WO2009087930A1 - Semiconductor element manufacturing method - Google Patents

Semiconductor element manufacturing method Download PDF

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Publication number
WO2009087930A1
WO2009087930A1 PCT/JP2008/073756 JP2008073756W WO2009087930A1 WO 2009087930 A1 WO2009087930 A1 WO 2009087930A1 JP 2008073756 W JP2008073756 W JP 2008073756W WO 2009087930 A1 WO2009087930 A1 WO 2009087930A1
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WO
WIPO (PCT)
Prior art keywords
base film
adhesive sheet
pressure
pickup
cut
Prior art date
Application number
PCT/JP2008/073756
Other languages
French (fr)
Japanese (ja)
Inventor
Akiyoshi Yamamoto
Tomokazu Takahashi
Fumiteru Asai
Toshio Shintani
Takatoshi Sasaki
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008002812A external-priority patent/JP2009164501A/en
Priority claimed from JP2008002814A external-priority patent/JP2009164502A/en
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2009087930A1 publication Critical patent/WO2009087930A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a method for manufacturing a semiconductor device, and more specifically, a method for manufacturing a semiconductor device to be subjected to a pick-up process after water jet laser dicing a workpiece such as a semiconductor wafer and / or a semiconductor-related material.
  • semiconductor wafers and semiconductor-related materials have been cut using a rotary blade and separated into chips and IC components.
  • a semiconductor wafer or the like is bonded to an adhesive sheet, and the wafer or the like is cut into chips and then peeled off from the adhesive sheet in a pickup process.
  • Patent Document 2 JP 2001-316648 A.
  • the separated semiconductor elements are subjected to a pickup / die bonding process.
  • the semiconductor element is pushed up and picked up by a needle from the lower part of the fixing adhesive sheet.
  • the pick-up sheet is fixed by adsorbing the vicinity of the push-up needle from the back side of the pressure-sensitive adhesive sheet, or by following the needle to facilitate the pick-up. Due to the perforation, there is a problem that the vacuum suction on the needle side breaks through, the adhesive sheet cannot be fixed, pickup failure occurs, and production efficiency is lowered.
  • the present invention has been made in view of the above problems, and provides a method for manufacturing a semiconductor element capable of performing a pickup process, which is the next process, while performing water jet laser dicing with good dicing quality. Objective.
  • the object to be cut is attached to a water jet laser dicing pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is laminated on a perforated base film, and water jet laser dicing is performed.
  • a pickup tape in which a pressure-sensitive adhesive layer is laminated on a base film having no perforations is attached to the base film having the perforations of the pressure-sensitive adhesive sheet,
  • C Thereafter, the object to be cut is subjected to a pickup process.
  • a surface to be cut is attached to an adhesive sheet for water jet laser dicing in which an adhesive layer is laminated on a base film having perforations. Jet laser dicing, (B2) The other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations, (C) Thereafter, the object to be cut is subjected to a pickup process.
  • the pick-up process by a needle push-up type.
  • the pressure-sensitive adhesive sheet for water jet laser dicing has a mesh structure or is formed of a base film made of a nonwoven fabric.
  • the pickup tape is preferably formed of a base film having a tensile Young's modulus of 30 MPa or more and 5000 MPa or less. Moreover, it is preferable that a pick-up tape is formed with the base film of thickness 10 micrometers or more and 300 micrometers or less.
  • the object to be cut (for example, one surface of the object to be cut) is an adhesive sheet for water jet laser dicing (hereinafter, simply referred to as “adhesive sheet”). Paste to dice.
  • the material to be cut in the present invention may be any material as long as it can finally become a semiconductor element.
  • semiconductor wafers and semiconductor-related materials include, for example, BGA packages, printed circuits, ceramic plates, glass components for liquid crystal devices, sheet materials, circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, or semiconductor packages. Etc.
  • the pressure-sensitive adhesive sheet of the present invention is suitably used for water jet laser dicing, and mainly comprises a substrate film and a pressure-sensitive adhesive layer disposed thereon.
  • water jet laser dicing is dicing using a laser beam guided by a liquid flow (usually a water flow), and the water jet laser dicing adhesive sheet is used for the above-mentioned dicing and at the time of dicing.
  • This liquid flow for example, when a liquid flow of a predetermined pressure or higher is applied directly or indirectly to the base film from the pressure-sensitive adhesive layer side, can be released from one surface side of the pressure-sensitive adhesive sheet to the other surface side.
  • the predetermined pressure at this time can usually be about several MPa or more.
  • the base film has perforations.
  • This perforation is preferably a hole penetrating in the thickness direction, but may be a hole that is connected in the thickness direction as a result of a plurality of holes being connected.
  • the holes in the base film are preferably openings when the base film has a mesh structure, or are made of unemployed cloth.
  • the size of the perforations is not particularly limited as long as it allows water to pass through, and can be appropriately adjusted depending on the pressure, flow rate, and the like of the liquid flow of the dicing apparatus to be used.
  • the material of the base film is not particularly limited, and examples thereof include synthetic resins usually used in the field, for example, polyolefins such as polyethylene and polypropylene, and polymers such as polyester.
  • the base film preferably has a tensile Young's modulus of about 30 to 5000 MPa.
  • the base film may have a single layer or a multilayer structure of two or more layers.
  • the pressure-sensitive adhesive layer is constituted by a pressure-sensitive adhesive layer applied to one surface of the base film.
  • This pressure-sensitive adhesive may be any of a pressure-sensitive type, a heat-sensitive type, and a photosensitive type, but is preferably a type of pressure-sensitive adhesive that is cured by irradiation with energy rays. Thereby, the peelability from the workpiece can be easily performed.
  • energy rays for example, those having various wavelengths such as ultraviolet rays, visible rays, infrared rays and the like can be used.
  • the laser beam used for dicing is an energy ray having an oscillation wavelength of 400 nm or less, for example, an oscillation wavelength of 248 nm.
  • KrF excimer laser 308 nm XeCI excimer laser, YAG laser third harmonic (355 nm), fourth harmonic (266 nm), or energy rays with an oscillation wavelength of 400 nm or more, for example, ultraviolet region via multiphoton absorption process
  • any of known pressure-sensitive adhesives including a rubber polymer, a (meth) acrylic polymer, and the like can be used.
  • the rubber polymer may be any of natural rubber (eg, polyisoprene) and synthetic rubber (eg, styrene-butadiene rubber, polybutadiene, butadiene-acrylonitrile, chloroprene rubber).
  • Examples of the monomer component constituting the (meth) acrylic polymer include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, an amyl group, an isoamyl group, and a hexyl group.
  • Examples of other monomer components include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid and other carboxyl group-containing monomers, maleic anhydride Acid anhydride monomers such as acid and itaconic anhydride, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy (meth) acrylate Hydroxyl group-containing compounds such as hexyl, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate , Sulfones such as styrene sulfonic acid, allyl sulf
  • polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol di (Meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, Examples include epoxy (meth) acrylate, polyester (meth) acrylate, and ure
  • a monomer and / or oligomer having an energy ray-curable functional group such as a carbon-carbon double bond may be used.
  • the monomer / oligomer include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, Examples thereof include dipentaerythritol hexa (meth) acrylate and 1,4-butylene glycol di (meth) acrylate. These may be used alone or in combination of two or more.
  • the blending amount of these is not particularly limited, but in consideration of tackiness, it is about 5 to 500 parts by weight with respect to 100 parts by weight of the base polymer such as (meth) acrylic polymer constituting the adhesive. It is preferably about 70 to 150 parts by weight.
  • a photoinitiator when comprising a photosensitive adhesive, it is preferable to use a photoinitiator.
  • the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, ⁇ -hydroxy- ⁇ , ⁇ -methylacetophenone, methoxyacetophenone, 2,2-dimethoxy-2- Acetophenone compounds such as phenylacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1, benzoin ethyl ether, benzoin Benzoin ether compounds such as isopropyl ether and anisoin methyl ether, ⁇ -ketol compounds such as 2-methyl-2-hydroxypropylphenone, ketal compounds such as benzyldimethyl ketal, 2-naphthalenesulfon
  • the blending amount of the photopolymerization initiator is preferably about 0.1 to 10 parts by weight, more preferably about 0.5 to 5 parts by weight with respect to 100 parts by weight of the base polymer constituting the pressure-sensitive adhesive. .
  • a crosslinking agent may optionally be added.
  • the crosslinking agent include polyisocyanate compounds, epoxy compounds, aziridine compounds, melamine resins, urea resins, anhydrous compounds, polyamines, and carboxyl group-containing polymers. These may be used alone or in combination of two or more.
  • the amount used thereof is generally about 0.01 to 5 parts by weight with respect to 100 parts by weight of the base polymer in consideration that the peeling adhesive strength does not decrease too much. preferable.
  • additives such as conventionally known tackifiers, anti-aging agents, fillers, anti-aging agents, and coloring agents can be optionally added.
  • a known method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method is applied to one or more monomers or a mixture thereof. Can be done.
  • the solution polymerization method is preferable.
  • the solvent used here include polar solvents such as ethyl acetate and toluene.
  • the solution concentration is usually about 20 to 80% by weight.
  • a polymerization initiator may be used.
  • the polymerization initiator include peroxides such as hydrogen peroxide, benzoyl peroxide, and t-butyl peroxide. Although it is desirable to use it alone, it may be used as a redox polymerization initiator in combination with a reducing agent.
  • the reducing agent include ionized salts such as sulfite, bisulfite, iron, copper, and cobalt salts, amines such as triethanolamine, and reducing sugars such as aldose and ketose.
  • An azo compound such as a salt, 2,2′-azobisisobutyronitrile, 2,2′-azobis-2-methyl-N- (2-hydroxyethyl) propionamide may be used. These may be used alone or in combination of two or more.
  • the reaction temperature is usually about 50 to 85 ° C., and the reaction time is about 1 to 8 hours.
  • the (meth) acrylic polymer preferably has a low content of a low molecular weight substance from the viewpoint of preventing contamination of the object to be cut, and the weight average molecular weight of the (meth) acrylic polymer is 300,000 or more, Further, about 80 to 3 million is preferable.
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably set to such a thickness that the liquid flow can pass through the dicing tape during dicing.
  • the pressure-sensitive adhesive sheet used in the present invention can be formed by a method for producing a tape known in the art. For example, first, a base film is prepared. Subsequently, an adhesive is laminated
  • the substrate film may be coated directly, or a transfer coating method in which an adhesive is coated on a process material coated with a release agent, dried, and then laminated on the substrate film is used.
  • the pressure-sensitive adhesive may be roll-laminated on the base film. These coatings can utilize various methods such as reverse roll coating, gravure coating, curtain spray coating, die coating, extrusion and other industrially applied coating methods.
  • the prepared base film may have perforations in the state of the base film, or may be formed after coating the base film with an adhesive.
  • Affixing of the object to be cut to the pressure-sensitive adhesive sheet is performed by affixing the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet to a material to be cut such as a semiconductor wafer (for example, one surface of a non-cut object), and is usually performed in this field. It can be performed according to conditions, methods, and the like.
