WO2009087930A1 - Méthode de fabrication d'éléments semi-conducteurs - Google Patents

Méthode de fabrication d'éléments semi-conducteurs Download PDF

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Publication number
WO2009087930A1
WO2009087930A1 PCT/JP2008/073756 JP2008073756W WO2009087930A1 WO 2009087930 A1 WO2009087930 A1 WO 2009087930A1 JP 2008073756 W JP2008073756 W JP 2008073756W WO 2009087930 A1 WO2009087930 A1 WO 2009087930A1
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WO
WIPO (PCT)
Prior art keywords
base film
adhesive sheet
pressure
pickup
cut
Prior art date
Application number
PCT/JP2008/073756
Other languages
English (en)
Japanese (ja)
Inventor
Akiyoshi Yamamoto
Tomokazu Takahashi
Fumiteru Asai
Toshio Shintani
Takatoshi Sasaki
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008002814A external-priority patent/JP2009164502A/ja
Priority claimed from JP2008002812A external-priority patent/JP2009164501A/ja
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2009087930A1 publication Critical patent/WO2009087930A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a method for manufacturing a semiconductor device, and more specifically, a method for manufacturing a semiconductor device to be subjected to a pick-up process after water jet laser dicing a workpiece such as a semiconductor wafer and / or a semiconductor-related material.
  • semiconductor wafers and semiconductor-related materials have been cut using a rotary blade and separated into chips and IC components.
  • a semiconductor wafer or the like is bonded to an adhesive sheet, and the wafer or the like is cut into chips and then peeled off from the adhesive sheet in a pickup process.
  • Patent Document 2 JP 2001-316648 A.
  • the separated semiconductor elements are subjected to a pickup / die bonding process.
  • the semiconductor element is pushed up and picked up by a needle from the lower part of the fixing adhesive sheet.
  • the pick-up sheet is fixed by adsorbing the vicinity of the push-up needle from the back side of the pressure-sensitive adhesive sheet, or by following the needle to facilitate the pick-up. Due to the perforation, there is a problem that the vacuum suction on the needle side breaks through, the adhesive sheet cannot be fixed, pickup failure occurs, and production efficiency is lowered.
  • the present invention has been made in view of the above problems, and provides a method for manufacturing a semiconductor element capable of performing a pickup process, which is the next process, while performing water jet laser dicing with good dicing quality. Objective.
  • the object to be cut is attached to a water jet laser dicing pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is laminated on a perforated base film, and water jet laser dicing is performed.
  • a pickup tape in which a pressure-sensitive adhesive layer is laminated on a base film having no perforations is attached to the base film having the perforations of the pressure-sensitive adhesive sheet,
  • C Thereafter, the object to be cut is subjected to a pickup process.
  • a surface to be cut is attached to an adhesive sheet for water jet laser dicing in which an adhesive layer is laminated on a base film having perforations. Jet laser dicing, (B2) The other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations, (C) Thereafter, the object to be cut is subjected to a pickup process.
  • the pick-up process by a needle push-up type.
  • the pressure-sensitive adhesive sheet for water jet laser dicing has a mesh structure or is formed of a base film made of a nonwoven fabric.
  • the pickup tape is preferably formed of a base film having a tensile Young's modulus of 30 MPa or more and 5000 MPa or less. Moreover, it is preferable that a pick-up tape is formed with the base film of thickness 10 micrometers or more and 300 micrometers or less.
  • the object to be cut (for example, one surface of the object to be cut) is an adhesive sheet for water jet laser dicing (hereinafter, simply referred to as “adhesive sheet”). Paste to dice.
  • the material to be cut in the present invention may be any material as long as it can finally become a semiconductor element.
  • semiconductor wafers and semiconductor-related materials include, for example, BGA packages, printed circuits, ceramic plates, glass components for liquid crystal devices, sheet materials, circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, or semiconductor packages. Etc.
  • the pressure-sensitive adhesive sheet of the present invention is suitably used for water jet laser dicing, and mainly comprises a substrate film and a pressure-sensitive adhesive layer disposed thereon.
  • water jet laser dicing is dicing using a laser beam guided by a liquid flow (usually a water flow), and the water jet laser dicing adhesive sheet is used for the above-mentioned dicing and at the time of dicing.
  • This liquid flow for example, when a liquid flow of a predetermined pressure or higher is applied directly or indirectly to the base film from the pressure-sensitive adhesive layer side, can be released from one surface side of the pressure-sensitive adhesive sheet to the other surface side.
  • the predetermined pressure at this time can usually be about several MPa or more.
  • the base film has perforations.
