CN1977399A - LED component and method for manufacturing same - Google Patents
LED component and method for manufacturing same Download PDFInfo
- Publication number
- CN1977399A CN1977399A CNA200680000435XA CN200680000435A CN1977399A CN 1977399 A CN1977399 A CN 1977399A CN A200680000435X A CNA200680000435X A CN A200680000435XA CN 200680000435 A CN200680000435 A CN 200680000435A CN 1977399 A CN1977399 A CN 1977399A
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- Prior art keywords
- led
- heating panel
- circuit board
- led chip
- member manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
An LED component is provided with a wiring board having a through hole at a center portion, a heat sink stored inside the through hole, an LED chip mounted on the heat sink, a connecting section for electrically connecting the LED chip with the wiring board, and a transparent resin for covering the LED chip and the connecting section. The LED component efficiently dissipates heat of the LED chip and has excellent productivity.
Description
Technical field
The present invention relates to the surface mounting LED parts and the manufacture method thereof of fine heat radiation property.
Background technology
Well-known is the structure of following LED parts such as existing light-emitting diode: led chip is installed on various substrates, and utilize terminal conjunction method or salient point that (bump-mounting) is installed, described led chip is connected with electrode pattern on being formed on various substrates, the transparent insulator that forms the double as lens on the surface of led chip (for example, Japan Patent discloses in communique 2004-207369 number and puts down in writing).
Figure 40 represents the profile of existing surface mounting LED parts.As shown in figure 40, existing surface mounting LED parts comprise: circuit board 100 is formed with conductor wiring portion 200,300 at two ends; Led chip 500 uses adhesive 400 to carry in a conductor wiring portion 200; Lead-in wire 600 mainly is made of gold etc., utilizes terminal conjunction method, connects led chip 500 and conductor wiring portion 200,300; And protective layer 700, form in the mode that covers described lead-in wire 600 and the surface of led chip 500.
And circuit board 100 uses smooth coating foil printed base plate.Led chip 500 uses the Ag cream as adhesive 400, by chip join (die-bonding) on circuit board 100.And then when carrying out mounted on surface on printed base plate etc., the conductor wiring portion 200,300 at the two ends of circuit board 100 is used as the soldering connecting portion.
But, in the described existing structure, have problem aspect thermal diffusivity when making LED parts long-time continuous luminous or the thermal diffusivity when led chip being supplied with big electric current in order to be used to throw light on.And then from the reliability angle, the electrostatic breakdown that produces in the low voltage drive development of technology of semiconductor device is becoming problem.
Summary of the invention
LED parts of the present invention comprise: the circuit board that is provided with through hole (opening) at central portion, be housed in the heating panel of through hole inboard, be installed in the led chip on the heating panel, be electrically connected the connecting portion of led chip and circuit board, and the transparent resin that covers led chip and connecting portion.
Utilize described structure, the heat that LED parts of the present invention can make led chip send distributes effectively.
And, LED parts of the present invention are provided with through hole at the central portion of the circuit board that is built-in with varistor element, and will be equipped with the inside of the heating panel engagement arrangement of led chip at described through hole, led chip is connected in parallel with the varistor element of establishing in circuit board, and utilizes transparent resin to bury led chip underground.
Utilize described structure, the heat that LED parts of the present invention can make led chip send is dispelled the heat effectively, and can realize surface mounting LED parts and its manufacture method that antistatic property is good.
Description of drawings
Fig. 1 is the profile of the LED parts in first execution mode of the present invention.
Fig. 2 is the profile in order to the LED parts that other examples in first execution mode of the present invention are described.
Fig. 3 is in order to the profile of the LED member manufacturing method in first execution mode of the present invention to be described.
Fig. 4 is in order to the profile of the LED member manufacturing method in first execution mode of the present invention to be described.
Fig. 5 is in order to the profile of the LED member manufacturing method in first execution mode of the present invention to be described.
Fig. 6 is in order to the profile of the LED member manufacturing method in first execution mode of the present invention to be described.
Fig. 7 is in order to the profile of the LED member manufacturing method in first execution mode of the present invention to be described.
Fig. 8 is the profile of the LED parts in second execution mode of the present invention.
Fig. 9 is the profile in order to other examples that the LED parts in second execution mode of the present invention are described.
Figure 10 is in order to the profile of the LED member manufacturing method in the 3rd execution mode of the present invention to be described.