  • the dicing may be performed using any apparatus as long as it can be performed using a laser beam guided by a liquid flow. For example, an apparatus using a technique described in WO95 / 32834 can be used.
  • a pickup tape is attached to the above-mentioned pressure-sensitive adhesive sheet.
  • the attachment to the pickup tape here is performed by attaching the adhesive layer of the pickup tape to the base film of the adhesive sheet described above.
  • the base film of the pressure-sensitive adhesive sheet is stuck so as to close the perforations with the pickup tape.
  • the method of attaching is not particularly limited, but a method of allowing the base film of the pressure-sensitive adhesive sheet to stand on the table and allowing the pickup tape to be attached to the base film with a roller is simple.
  • a pickup tape is attached to the other surface of the diced workpiece to be transferred.
  • the attachment to the pickup tape here is performed by attaching an adhesive layer of the pickup tape to the surface opposite to the surface to which the adhesive sheet of the diced object to be cut is attached. That is, the object to be cut is pasted so as to be sandwiched between the adhesive sheet and the pickup tape.
  • the method of pasting is not particularly limited, but is allowed to stand on the table with the surface opposite to the surface on which the adhesive sheet of the diced object to be cut is pasted, and the pickup tape is pasted with a roller.
  • the attaching method is simple. Conditions such as pressure, roller rotation speed, and temperature can be adjusted to such an extent that the object to be cut does not break and the pickup tape adheres to the pressure-sensitive adhesive sheet.
  • the pickup tape mainly includes a base film and an adhesive layer disposed thereon.
  • a conventionally well-known film which does not have perforation can be used for a base film.
  • a base film having a tensile Young's modulus of about 30 to 5000 MPa is preferable.
  • the thickness is not particularly limited, for example, in order to propagate the needle push-up stress and facilitate pickup, the thickness is 10 to 300 ⁇ m, preferably 30 to 200 ⁇ m.
  • the base film may have a single layer or a multilayer structure of two or more layers.
  • the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be any of pressure-sensitive type, heat-sensitive type, and photosensitive type. Examples of the material for forming the pressure-sensitive adhesive layer, the method for forming the pressure-sensitive adhesive layer, and the like are the same as those for the pressure-sensitive adhesive sheet described above.
  • the thickness of an adhesive layer can be suitably adjusted in the range which does not peel from the base film of an adhesive sheet. In order to block the perforation of the base film of the pressure-sensitive adhesive sheet, the thickness is about 30 to 500 ⁇ m, more preferably about 30 to 200 ⁇ m.
  • the elastic modulus of the pressure-sensitive adhesive layer can be adjusted as appropriate, but is preferably about 0.1 to 2 MPa in order to block perforation of the base film of the pressure-sensitive adhesive sheet.
  • transfer means to transfer the form of the object to be cut after the one surface of the object to be cut is attached to the adhesive sheet and diced to the pickup tape as usual. This means that the surface is affixed to the pickup tape, and then the adhesive sheet is peeled off.
  • the adhesive sheet 11 which has the perforation 11a in a base material is affixed on a to-be-cut body, and an adhesive sheet water jet laser dicing is performed.
  • the other surface of the semiconductor chip 10 which is the diced object to be cut is attached to the pickup tape 12 which does not have perforations in the base material, and the adhesive sheet 11 is peeled off.
  • the semiconductor chip 10 is transferred to the pickup tape 12.
  • the pressure-sensitive adhesive sheet is preferably peeled after the pressure-sensitive adhesive sheet is lightly peeled.
  • the pressure-sensitive adhesive sheet is formed of a photosensitive type or heat-sensitive type pressure-sensitive adhesive
  • light peeling can be performed by performing light irradiation and / or heating.
  • the light release may be performed before or after the pickup tape is attached. If an external force is applied to the pick-up tape after light release, the object to be cut may be peeled off unexpectedly. preferable.
  • the pickup is performed after the other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations, that is, after the adhesive sheet is peeled off. It is preferable to lightly peel the tape. Light release can be performed in the same manner as described above.
  • a to-be-cut body is used for a pick-up process.
  • a pick-up process is not specifically limited, The thing normally utilized in the said field
  • a substrate to be cut is pasted on a pressure-sensitive adhesive sheet 11 having perforations 11a in the base material, and water jet laser dicing is performed.
  • the pickup tape 12 is affixed.
  • the semiconductor chip 10 to which the adhesive sheet 11 and the pickup tape 12 are attached in this way is pushed up in the direction of the arrow by the needle 13 from the pickup tape 12 side.
  • the other surface of the semiconductor chip 10 that is a diced object to be cut is attached to a pickup tape 12 that does not have perforations in the base material (semiconductor chip 10).
  • the pressure-sensitive adhesive sheet 11 that has been affixed to one surface has already been peeled off), and the semiconductor chip 10 may be pushed up in the direction of the arrow by the needle 13 from the pickup tape 12 side.
  • the semiconductor chip 10 Since the semiconductor chip 10 has high rigidity at the time of pushing up, if the adhesive force of the adhesive sheet 11 is sufficiently reduced, the semiconductor chip 10 is partly peeled off by the needle 13.
  • the semiconductor chip 10 is adsorbed by the collet 14 from above the semiconductor chip 10 as shown in FIG. 2B or 1C. As the collet 14 is pulled up in the direction of the arrow, the adhesive sheet 11 is naturally peeled from the semiconductor chip 10.
  • the object to be cut can be picked up without the needle directly touching the base film having the perforations, adhesion and accumulation of the adhesive on the needle are avoided. Therefore, contamination of the semiconductor element, cleaning of the needle, etc. can be minimized. Further, since the substrate film having perforations is not directly sucked under reduced pressure, the pickup can be performed without causing a pickup failure or the like. Thereby, it becomes possible to improve the manufacturing yield of the semiconductor element.
  • Examples of the method for manufacturing a semiconductor device of the present invention will be described in detail below.
  • Examples 1 and 2 Preparation of base film for water jet laser dicing
  • a mesh film having a density of 200 ⁇ 200 fibers / inch, a void area of 32%, and a thickness of 90 ⁇ m was formed using polyethylene terephthalate fibers having a fiber diameter of 55 ⁇ m.
  • a material obtained by subjecting this mesh film to corona treatment was used as a base film.
  • Adhesive sheet for water jet laser dicing 40 parts by weight of methyl acrylate, 35 parts by weight of 2-methoxyethyl acrylate, 20 parts by weight of acryloylmorpholine, and 5 parts by weight of acrylic acid were copolymerized in a conventional manner in ethyl acetate. As a result, a solution containing an acrylic copolymer having a weight average molecular weight of 600,000 was obtained. Next, 100 parts by weight of an ultraviolet curable oligomer (viscosity at 25 ° C.
  • a film (Young's modulus 150 MPa) made of linear low-density polyethylene having a thickness of 70 ⁇ m was used as the base film. One side of this film was corona treated.
  • the pick-up tape 1 was affixed at a speed of 10 mm / s with a roller having a diameter of 75 mm, a width of 200 mm, and a weight of 2 kg on the back surface of the workpiece after dicing, that is, the base film of the pressure-sensitive adhesive sheet for water jet laser dicing.
  • Water jet laser dicing is performed by irradiating with ultraviolet light for 20 seconds at an illuminance of 30 mW / cm 2 using a high pressure mercury lamp from the back of the workpiece after dicing in a nitrogen atmosphere, that is, the base film side of the water jet laser dicing adhesive sheet.
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet was cured and lightly peeled.
  • the pickup tape 2 was attached to the surface of the semiconductor element with a roller having a diameter of 75 mm, a width of 200 mm, and a weight of 2 kg at a speed of 10 mm / s, and the pressure-sensitive adhesive sheet for water jet laser dicing was peeled off.
  • UV irradiation From the back surface of the pickup tape, UV irradiation was performed for 20 seconds at an illuminance of 30 mW / cm 2 using a high-pressure mercury lamp, and the pickup tape was used for the pickup process.
  • the pickup property can be obtained by attaching a pickup tape to the back surface of the water jet laser dicing adhesive sheet or by transferring the semiconductor element from the water jet laser dicing adhesive sheet to the pickup tape. And the adhesion of the adhesive to the back surface of the semiconductor chip can be suppressed.
  • the comparative example when the pickup tape was not attached, many scratches or chip cracks due to needles were observed on the back surface of the chip.
  • the method for manufacturing a semiconductor device of the present invention is an object that can be subjected to water jet laser dicing, that is, a semiconductor-related material (for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material). , Circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, semiconductor packages, etc.), etc., and a wide range of materials.
  • a semiconductor-related material for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)

Abstract

It is possible to provide a semiconductor element manufacturing method which can preferably perform a pickup step as a next step while performing a high-quality water jet laser dicing process. The method includes: a step [A] for bonding an object to be cut (for example, one side of the object) onto an adhesion sheet for a water jet laser dicing formed by an adhesive layer layered on a base film having bore holes and subjecting the object to a water jet laser dicing process; a step [B1] for bonding a pickup tape formed by an adhesive layer layered on a base film having no bore holes, onto the base film of the adhesion sheet having bore holes; or a step [B2] for transferring the other side of the object to be cut and subjected to the dicing process, onto the pickup tape formed by layering an adhesive layer on the base film having no bore holes; and a step [C] for feeding the object to be cut to the pickup step.

Description

半導体素子の製造方法Manufacturing method of semiconductor device
　本発明は、半導体素子の製造方法に関し、より詳細には、半導体ウェハおよび／または半導体関連材料等の被切断体をウォータージェットレーザーダイシングした後にピックアップ工程に供する半導体素子の製造方法。 The present invention relates to a method for manufacturing a semiconductor device, and more specifically, a method for manufacturing a semiconductor device to be subjected to a pick-up process after water jet laser dicing a workpiece such as a semiconductor wafer and / or a semiconductor-related material.
　従来から、半導体ウェハおよび半導体関連材料等は、回転ブレードを使って切断され、チップおよびＩＣ部品に分離されていた。このダイシング工程では、通常、半導体ウェハ等を固定するために粘着シートに接着され、ウェハ等がチップ状に切断された後、粘着シートからピックアップ工程で剥離される。 Conventionally, semiconductor wafers and semiconductor-related materials have been cut using a rotary blade and separated into chips and IC components. In this dicing process, usually, a semiconductor wafer or the like is bonded to an adhesive sheet, and the wafer or the like is cut into chips and then peeled off from the adhesive sheet in a pickup process.
　しかし、従来の方法では、回転ブレードによる物理的な応力によって、ダイフライが起こることがあり、また、クラッキング、チッピング等の欠陥が生じ、それらチップ等の品質が低下し、この切断方法の生産性をも低下させるという問題が生じていた。特に、近年における電子装置の小型化、薄膜化の需要により、これらは、より深刻な問題となっている。 However, in the conventional method, die fly may occur due to physical stress by the rotating blade, and defects such as cracking and chipping occur, and the quality of these chips and the like deteriorates, and the productivity of this cutting method is reduced. There was a problem of lowering. In particular, due to the recent demand for downsizing and thinning of electronic devices, these are more serious problems.
