TWM504421U - Light emitting diode package element for directly receiving AC power - Google Patents

Abstract

A light emitting diode package element for directly receiving AC power includes a substrate, a plurality of LED chips, a current-limiting unit and a bridge rectifying unit and a package body. The substrate is provided with a chip-loaded area and a surround area surrounding the chip-loaded area. The LED chips are disposed on the chip-loaded area, and electrically connected to the substrate. At least one of the current-limiting unit and the bridge rectifying unit is bonded on the surround area with a bonding method of surface mount technology. The package body covers the chip-loaded area, and fixes the LED chips on the substrate.

Description

Light-emitting diode package component that directly accepts alternating current

The present invention relates to a light emitting diode package component, and more particularly to a light emitting diode package component that directly accepts alternating current.

Since the current light-emitting diode light source uses a low-voltage power source, it has the advantages of low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, multi-color light emission, etc., and most of the lamps used in the lighting industry currently use light. Diode (LED) light source.

Recently, compared with the DC-driven LED, a newly introduced AC-powered LED source (hereinafter referred to as AC LED source) has the characteristics of more energy saving, longer life. The AC LED light source is a current that allows the light-emitting diode (LED) die to directly use an AC power source for illuminating operation.

However, the AC LED light source often affects the quality of the electrical connection to the AC power source due to the stability of the connection state of the internal components.

Therefore, how to develop a solution to improve the above The lack of inconvenience and inconvenience is an important issue that the relevant industry is currently unable to delay.

In view of the above, it is an object of the present invention to provide a light emitting diode package component that directly accepts alternating current, thereby solving the problems described in the prior art.

In order to achieve the above object, in accordance with an embodiment of the present invention, a light-emitting diode package component that directly accepts alternating current includes a substrate, a plurality of light-emitting diode chips, at least one bridge rectifier unit, at least one current limiting unit, and a package. unit. The substrate is electrically connected to an AC power source. One of the masks of the substrate has a first crystallographic region and a peripheral region surrounding the first crystallographic region. The light emitting diode chip is located on the first crystallographic region and electrically connected to the substrate. The bridge rectifier unit is electrically connected to the substrate for converting AC power of the AC power source into DC power. The current limiting unit is electrically connected to the substrate, the bridge rectifier unit and the LED chip for controlling the DC power supplied to the LED chip. At least one of the bridge rectifier unit and the current limiting unit is disposed on the peripheral area by means of surface adhesion technology. The package unit includes a first encapsulant. The first encapsulant covers the first crystallographic region and fixes the LED chip on the substrate.

In the above embodiment, since at least the bridge rectifier unit or the current limiting unit is disposed on the peripheral area through the surface adhesion technology, the working stability of the bridge rectifier unit or the current limiting unit can be greatly improved, thereby improving communication and communication. The electrical connection quality of the power connection.

In one or more embodiments of the present invention, the LED package component further includes a surrounding unit. The surround unit is on the side of the substrate and surrounds A glue space corresponding to the first crystal zone is formed. The first encapsulant fills the adhesive space and covers both the first crystal region and the LED chip.

In one or more embodiments of the present invention, the substrate further has a second crystal zone. The second crystal zone is located on the peripheral zone. The bridge rectifier unit is disposed on the peripheral zone by surface soldering technology, and the current limiting unit is located in the second crystal zone. The package unit further comprises a second encapsulant. The second encapsulant covers the second crystallographic region and fixes the current limiting unit on the substrate.

In one or more embodiments of the present invention, the substrate further has a second crystal zone. The second crystal zone is located on the peripheral zone. The current limiting unit is disposed on the peripheral area by means of surface soldering technology, and the bridge rectifier unit is located in the second crystallizing area. The package unit further comprises a second encapsulant. The second encapsulant covers the second crystallographic region and fixes the bridge rectifier unit on the substrate.