Figure 11 is in order to the profile of the LED member manufacturing method in the 3rd execution mode of the present invention to be described.
Figure 12 is in order to the profile of the LED member manufacturing method in the 3rd execution mode of the present invention to be described.
Figure 13 is in order to the profile of the LED member manufacturing method in the 3rd execution mode of the present invention to be described.
Figure 14 is the profile in order to other examples that the LED parts in the 3rd execution mode of the present invention are described.
Figure 15 is the profile of the LED parts in the 4th execution mode of the present invention.
Figure 16 is the profile of the LED parts of other examples in the 4th execution mode of the present invention.
Figure 17 is in order to the profile of the LED member manufacturing method in the 4th execution mode of the present invention to be described.
Figure 18 is in order to the profile of the LED member manufacturing method in the 4th execution mode of the present invention to be described.
Figure 19 is in order to the profile of the LED member manufacturing method in the 4th execution mode of the present invention to be described.
Figure 20 is in order to the profile of the LED member manufacturing method in the 4th execution mode of the present invention to be described.
Figure 21 is in order to the profile of the LED member manufacturing method in the 4th execution mode of the present invention to be described.
Figure 22 is in order to the profile of the LED member manufacturing method in the 4th execution mode of the present invention to be described.
Figure 23 is the profile of the LED parts in the 5th execution mode of the present invention.
Figure 24 is the profile of the LED parts of other examples in the 5th execution mode of the present invention.
Figure 25 is the profile of the LED parts in the 6th execution mode of the present invention.
Figure 26 is the profile of the LED parts of other examples in the 6th execution mode of the present invention.
Figure 27 is in order to the profile of the LED member manufacturing method in the 6th execution mode of the present invention to be described.
Figure 28 is in order to the profile of the LED member manufacturing method in the 6th execution mode of the present invention to be described.
Figure 29 is in order to the profile of the LED member manufacturing method in the 6th execution mode of the present invention to be described.
Figure 30 is in order to the profile of the LED member manufacturing method in the 6th execution mode of the present invention to be described.
Figure 31 is in order to the profile of the LED member manufacturing method in the 6th execution mode of the present invention to be described.
Figure 32 is in order to the profile of the LED member manufacturing method in the 6th execution mode of the present invention to be described.
Figure 33 is the profile of the LED parts in the 7th execution mode of the present invention.
Figure 34 is in order to the profile of the LED member manufacturing method in the 7th execution mode of the present invention to be described.
Figure 35 is in order to the profile of the LED member manufacturing method in the 7th execution mode of the present invention to be described.
Figure 36 is in order to the profile of the LED member manufacturing method in the 7th execution mode of the present invention to be described.
Figure 37 is in order to the profile of the LED member manufacturing method in the 7th execution mode of the present invention to be described.
Figure 38 is in order to the profile of the LED member manufacturing method in the 7th execution mode of the present invention to be described.
Figure 39 is the profile of the LED parts of other examples in the 7th execution mode of the present invention.
Figure 40 is the profile of existing LED parts.
The explanation of Reference numeral
1 circuit board
2 wiring patterns
3 adhesives
4 led chips
5 lead-in wires
6 transparent resins
7 heating panels
7a, 7b, 7c, 7d heating panel
8 reflectance coatings
9 reflectings surface
10 claws
11 through holes
12 through holes
13 wiring patterns
14 wiring patterns
15 hole portions
34 heating panels
101 circuit boards
102 wiring patterns
103 wiring patterns
104 adhesives
105 led chips
105a flip chip type led chip
106 lead-in wires
107 transparent resins
108,108a, 108b, 108c heating panel
108d, 108e, 108f heating panel
109 reflectings surface
110 reflectance coatings
111 claws
112 through holes
122 resin plasters
123 insulating pastes
131 become resistance material (varistor material)
132 become resistance electrode (varistor electrode)
133 become resistance electrode
134 become resistance electrode
135 varistor elements (varistor element)
136 salient points
Embodiment
(first execution mode)
Below, with reference to LED parts and the manufacture method thereof in description of drawings first execution mode of the present invention.
Fig. 1 is the profile in order to the structure that the surface mounting LED parts in first execution mode of the present invention are described, Fig. 2 is the profile of the LED parts of other examples.
Among Fig. 1, preferred circuit board 1 uses ceramic substrates such as resin substrate such as glass-epoxy or aluminum oxide substrate.On described circuit board 1, form performance as the wiring pattern 2 of wiring with the effect of the termination electrode of surface mounting assembly.Use electrode materials such as copper or silver in the preferred described wiring pattern 2.
