WO2009082865A1

WO2009082865A1 - Led plane light source for universial illumination

Info

Publication number: WO2009082865A1
Application number: PCT/CN2008/000382
Authority: WO
Inventors: Binhai Yu; Junzheng Li; Yaohao Wang; Xufeng Li
Original assignee: Foshan Nationstar Optoelectronics Limited Liability Company
Priority date: 2007-12-30
Filing date: 2008-02-22
Publication date: 2009-07-09
Also published as: CN101216156A

Abstract

A plane light source comprising LEDs is applied to universal illumination. The plane light source mainly contains heat sinks (113), a wiring board (101), LED chips (114), wirings (115) and resins (117) for assembly. Several electrodes (106) are set to electrically connect LED chips on the board, and a circuit layout (107) interconnects the LED chips. Holes (102), where the sinks are embedded, lie in the board. Plurality of holes in parallel forms some pattern. Such LED chips (114) are mounted on the heat sinks. All the LED chips (114) and wirings (115) are one-step encapsulated by the resins. The encapsulation acts as an optical lens.

Description

LED surface light source for general illumination

Technical field

The invention relates to a semiconductor light source structure, in particular to an LED surface light source with good heat dissipation effect, low cost and uniform spatial light intensity distribution, and can be widely applied to various semiconductor lighting products.

Background technique

The known LED light sources are mainly composed of the following two types:

The first type is a light source for directly soldering LED components to a substrate. As shown in Fig. 9, the LED elements 101 are directly connected to the substrate 102, and the respective elements are connected by wires on the substrate to form an LED light source.

The second method is a COB (Chip on board), as shown in FIG. 10, directly bonding the LED chip 201 to the substrate 202, and then encapsulating the chip 201 by using the encapsulant 203. Thereby forming an LED light source.

The above-mentioned known LED surface light source applied to general illumination has poor heat dissipation effect, and the spatial light intensity distribution of the product is uneven.

Summary of the invention

The invention patent provides an LED light source with good heat dissipation effect, low cost, uniform spatial light intensity distribution and rich structure shape.

The present invention achieves the above objects by the following technical solutions:

An LED surface light source for general illumination, the main components comprising a heat sink, a substrate, a chip, an inner lead, and an encapsulant, wherein the substrate is provided with an electrode for connecting the chip and a line for maintaining interconnection between the chips; The substrate is provided with a counterbore, and the heat sink is embedded in the counterbore, and the counterbore is arranged in plurality and arranged to form a certain pattern required; the chip is placed in the heat

1

Confirmation Upon sinking, the encapsulant is integrally molded to encapsulate a plurality of chips and inner leads, and the encapsulant is disposed as an optical lens structure. . . . The pattern is a strip, a ring, a u shape, a double U shape, a circle shape, an elliptical shape, an S shape, a zigzag shape, or the like, or a combination thereof.

The counterbore is an unequal diameter structure, and the lower hole opening area is larger than the upper hole, and both holes are vertical perforated structures, and the stepped surface transition is adopted; the shape of the heat sink corresponds to the structure of the counterbore.

The chips are arranged in a corresponding shape by being connected in parallel or in series.

The optical lens is provided as a single optical lens structure or a plurality of optical lens combinations. The substrate is also provided with electronic components such as resistors, capacitors, and driving ICs constituting the light source module, and is connected with the circuit on the substrate to form a light source module that can be directly used. An LED surface light source for general illumination provided by the present invention has the following advantages:

1. The heat dissipation effect is good, the bottom of the heat sink is in direct contact with the outside, and the semi-encapsulated structure is beneficial to improve the heat dissipation effect;

2, the cost is low, the invention prints the metal electrode on the substrate, the structure is simple, and the cost of the accessory is low;

3. The spatial light intensity is evenly distributed. The present invention adopts an optical lens or a plurality of optical lens combined light-emitting structures corresponding to the shape of the counterbore, effectively dispersing the central brightness of the LED light source, and providing a uniform spatial light intensity distribution. a light source that requires a shape;

4, high production efficiency, heat sink installation is convenient, the package is molded once, the entire process can be automated;

5, the application is convenient, the product of the invention can be directly assembled in the lamp or other application products, and the compatibility is good.

6. The shape of the light source structure of the present invention can be prepared into a circular arc shape and a linear combination shape. It can be used to form various desired patterns, and the shape of the light source is rich and colorful.

DRAWINGS

Figure 1 is a plan view of an annular substrate structure having a counterbore structure;

Figure 2 is a cross-sectional view of the annular substrate structure A-A' having a counterbore structure;

Figure 3 Schematic diagram of the heat sink structure;

Figure 4 Schematic diagram of heat sink assembly and chip placement;

Figure 5 Schematic diagram of the chip connection circuit;

Figure 6 is a top view of the annular product structure completed by the colloidal package;

Figure 7 is a cross-sectional view of the ring product structure completed by the colloidal package B-B';

Figure 8-1—Figure 8-4 are schematic diagrams of the light-emitting areas of products in various shapes;

Figure 9 is a structural diagram of a conventional welding device light source;

Figure 10 is a structural diagram of a conventional COB mode light source.