　そこで、回転ブレートを用いた半導体ウェハ等の切断技術に代わるものとして、レーザービームを使ったダイシング方法、特に、液体ジェットによって案内されるレーザービームを使用して、切断、穿孔、溶接、刻印および剥離等による材料の加工方法が提案されている（例えば、特許文献１：ＷＯ９５／３２８３４号）。
　この方法では、ウェハ等は、上からの水流にさらされるのみであるため、回転ブレードでもたらされるような物理的な応力によるダイフライ等を防止することができる。 Therefore, as an alternative to cutting technology for semiconductor wafers using a rotating blade, a dicing method using a laser beam, particularly using a laser beam guided by a liquid jet, cutting, drilling, welding, marking and peeling. Have been proposed (for example, Patent Document 1: WO95 / 32834).
In this method, since the wafer or the like is only exposed to the water flow from above, die fly or the like due to physical stress caused by the rotating blade can be prevented.
　また、このレーザー技術を用いた切断方法では、水流を利用することに起因して、チップ等がそれらを固定する粘着シートから剥離し易いという課題があるが、それに対して、ウォータージェットレーザーダイシングに好適に使用できる水透過性の接着シートが提案されている（例えば、特許文献２：特開２００１－３１６６４８号公報）。 Moreover, in the cutting method using this laser technology, there is a problem that chips and the like are easily peeled off from the adhesive sheet for fixing them due to the use of water flow. A water-permeable adhesive sheet that can be suitably used has been proposed (for example, Patent Document 2: JP 2001-316648 A).
　通常、個片化された半導体素子は、ピックアップ／ダイボンド工程に供される。この工程では、一般に、半導体素子は、固定用粘着シートの下部から、ニードルで突き上げられ、ピックアップされる。 Usually, the separated semiconductor elements are subjected to a pickup / die bonding process. In this process, generally, the semiconductor element is pushed up and picked up by a needle from the lower part of the fixing adhesive sheet.
　しかし、上述したようにレーザービームを用いる場合には、水透過性の特殊な粘着シートを用いて切断を行う。この粘着シートの基材フィルムは、穿孔が設けられており、これによって液体の透過性を確保している。従って、ピックアップ工程において、突き上げられたニードルが、基材フィルムの穿孔から、直接粘着剤に衝突し、粘着剤を半導体素子に強固に付着させ、ピックアップ後に残渣を残すことがある。これにより、半導体素子が汚染され、粘着剤残渣が起因となる半導体素子の破壊などが生じ、信頼性が低下し、半導体素子製造の歩留まりを著しく低下させる。また、ピックアップ回数を追うごとに、ニードルに粘着剤の残渣が蓄積され、ニードルの清掃など、生産効率を低下させる要因となる。 However, when using a laser beam as described above, cutting is performed using a water-permeable special adhesive sheet. The base film of this pressure-sensitive adhesive sheet is provided with perforations, thereby ensuring liquid permeability. Therefore, in the pick-up process, the pushed-up needle may directly collide with the adhesive from the perforation of the base film, causing the adhesive to adhere firmly to the semiconductor element and leave a residue after the pick-up. As a result, the semiconductor element is contaminated, the semiconductor element is destroyed due to the adhesive residue, the reliability is lowered, and the yield of the semiconductor element manufacturing is significantly reduced. Further, as the number of pick-ups is followed, adhesive residue is accumulated on the needle, which causes a reduction in production efficiency such as cleaning of the needle.
　さらに、ピックアップ時には、突き上げニードル近傍を粘着シートの背面より減圧吸着させることにより、粘着シートを固定するか、ニードルに追従させることで、ピックアップを容易にしているが、基材フィルムに設けられている穿孔により、ニードル側の減圧吸着が破過し、粘着シートを固定できず、ピックアップ不良発生し、生産効率を低下させるという課題もある。 Furthermore, at the time of pick-up, the pick-up sheet is fixed by adsorbing the vicinity of the push-up needle from the back side of the pressure-sensitive adhesive sheet, or by following the needle to facilitate the pick-up. Due to the perforation, there is a problem that the vacuum suction on the needle side breaks through, the adhesive sheet cannot be fixed, pickup failure occurs, and production efficiency is lowered.
発明の概要Summary of the Invention
　本発明は上記課題に鑑みなされたものであり、良好なダイシング品位を備えるウォータージェットレーザーダイシングを行いながら、次工程であるピックアップ工程を良好に行うことができる半導体素子の製造方法を提供することを目的とする。 The present invention has been made in view of the above problems, and provides a method for manufacturing a semiconductor element capable of performing a pickup process, which is the next process, while performing water jet laser dicing with good dicing quality. Objective.
　本発明の半導体素子の製造方法は、（Ａ１）被切断体を、穿孔を有する基材フィルム上に粘着剤層が積層されてなるウォータージェットレーザーダイシング用粘着シートに貼り付けてウォータージェットレーザーダイシングし、
　（Ｂ１）前記粘着シートの穿孔を有する基材フィルムに、穿孔を有しない基材フィルム上に粘着剤層が積層されてなるピックアップテープを貼り付け、
　（Ｃ）その後、前記被切断体をピックアップ工程に供することを特徴とする。 In the method for producing a semiconductor element of the present invention, (A1) the object to be cut is attached to a water jet laser dicing pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is laminated on a perforated base film, and water jet laser dicing is performed. ,
(B1) A pickup tape in which a pressure-sensitive adhesive layer is laminated on a base film having no perforations is attached to the base film having the perforations of the pressure-sensitive adhesive sheet,
(C) Thereafter, the object to be cut is subjected to a pickup process.
　また、本発明の半導体素子の製造方法は、（Ａ２）被切断体の一面を、穿孔を有する基材フィルム上に粘着剤層が積層されてなるウォータージェットレーザーダイシング用粘着シートに貼り付けてウォータージェットレーザーダイシングし、
　（Ｂ２）ダイシングされた被切断体の他面を、穿孔を有しない基材フィルム上に粘着剤層が積層されてなるピックアップテープに貼り付けて転写し、
　（Ｃ）その後、前記被切断体をピックアップ工程に供することを特徴とする。
　これらの方法では、ピックアップ工程を、ニードル突上げ式で行うことが好ましい。
　また、ウォータージェットレーザーダイシング用粘着シートが、メッシュ構造を有するか、不織布からなる基材フィルムによって形成されることが好ましい。
　さらに、ピックアップテープが、引張ヤング率３０ＭＰａ以上、５０００ＭＰａ以下の基材フィルムによって形成されていることが好ましい。
　また、ピックアップテープが、厚さ１０μｍ以上、３００μｍ以下の基材フィルムによって形成されてなることが好ましい。 In the method for producing a semiconductor element of the present invention, (A2) a surface to be cut is attached to an adhesive sheet for water jet laser dicing in which an adhesive layer is laminated on a base film having perforations. Jet laser dicing,
(B2) The other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations,
(C) Thereafter, the object to be cut is subjected to a pickup process.
In these methods, it is preferable to perform the pick-up process by a needle push-up type.
Moreover, it is preferable that the pressure-sensitive adhesive sheet for water jet laser dicing has a mesh structure or is formed of a base film made of a nonwoven fabric.
Furthermore, the pickup tape is preferably formed of a base film having a tensile Young's modulus of 30 MPa or more and 5000 MPa or less.
Moreover, it is preferable that a pick-up tape is formed with the base film of thickness 10 micrometers or more and 300 micrometers or less.
本発明の半導体素子の製造方法を示す概略平面図である。It is a schematic plan view which shows the manufacturing method of the semiconductor element of this invention. 本発明の別の半導体素子の製造方法を示す概略平面図である。It is a schematic plan view which shows the manufacturing method of another semiconductor element of this invention.
発明を実施するための形態BEST MODE FOR CARRYING OUT THE INVENTION
　本発明の半導体素子の製造方法では、まず、（Ａ）被切断体（例えば、被切断体の一面）を、ウォータージェットレーザーダイシング用粘着シート（以下、単に「粘着シート」と記すことがある）に貼り付けてダイシングする。 In the method for producing a semiconductor device of the present invention, first, (A) the object to be cut (for example, one surface of the object to be cut) is an adhesive sheet for water jet laser dicing (hereinafter, simply referred to as “adhesive sheet”). Paste to dice.
　本発明における被切断体とは、最終的に半導体素子になり得るものであればどのようなものであってもよい。通常、半導体ウェハ、半導体関連材料を指す。後者は、例えば、ＢＧＡパッケージ、プリント回路、セラミック板、液晶装置用のガラス部品、シート材料、回路基板、ガラス基板、セラミック基板、金属基板、半導体レーザーの発光／受光素子基板、ＭＥＭＳ基板又は半導体パッケージ等を含む。 The material to be cut in the present invention may be any material as long as it can finally become a semiconductor element. Usually refers to semiconductor wafers and semiconductor-related materials. The latter includes, for example, BGA packages, printed circuits, ceramic plates, glass components for liquid crystal devices, sheet materials, circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, or semiconductor packages. Etc.
　本発明の粘着シートは、ウォータージェットレーザーダイシングに好適に用いられるものであり、主として、基材フィルムと、その上に配置される粘着剤層とからなる。
　ここで、ウォータージェットレーザーダイシングとは、液体流（通常、水流）によって案内されるレーザービームを使用したダイシングであり、ウォータージェットレーザーダイシング用粘着シートとは、上述したダイシングに用いられ、かつダイシング時におけるこの液体流、例えば、所定圧力以上の液体流を、粘着剤層側から基材フィルムに直接又は間接に付与した場合の液体を、粘着シートの一表面側から他表面側に逃がすことが可能な粘着シートを指す。この際の所定圧力は、通常、数ＭＰａ程度以上とすることができる。 The pressure-sensitive adhesive sheet of the present invention is suitably used for water jet laser dicing, and mainly comprises a substrate film and a pressure-sensitive adhesive layer disposed thereon.
Here, water jet laser dicing is dicing using a laser beam guided by a liquid flow (usually a water flow), and the water jet laser dicing adhesive sheet is used for the above-mentioned dicing and at the time of dicing. This liquid flow, for example, when a liquid flow of a predetermined pressure or higher is applied directly or indirectly to the base film from the pressure-sensitive adhesive layer side, can be released from one surface side of the pressure-sensitive adhesive sheet to the other surface side. Refers to an adhesive sheet. The predetermined pressure at this time can usually be about several MPa or more.
　基材フィルムは、穿孔を有している。この穿孔は、厚み方向に貫かれた孔であることが好ましいが、複数の孔が連なることにより結果的に厚み方向に繋がる孔であってもよい。特に、基材フィルムの孔は、基材フィルムがメッシュ構造で構成されている場合の開口であるか、不職布によるものが好ましい。
　穿孔の大きさは、水が通過し得る大きさであれば特に限定されるものではなく、用いるダイシング装置の液体流の圧力、流速等によって適宜調整することができる。
　また、基材フィルムの材料は特に限定されるものではなく、当該分野で通常用いられる合成樹脂、例えば、ポリエチレンおよびポリプロピレンなどのポリオレフィン、ポリエステル等のポリマーが挙げられる。特に、基材フィルムの引張りヤング率が３０～５０００ＭＰａ程度のものが好ましい。これにより、ピックアップ工程において、粘着シート及び後述するピックアップテープを伸ばすことができ、接着シートから被切断体を容易にピックアップすることが可能になる。基材フィルムは、単一層又は２層以上の多層構造としてもよい。 The base film has perforations. This perforation is preferably a hole penetrating in the thickness direction, but may be a hole that is connected in the thickness direction as a result of a plurality of holes being connected. In particular, the holes in the base film are preferably openings when the base film has a mesh structure, or are made of unemployed cloth.