And be following structure: the central portion at described circuit board 1 is provided with through hole 12, at the internal configurations of described through hole 12 heating panel 7 better than the thermal conductivity of circuit board 1.And then, utilize chip join, use adhesive 3 with conductivity, led chip 4 is bonded on the one side of described heating panel 7.And then, use the lead-in wire 5 of gold etc., utilize terminal conjunction method to be electrically connected pad and led chip 4 on the part that is arranged on wiring pattern 2.
In the described structure, importantly make the thermal conductivity of heating panel 7 higher than the thermal conductivity of circuit board 1.From the angle of production capacity, resin substrates such as circuit board 1 preferred use glass-epoxy.As other circuit boards 1, also can use polyimide substrate, glass substrate, SOI substrate or porcelain enamel substrate etc.Wherein, so-called SOI substrate is to utilize oxide-film that silicon substrate after the insulation processing is carried out on the surface.And, for requiring the more LED parts of high brightness and heat-resisting reliability, the preferred use with the ceramic substrate as main component such as aluminium oxide.
And preferred heating panel 7 uses the good metal material of thermal conductivity.Especially, as the good metal material of thermal conductivity, the gold that silver that preferred thermal conductivity is the aluminium of 240W/mK, copper that thermal conductivity is 400W/mK, thermal conductivity is 430W/mK or thermal conductivity are 340W/mK etc.Can use the good metallic plate of described thermal conductivity as heating panel 7, and can use the high glass-epoxy substrate of productivity ratio, the resin substrate of polyamide, polyimides etc., or the ceramic substrate of excellent heat resistance etc. is as circuit board 1.
And then, by using ceramic substrates such as good aluminium oxide of thermal endurance and insulating properties or forsterite, talcum, low-temperature sintered ceramics substrate, also can realize the LED parts that thermal endurance and insulating properties are better as heating panel 7.And, for requiring more high-cooling property and stable on heating purposes, also can use ceramic materials such as the better aluminium nitride of thermal conductivity, carborundum.
And, utilize structure as shown in Figure 1, configuration forms the heat transmission copper coin on the circuit substrate that the LED parts are installed, and use the good adhesive of thermal conductivity that heating panel 7 is fixed on the described copper coin, thereby the heat that sheds from heating panel 7 directly can be distributed on the copper coin that is formed on the circuit substrate.
And then, also can use metal material as heating panel 7, like this, in the time of on the LED parts being installed in circuit substrate etc., it is connected in circuit substrate via heating panel 7 ground connection, perhaps utilizes good adhesive of thermal conductivity or scolder fixedly heating panel 7 and circuit substrate, improves installation strength with this.
And, when being necessary for insulation between led chip 4 and the heating panel 7, preferably on the one side that led chip 4 is installed of the heating panel 7 that metal constitutes, form thin dielectric film.Wherein, because dielectric film hinders heat radiation, so that the thickness of dielectric film is preferably is thin as much as possible.
In addition, also can have aluminium nitride or carborundum etc. more that the ceramic material of high-termal conductivity is used for heating panel 7, described aluminium nitride or carborundum etc. are for improving the necessary minimum of heat radiation of led chip 4.
Secondly, wiring pattern 2 can form in the following manner, that is, by photoetching or electroplate attached to the Copper Foil on glass-epoxy (glass-epoxy) substrate or be formed on the lip-deep copper electrode of aluminum oxide substrate, or the method by printing conductive cream.As for described conductive paste, can use the resin system conductive paste that comprises silver or copper.And, also can use to comprise nano metal powder or organometallic conductivity favorable conductive cream.
And, when using ceramic material such as aluminum oxide substrate, can use the high-temperature firing conductive paste of firing more than 500 ℃, below 1400 ℃ as circuit board 1.The described conductive paste that is used for high-temperature firing preferably uses the precious metal materials such as alloy of silver, gold, platinum, palladium (Pd) and described each metal, perhaps uses the base metal materials such as alloy of copper, nickel, tungsten, molybdenum and described each metal.
And, utilize the soldering material with the LED part bonding on circuit substrate the time, at the soldering portion lamination plated nickel film of wiring pattern 2 or tin-plated coating film etc., to prevent because the changes in material of the wiring pattern 2 that the mutual diffusion of electrode material brings.
