TW200943406A - Semiconductor element manufacturing method - Google Patents

Semiconductor element manufacturing method

Info

Publication number
TW200943406A
TW200943406A TW097151669A TW97151669A TW200943406A TW 200943406 A TW200943406 A TW 200943406A TW 097151669 A TW097151669 A TW 097151669A TW 97151669 A TW97151669 A TW 97151669A TW 200943406 A TW200943406 A TW 200943406A
Authority
TW
Taiwan
Prior art keywords
base film
bore holes
pickup
onto
cut
Prior art date
Application number
TW097151669A
Other languages
Chinese (zh)
Inventor
Akiyoshi Yamamoto
Tomokazu Takahashi
Fumiteru Asai
Toshio Shintani
Takatoshi Sasaki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008002814A external-priority patent/JP2009164502A/en
Priority claimed from JP2008002812A external-priority patent/JP2009164501A/en
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200943406A publication Critical patent/TW200943406A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)

Abstract

It is possible to provide a semiconductor element manufacturing method which can preferably perform a pickup step as a next step while performing a high-quality water jet laser dicing process. The method includes: a step [A] for bonding an object to be cut (for example, one side of the object) onto an adhesion sheet for a water jet laser dicing formed by an adhesive layer layered on a base film having bore holes and subjecting the object to a water jet laser dicing process; a step [B1] for bonding a pickup tape formed by an adhesive layer layered on a base film having no bore holes, onto the base film of the adhesion sheet having bore holes; or a step [B2] for transferring the other side of the object to be cut and subjected to the dicing process, onto the pickup tape formed by layering an adhesive layer on the base film having no bore holes; and a step [C] for feeding the object to be cut to the pickup step.
TW097151669A 2008-01-10 2008-12-31 Semiconductor element manufacturing method TW200943406A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008002814A JP2009164502A (en) 2008-01-10 2008-01-10 Semiconductor element manufacturing method
JP2008002812A JP2009164501A (en) 2008-01-10 2008-01-10 Method for manufacturing semiconductor element

Publications (1)

Publication Number Publication Date
TW200943406A true TW200943406A (en) 2009-10-16

Family

ID=40853052

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097151669A TW200943406A (en) 2008-01-10 2008-12-31 Semiconductor element manufacturing method

Country Status (2)

Country Link
TW (1) TW200943406A (en)
WO (1) WO2009087930A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI582209B (en) * 2013-02-08 2017-05-11 Nitto Denko Corp Adhesive tape
TWI595069B (en) * 2013-02-08 2017-08-11 Nitto Denko Corp Adhesive tape
CN107756518A (en) * 2017-11-07 2018-03-06 上海御渡半导体科技有限公司 A kind of circuit board punch mechanism with clamping device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043409B2 (en) 2018-03-05 2021-06-22 Infineon Technologies Ag Method of forming contacts to an embedded semiconductor die and related semiconductor packages

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128843B2 (en) * 2002-10-16 2008-07-30 古河電気工業株式会社 Semiconductor chip manufacturing method
TWI284580B (en) * 2002-11-05 2007-08-01 New Wave Res Method and apparatus for cutting devices from substrates
JP2005167042A (en) * 2003-12-04 2005-06-23 Furukawa Electric Co Ltd:The Adhesive tape for fixing semiconductor wafer
JP4505789B2 (en) * 2004-02-10 2010-07-21 株式会社東京精密 Chip manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI582209B (en) * 2013-02-08 2017-05-11 Nitto Denko Corp Adhesive tape
TWI595069B (en) * 2013-02-08 2017-08-11 Nitto Denko Corp Adhesive tape
CN107756518A (en) * 2017-11-07 2018-03-06 上海御渡半导体科技有限公司 A kind of circuit board punch mechanism with clamping device

Also Published As

Publication number Publication date
WO2009087930A1 (en) 2009-07-16

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