The size of the perforations is not particularly limited as long as it allows water to pass through, and can be appropriately adjusted depending on the pressure, flow rate, and the like of the liquid flow of the dicing apparatus to be used.
The material of the base film is not particularly limited, and examples thereof include synthetic resins usually used in the field, for example, polyolefins such as polyethylene and polypropylene, and polymers such as polyester. In particular, the base film preferably has a tensile Young's modulus of about 30 to 5000 MPa. Thereby, in a pick-up process, an adhesive sheet and the pick-up tape mentioned later can be extended, and it becomes possible to pick up a to-be-cut body easily from an adhesive sheet. The base film may have a single layer or a multilayer structure of two or more layers.
　粘着剤層は、基材フィルムの一面に塗布された粘着剤層によって構成されている。この粘着剤は、感圧型、感熱型、感光型のいずれの型でもよいが、エネルギー線の照射によって硬化するタイプの粘着剤であることが適している。これにより、被加工物からの剥離性を容易に行うことができる。
　エネルギー線としては、例えば、紫外線、可視光線、赤外線等、種々の波長のものを利用することができるが、ダイシングに用いるレーザービームが、４００ｎｍ以下の発振波長のエネルギー線、例えば、発振波長２４８ｎｍのＫｒＦエキシマレーザー、３０８ｎｍのＸｅＣＩエキシマレーザー、ＹＡＧレーザーの第三高調波（３５５ｎｍ）、第四高調波（２６６ｎｍ）、あるいは４００ｎｍ以上の発振波長のエネルギー線、例えば、多光子吸収過程を経由した紫外線領域の光吸収が可能で、かつ多光子吸収アブレーションにより２０μｍ以下の幅の切断加工などが可能である波長７５０～８００ｎｍ付近のチタンサファイヤレーザー等でパルス幅が１×１０－９秒（０．００００００００１秒）以下のレーザーなどであることから、用いるダイシング装置のレーザービームの照射によって硬化しない粘着剤を用いることが好ましい。 The pressure-sensitive adhesive layer is constituted by a pressure-sensitive adhesive layer applied to one surface of the base film. This pressure-sensitive adhesive may be any of a pressure-sensitive type, a heat-sensitive type, and a photosensitive type, but is preferably a type of pressure-sensitive adhesive that is cured by irradiation with energy rays. Thereby, the peelability from the workpiece can be easily performed.
As energy rays, for example, those having various wavelengths such as ultraviolet rays, visible rays, infrared rays and the like can be used. However, the laser beam used for dicing is an energy ray having an oscillation wavelength of 400 nm or less, for example, an oscillation wavelength of 248 nm. KrF excimer laser, 308 nm XeCI excimer laser, YAG laser third harmonic (355 nm), fourth harmonic (266 nm), or energy rays with an oscillation wavelength of 400 nm or more, for example, ultraviolet region via multiphoton absorption process And a pulse width of 1 × 10 −9 seconds (0.000000001 seconds) using a titanium sapphire laser having a wavelength of about 750 to 800 nm, which can be cut by a width of 20 μm or less by multiphoton absorption ablation. ) Use because it is the following laser etc. It is preferable to use a pressure sensitive adhesive not cured by the irradiation of laser beam Ishingu device.
　粘着剤層の形成材料としては、ゴム系ポリマー、（メタ）アクリル系ポリマー等を含む公知の粘着剤のいずれをも用いることができる。
　ゴム系ポリマーとしては、例えば、天然ゴム（例えば、ポリイソプレン等）、合成ゴム（例えば、スチレン－ブタジエンゴム、ポリブタジエン系、ブタジエン-アクリロニトリル系、クロロプレン系ゴム等）のいずれであってもよい。 As a material for forming the pressure-sensitive adhesive layer, any of known pressure-sensitive adhesives including a rubber polymer, a (meth) acrylic polymer, and the like can be used.
The rubber polymer may be any of natural rubber (eg, polyisoprene) and synthetic rubber (eg, styrene-butadiene rubber, polybutadiene, butadiene-acrylonitrile, chloroprene rubber).
　（メタ）アクリル系ポリマーを構成するモノマー成分としては、例えば、メチル基、エチル基、ｎ－プルピル基、イソプルピル基、ｎ－ブチル基、ｔ－ブチル基、イソブチル基、アミル基、イソアミル基、ヘキシル基、ヘプチル基、シクロヘキシル基、２－エチルヘキシル基、オクチル基、イソオクチル基、ノニル基、イソノニル基、デシル基、イソデシル基、ウンデシル基、ラウリル基、トリデシル基、テトラデシル基、ステアリル基、オクタデシル基及びドデシル基などの炭素数３０以下、好ましくは炭素数４～１８の直鎖又は分岐のアルキル基を有するアルキルアクリレート又はアルキルメタクリレートが挙げられる。これらアルキル（メタ）アクリレートは単独で用いてもよく、２種以上を併用してもよい。 Examples of the monomer component constituting the (meth) acrylic polymer include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a t-butyl group, an isobutyl group, an amyl group, an isoamyl group, and a hexyl group. Group, heptyl group, cyclohexyl group, 2-ethylhexyl group, octyl group, isooctyl group, nonyl group, isononyl group, decyl group, isodecyl group, undecyl group, lauryl group, tridecyl group, tetradecyl group, stearyl group, octadecyl group and dodecyl group Examples thereof include alkyl acrylate or alkyl methacrylate having a linear or branched alkyl group having 30 or less carbon atoms, preferably 4 to 18 carbon atoms. These alkyl (meth) acrylates may be used alone or in combination of two or more.
　上記以外のモノマー成分としては、例えば、アクリル酸、メタクリル酸、カルボキシエチル（メタ）アクリレート、カルボキシペンチル（メタ）アクリレート、イタコン酸、マレイン酸、フマール酸及びクロトン酸などのカルボキシル基含有モノマー、無水マレイン酸や無水イタコン酸などの酸無水物モノマー、（メタ）アクリル酸２－ヒドロキシエチル、（メタ）アクリル酸２－ヒドロキシプロピル、（メタ）アクリル酸４－ヒドロキシブチル、（メタ）アクリル酸６－ヒドロキシヘキシル、（メタ）アクリル酸８－ヒドロキシオクチル、（メタ）アクリル酸１０－ヒドロキシデシル、（メタ）アクリル酸１２－ヒドロキシラウリル及び（４－ヒドロキシメチルシクロヘキシル）メチル（メタ）アクリレートなどのヒドロキシル基含有モノマー、スチレンスルホン酸、アリルスルホン酸、２－（メタ）アクリルアミド－２－メチルプロパンスルホン酸、（メタ）アクリルアミドプロパンスルホン酸、スルホプロピル（メタ）アクリレート及び（メタ）アクリロイルオキシナフタレンスルホン酸などのスルホン酸基含有モノマー、２－ヒドロキシエチルアクリロイルホスフェートなどのリン酸基含有モノマー、（メタ）アクリルアミド、（メタ）アクリル酸Ｎ－ヒドロキシメチルアミド、（メタ）アクリル酸アルキルアミノアルキルエステル（例えば、ジメチルアミノエチルメタクリレート、ｔ－ブチルアミノエチルメタクリレート等）、Ｎ－ビニルピロリドン、アクリロイルモルフオリン、酢酸ビニル、スチレン、アクリロニトリル等が挙げられる。これらモノマー成分は単独で用いてもよく、２種以上を併用してもよい。 Examples of other monomer components include acrylic acid, methacrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid and other carboxyl group-containing monomers, maleic anhydride Acid anhydride monomers such as acid and itaconic anhydride, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxy (meth) acrylate Hydroxyl group-containing compounds such as hexyl, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate and (4-hydroxymethylcyclohexyl) methyl (meth) acrylate , Sulfones such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate and (meth) acryloyloxynaphthalene sulfonic acid Acid group-containing monomers, phosphate group-containing monomers such as 2-hydroxyethylacryloyl phosphate, (meth) acrylamide, (meth) acrylic acid N-hydroxymethylamide, (meth) acrylic acid alkylaminoalkyl esters (for example, dimethylaminoethyl Methacrylate, t-butylaminoethyl methacrylate, etc.), N-vinylpyrrolidone, acryloylmorpholine, vinyl acetate, styrene, acrylonitrile and the like. These monomer components may be used alone or in combination of two or more.
　また、（メタ）アクリル系ポリマーの架橋を目的に、任意に、多官能モノマーを用いてもよい。多官能モノマーとしては、例えば、ヘキサンジオールジ（メタ）アクリレート、（ポリ）エチレングリコールジ（メタ）アクリレート、（ポリ）プロピレングリコールジ（メタ）アクリレート、ネオペンチルグリコールジ（メタ）アクリレート、ペンタエリスリトールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールモノヒドロキシペンタ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、エポキシ（メタ）アクリレート、ポリエステル（メタ）アクリレート及びウレタン（メタ）アクリレートなどが挙げられる。これら多官能モノマーは単独で用いてもよく、２種以上を併用してもよい。
　多官能モノマーの使用量は、粘着特性等の観点より、全モノマー成分の３０重量％以下であることが好ましく、さらに２０重量％以下が好ましい。 Moreover, you may use a polyfunctional monomer arbitrarily for the purpose of bridge | crosslinking of a (meth) acrylic-type polymer. Examples of polyfunctional monomers include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol di (Meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, Examples include epoxy (meth) acrylate, polyester (meth) acrylate, and urethane (meth) acrylate. These polyfunctional monomers may be used alone or in combination of two or more.
The amount of the polyfunctional monomer used is preferably 30% by weight or less, more preferably 20% by weight or less of the total monomer components from the viewpoint of adhesive properties and the like.
　さらに、炭素－炭素二重結合等のエネルギー線硬化性の官能基を有するモノマー及び／又はオリゴマーを使用してもよい。
　モノマー／オリゴマーとしては、例えば、ウレタン（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ペンタエリスリトールトリ（メタ）アクリレート、ペンタエリスリトールテトラ（メタ）アクリレート、ジペンタエリスリトールモノヒドロキシペンタ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート及び１，４－ブチレングリコールジ（メタ）アクリレートなどが挙げられる。これらは単独で用いてもよく、２種以上を併用してもよい。
　これらの配合量は、特に制限されるものではないが、粘着性を考慮すると、粘着剤を構成する(メタ）アクリル系ポリマー等のベースポリマー１００重量部に対して、５～５００重量部程度であることが好ましく、さらに７０～１５０重量部程度であることが好ましい。 Furthermore, a monomer and / or oligomer having an energy ray-curable functional group such as a carbon-carbon double bond may be used.
Examples of the monomer / oligomer include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, Examples thereof include dipentaerythritol hexa (meth) acrylate and 1,4-butylene glycol di (meth) acrylate. These may be used alone or in combination of two or more.