  • This perforation is preferably a hole penetrating in the thickness direction, but may be a hole that is connected in the thickness direction as a result of a plurality of holes being connected.
  • the holes in the base film are preferably openings when the base film has a mesh structure, or are made of unemployed cloth.
  • the size of the perforations is not particularly limited as long as it allows water to pass through, and can be appropriately adjusted depending on the pressure, flow rate, and the like of the liquid flow of the dicing apparatus to be used.
  • the material of the base film is not particularly limited, and examples thereof include synthetic resins usually used in the field, for example, polyolefins such as polyethylene and polypropylene, and polymers such as polyester.
  • the base film preferably has a tensile Young's modulus of about 30 to 5000 MPa.
  • the base film may have a single layer or a multilayer structure of two or more layers.
  • the pressure-sensitive adhesive layer is constituted by a pressure-sensitive adhesive layer applied to one surface of the base film.
  • This pressure-sensitive adhesive may be any of a pressure-sensitive type, a heat-sensitive type, and a photosensitive type, but is preferably a type of pressure-sensitive adhesive that is cured by irradiation with energy rays. Thereby, the peelability from the workpiece can be easily performed.
  • energy rays for example, those having various wavelengths such as ultraviolet rays, visible rays, infrared rays and the like can be used.
  • the laser beam used for dicing is an energy ray having an oscillation wavelength of 400 nm or less, for example, an oscillation wavelength of 248 nm.
  • KrF excimer laser 308 nm XeCI excimer laser, YAG laser third harmonic (355 nm), fourth harmonic (266 nm), or energy rays with an oscillation wavelength of 400 nm or more, for example, ultraviolet region via multiphoton absorption process
  • any of known pressure-sensitive adhesives including a rubber polymer, a (meth) acrylic polymer, and the like can be used.
  • the rubber polymer may be any of natural rubber (eg, polyisoprene) and synthetic rubber (eg, styrene-butadiene rubber, polybutadiene, butadiene-acrylonitrile, chloroprene rubber).
  • Examples of the monomer component constituting the (meth) acrylic polymer include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, an amyl group, an isoamyl group, and a hexyl group.
  • Examples of other monomer components include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid and other carboxyl group-containing monomers, maleic anhydride Acid anhydride monomers such as acid and itaconic anhydride, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy (meth) acrylate Hydroxyl group-containing compounds such as hexyl, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate , Sulfones such as styrene sulfonic acid, allyl sulf
  • polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol di (Meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, Examples include epoxy (meth) acrylate, polyester (meth) acrylate, and ure
  • a monomer and / or oligomer having an energy ray-curable functional group such as a carbon-carbon double bond may be used.
  • the monomer / oligomer include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, Examples thereof include dipentaerythritol hexa (meth) acrylate and 1,4-butylene glycol di (meth) acrylate. These may be used alone or in combination of two or more.
  • the blending amount of these is not particularly limited, but in consideration of tackiness, it is about 5 to 500 parts by weight with respect to 100 parts by weight of the base polymer such as (meth) acrylic polymer constituting the adhesive. It is preferably about 70 to 150 parts by weight.
  • a photoinitiator when comprising a photosensitive adhesive, it is preferable to use a photoinitiator.
  • the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ -methylacetophenone, methoxyacetophenone, 2,2-dimethoxy-2- Acetophenone compounds such as phenylacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1, benzoin ethyl ether, benzoin Benzoin ether compounds such as isopropyl ether and anisoin methyl ether, ⁇ -ketol compounds such as 2-methyl-2-hydroxypropylphenone, ketal compounds such as benzyldimethyl ketal, 2-naphthalenesulfon
  • the blending amount of the photopolymerization initiator is preferably about 0.1 to 10 parts by weight, more preferably about 0.5 to 5 parts by weight with respect to 100 parts by weight of the base polymer constituting the pressure-sensitive adhesive. .
  • a crosslinking agent may optionally be added.
  • the crosslinking agent include polyisocyanate compounds, epoxy compounds, aziridine compounds, melamine resins, urea resins, anhydrous compounds, polyamines, and carboxyl group-containing polymers. These may be used alone or in combination of two or more.
  • the amount used thereof is generally about 0.01 to 5 parts by weight with respect to 100 parts by weight of the base polymer in consideration that the peeling adhesive strength does not decrease too much. preferable.
  • additives such as conventionally known tackifiers, anti-aging agents, fillers, anti-aging agents, and coloring agents can be optionally added.
  • a known method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method is applied to one or more monomers or a mixture thereof. Can be done.
  • the solution polymerization method is preferable.
  • the solvent used here include polar solvents such as ethyl acetate and toluene.
