材質をCdTe結晶又はBrTl結晶とし、片方の面が電気伝導抵抗性電極、もう片方の面を電気伝導性電極とするものである。
次に図2は、インジウム電極面の4隅のうちの2つから電極を2端子とり、また白金電極面から1端子とり、1ミクロンスポットサイズの陽子ビームを0.5mm間隔で照射した結果得られたVa/(Va+Vb)の頻度を示すものである。図2より、この半導体検出器では0.2mm以上の位置分解能を得られていることが認められた。
半導体検出器ブロックは次のように形成される。
CdTe結晶からなる半導体板の白金電極面2同士を電気伝導性を持つペーストで相互に貼り付ける。これを、非常に薄い絶縁薄膜3と交互に幾重にも張り合わせることによって、力学的強度の無い薄い半導体板(CdTe結晶)からなる半導体検出器から、強度があり、しかも、高空間分解能でガンマ線の位置を3次元的に測定できる半導体検出器ブロックが形成される。
半導体検出器ブロックのどの半導体板でガンマ線が測定されたかは、白金電極とインジウム抵抗性電極の同時計数より決定される。
半導体検出器ブロックの電極面をガンマ線の検出方向に対して、垂直に配置することにより、パッキング比が100%の陽電子断層撮影装置が実現される(図4)。
半導体検出器ブロックが独立して動くようにし、任意の形状の被写体に対して同時計数する半導体検出器ブロック間の距離を短くすることによって、高感度かつ高空間分解能の陽電子断層撮影画像が得られる。
半導体検出器ブロック間の距離を20cm以下にすると、空間分解能は1mm以下の値にすることができることが実験的に分かった。本発明はこれにより、1mm以下の空間分解能を持った陽電子分布画像を実現する。
Claims (7)
- 表面に電気伝導抵抗性電極、裏面に電気伝導性電極が形成された半導体板からなり、電気伝導抵抗性電極の4隅からの電気信号の比率を用いて半導体板内でのガンマ線の検出位置を2次元的に検出する半導体検出器を複数個重ね合わせ、3次元的にガンマ線の検出位置を求めることができるようにした半導体検出器ブロック。
- 上記電気伝導抵抗性電極は、半導体板との間でショットキー接合を構成していることを特徴とする請求項1に記載の半導体検出器ブロック。
- 上記電気伝導抵抗性電極、半導体板及び電気伝導性電極の構成材料は、それぞれインジウム、CdTe結晶又はBrTl結晶及び白金であることを特徴とする請求項1又は2に記載の半導体検出器ブロック。
- 隣接する半導体検出器の白金電極面同士を電気伝導性を持つペーストで貼り付けるとともにインジウム電極面同士を絶縁膜を介して複数個重ね合わせることを特徴とする請求項3に記載の半導体検出器ブロック。
- 上記電気伝導性電極からの電気信号を同時計数用の時間信号とし、ガンマ線を検出した他の半導体検出器との同時計数の判定に用いることを特徴とする請求項1乃至4のいずれか1項に記載の半導体検出器ブロック。
- 請求項1乃至5のいずれか1項に記載の半導体検出器ブロックを2個以上備えた陽電子断層撮影装置。
- 上記半導体検出器ブロックは、動径方向又は対向方向に独立して移動することができることを特徴とする請求項6に記載の陽電子断層撮影装置。
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DE112008003827T DE112008003827T5 (de) | 2008-04-24 | 2008-04-24 | Halbleiterdetektorblock und Positronenemissionstomografieapparat, der diesen verwendet |
US12/988,698 US20110042575A1 (en) | 2008-04-24 | 2008-04-24 | Semiconductor Detector Block and Positron Emission Tomography Device Using the Same |
CN2008801286653A CN102016639A (zh) | 2008-04-24 | 2008-04-24 | 半导体探测器模块及使用该半导体探测器模块的正电子断层摄影装置 |
PCT/JP2008/057968 WO2009130782A1 (ja) | 2008-04-24 | 2008-04-24 | 半導体検出器ブロック及びこれを用いた陽電子断層撮影装置 |
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US9831375B2 (en) | 2012-04-25 | 2017-11-28 | Westinghouse Electric Company Llc | Solid state radiation detector with enhanced gamma radiation sensitivity |
US9482762B2 (en) * | 2014-08-28 | 2016-11-01 | Infineon Technologies Ag | Gamma ray detector and method of detecting gamma rays |
IT201800020116A1 (it) | 2018-12-18 | 2020-06-18 | Nexion Spa | Apparato di servizio per la ruota di un veicolo |
US11170903B2 (en) | 2019-06-12 | 2021-11-09 | Westinghouse Electric Company Llc | Method and system to detect and locate the in-core position of fuel bundles with cladding perforations in candu-style nuclear reactors |
US11445995B2 (en) | 2020-06-26 | 2022-09-20 | Raytheon Company | Gradient index scintillator for improved resolution |
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US20030075746A1 (en) * | 2001-10-22 | 2003-04-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for determining identification code and application thereof |
JP2005208057A (ja) | 2003-12-26 | 2005-08-04 | Institute Of Physical & Chemical Research | ガンマ線検出器及びガンマ線撮像装置 |
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- 2008-04-24 WO PCT/JP2008/057968 patent/WO2009130782A1/ja active Application Filing
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JPS61108930A (ja) * | 1984-11-01 | 1986-05-27 | Hamamatsu Photonics Kk | 粒子線等の入射位置を検出するための半導体入射位置検出装置 |
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DE112008003827T5 (de) | 2011-02-17 |
CN102016639A (zh) | 2011-04-13 |
US20110042575A1 (en) | 2011-02-24 |
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