The blending amount of these is not particularly limited, but in consideration of tackiness, it is about 5 to 500 parts by weight with respect to 100 parts by weight of the base polymer such as (meth) acrylic polymer constituting the adhesive. It is preferably about 70 to 150 parts by weight.
　また、感光型粘着剤を構成する場合には、光重合開始剤を用いることが好ましい。
　光重合開始剤としては、例えば、４－（２－ヒドロキシエトキシ）フェニル（２－ヒドロキシ－２－プロピル）ケトン、α－ヒドロキシ－α，α－メチルアセトフェノン、メトキシアセトフェノン、２，２－ジメトキシー２－フェニルアセトフェノン、２，２－ジエトキシアセトフェノン、１－ヒドロキシシクロヘキシルフェニルケトン、２－メチル－１－〔４－（メチルチオ）フェニル〕－２－モルホリノプロパン－１などのアセトフェノン系化合物、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、アニゾインメチルエーテルなどのベンゾインエーテル系化合物、２－メチル－２－ヒドロキシプロピルフェノンなどのα－ケトール系化合物、ベンジルジメチルケタールなどのケタール系化合物、２－ナフタレンスルホニルクロリドなどの芳香族スルホニルクロリド系化合物、１－フェノン－１，１－プロパンジオン－２－（ｏ－エトキシカルボニル）オキシムなどの光活性オキシム系化合物、ベンゾフェノン、ベンゾイル安息香酸、３，３’－ジメチル－４－メトキシベンゾフェノンなどのベンゾフェノン系化合物、チオキサンソン、２－クロロチオキサンソン、２－メチルチオキサンソン、２，４－ジメチルチオキサンソン、イソプロピルチオキサンソン、２，４－ジクロロチオキサンソン、２，４－ジエチルチオキサンソン、２，４－ジイソプロピルチオキサンソンなどのチオキサンソン系化合物、カンファーキノン、ハロゲン化ケトン、アシルホスフィノキシド及びアシルホスフォナートなどが挙げられる。これらは単独で用いてもよく、２種以上を併用してもよい。
　光重合開始剤の配合量は、粘着剤を構成するベースポリマー１００重量部に対して、０．１～１０重量部程度であることが好ましく、さらに好ましくは０．５～５重量部程度である。 Moreover, when comprising a photosensitive adhesive, it is preferable to use a photoinitiator.
Examples of the photopolymerization initiator include 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α-methylacetophenone, methoxyacetophenone, 2,2-dimethoxy-2- Acetophenone compounds such as phenylacetophenone, 2,2-diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1, benzoin ethyl ether, benzoin Benzoin ether compounds such as isopropyl ether and anisoin methyl ether, α-ketol compounds such as 2-methyl-2-hydroxypropylphenone, ketal compounds such as benzyldimethyl ketal, 2-naphthalenesulfonyl chloride Aromatic sulfonyl chloride compounds such as Lido, photoactive oxime compounds such as 1-phenone-1,1-propanedione-2- (o-ethoxycarbonyl) oxime, benzophenone, benzoylbenzoic acid, 3,3′-dimethyl Benzophenone compounds such as -4-methoxybenzophenone, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2 Thioxanthone compounds such as 1,4-diethylthioxanthone and 2,4-diisopropylthioxanthone, camphorquinone, halogenated ketone, acyl phosphinoxide and acyl phosphonate. These may be used alone or in combination of two or more.
The blending amount of the photopolymerization initiator is preferably about 0.1 to 10 parts by weight, more preferably about 0.5 to 5 parts by weight with respect to 100 parts by weight of the base polymer constituting the pressure-sensitive adhesive. .
　さらに、ベースポリマーの重量平均分子量を高めるため、任意に、架橋剤を加えてもよい。
　架橋剤としては、ポリイソシアネート化合物、エポキシ化合物、アジリジン化合物、メラミン樹脂、尿素樹脂、無水化合物、ポリアミン、カルボキシル基含有ポリマーなどが挙げられる。これらは単独で用いてもよく、２種以上を併用してもよい。架橋剤を使用する場合、その使用量は引き剥がし粘着力が下がり過ぎないことを考慮し、一般的には、ベースポリマー１００重量部に対して、０．０１～５重量部程度であることが好ましい。 Furthermore, in order to increase the weight average molecular weight of the base polymer, a crosslinking agent may optionally be added.
Examples of the crosslinking agent include polyisocyanate compounds, epoxy compounds, aziridine compounds, melamine resins, urea resins, anhydrous compounds, polyamines, and carboxyl group-containing polymers. These may be used alone or in combination of two or more. In the case of using a crosslinking agent, the amount used thereof is generally about 0.01 to 5 parts by weight with respect to 100 parts by weight of the base polymer in consideration that the peeling adhesive strength does not decrease too much. preferable.
　また、任意に、上記成分のほかに、従来公知の粘着付与剤、老化防止剤、充填剤、老化防止剤、着色剤等の添加剤を含有させることができる。 In addition to the above components, additives such as conventionally known tackifiers, anti-aging agents, fillers, anti-aging agents, and coloring agents can be optionally added.
　（メタ）アクリル系ポリマーの調製は、例えば、１種又は２種以上のモノマーまたはそれらの混合物に、溶液重合法、乳化重合法、塊状重合法、懸濁重合法等の公知の方法を適用して行うことができる。なかでも、溶液重合法が好ましい。ここで用いる溶媒は、例えば、酢酸エチル、トルエン等の極性溶剤が挙げられる。溶液濃度は、通常２０～８０重量％程度である。 For the preparation of the (meth) acrylic polymer, for example, a known method such as a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, or a suspension polymerization method is applied to one or more monomers or a mixture thereof. Can be done. Of these, the solution polymerization method is preferable. Examples of the solvent used here include polar solvents such as ethyl acetate and toluene. The solution concentration is usually about 20 to 80% by weight.
　ポリマーの調製においては、重合開始剤を用いてもよい。重合開始剤としては、過酸化水素、過酸化ベンゾイル、ｔ－ブチルパーオキサイドなどの過酸化物系が挙げられる。単独で用いるのが望ましいが、還元剤と組み合わせてレドックス系重合開始剤として使用してもよい。
　還元剤としては、例えば、亜硫酸塩、亜硫酸水素塩、鉄、銅、コバルト塩などのイオン化の塩、トリエタノールアミン等のアミン類、アルドース、ケトース等の還元糖などが挙げられる。また、２，２’－アゾビス－２－メチルプロピオアミジン酸塩、２，２’－アゾビス－２，４－ジメチルバレロニトリル、２，２’－アゾビス－Ｎ，Ｎ’－ジメチレンイソブチルアミジン酸塩、２，２’－アゾビスイソブチロニトリル、２，２’－アゾビス－２－メチル－Ｎ－（２－ヒドロキシエチル）プロピオンアミド等のアゾ化合物を使用してもよい。これらは、単独で用いてもよいし、２種以上併用して使用してもよい。 In preparing the polymer, a polymerization initiator may be used. Examples of the polymerization initiator include peroxides such as hydrogen peroxide, benzoyl peroxide, and t-butyl peroxide. Although it is desirable to use it alone, it may be used as a redox polymerization initiator in combination with a reducing agent.
Examples of the reducing agent include ionized salts such as sulfite, bisulfite, iron, copper, and cobalt salts, amines such as triethanolamine, and reducing sugars such as aldose and ketose. 2,2′-azobis-2-methylpropioaminate, 2,2′-azobis-2,4-dimethylvaleronitrile, 2,2′-azobis-N, N′-dimethyleneisobutylamidine acid An azo compound such as a salt, 2,2′-azobisisobutyronitrile, 2,2′-azobis-2-methyl-N- (2-hydroxyethyl) propionamide may be used. These may be used alone or in combination of two or more.
　反応温度は、通常５０～８５℃程度、反応時間は１～８時間程度である。
　特に、（メタ）アクリル系ポリマーは、被切断体への汚染防止等の観点から、低分子量物質の含有量が少ないものが好ましく、（メタ）アクリル系ポリマーの重量平均分子量は、３０万以上、さらに８０～３００万程度が好ましい。 The reaction temperature is usually about 50 to 85 ° C., and the reaction time is about 1 to 8 hours.
In particular, the (meth) acrylic polymer preferably has a low content of a low molecular weight substance from the viewpoint of preventing contamination of the object to be cut, and the weight average molecular weight of the (meth) acrylic polymer is 300,000 or more, Further, about 80 to 3 million is preferable.
　粘着剤層の厚さは、特に限定されるものではないが、ダイシング時に液体流がダイシングテープを通過することができる程度の厚さに設定されていることが好ましい。 The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably set to such a thickness that the liquid flow can pass through the dicing tape during dicing.
　本発明に使用される粘着シートは、当技術分野で公知のテープの製造方法によって形成することができる。
　例えば、まず、基材フィルムを準備する。
　次いで、粘着剤を基材フィルムに積層する。この場合、直接基材フィルムにコーティングしてもよいし、粘着剤を剥離剤が塗布されたプロセス材料にコーティングし、乾燥した後、その粘着剤を基材フィルムに積層するトランスファーコーティング法を利用して積層してもよいし、基材フィルム上に粘着剤を圧延積層してもよい。
　これらのコーティングは、例えば、リバースロールコーティング、グラビアコーティング、カーテンスプレーコーティング、ダイコーティング、押出および他の工業的に応用されるコーティング法など、種々の方法を利用することができる。
　準備した基材フィルムは、基材フィルムの状態で穿孔を有していてもよいし、基材フィルムに粘着剤をコーティングした後に形成してもよい。 The pressure-sensitive adhesive sheet used in the present invention can be formed by a method for producing a tape known in the art.
For example, first, a base film is prepared.
Subsequently, an adhesive is laminated | stacked on a base film. In this case, the substrate film may be coated directly, or a transfer coating method in which an adhesive is coated on a process material coated with a release agent, dried, and then laminated on the substrate film is used. The pressure-sensitive adhesive may be roll-laminated on the base film.
These coatings can utilize various methods such as reverse roll coating, gravure coating, curtain spray coating, die coating, extrusion and other industrially applied coating methods.
The prepared base film may have perforations in the state of the base film, or may be formed after coating the base film with an adhesive.
　被切断体の粘着シートへの貼り付けは、半導体ウェハ等の被切断体（例えば、非切断体の一面）に、粘着シートの粘着剤層を貼り付けることにより行い、当該分野において、通常行われる条件、方法等に従って行うことができる。
　また、ダイシングは、液体流によって案内されるレーザービームを使用して行うことができるものであれば、どのような装置を用いて行ってもよい。例えば、ＷＯ９５／３２８３４に記載された技術を利用する装置を用いることができる。 Affixing of the object to be cut to the pressure-sensitive adhesive sheet is performed by affixing the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet to a material to be cut such as a semiconductor wafer (for example, one surface of a non-cut object), and is usually performed in this field. It can be performed according to conditions, methods, and the like.
The dicing may be performed using any apparatus as long as it can be performed using a laser beam guided by a liquid flow. For example, an apparatus using a technique described in WO95 / 32834 can be used.