DESCRIPTION OF REFERENCE NUMERALS: a substrate 401, a lower hole 402 in the counterbore structure, an upper hole 403, a stepped surface 404, a line 405, a heat sink 406, an upper mesa 407, a lower mesa 408, a chip 409, a lead 410, an encapsulant 411, and Surface 412, resistor 413

detailed description

As shown in FIG. 1 to FIG. 7 , an LED surface light source applied to general illumination of the present invention takes an annular light source as an example. The other structural shape is different from the annular light source, and the structural principle is the same as the annular light source. Similarly, the main components include a heat sink, a substrate, a chip, an inner lead, and an encapsulant, wherein the substrate is provided with an electrode for connecting the chip and a line for maintaining interconnection between the chips; and the substrate is provided with a counterbore The heat sink is embedded in the counterbore, and the counterbore is arranged in a plurality of layers to form a certain pattern; the chip is placed on the heat sink, and the package colloid is integrally molded to form a plurality of chips and inner leads into one body, and the package colloid is set. It is an optical lens structure. As a further embodiment of the present invention, the pattern includes a rectangle, a ring, a U shape, a double U shape, a circular shape, an elliptical shape, an S shape, a zigzag shape, and the like. In the counterbore structure, the opening area of the lower hole is larger than that of the upper hole, and both holes are vertical perforated structures, and the step surface transition is adopted; the shape of the heat sink corresponds to the structure of the counterbore. The chips are connected in parallel in series or in series and arranged in a corresponding shape. The optical lens is provided as a single optical lens structure or a plurality of optical lens combinations.

In addition, electronic components such as resistors, capacitors, and driver ICs constituting the light source module are disposed on the substrate, and are connected with circuits on the substrate to form a light source module that can be directly used.

The preparation process of the invention is as follows:

1. Forming of the substrate, as shown in Fig. 1 and Fig. 2, wherein Fig. 2 is a schematic view of the A-A' section of Fig. 1. A substrate 101 having eight counterbore structures 102 is prepared, and the counterbore structure 102 is arranged in a circular shape. The bottom hole 103 of the counterbore structure 102 has a larger opening area than the upper hole 104, and both holes 103 and 104 are vertical hole structures, and steps are adopted. Face 105 transition. As shown in FIG. 1, the surface of the substrate 101 is printed with electrodes 106 for connecting the chips, a line 107 for keeping the chips connected to each other, and a line 108 connected to the external circuit, and a resistance welding position 109;

2, the formation of heat sink, using the forging process, the heat sink 113 shown in Figure 3, is cylindrical, divided into two upper and lower mesas 110 and 111, 110 and 111 step structure is exactly the same as the 103 on the substrate The counterbore structure of 104 is matched, as shown in FIG. 5; the upper mesa 110 is provided with a reflective cup 112;

3. Assembly: The heat sink 113 is assembled into the counterbore structure 102 embedded in the substrate 101;

4. Chip bonding: completing the mounting of the chip 114, and completing the binding of the lead 115, completing the electrical connection between the chip 114 and the electrode 106 on the substrate 101, and completing the placement of the resistor 116. The schematic diagram is as shown in FIG. 4, and the line connection is as shown in FIG. Figure 5;

5. Package: The package body 117 encloses the chip 114, as shown in FIG. 6 and FIG. The glue body 117 is formed in one time, and the upper surface 118 forms an annular concave lens structure, thereby making the light source uniform.

The substrate of the present invention may adopt a desired structural shape, such as a circular arc-arranged structure in which a plurality of counterbore combinations are combined, a plurality of strip-shaped structures or a plurality of circular arc structures combined to form a circular ring, an E-shape or the like. The desired combined shape, the corresponding counterbore can also be a circular structure in which a plurality of countersunks are combined and other desired combined shapes such as strip, ring, U-shaped, double U-shaped , round, elliptical, S-shaped, fusiform, etc.

Figure 8-1, Figure 8-2, Figure 8-3, Figure 8-4 depict an LED surface light source that describes a U-shaped, S-shaped, polygonal line, and diamond shape, respectively. .

Claims

Rights request

1. An LED surface light source for general illumination, the main components comprising a heat sink, a substrate, a chip, an inner lead, and an encapsulant, wherein the substrate is provided with an electrode for connecting the chip and a line for keeping the chips connected to each other; The utility model is characterized in that the substrate is provided with a counterbore, and the heat sink is embedded in the counterbore, and the counterbore is arranged in plurality and arranged to form a desired pattern; the chip is placed on the heat sink, and the package colloid is formed at one time. The chip and the inner lead are integrally packaged, and the encapsulant is disposed as an optical lens structure.

2. The LED surface light source for general illumination according to claim 1, wherein the pattern is rectangular, circular, U-shaped, double U-shaped, circular, elliptical, S-shaped, and fusiform. One of the shapes or a combination between them.

3. The LED surface light source for general illumination according to claim 1 or 2, wherein the counterbore is of an unequal diameter structure, the aperture opening area of the lower hole is larger than the upper hole, and both holes are vertical. Perforated structure, using stepped surface transition.

4. An LED surface light source for general illumination according to claim 3, wherein the shape of the heat sink corresponds to the structure of the counterbore.

5. An LED surface light source for general illumination according to claim 1 or 2, characterized in that said chips are arranged in a corresponding shape by being connected in parallel or in series.

6. An LED surface light source for general illumination according to claim 1 or 2, characterized in that the optical lens is provided as a single optical lens structure or a plurality of optical lens combinations.

The LED surface light source for general illumination according to claim 1 or 2, wherein the substrate is further provided with a resistor, a capacitor, a driving IC type electronic component constituting the light source module, and the substrate The circuit connections form a light source module that can be used directly.