  • the solution concentration is usually about 20 to 80% by weight.
  • a polymerization initiator may be used.
  • the polymerization initiator include peroxides such as hydrogen peroxide, benzoyl peroxide, and t-butyl peroxide. Although it is desirable to use it alone, it may be used as a redox polymerization initiator in combination with a reducing agent.
  • the reducing agent include ionized salts such as sulfite, bisulfite, iron, copper, and cobalt salts, amines such as triethanolamine, and reducing sugars such as aldose and ketose.
  • An azo compound such as a salt, 2,2′-azobisisobutyronitrile, 2,2′-azobis-2-methyl-N- (2-hydroxyethyl) propionamide may be used. These may be used alone or in combination of two or more.
  • the reaction temperature is usually about 50 to 85 ° C., and the reaction time is about 1 to 8 hours.
  • the (meth) acrylic polymer preferably has a low content of a low molecular weight substance from the viewpoint of preventing contamination of the object to be cut, and the weight average molecular weight of the (meth) acrylic polymer is 300,000 or more, Further, about 80 to 3 million is preferable.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably set to such a thickness that the liquid flow can pass through the dicing tape during dicing.
  • the pressure-sensitive adhesive sheet used in the present invention can be formed by a method for producing a tape known in the art. For example, first, a base film is prepared. Subsequently, an adhesive is laminated
  • the substrate film may be coated directly, or a transfer coating method in which an adhesive is coated on a process material coated with a release agent, dried, and then laminated on the substrate film is used.
  • the pressure-sensitive adhesive may be roll-laminated on the base film. These coatings can utilize various methods such as reverse roll coating, gravure coating, curtain spray coating, die coating, extrusion and other industrially applied coating methods.
  • the prepared base film may have perforations in the state of the base film, or may be formed after coating the base film with an adhesive.
  • Affixing of the object to be cut to the pressure-sensitive adhesive sheet is performed by affixing the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet to a material to be cut such as a semiconductor wafer (for example, one surface of a non-cut object), and is usually performed in this field. It can be performed according to conditions, methods, and the like.
  • the dicing may be performed using any apparatus as long as it can be performed using a laser beam guided by a liquid flow. For example, an apparatus using a technique described in WO95 / 32834 can be used.
  • a pickup tape is attached to the above-mentioned pressure-sensitive adhesive sheet.
  • the attachment to the pickup tape here is performed by attaching the adhesive layer of the pickup tape to the base film of the adhesive sheet described above.
  • the base film of the pressure-sensitive adhesive sheet is stuck so as to close the perforations with the pickup tape.
  • the method of attaching is not particularly limited, but a method of allowing the base film of the pressure-sensitive adhesive sheet to stand on the table and allowing the pickup tape to be attached to the base film with a roller is simple.
  • a pickup tape is attached to the other surface of the diced workpiece to be transferred.
  • the attachment to the pickup tape here is performed by attaching an adhesive layer of the pickup tape to the surface opposite to the surface to which the adhesive sheet of the diced object to be cut is attached. That is, the object to be cut is pasted so as to be sandwiched between the adhesive sheet and the pickup tape.
  • the method of pasting is not particularly limited, but is allowed to stand on the table with the surface opposite to the surface on which the adhesive sheet of the diced object to be cut is pasted, and the pickup tape is pasted with a roller.
  • the attaching method is simple. Conditions such as pressure, roller rotation speed, and temperature can be adjusted to such an extent that the object to be cut does not break and the pickup tape adheres to the pressure-sensitive adhesive sheet.
  • the pickup tape mainly includes a base film and an adhesive layer disposed thereon.
  • a conventionally well-known film which does not have perforation can be used for a base film.
  • a base film having a tensile Young's modulus of about 30 to 5000 MPa is preferable.
  • the thickness is not particularly limited, for example, in order to propagate the needle push-up stress and facilitate pickup, the thickness is 10 to 300 ⁇ m, preferably 30 to 200 ⁇ m.
  • the base film may have a single layer or a multilayer structure of two or more layers.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be any of pressure-sensitive type, heat-sensitive type, and photosensitive type. Examples of the material for forming the pressure-sensitive adhesive layer, the method for forming the pressure-sensitive adhesive layer, and the like are the same as those for the pressure-sensitive adhesive sheet described above.
  • the thickness of an adhesive layer can be suitably adjusted in the range which does not peel from the base film of an adhesive sheet. In order to block the perforation of the base film of the pressure-sensitive adhesive sheet, the thickness is about 30 to 500 ⁇ m, more preferably about 30 to 200 ⁇ m.