Led chip 4 and go between 5 insulation protection and the transparent resin 6 that plays a role as lens preferably use thermal-curable acrylic resinoid or epoxy resin etc.Transparent resin 6 covers whole LED chip 4, and covers the lead-in wire 5 and the pad of the connecting portion that constitutes led chip 4 and circuit board 1.
Secondly, the structure of the LED parts of other examples shown in Figure 2 is described.
In the structure of LED parts shown in Figure 2, with the obvious difference of the structure of LED parts shown in Figure 1 be, make heating panel 7 thinner than the thickness of circuit board 1, make the lift-launch face of led chip 4 lower with this than the plane of circuit board 1, form with the one side of heating panel 7 as the bottom surface, utilize the void structure of inside wall of the through hole 12 of circuit board 1.And then, in the interior perimembranous of the through hole 12 that forms described void structure the conical surface 80 is set, with the inclined plane of the described conical surface 80 as led chip 4 reflecting plate when luminous.
Utilize described structure, can realize compared with LED parts shown in Figure 1 the LED parts that luminous efficiency is better.The shape of the conical surface that preferably will be arranged on the interior perimembranous of described through hole 12 is processed as catoptrical effectively shape.That is, the shape of the described conical surface 80 is processed as coniform, curve-like, can realizes the LED parts that reflectivity is good with this.
And then, on the interior perimembranous surface of the through hole 12 that is provided with the described conical surface 80, be provided with and use the good film forming reflectance coating 8 of metal material of reflectivity.By the LED parts that described reflectance coating 8 can realize that luminous efficiency is better are set, described reflectance coating 8 can form by forming metallic film.
In addition, on the surface of the heating panel 7 that led chip 4 is installed, also can form described reflectance coating 8, can realize the LED parts that reflectivity is better with this.
Secondly, use Fig. 3～Fig. 7 that LED member manufacturing method of the present invention is described.In this first execution mode, the LED member manufacturing method of being made heating panel 7, being made of as wiring plate 1 aluminum oxide substrate by metal material is described.
At first, as first step, as shown in Figure 3, make and to carry out perforate in advance and handle the aluminum oxide substrate that obtains through hole 11 and through hole 12 as circuit board 1 (below, be called aluminum oxide substrate 1), wherein, through hole 11 is as slot segmentation, the LED parts are divided into single, and as the termination electrode of single LED parts, through hole 12 is used to insert heating panel 7.
Secondly, as shown in Figure 4, utilize silk screen print method, use silver paste to form wiring pattern 13,14 on the two sides of aluminum oxide substrate 1 and the inwall of through hole 11.
Secondly, as second step, as shown in Figure 5, metal material processing such as the aluminium that thermal conductivity is good, copper are after having the heating panel 7 of regulation shape, as third step, described heating panel 7 is pressed into the inside of through hole 12 or utilizes adhesive bond and fix.At this moment, for the thermal conductivity that suppresses to be caused by adhesive reduces, preferably use good thermal hole of thermal diffusivity or chip join with conductive adhesive etc. as adhesive.
Secondly,, as shown in Figure 6, use adhesive 3, make led chip 4 be fixed on the one side of heating panel 7 as the 4th step.
Afterwards,, use lead wire connecting apparatus,, utilize the lead-in wire 5 of gold to be electrically connected electrode pad portion on led chips 4 and the wiring pattern 13 that is arranged on circuit board 1 by wire-bonded as the 5th step.
Secondly, as the 6th step, transparent resins 6 such as acrylic resin that the coating permeability is good or epoxy resin, the effect of described transparent resin 6 performance insulation protections and the effect that makes the lens of the optical convergence that led chip 4 sends.At this moment, by selecting suitable viscosity or rubbing method so that the shape of transparent resin 6 becomes the lens shape of regulation.And described transparent resin 6 also has the effect that engages of strengthening circuit board 1 and heating panel 7.
Secondly, as shown in Figure 7, can be in the part of through hole 11 with aluminum oxide substrate 1 cutting or be divided into half, make through individualized and mounted on surface LED parts independently with this.
As mentioned above, the inside of the through hole 12 that on the part of lift-launch, forms as the circuit board 1 of the led chip 4 of this first execution mode, the good heating panel 7 of configuration thermal conductivity can be realized surface mounting LED parts and manufacture method thereof that fine heat radiation property and productivity ratio are good.
(second execution mode)
Below, with reference to LED parts and the manufacture method thereof in description of drawings second execution mode of the present invention.