In one or more embodiments of the present invention, the LED package component further includes a surrounding unit. The surrounding unit is located on the surface of the substrate and surrounds a capacitive space corresponding to the second crystallizing area. The second encapsulant fills the adhesive space and covers the second crystallizing area and one of the bridge rectifier unit and the current limiting unit.

In one or more embodiments of the present invention, the bridge rectifier unit and the current limiting unit are disposed on the peripheral region by means of surface soldering technology. The LED package component further includes at least one voltage stabilizing unit, at least one fuse and at least one surge absorber. The voltage stabilizing unit is located on the substrate, and is electrically connected to the substrate and the current limiting unit. The fuse is located on the substrate and electrically connected to the substrate and the voltage stabilizing unit. The surge absorber is located on the substrate and electrically connected to the substrate and the fuse.

In one or more embodiments of the present invention, the substrate comprises a board body. The plate body is a metal plate or a non-metal plate.

The above description is only for explaining the problems to be solved by the present invention, the technical means for solving the problems, the effects thereof, and the like, and the specific details of the present invention will be described in detail in the following embodiments and related drawings.

10~12‧‧‧Lighting diode package components

100‧‧‧Substrate

110‧‧‧ board

120‧‧‧heat layer

130‧‧‧Insulation

140‧‧‧ solder pads

150‧‧‧first crystal zone

151‧‧‧Setting area

160‧‧‧Second crystal zone

170‧‧‧ surrounding area

180‧‧‧First surround unit

181‧‧‧The first plastic space

190‧‧‧Second surround unit

191‧‧‧Second plastic space

200‧‧‧Light Diode Wafer

210‧‧‧Line

310‧‧‧Bridge rectifier unit

320, 321‧‧‧ current limiting unit

330‧‧‧Stabilizer

340‧‧‧Fuse

350‧‧‧ surge absorber

400‧‧‧Package unit

410‧‧‧First encapsulant

411‧‧‧Package colloid

420‧‧‧Second encapsulant

S‧‧‧AC power supply

P‧‧‧ Ontology

L‧‧‧ pin

The above and other objects, features, advantages and embodiments of the present invention will be more apparent and understood. The description of the drawings is as follows: FIG. 1 illustrates a light-emitting diode directly receiving alternating current according to an embodiment of the present invention. 2 is a cross-sectional view of the package component; FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1; and FIG. 3 is a perspective view of the LED package component directly receiving AC power according to another embodiment of the present invention; 4 is a functional block diagram of a light emitting diode package component that directly accepts alternating current according to still another embodiment of the present invention.

The plural embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, a number of practical details will be described in the following description. However, it should be understood by those skilled in the art that these practical details are not necessary in some embodiments of the present invention and therefore are not intended to limit the present invention. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings. In addition, the dimensions of the various elements in the drawings are not shown in actual scale for the convenience of the reader.

FIG. 1 is a perspective view of a light emitting diode package component 10 directly receiving alternating current according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line 2-2 of Fig. 1. As shown in FIG. 1 and FIG. 2 , the LED device 10 directly receiving AC power includes a substrate 100 , a plurality of LED chips 200 , a bridge rectifier unit 310 , and a current limiting unit 320 . A package unit 400. The substrate 100 has opposite sides, one side of which is divided into a first crystal region 150, a second crystal region 160 and a peripheral portion 170 of the remaining position. The substrate 100 is electrically connected to an external AC power source (for example, a commercial AC power source, not shown) through a wiring pattern (not shown). The LED chips 200 are located on the first crystal region 150 and electrically connected to the substrate 100. The bridge rectifier unit 310 is disposed on the peripheral region 170 by means of a surface adhesion technique. The bridge rectifier unit 310 is electrically connected to the substrate 100 for converting AC power of the AC power source into DC power. The current limiting unit 320 is located on the second crystal placing region 160 and electrically connected to the substrate 100. The current limiting unit 320 is electrically connected to the substrate 100, the bridge rectifier unit 310, and the LED chip 200 for controlling the amount of direct current power supplied to the LED 200. The package unit 400 includes a first encapsulant 410 and a second encapsulant 420. The first encapsulant 410 covers the first crystal region 150 and fixes the LED wafer 200 on the substrate 100. The second encapsulant 420 covers the second crystal region 160 and fixes the current limiting unit 320 on the substrate 100.