  • the elastic modulus of the pressure-sensitive adhesive layer can be adjusted as appropriate, but is preferably about 0.1 to 2 MPa in order to block perforation of the base film of the pressure-sensitive adhesive sheet.
  • transfer means to transfer the form of the object to be cut after the one surface of the object to be cut is attached to the adhesive sheet and diced to the pickup tape as usual. This means that the surface is affixed to the pickup tape, and then the adhesive sheet is peeled off.
  • the adhesive sheet 11 which has the perforation 11a in a base material is affixed on a to-be-cut body, and an adhesive sheet water jet laser dicing is performed.
  • the other surface of the semiconductor chip 10 which is the diced object to be cut is attached to the pickup tape 12 which does not have perforations in the base material, and the adhesive sheet 11 is peeled off.
  • the semiconductor chip 10 is transferred to the pickup tape 12.
  • the pressure-sensitive adhesive sheet is preferably peeled after the pressure-sensitive adhesive sheet is lightly peeled.
  • the pressure-sensitive adhesive sheet is formed of a photosensitive type or heat-sensitive type pressure-sensitive adhesive
  • light peeling can be performed by performing light irradiation and / or heating.
  • the light release may be performed before or after the pickup tape is attached. If an external force is applied to the pick-up tape after light release, the object to be cut may be peeled off unexpectedly. preferable.
  • the pickup is performed after the other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations, that is, after the adhesive sheet is peeled off. It is preferable to lightly peel the tape. Light release can be performed in the same manner as described above.
  • a to-be-cut body is used for a pick-up process.
  • a pick-up process is not specifically limited, The thing normally utilized in the said field
  • a substrate to be cut is pasted on a pressure-sensitive adhesive sheet 11 having perforations 11a in the base material, and water jet laser dicing is performed.
  • the pickup tape 12 is affixed.
  • the semiconductor chip 10 to which the adhesive sheet 11 and the pickup tape 12 are attached in this way is pushed up in the direction of the arrow by the needle 13 from the pickup tape 12 side.
  • the other surface of the semiconductor chip 10 that is a diced object to be cut is attached to a pickup tape 12 that does not have perforations in the base material (semiconductor chip 10).
  • the pressure-sensitive adhesive sheet 11 that has been affixed to one surface has already been peeled off), and the semiconductor chip 10 may be pushed up in the direction of the arrow by the needle 13 from the pickup tape 12 side.
  • the semiconductor chip 10 Since the semiconductor chip 10 has high rigidity at the time of pushing up, if the adhesive force of the adhesive sheet 11 is sufficiently reduced, the semiconductor chip 10 is partly peeled off by the needle 13.
  • the semiconductor chip 10 is adsorbed by the collet 14 from above the semiconductor chip 10 as shown in FIG. 2B or 1C. As the collet 14 is pulled up in the direction of the arrow, the adhesive sheet 11 is naturally peeled from the semiconductor chip 10.
  • the object to be cut can be picked up without the needle directly touching the base film having the perforations, adhesion and accumulation of the adhesive on the needle are avoided. Therefore, contamination of the semiconductor element, cleaning of the needle, etc. can be minimized. Further, since the substrate film having perforations is not directly sucked under reduced pressure, the pickup can be performed without causing a pickup failure or the like. Thereby, it becomes possible to improve the manufacturing yield of the semiconductor element.
  • Examples of the method for manufacturing a semiconductor device of the present invention will be described in detail below.
  • Examples 1 and 2 Preparation of base film for water jet laser dicing
  • a mesh film having a density of 200 ⁇ 200 fibers / inch, a void area of 32%, and a thickness of 90 ⁇ m was formed using polyethylene terephthalate fibers having a fiber diameter of 55 ⁇ m.
  • a material obtained by subjecting this mesh film to corona treatment was used as a base film.
  • Adhesive sheet for water jet laser dicing 40 parts by weight of methyl acrylate, 35 parts by weight of 2-methoxyethyl acrylate, 20 parts by weight of acryloylmorpholine, and 5 parts by weight of acrylic acid were copolymerized in a conventional manner in ethyl acetate. As a result, a solution containing an acrylic copolymer having a weight average molecular weight of 600,000 was obtained. Next, 100 parts by weight of an ultraviolet curable oligomer (viscosity at 25 ° C.
  • a film (Young's modulus 150 MPa) made of linear low-density polyethylene having a thickness of 70 ⁇ m was used as the base film. One side of this film was corona treated.
  • the pick-up tape 1 was affixed at a speed of 10 mm / s with a roller having a diameter of 75 mm, a width of 200 mm, and a weight of 2 kg on the back surface of the workpiece after dicing, that is, the base film of the pressure-sensitive adhesive sheet for water jet laser dicing.