Fig. 8 is the profile in order to the structure that the surface mounting LED parts in second execution mode of the present invention are described, Fig. 9 is in order to the profile of other examples to be described.
Among Fig. 8, Fig. 9, the structure of the LED parts in this second execution mode and the obvious difference of first execution mode are the shapes of heating panel 7a, 7b.The obvious characteristic of heating panel 7a, the 7b of second execution mode is recess is set and forms void structure.
Fig. 8 and heating panel 7a, 7b utilization shown in Figure 9 are carried out machining to good metals of thermal conductivity such as aluminium, copper or silver and are formed void structure.Constitute and be provided with the space that led chip 4 can be installed in the bottom surface of described void structure.
And, in the interior perimembranous of the recess of the void structure that forms described heating panel 7a, 7b, utilize mould molding or polishing etc. to be provided with the conical surface, form reflecting surface 9 with this.Keep the regulation angle of inclination by the conical surface that makes described reflecting surface 9, thereby lift-launch is assembled efficiently at the radiating light of the led chip 4 of the bottom surface of the void structure of heating panel 7a, 7b, perhaps luminous efficiency can be improved, thereby the luminance of LED parts can be controlled.
In addition, can make reflection of light better with this with being provided with the reflecting surface 9 surperficial mirror-polishings of the conical surface of the interior perimembranous of described recess.
And, for the light of led chip 4 more effectively being reflected, utilizing thin film techniques such as electroplating surface or evaporation at described reflecting surface 9, the material that reflectivity is higher forms reflectance coating 9a, can realize the LED parts that reflection characteristic further improves with this.Therefore, in heating panel 7a, 7b, use the good metal material of thermal conductivity, and the good reflectance coating of interior perimembranous formation reflectivity of the recess that on described heating panel 7a, 7b, forms, can realize productivity ratio and the good LED parts of luminous efficiency with this.
Secondly, as shown in Figure 9, when utilizing mould molding, use metallic plate formation heating panel 7b, can utilize mould molding to form claw 10, by described claw 10 is set, in the time of can inserting heating panels 7 at through hole 12, with the insertion depth adjustment and remain certain degree of depth to circuit board 1.
In addition, described claw 10 also can have projection continuous as along portion.
As mentioned above, in this second execution mode, heating panel 7a, 7b use metal material of lift-launch led chip 4 etc. and machining can easily form void structure with this, and can form reflecting surface 9 simultaneously on heating panel 7.Utilize described structure, can realize the miniaturization of LED parts, realize the LED parts that productivity ratio is high simultaneously.
In addition, also ceramic forming material that can thermal conductivity is good and form the shape of heating panel 7a, 7b at this moment, except that above-mentioned effect, also can be realized the LED parts that thermal endurance is better.
(the 3rd execution mode)
Below, with reference to LED parts and the manufacture method thereof in description of drawings the 3rd execution mode of the present invention.
Figure 10～Figure 13 is in order to the profile of the LED member manufacturing method in the 3rd execution mode of the present invention to be described, Figure 14 is the profile of other examples of the LED parts in this 3rd execution mode.
The basic structure of the surface mounting LED parts in the 3rd execution mode of the present invention has structure shown in Figure 8, and the obvious difference of the LED parts in this 3rd execution mode and the LED parts of second execution mode is the material of heating panel 7a.In the LED parts in this 3rd execution mode, replace the heating panel 7a of Fig. 8 to use heating panel 7c.Described heating panel 7c is made of the resin that contains the good metallic stuffing of thermal conductivity (heat filling).Below explanation is used for the metallic stuffing of described heating panel 7c.At first, the powder of copper, aluminium, gold, silver etc. and epoxy resin etc. is mixing, make resin plaster with this.After the resin plaster of made is filled in the inside of the through hole 12 that is formed on the circuit board 1, make it hot curing.Because by making it hot curing, can make the formation of heating panel 7c and carry out, so can realize the LED parts that productivity ratio is good with engaging simultaneously of circuit board 1.
And then, replace described metallic stuffing and when using inorganic filler, except that above-mentioned effect, can further obtain the also good LED parts of insulating properties.By using aluminium oxide, aluminium nitride, carborundum, magnesium oxide etc., can realize the LED parts that thermal diffusivity and productivity ratio are good as inorganic filler.