In this embodiment, since at least the bridge rectifier unit 310 is disposed on the peripheral region 170 by means of surface adhesion technology, the working stability of the bridge rectifier unit 310 can be greatly improved, thereby improving the electrical connection with the AC power source. quality.

Specifically, the substrate 100 includes a board 110 and a heat dissipation layer. 120, an insulating layer 130 and a plurality of conductive pads 140. The plate body 110 is interposed between the heat dissipation layer 120 and the insulation layer 130. The heat dissipation layer 120 is located on one side of the board 110 to improve the heat dissipation performance of the LED package component 10. The insulating layer 130 is located on the other side of the plate body 110, exposing two portions of the plate body 110 to become the first crystallizing region 150 and the second seeding region 160 described above. The conductive pads 140 are respectively disposed in the first and second crystal regions 150 and 160, and are spaced apart from each other on the surface of the substrate 110 for the light-emitting diode 200 and the current limiting unit 320 to pass through the substrate 100. The line pattern is electrically connected to the AC power source S.

In the embodiment, the plate body 110 is a metal plate (such as the aluminum substrate 100, the copper substrate 100) or a non-metal plate (such as the ceramic substrate 100). However, the present invention is not limited thereto. In other embodiments, the board 110 may also be a printed circuit board or a flexible circuit board or the like. In addition, in the present embodiment, the material of the first encapsulant 410 and the second encapsulant 420 is, for example, a translucent resin (such as eucalyptus or epoxy) or other conventional materials. It should be understood that the first encapsulant 410 and the second encapsulant 420 are not limited by the type, material, molding time point or volume.

In this embodiment, for example, each of the LED chips 200 is a blue LED wafer 200, and each of the LED chips 200 is electrically connected by wire-bonding. The conductive pads 140 (positive and negative) corresponding to the two sides are connected, and the substrate 100 is electrically connected through the conductive pads 140.

For example, the current limiting unit 320 is a current limiting chip or the like, and the current limiting unit 320 is electrically connected to the conductive pads 140 (positive and negative) corresponding to the two sides through a wire-bonding connection. Conductive pad 140 The substrate 100, the bridge rectifier unit 310, and the LED array 200 are electrically connected. The bridge rectifier unit 310, such as a bridge rectifier or a bridge rectifier wafer, is an integrated circuit package component. The integrated circuit package component includes a package body P and at least two pins L. The pins L are respectively arranged on opposite sides of the package body P, and are respectively bently extended from opposite sides of the package body P, and the pins L are respectively soldered to the corresponding conductive pads 140 on both sides thereof. The positive electrode and the negative electrode are electrically connected to the substrate 100 through the conductive pad 140.

In addition, since the bridge rectifier unit 310 converts the alternating current of the alternating current power source into direct current, the current limiting unit 320 can sequentially control the direct current power used by any number of the light emitting diode chips 200 to sequentially illuminate a certain number. Light-emitting diode wafer 200.

Further, the LED package component 10 further includes a first surrounding unit 180 and a second surrounding unit 190. The first surrounding unit 180 is located on the substrate 100 , for example, on the first surface of the substrate 100 , and surrounds a first capacitive space 181 corresponding to the first crystal forming region 150 . The second surrounding unit 190 is located on the substrate 100 , for example, on the first surface of the substrate 100 , and surrounds a second capacitive space 191 corresponding to the second crystal forming region 160 . In this way, the first encapsulant 410 is contacted with the inner wall of the first surrounding unit 180 and fills the first capacitive space 181 while covering the first crystallizing area 150 and the light emitting diode. The wafer 200 is such that the second encapsulant 420 can contact the inner wall of the second surrounding unit 190 and fill the second adhesive space 191 while covering the second crystal region 160 and the current limiting unit 320. However, the present invention is not limited thereto. In other embodiments, the first surrounding unit may be omitted, and only the first encapsulating layer covers the first crystallographic region and the LED substrate simultaneously, and/or the second ring is omitted. Around the unit, only the second encapsulation colloid covers the second crystal zone and the current limiting unit.