　粘着シートに感光型、感熱型粘着剤を使用しているときには、軽剥離化のための光照射及び／又は加熱が必要であるが、これらは、後述するピックアップテープの貼り付け前に行っても、貼り付け後に行ってもよい。軽剥離化した後にピックアップテープの貼り付けのための外力を加えると、被切断体の不意の剥離が起こることがあるため、ピックアップテープの貼り付け後に軽剥離化処理を行うことが好ましい。特に、感光型粘着剤の場合は、粘着剤が空気（酸素）に触れることで、硬化阻害を起こすことが知られていることから、ピックアップテープを貼り付けることで、空気を遮断した後に光照射を行うことが好ましい。 When a photosensitive or heat sensitive adhesive is used for the pressure sensitive adhesive sheet, light irradiation and / or heating for light release is necessary, but these may be performed before the pickup tape described later is applied. , May be performed after pasting. If an external force for attaching the pickup tape is applied after light peeling, the object to be cut may be unexpectedly peeled off. Therefore, it is preferable to perform light peeling treatment after the pickup tape is attached. In particular, in the case of photosensitive adhesives, it is known that when the adhesives come into contact with air (oxygen), curing inhibition is known. It is preferable to carry out.
　次いで、（Ｂ１）上述した粘着シートにピックアップテープを貼り付ける。
　ここでのピックアップテープへの貼り付けは、上述した粘着シートの基材フィルムに、ピックアップテープの粘着剤層を貼り付けることにより行う。つまり、粘着シートの基材フィルムの穿孔を、ピックアップテープによって塞ぐように貼り付けることが好ましい。
　貼り付けの手法は、特に限定されないが、テーブル上に粘着シートの基材フィルムを上にして静置し、基材フィルムにピックアップテープを、ローラーで貼り付ける方法が簡便である。 Next, (B1) a pickup tape is attached to the above-mentioned pressure-sensitive adhesive sheet.
The attachment to the pickup tape here is performed by attaching the adhesive layer of the pickup tape to the base film of the adhesive sheet described above. In other words, it is preferable that the base film of the pressure-sensitive adhesive sheet is stuck so as to close the perforations with the pickup tape.
The method of attaching is not particularly limited, but a method of allowing the base film of the pressure-sensitive adhesive sheet to stand on the table and allowing the pickup tape to be attached to the base film with a roller is simple.
　また、別の方法として、ダイシングされた被切断体の他面にピックアップテープを貼り付けて転写する。
　ここでのピックアップテープへの貼り付けは、ダイシングされた被切断体の粘着シートが貼り付けられた面と反対側の面に、ピックアップテープの粘着剤層を貼り付けることにより行う。つまり、被切断体を粘着シートとピックアップテープとで挟むように貼り付ける。
　貼り付けの手法は、特に限定されないが、テーブル上に、ダイシングされた被切断体の粘着シートが貼り付けられた面と反対側の面を上にして静置し、ピックアップテープを、ローラーで貼り付ける方法が簡便である。
　これらの際の圧力、ローラーの回転速度、温度等の条件は、被切断体が破壊しない程度、かつ、粘着シートにピックアップテープが接着する程度に調整することができる。 As another method, a pickup tape is attached to the other surface of the diced workpiece to be transferred.
The attachment to the pickup tape here is performed by attaching an adhesive layer of the pickup tape to the surface opposite to the surface to which the adhesive sheet of the diced object to be cut is attached. That is, the object to be cut is pasted so as to be sandwiched between the adhesive sheet and the pickup tape.
The method of pasting is not particularly limited, but is allowed to stand on the table with the surface opposite to the surface on which the adhesive sheet of the diced object to be cut is pasted, and the pickup tape is pasted with a roller. The attaching method is simple.
Conditions such as pressure, roller rotation speed, and temperature can be adjusted to such an extent that the object to be cut does not break and the pickup tape adheres to the pressure-sensitive adhesive sheet.
　ピックアップテープは、主として、基材フィルムと、その上に配置される粘着剤層とからなる。
　基材フィルムは穿孔を有していない、従来公知のフィルムを使用することができる。特に、引っ張りヤング率が３０～５０００ＭＰａ程度の基材フィルムが好ましい。厚みは特に限定されないが、例えば、ニードル突き上げ応力を伝播させ、ピックアップを容易にするために、１０～３００μｍ、好ましくは３０～２００μｍが挙げられる。また、基材フィルムは単一層又は２層以上の多層構造としてもよい。 The pickup tape mainly includes a base film and an adhesive layer disposed thereon.
A conventionally well-known film which does not have perforation can be used for a base film. In particular, a base film having a tensile Young's modulus of about 30 to 5000 MPa is preferable. Although the thickness is not particularly limited, for example, in order to propagate the needle push-up stress and facilitate pickup, the thickness is 10 to 300 μm, preferably 30 to 200 μm. The base film may have a single layer or a multilayer structure of two or more layers.
　粘着剤層を構成する粘着剤は、感圧型、感熱型、感光型のいずれの型でもよい。
　粘着剤層の形成材料、形成方法等は、上述した粘着シートと同様のものが挙げられる。 The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer may be any of pressure-sensitive type, heat-sensitive type, and photosensitive type.
Examples of the material for forming the pressure-sensitive adhesive layer, the method for forming the pressure-sensitive adhesive layer, and the like are the same as those for the pressure-sensitive adhesive sheet described above.
　粘着剤層の厚さは、粘着シートの基材フィルムから剥離しない範囲において適宜調整することができる。粘着シートの基材フィルムの穿孔を塞ぐために３０～５００μｍ程度、さらに好ましくは３０～２００μｍ程度である。
　また、粘着剤層の弾性率は、適宜調整することができるが、粘着シートの基材フィルムの穿孔を塞ぐために０．１～２ＭＰａ程度が好ましい。 The thickness of an adhesive layer can be suitably adjusted in the range which does not peel from the base film of an adhesive sheet. In order to block the perforation of the base film of the pressure-sensitive adhesive sheet, the thickness is about 30 to 500 μm, more preferably about 30 to 200 μm.
The elastic modulus of the pressure-sensitive adhesive layer can be adjusted as appropriate, but is preferably about 0.1 to 2 MPa in order to block perforation of the base film of the pressure-sensitive adhesive sheet.
　なお、転写するとは、被切断体の一面が粘着シートに貼り付けられてダイシングされた後の被切断体の形態を、そのままピックアップテープに移すことであり、通常、ダイシングされた被切断体の他面を、ピックアップテープに貼り付け、その後に粘着シートを剥離することを意味する。
　例えば、図１（ａ）に示したように、基材に穿孔１１ａを有する粘着シート１１を被切断体に貼り付け、粘着シートウォータージェットレーザーダイシングを行う。
　その後、図１（ｂ）に示したように、基材に穿孔を有さないピックアップテープ１２に、ダイシングされた被切断体である半導体チップ１０の他面を貼り付け、粘着シート１１を剥離することにより、ピックアップテープ１２に半導体チップ１０を転写する。 The term “transfer” means to transfer the form of the object to be cut after the one surface of the object to be cut is attached to the adhesive sheet and diced to the pickup tape as usual. This means that the surface is affixed to the pickup tape, and then the adhesive sheet is peeled off.
For example, as shown to Fig.1 (a), the adhesive sheet 11 which has the perforation 11a in a base material is affixed on a to-be-cut body, and an adhesive sheet water jet laser dicing is performed.
Thereafter, as shown in FIG. 1B, the other surface of the semiconductor chip 10 which is the diced object to be cut is attached to the pickup tape 12 which does not have perforations in the base material, and the adhesive sheet 11 is peeled off. As a result, the semiconductor chip 10 is transferred to the pickup tape 12.
　粘着シートの剥離は、粘着シートの軽剥離化を行った後に行うことが好ましい。例えば、粘着シートが感光型、感熱型粘着剤によって形成されている場合には、光照射及び／又は加熱を行うことにより、軽剥離化を行うことができる。
　軽剥離化は、ピックアップテープの貼り付け前に行ってもよいし、貼り付け後に行ってもよい。軽剥離化した後にピックアップテープの貼り付けのための外力を加えると、被切断体の不意の剥離が起こることがあるため、ピックアップテープの貼り付け後、かつ転写後に軽剥離化処理を行うことが好ましい。
　また、ダイシングされた被切断体の他面を、穿孔を有しない基材フィルム上に粘着剤層が積層されてなるピックアップテープに貼り付けて転写した後、つまり、粘着シートを剥離した後、ピックアップテープの軽剥離化を行うことが好ましい。軽剥離化は上記と同様に行うことができる。 The pressure-sensitive adhesive sheet is preferably peeled after the pressure-sensitive adhesive sheet is lightly peeled. For example, when the pressure-sensitive adhesive sheet is formed of a photosensitive type or heat-sensitive type pressure-sensitive adhesive, light peeling can be performed by performing light irradiation and / or heating.
The light release may be performed before or after the pickup tape is attached. If an external force is applied to the pick-up tape after light release, the object to be cut may be peeled off unexpectedly. preferable.
Further, after the other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations, that is, after the adhesive sheet is peeled off, the pickup is performed. It is preferable to lightly peel the tape. Light release can be performed in the same manner as described above.
　（Ｃ）その後、被切断体をピックアップ工程に供する。
　ピックアップ工程は、特に限定されるものではなく、当該分野で通常利用されているものを利用することができる。なかでも、以下に説明するような、ニードル突上げ式を利用するものが好ましい。
　例えば、図２（ａ）に示したように、基材に穿孔１１ａを有する粘着シート１１に、被切断体を貼り付け、ウォータージェットレーザーダイシングを行った後、さらに、粘着シート１１の基材フィルムに、ピックアップテープ１２を貼り付ける。このように粘着シート１１及びピックアップテープ１２が貼り付けられた半導体チップ１０は、ピックアップテープ１２側から、ニードル１３によって、矢印方向に突上げられる。 (C) Then, a to-be-cut body is used for a pick-up process.
A pick-up process is not specifically limited, The thing normally utilized in the said field | area can be utilized. Among these, those utilizing a needle push-up type as described below are preferable.
For example, as shown in FIG. 2 (a), a substrate to be cut is pasted on a pressure-sensitive adhesive sheet 11 having perforations 11a in the base material, and water jet laser dicing is performed. Then, the pickup tape 12 is affixed. The semiconductor chip 10 to which the adhesive sheet 11 and the pickup tape 12 are attached in this way is pushed up in the direction of the arrow by the needle 13 from the pickup tape 12 side.
　また、図１（ｂ）に示したように、ダイシングされた被切断体である半導体チップ１０の他面が、基材に穿孔を有さないピックアップテープ１２に貼り付けられており（半導体チップ１０の一面に貼り付けられていた粘着シート１１はすでに剥離されている）、この半導体チップ１０を、ピックアップテープ１２側から、ニードル１３によって、矢印方向に突上げてもよい。 In addition, as shown in FIG. 1B, the other surface of the semiconductor chip 10 that is a diced object to be cut is attached to a pickup tape 12 that does not have perforations in the base material (semiconductor chip 10). The pressure-sensitive adhesive sheet 11 that has been affixed to one surface has already been peeled off), and the semiconductor chip 10 may be pushed up in the direction of the arrow by the needle 13 from the pickup tape 12 side.