  • Water jet laser dicing is performed by irradiating with ultraviolet light for 20 seconds at an illuminance of 30 mW / cm 2 using a high pressure mercury lamp from the back of the workpiece after dicing in a nitrogen atmosphere, that is, the base film side of the water jet laser dicing adhesive sheet.
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet was cured and lightly peeled.
  • the pickup tape 2 was attached to the surface of the semiconductor element with a roller having a diameter of 75 mm, a width of 200 mm, and a weight of 2 kg at a speed of 10 mm / s, and the pressure-sensitive adhesive sheet for water jet laser dicing was peeled off.
  • UV irradiation From the back surface of the pickup tape, UV irradiation was performed for 20 seconds at an illuminance of 30 mW / cm 2 using a high-pressure mercury lamp, and the pickup tape was used for the pickup process.
  • the pickup property can be obtained by attaching a pickup tape to the back surface of the water jet laser dicing adhesive sheet or by transferring the semiconductor element from the water jet laser dicing adhesive sheet to the pickup tape. And the adhesion of the adhesive to the back surface of the semiconductor chip can be suppressed.
  • the comparative example when the pickup tape was not attached, many scratches or chip cracks due to needles were observed on the back surface of the chip.
  • the method for manufacturing a semiconductor device of the present invention is an object that can be subjected to water jet laser dicing, that is, a semiconductor-related material (for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material). , Circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, semiconductor packages, etc.), etc., and a wide range of materials.
  • a semiconductor-related material for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention porte sur une méthode de fabrication d'éléments semi-conducteurs qui de préférence effectue l'étape de recueil après le processus de haute qualité de découpage en dés au jet d'eau laser. La méthode comporte les étapes suivantes: [A] fixation de l'objet à découper (par exemple l'un des côtés de l'objet) sur une feuille adhésive en vue du découpage en dés au jet d'eau laser, ladite feuille étant déposée sur un film de base percé de trous, puis découpage de l'objet au jet d'eau laser; [B1] fixation d'une bande de recueil faite d'une couche adhésive disposé sur un film de base sans trous traversants disposé lui-même sur le film de base percé de trous; ou [B2] transfert de l'autre côté de l'objet à découper, puis découpage de l'objet au jet d'eau laser, sur ladite bande de recueil formée par pose d'une bande adhésive sur le film de base sans trous traversants; et [C] transfert de l'objet à découper vers l'étape de recueil.
PCT/JP2008/073756 2008-01-10 2008-12-26 Méthode de fabrication d'éléments semi-conducteurs WO2009087930A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008002814A JP2009164502A (ja) 2008-01-10 2008-01-10 半導体素子の製造方法
JP2008002812A JP2009164501A (ja) 2008-01-10 2008-01-10 半導体素子の製造方法
JP2008-002814 2008-01-10
JP2008-002812 2008-01-10

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WO (1) WO2009087930A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043409B2 (en) 2018-03-05 2021-06-22 Infineon Technologies Ag Method of forming contacts to an embedded semiconductor die and related semiconductor packages

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211771B2 (ja) * 2013-02-08 2017-10-11 日東電工株式会社 粘着テープ
JP6095996B2 (ja) * 2013-02-08 2017-03-15 日東電工株式会社 粘着テープ
CN107756518A (zh) * 2017-11-07 2018-03-06 上海御渡半导体科技有限公司 一种具有装夹装置的电路板冲孔机构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163186A (ja) * 2002-10-16 2003-06-06 Furukawa Electric Co Ltd:The 半導体チップ製造方法
JP2004158859A (ja) * 2002-11-05 2004-06-03 New Wave Research 基板から素子を切り取る装置及び方法
JP2005167042A (ja) * 2003-12-04 2005-06-23 Furukawa Electric Co Ltd:The 半導体ウェハ固定用粘着テープ
JP2005228794A (ja) * 2004-02-10 2005-08-25 Tokyo Seimitsu Co Ltd チップ製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163186A (ja) * 2002-10-16 2003-06-06 Furukawa Electric Co Ltd:The 半導体チップ製造方法
JP2004158859A (ja) * 2002-11-05 2004-06-03 New Wave Research 基板から素子を切り取る装置及び方法
JP2005167042A (ja) * 2003-12-04 2005-06-23 Furukawa Electric Co Ltd:The 半導体ウェハ固定用粘着テープ
JP2005228794A (ja) * 2004-02-10 2005-08-25 Tokyo Seimitsu Co Ltd チップ製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043409B2 (en) 2018-03-05 2021-06-22 Infineon Technologies Ag Method of forming contacts to an embedded semiconductor die and related semiconductor packages

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