It should be noted that although the first crystallizing region 150 is disposed in the center of the substrate 100 in a circular shape, and the second crystallizing region 160 is disposed in a square shape on the side edge of the substrate 100, the present invention is not limited thereto, and other embodiments are In the present, the person having ordinary knowledge can also arbitrarily change the shape or position of the first and second crystal regions according to requirements or restrictions.

However, the present invention is not limited thereto, and reference is made to FIG. 1 . In another embodiment, conversely, the current limiting unit 320 is disposed on the peripheral region 170 by means of surface adhesion technology. More specifically, the current limiting unit 320 is an integrated circuit package component. The integrated circuit package component includes a package body P and at least two pins L. The pins L are respectively arranged on opposite sides of the package body P, and are respectively bently extended from opposite sides of the package body P, and the pins L are respectively soldered to the corresponding conductive pads 140 on both sides thereof. The positive electrode and the negative electrode are electrically connected to the substrate 100 through the conductive pad 140. The bridge rectifier unit 310 is located on the second crystal region 160, and is electrically connected to the corresponding conductive pads 140 (positive and negative electrodes) on both sides thereof through a wire-bonding connection, and is electrically transmitted through the conductive pads 140. The substrate 100 is connected to the above. The second encapsulant 420 covers the second crystal region 160 and fixes the bridge rectifying unit 310 on the substrate 100.

FIG. 3 is a perspective view of a light emitting diode package component 11 directly receiving alternating current according to another embodiment of the present invention. As shown in FIG. 3, the LED package component 11 of another embodiment includes a substrate 100, a plurality of LED packages 200, a bridge rectifier unit 310, a current limiting unit 321 and a first encapsulant. 410. One of the masks of the substrate 100 has a crystal region 151 and a peripheral region 170 surrounding the crystal region 151. The substrate 100, for example, a line passing therethrough The road pattern (not shown) is electrically connected to an external AC power source (for example, a commercial AC power source, not shown). The LED chips 200 are located on the crystallizing region 151 and electrically connected to the substrate 100. Both the bridge rectifier unit 310 and the current limiting unit 321 are disposed on the peripheral region 170 by means of a surface adhesion technique. The encapsulant 411 covers the crystal region 151 and fixes the LED chip 200 on the substrate 100. Since the functions of the bridge rectifier unit 310 and the current limiting unit 321 are the same as described above, they are not described herein again.

In this embodiment, since the bridge rectifying unit 310 and the current limiting unit 321 are all disposed on the peripheral area 170 by means of surface adhesion technology, the working stability of the bridge rectifying unit 310 and the current limiting unit 321 can be greatly improved. This further improves the quality of the electrical connection to the AC power source.

FIG. 4 is a functional block diagram of a light emitting diode package component 12 directly receiving alternating current according to still another embodiment of the present invention. As shown in FIG. 4, the LED package component 12 of FIG. 4 is substantially the same as the LED package component 10 of FIG. 1. One of the differences is that the LED package component 12 further includes at least one stable The pressing unit 330, the at least one fuse 340 and the at least one surge absorber 350. The voltage stabilizing unit 330, the fuse 340 and the surge absorber 350 are sequentially or selectively arranged on the LED package component 12 (such as a substrate) and electrically connected between the AC power source S and the LED chip 200. . In other words, the voltage stabilizing unit 330 is electrically connected to the bridge rectifier unit 310 and the current limiting unit 320 through the substrate 100. The fuse 340 is electrically connected to the surge absorber 350 and the voltage stabilizing unit 330 through the substrate 100. The surge absorber 350 is electrically connected to the AC power source S and the fuse 340 through the substrate 100.