　突き上げの際、半導体チップ１０は、剛性が高いため、粘着シート１１の粘着力が十分に低下していれば、ニードル１３により半導体チップ１０の一部剥離が起こる。 Since the semiconductor chip 10 has high rigidity at the time of pushing up, if the adhesive force of the adhesive sheet 11 is sufficiently reduced, the semiconductor chip 10 is partly peeled off by the needle 13.
　ニードル１３による突上げ後、図２（ｂ）又は図１（ｃ）に示したように、半導体チップ１０の上方から、半導体チップ１０を、コレット１４によって吸着する。コレット１４を矢印方向に引き上げるにつれて、自然に半導体チップ１０から粘着シート１１が剥離される。 After the needle 13 is pushed up, the semiconductor chip 10 is adsorbed by the collet 14 from above the semiconductor chip 10 as shown in FIG. 2B or 1C. As the collet 14 is pulled up in the direction of the arrow, the adhesive sheet 11 is naturally peeled from the semiconductor chip 10.
　本発明の半導体素子の製造方法によれば、穿孔を有する基材フィルムに直接ニードルが触れることなく、被切断体のピックアップを行うことができるため、ニードルへの粘着剤の付着、蓄積を回避することができ、半導体素子の汚染、ニードルの清掃等を最小限にとどめることができる。また、穿孔を有する基材フィルムを直接減圧吸着することがないため、ピックアップ不良等を生じることなくピックアップを行うことができる。これにより、半導体素子の製造の歩留まりを向上させることが可能となる。 According to the method for manufacturing a semiconductor element of the present invention, since the object to be cut can be picked up without the needle directly touching the base film having the perforations, adhesion and accumulation of the adhesive on the needle are avoided. Therefore, contamination of the semiconductor element, cleaning of the needle, etc. can be minimized. Further, since the substrate film having perforations is not directly sucked under reduced pressure, the pickup can be performed without causing a pickup failure or the like. Thereby, it becomes possible to improve the manufacturing yield of the semiconductor element.
　本発明の半導体素子の製造方法の実施例を以下に詳しく説明する。
実施例１及び２
（ウォータージェットレーザーダイシング用基材フィルムの準備）
　繊維径５５μｍのポリエチレンテレフタレート繊維で、密度２００本×２００本／インチ、空隙面積３２％、厚さ９０μｍのメッシュフィルムを形成した。このメッシュフィルムにコロナ処理を行ったものを基材フィルムとした。 Examples of the method for manufacturing a semiconductor device of the present invention will be described in detail below.
Examples 1 and 2
(Preparation of base film for water jet laser dicing)
A mesh film having a density of 200 × 200 fibers / inch, a void area of 32%, and a thickness of 90 μm was formed using polyethylene terephthalate fibers having a fiber diameter of 55 μm. A material obtained by subjecting this mesh film to corona treatment was used as a base film.
（ウォータージェットレーザーダイシング用粘着シート）
　アクリル酸メチル４０重量部、アクリル酸２－メトキシエチル３５重量部、アクリロイルモルフォリン２０重量部、アクリル酸５重量部を酢酸エチル中で常法により共重合させた。これにより、重量平均分子量６０万のアクリル系共重合体を含有する溶液を得た。
　次に、アクリル系共重合体を含有する溶液に、ペンタエリスリトールトリアクリレートとジイソシアネートとを反応させて得た紫外線硬化性オリゴマー（２５℃での粘度１０Ｐａ・ｓｅｃ）１００重量部、光重合開始剤（商品名「イルガキュア６５１」、チバ・スペシャルティー・ケミカルズ社製）３重量部及びポリイソシアネート化合物（商品名「コロネートＬ」、日本ポリウレタン社製）２重量部を加えて、アクリル系の紫外線硬化型粘着剤溶液を得た。
　上記の基材フィルム上に、粘着剤層の厚みが１５μｍとなるように、得られた紫外線硬化型粘着剤溶液を塗布し、粘着シートを得た。 (Adhesive sheet for water jet laser dicing)
40 parts by weight of methyl acrylate, 35 parts by weight of 2-methoxyethyl acrylate, 20 parts by weight of acryloylmorpholine, and 5 parts by weight of acrylic acid were copolymerized in a conventional manner in ethyl acetate. As a result, a solution containing an acrylic copolymer having a weight average molecular weight of 600,000 was obtained.
Next, 100 parts by weight of an ultraviolet curable oligomer (viscosity at 25 ° C. of 10 Pa · sec) obtained by reacting a solution containing an acrylic copolymer with pentaerythritol triacrylate and diisocyanate, a photopolymerization initiator ( Add 3 parts by weight of the product name “Irgacure 651”, manufactured by Ciba Specialty Chemicals Co., Ltd.) and 2 parts by weight of a polyisocyanate compound (trade name “Coronate L”, manufactured by Nippon Polyurethane Co., Ltd.). An agent solution was obtained.
The obtained ultraviolet curable pressure-sensitive adhesive solution was applied onto the above base film so that the pressure-sensitive adhesive layer had a thickness of 15 μm to obtain a pressure-sensitive adhesive sheet.
（ダイシング条件）
　得られたダイシング用粘着シート上に、厚さ１００μｍに研削されたシリコンウェハを貼り付け、以下の条件でダイシングした。
　　　レーザー波長：５３２ｎｍ
　　　ダイシング速度：５０ｍｍ／ｓ
　　　レーザー直径：５０μｍ
　　　水ジェット圧：８ＭＰａ
　　　チップサイズ：５ｍｍ×５ｍｍ
　　　ウェハサイズ：１３．７ｃｍ（５インチ） (Dicing conditions)
A silicon wafer ground to a thickness of 100 μm was pasted on the obtained adhesive sheet for dicing, and diced under the following conditions.
Laser wavelength: 532 nm
Dicing speed: 50mm / s
Laser diameter: 50 μm
Water jet pressure: 8MPa
Chip size: 5mm x 5mm
Wafer size: 13.7 cm (5 inches)
（ピックアップテープ用基材の準備）
　基材フィルムとして、厚み７０μｍの直鎖状低密度ポリエチレンからなるフィルム（ヤング率１５０ＭＰａ）を使用した。このフィルムの片面にはコロナ処理を施した。 (Preparation of base material for pickup tape)
A film (Young's modulus 150 MPa) made of linear low-density polyethylene having a thickness of 70 μm was used as the base film. One side of this film was corona treated.
（ピックアップテープ１の作製：実施例１）
　アクリル酸２－エチルヘキシル９５重量部、アクリル酸５重量部を酢酸エチル中で常法により共重合させた。これにより、重量平均分子量８０万のアクリル系共重合体を含有する溶液を得た。次に、アクリル系共重合体を含有する溶液に、ポリイソシアネート化合物（商品名「コロネートＬ」、日本ポリウレタン社製）２重量部を加えて、アクリル系の紫外線硬化型粘着剤溶液を得た。
　上記の基材フィルム上に、粘着剤層の厚みが４０μｍとなるように、得られた紫外線硬化型粘着剤溶液を塗布し、粘着シートを得た。 (Preparation of Pickup Tape 1: Example 1)
95 parts by weight of 2-ethylhexyl acrylate and 5 parts by weight of acrylic acid were copolymerized in a conventional manner in ethyl acetate. As a result, a solution containing an acrylic copolymer having a weight average molecular weight of 800,000 was obtained. Next, 2 parts by weight of a polyisocyanate compound (trade name “Coronate L”, manufactured by Nippon Polyurethane Co., Ltd.) was added to the solution containing the acrylic copolymer to obtain an acrylic ultraviolet curable adhesive solution.
The obtained ultraviolet curable pressure-sensitive adhesive solution was applied onto the above base film so that the thickness of the pressure-sensitive adhesive layer was 40 μm to obtain a pressure-sensitive adhesive sheet.
（ピックアップテープ２の作製：実施例２）
　アクリル酸メチル５０重量部、アクリル酸２エチルヘキシル４５重量部、アクリル酸５重量部を酢酸エチル中で常法により共重合させた。これにより、重量平均分子量８０万のアクリル系共重合体を含有する溶液を得た。次に、アクリル系共重合体を含有する溶液に、ペンタエリスリトールトリアクリレートとジイソシアネートとを反応させて得た紫外線硬化性オリゴマー（２５℃での粘度１０Ｐａ・ｓｅｃ）１００重量部、光重合開始剤（商品名「イルガキュア６５１」、チバ・スペシャルティー・ケミカルズ社製）３重量部及びポリイソシアネート化合物（商品名「コロネートＬ」、日本ポリウレタン社製）２重量部を加えて、アクリル系の紫外線硬化型粘着剤溶液を得た。
　上記の基材フィルム上に、粘着剤層の厚みが１０μｍとなるように、得られた紫外線硬化型粘着剤溶液を塗布し、粘着シートを得た。 (Preparation of Pickup Tape 2: Example 2)
50 parts by weight of methyl acrylate, 45 parts by weight of 2-ethylhexyl acrylate, and 5 parts by weight of acrylic acid were copolymerized in ethyl acetate by a conventional method. As a result, a solution containing an acrylic copolymer having a weight average molecular weight of 800,000 was obtained. Next, 100 parts by weight of an ultraviolet curable oligomer (viscosity at 25 ° C. of 10 Pa · sec) obtained by reacting a solution containing an acrylic copolymer with pentaerythritol triacrylate and diisocyanate, a photopolymerization initiator ( Add 3 parts by weight of the product name “Irgacure 651”, manufactured by Ciba Specialty Chemicals Co., Ltd.) and 2 parts by weight of a polyisocyanate compound (trade name “Coronate L”, manufactured by Nippon Polyurethane Co., Ltd.). An agent solution was obtained.
The obtained ultraviolet curable pressure-sensitive adhesive solution was applied on the above base film so that the thickness of the pressure-sensitive adhesive layer was 10 μm to obtain a pressure-sensitive adhesive sheet.
（ピックアップテープ１の貼り付け：実施例１）
　ダイシングが終了したワーク背面、つまり、ウォータージェットレーザーダイシング用粘着シートの基材フィルムに、径７５ｍｍ、幅２００ｍｍ、重さ２ｋｇのローラーで１０ｍｍ／ｓの速度でピックアップテープ１を貼り付けた。 (Attaching the pickup tape 1: Example 1)
The pick-up tape 1 was affixed at a speed of 10 mm / s with a roller having a diameter of 75 mm, a width of 200 mm, and a weight of 2 kg on the back surface of the workpiece after dicing, that is, the base film of the pressure-sensitive adhesive sheet for water jet laser dicing.
　（ピックアップテープ２への半導体素子の転写：実施例２）
　窒素雰囲気下で、ダイシングが終了したワーク背面、つまり、ウォータージェットレーザーダイシング用粘着シートの基材フィルム側から高圧水銀灯を用いて、照度３０ｍＷ／ｃｍ２で２０秒間紫外線照射を行い、ウォータージェットレーザーダイシング用粘着シートの粘着剤層を硬化させ、軽剥離化した。
　次いで、半導体素子表面へ、径７５ｍｍ、幅２００ｍｍ、重さ２ｋｇのローラーで１０ｍｍ／ｓの速度でピックアップテープ２を貼り付け、ウォータージェットレーザーダイシング用粘着シートを剥離した。 (Transfer of semiconductor element to pickup tape 2: Example 2)
Water jet laser dicing is performed by irradiating with ultraviolet light for 20 seconds at an illuminance of 30 mW / cm 2 using a high pressure mercury lamp from the back of the workpiece after dicing in a nitrogen atmosphere, that is, the base film side of the water jet laser dicing adhesive sheet. The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet was cured and lightly peeled.
Next, the pickup tape 2 was attached to the surface of the semiconductor element with a roller having a diameter of 75 mm, a width of 200 mm, and a weight of 2 kg at a speed of 10 mm / s, and the pressure-sensitive adhesive sheet for water jet laser dicing was peeled off.
（紫外線照射）
　ピックアップテープ背面から、高圧水銀灯を用いて、照度３０ｍＷ／ｃｍ２で２０秒間紫外線照射を行い、ピックアップ工程に供した。 (UV irradiation)
From the back surface of the pickup tape, UV irradiation was performed for 20 seconds at an illuminance of 30 mW / cm 2 using a high-pressure mercury lamp, and the pickup tape was used for the pickup process.
比較例
　ダイシングが終了したワークの背面から、ピックアップテープを貼り付け及び転写することなく、実施例と同様の紫外線照射を行ない、ピックアップへ供した。 Comparative Example From the back surface of the workpiece after dicing, the same ultraviolet irradiation as in the example was performed without applying and transferring the pickup tape, and the sample was used for pickup.
（ピックアップ試験）
　実施例及び比較例における任意の半導体チップ５０個を、以下の条件でピックアップし、その成功数をカウントした。その結果を表１に示す。
　表１において、全て成功した場合を良、不成功がある場合を不良とした。
　また、ピックアップが成功したチップを顕微鏡で観察し、粘着剤の付着の有無を確認した。粘着剤付着が認められない場合を良、認められた場合を不良とした。 (Pickup test)
50 arbitrary semiconductor chips in Examples and Comparative Examples were picked up under the following conditions, and the number of successes was counted. The results are shown in Table 1.
In Table 1, a case where everything was successful was judged as good and a case where there was unsuccessful was regarded as bad.
Moreover, the chip | tip which picked up successfully was observed with the microscope, and the presence or absence of adhesion of an adhesive was confirmed. The case where adhesion of an adhesive was not recognized was good, and the case where it was recognized was regarded as poor.
（ピックアップ条件）
　ダイボンダー：新川　ＳＰＡ－３００
　ピン数：４本
　ピンの間隔：３．５×３．５ｍｍ
　ピン先端曲率：０．２５０ｍｍ
　ピン突き上げ量：０．８０ｍｍ
　吸着保持時間：０．２秒
　エキスバンド量：１ｍｍ (Pickup conditions)
Die Bonder: Shinkawa SPA-300
Number of pins: 4 Pin spacing: 3.5 x 3.5 mm
Pin tip curvature: 0.250mm
Pin push-up amount: 0.80mm
Adsorption holding time: 0.2 seconds Extraction amount: 1 mm
Figure JPOXMLDOC01-appb-T000001
 　表１から明らかなように、ウォータージェットレーザーダイシング用粘着シートの背面にピックアップテープを貼り付けることで、あるいは、半導体素子をウォータージェットレーザーダイシング用粘着シートから、ピックアップテープへ転写することで、ピックアップ性が良好になり、半導体チップ裏面への粘着剤付着を抑制することができる。
　一方、比較例に示したように、ピックアップテープを貼り付けていない場合には、チップ裏面にニードルによる傷又はチップ割れが多数見られた。
Figure JPOXMLDOC01-appb-T000001
 As is apparent from Table 1, the pickup property can be obtained by attaching a pickup tape to the back surface of the water jet laser dicing adhesive sheet or by transferring the semiconductor element from the water jet laser dicing adhesive sheet to the pickup tape. And the adhesion of the adhesive to the back surface of the semiconductor chip can be suppressed.
On the other hand, as shown in the comparative example, when the pickup tape was not attached, many scratches or chip cracks due to needles were observed on the back surface of the chip.
　本発明の半導体素子の製造方法は、ウォータージェットレーザーダイシングを行うことができる対象、すなわち、半導体関連材料（例えば、半導体ウェハ、ＢＧＡパッケージ、プリント回路、セラミック板、液晶装置用のガラス部品、シート材料、回路基板、ガラス基板、セラミック基板、金属基板、半導体レーザーの発光／受光素子基板、ＭＥＭＳ基板又は半導体パッケージ等）等のみならず、あらゆる種類の材料に対して、広範囲に利用することができる。 The method for manufacturing a semiconductor device of the present invention is an object that can be subjected to water jet laser dicing, that is, a semiconductor-related material (for example, a semiconductor wafer, a BGA package, a printed circuit, a ceramic plate, a glass component for a liquid crystal device, a sheet material). , Circuit boards, glass substrates, ceramic substrates, metal substrates, semiconductor laser light emitting / receiving element substrates, MEMS substrates, semiconductor packages, etc.), etc., and a wide range of materials.
符号の説明Explanation of symbols
　１０　半導体チップ（被切断体）
　１１　粘着シート
　１１ａ　穿孔
　１２　ピックアップテープ
　１３　ニードル
　１４　コレット   10 Semiconductor chip (object to be cut)
11 Adhesive Sheet 11a Perforation 12 Pickup Tape 13 Needle 14 Collet
先行技術文献Prior art documents
ＷＯ９５／３２８３４号WO95 / 32834 特開２００１－３１６６４８号公報JP 2001-316648 A

Claims (7)

  1. 　（Ａ１）被切断体を、穿孔を有する基材フィルム上に粘着剤層が積層されてなるウォータージェットレーザーダイシング用粘着シートに貼り付けてウォータージェットレーザーダイシングし、
    　（Ｂ１）前記粘着シートの穿孔を有する基材フィルムに、穿孔を有しない基材フィルム上に粘着剤層が積層されてなるピックアップテープを貼り付け、
    　（Ｃ）その後、前記被切断体をピックアップ工程に供することを特徴とする半導体素子の製造方法。     (A1) The object to be cut is attached to an adhesive sheet for water jet laser dicing in which an adhesive layer is laminated on a base film having perforations, and water jet laser dicing is performed.
    (B1) A pickup tape in which a pressure-sensitive adhesive layer is laminated on a base film having no perforations is attached to the base film having the perforations of the pressure-sensitive adhesive sheet,
    (C) Then, the said to-be-cut body is used for a pick-up process, The manufacturing method of the semiconductor element characterized by the above-mentioned.
  2. 　（Ａ２）被切断体の一面を、穿孔を有する基材フィルム上に粘着剤層が積層されてなるウォータージェットレーザーダイシング用粘着シートに貼り付けてウォータージェットレーザーダイシングし、
    　（Ｂ２）ダイシングされた被切断体の他面を、穿孔を有しない基材フィルム上に粘着剤層が積層されてなるピックアップテープに貼り付けて転写し、
    　（Ｃ）その後、前記被切断体をピックアップ工程に供することを特徴とする半導体素子の製造方法。     (A2) One surface of the object to be cut is attached to an adhesive sheet for water jet laser dicing in which an adhesive layer is laminated on a base film having perforations, and water jet laser dicing is performed.
    (B2) The other surface of the diced object to be cut is pasted and transferred to a pickup tape in which an adhesive layer is laminated on a base film having no perforations,
    (C) Then, the said to-be-cut body is used for a pick-up process, The manufacturing method of the semiconductor element characterized by the above-mentioned.
  3. 　ピックアップ工程を、ニードル突上げ式で行う請求項１又は２に記載の半導体素子の製造方法。 The method for manufacturing a semiconductor element according to claim 1 or 2, wherein the pickup step is performed by a needle push-up type.
  4. 　ウォータージェットレーザーダイシング用粘着シートが、メッシュ構造を有する基材フィルムによって形成されてなる請求項１又は２に記載の半導体素子製造方法。 The method for producing a semiconductor element according to claim 1 or 2, wherein the water jet laser dicing adhesive sheet is formed of a base film having a mesh structure.
  5. 　ウォータージェットレーザーダイシング用粘着シートが、不織布からなる基材フィルムによって形成されてなる請求項１又は２に記載の半導体素子製造方法。 The semiconductor element manufacturing method according to claim 1 or 2, wherein the water jet laser dicing adhesive sheet is formed of a base film made of a nonwoven fabric.
  6. 　ピックアップテープが、引張ヤング率３０ＭＰａ以上、５０００ＭＰａ以下の基材フィルムによって形成されてなる請求項１又は２に記載の半導体素子製造方法。 3. The semiconductor element manufacturing method according to claim 1, wherein the pickup tape is formed of a base film having a tensile Young's modulus of 30 MPa or more and 5000 MPa or less.
  7. 　ピックアップテープが、厚さ１０μｍ以上、３００μｍ以下の基材フィルムによって形成されてなる請求項１又は２に記載の半導体素子製造方法。
          The semiconductor element manufacturing method according to claim 1, wherein the pickup tape is formed of a base film having a thickness of 10 μm to 300 μm.
PCT/JP2008/073756 2008-01-10 2008-12-26 Semiconductor element manufacturing method WO2009087930A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043409B2 (en) 2018-03-05 2021-06-22 Infineon Technologies Ag Method of forming contacts to an embedded semiconductor die and related semiconductor packages

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211771B2 (en) * 2013-02-08 2017-10-11 日東電工株式会社 Adhesive tape
JP6095996B2 (en) * 2013-02-08 2017-03-15 日東電工株式会社 Adhesive tape
CN107756518A (en) * 2017-11-07 2018-03-06 上海御渡半导体科技有限公司 A kind of circuit board punch mechanism with clamping device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163186A (en) * 2002-10-16 2003-06-06 Furukawa Electric Co Ltd:The Method for fabricating semiconductor chip
JP2004158859A (en) * 2002-11-05 2004-06-03 New Wave Research Apparatus and method for cutting off element from substrate
JP2005167042A (en) * 2003-12-04 2005-06-23 Furukawa Electric Co Ltd:The Adhesive tape for fixing semiconductor wafer
JP2005228794A (en) * 2004-02-10 2005-08-25 Tokyo Seimitsu Co Ltd Method of manufacturing chip

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163186A (en) * 2002-10-16 2003-06-06 Furukawa Electric Co Ltd:The Method for fabricating semiconductor chip
JP2004158859A (en) * 2002-11-05 2004-06-03 New Wave Research Apparatus and method for cutting off element from substrate
JP2005167042A (en) * 2003-12-04 2005-06-23 Furukawa Electric Co Ltd:The Adhesive tape for fixing semiconductor wafer
JP2005228794A (en) * 2004-02-10 2005-08-25 Tokyo Seimitsu Co Ltd Method of manufacturing chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11043409B2 (en) 2018-03-05 2021-06-22 Infineon Technologies Ag Method of forming contacts to an embedded semiconductor die and related semiconductor packages

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