Due to the surge absorber 350, fuse 340, voltage regulator unit 330, the bridge rectifier unit 310 and the current limiting unit 320 are simultaneously disposed on the substrate 100, so that the alternating current (AC) from the alternating current power source S passes through the surge absorber 350, the fuse 340, the voltage stabilization unit 330, and the bridge rectifier. Unit 310 and current limiting unit 320, in turn, are capable of providing a stable direct current (DC) for use with light emitting diode wafer 200.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

10‧‧‧Lighting diode package components

100‧‧‧Substrate

140‧‧‧ solder pads

150‧‧‧first crystal zone

160‧‧‧Second crystal zone

170‧‧‧ surrounding area

180‧‧‧First surround unit

181‧‧‧The first plastic space

190‧‧‧Second surround unit

191‧‧‧Second plastic space

200‧‧‧Light Diode Wafer

210‧‧‧Line

310‧‧‧Bridge rectifier unit

320‧‧‧ Current limiting unit

400‧‧‧Package unit

410‧‧‧First encapsulant

420‧‧‧Second encapsulant

P‧‧‧ Ontology

L‧‧‧ pin

Claims (8)

A light-emitting diode package component directly receiving an alternating current, comprising: a substrate for electrically connecting an alternating current power source, wherein a mask of the substrate has a first crystallizing area and a peripheral area surrounding the first crystallizing area; a plurality of light emitting diode chips are disposed on the first crystallizing region and electrically connected to the substrate; at least one bridge rectifier unit electrically connected to the substrate for converting the alternating current power of the alternating current power source into direct current power; at least one limit a flow unit electrically connected to the substrate, the bridge rectifier unit and the LED chips for controlling a DC power supplied to the LED chips, wherein the bridge rectifier unit and the current limiting At least one of the cells is disposed on the peripheral region by a surface adhesion technique; and a package unit includes a first encapsulant, the first encapsulant covers the first crystal region, and the LEDs are fixed The wafer is on the substrate. The light-emitting diode package component directly receiving the alternating current according to claim 1, further comprising: a surrounding unit located on the surface of the substrate, and surrounding a capacitive space corresponding to the first crystallizing area, The first encapsulant fills the adhesive space and covers the first crystal region and the LED chips at the same time. The light-emitting diode package component of claim 1 , wherein the substrate further has a second crystal region, wherein the second crystal region is located on the peripheral region, wherein the bridge rectifier unit transmits the surface Welding technology The method is disposed on the peripheral region, and the current limiting unit is located in the second crystallizing region; and the packaging unit further comprises a second encapsulant, the second encapsulant covers the second crystal region, and The current limiting unit is fixed on the substrate. The illuminating diode package component of claim 1 , wherein the substrate further has a second crystal region, wherein the second crystal region is located on the peripheral region, wherein the current limiting unit is affixed through the surface a soldering technique is disposed on the peripheral region, and the bridge rectifier unit is located in the second crystal region; and the package unit further includes a second encapsulant, the second encapsulant covers the second crystal region And fixing the bridge rectifier unit on the substrate. The LED package component of claim 3 or 4, further comprising: a surrounding unit, located on the surface of the substrate, and surrounding a capacitor corresponding to the second crystal region a space, wherein the second encapsulant fills the adhesive space and covers the second crystallizing region and one of the bridge rectifier unit and the current limiting unit. The light-emitting diode package component of claim 1 , wherein the bridge rectifier unit and the current limiting unit are disposed on the peripheral region by surface soldering technology. The light-emitting diode package component of claim 1 , further comprising: at least one voltage stabilizing unit, located on the substrate, electrically connecting the substrate and the current limiting unit; at least one fuse located on the substrate And electrically connecting the substrate and the voltage stabilizing unit; and at least one surge absorber located on the substrate, electrically connecting the substrate and the fuse. The light-emitting diode package component of claim 1 , wherein the substrate comprises a plate body, and the plate body is a metal plate or a non-metal plate.