That is, heating panel 7c is after the resin plaster that thermal conductivity good metal powder or ceramic powders are added with filler as heat conduction is filled in the inside of through hole 12 of circuit board 1, is heating and curing and makes.Simultaneously, in described step, utilize mould molding or be machined in heating panel 7c and go up the formation recess, thereby be processed as the structure that is provided with void structure.
About content in addition, so because have the structure omission explanation roughly the same with second execution mode.
Utilize described structure, can be in being heating and curing of resin plaster, carry out engaging of circuit board 1 and heating panel 7c, and form the coefficient of expansion of controlling circuit board 1 and heating panel 7c by the material that changes resin plaster.
Secondly, use Figure 10～Figure 14 illustrates the LED member manufacturing method in this 3rd execution mode.
At first,, as shown in figure 10, form wiring pattern 13,14, and make and carry out perforate and handle and be formed with the aluminum oxide substrate of through hole 11 and through hole 12 as circuit board 1 as first step.
Secondly, as second step, utilize silk screen print method to fill the resin plaster 22 that contains metallic stuffings such as silver after, as third step, the resin plaster 22 of being filled be heating and curing and make heating panel 7, engage with circuit board 1 simultaneously.The metallic stuffing of Shi Yonging herein, the more preferably metal dust of the gold, silver that thermal conductivity is good, aluminium, copper etc.And then, change heating panel 7 that can the design code thermal conductivity by the containing ratio that makes described metallic stuffing.
And, except metallic stuffing, can also use inorganic filler.By using the good ceramic powders of thermal conductivity such as aluminium oxide, aluminium nitride, carborundum, magnesium oxide, can realize the good LED parts of wear properties such as thermal endurance, moisture-proof.
In addition, preferably in described resin plaster 22, use the little material of cure shrinkage.
Secondly, utilize machining, the resin plaster 22 that is heated curing is formed the shape of heating panel 7c as shown in figure 11.Utilization forms the heating panel 7c of described shape, can bring into play with second execution mode in the illustrated same function of heating panel 7a.Afterwards, use the conductive paste of silver or copper etc., utilize print process, form wiring pattern 13,14 on the two sides of circuit board 1 and the inwall of through hole 11.
Afterwards,, as shown in figure 12, use adhesive 3, led chip 4 is fixed on the recess bottom surface of heating panel 7c as the 4th step.
Secondly,, and then utilize lead wire connecting apparatus, carry out wire-bonded, utilize the lead-in wire 5 of gold to be electrically connected welding disk on the part of led chips 4 and the wiring pattern 13 that is arranged on circuit board 1 as the 5th step.
Secondly,, in order to protect led chip 4 and lead-in wire 5, and, use the good transparent resin 6 of permeability, cover led chip 4 and lead-in wire 5 in order to bring into play the effect that makes the lens that the light that sends assembles as the 6th step.Afterwards, through hole 11 as the benchmark of cutting apart, is cut apart, the single shape that turns to regulation can be finished surface mounting LED parts shown in Figure 13 with this.
As mentioned above, in this 3rd execution mode, can on the circuit board 1 that is equipped with led chip 4, form the good heating panel 7c of productivity ratio, and can realize the LED parts and the manufacture method thereof of miniaturization.
And, as shown in figure 14, also can be in the recess bottom surface of the heating panel 7c that constitutes by the resin plaster that contains filler, the heating panel 34 that configuration is formed by flatness and the better metal of thermal conductivity or ceramic material.Utilize described structure, can realize the LED parts and the manufacture method thereof of miniaturization more.
And, can in described heating panel 34, use ceramic materials such as metal materials such as thermal conductivity good gold, silver, aluminium and copper or aluminium oxide, aluminium nitride, carborundum, magnesium oxide.
(the 4th execution mode)
Below, with reference to LED parts and the manufacture method thereof in description of drawings the 4th execution mode of the present invention.
Figure 15 is the profile in order to the structure that the surface mounting LED parts in the 4th execution mode of the present invention are described, Figure 16 is the profile of the LED parts of other examples.
Among Figure 15, because the varistor element 135 of built-in ceramic material, so circuit board 101 preferred use aluminium oxide, forsterite or talcums etc. have the stable on heating ceramic substrate more than 500 ℃.And, on the one side of described circuit board 101, form varistor element 135 as follows, that is, across becoming resistance material 131, become resistance electrode 132 and become resistance electrode 133 in opposite directions, and become resistance electrode 134 and become resistance electrode 133 in opposite directions.
For example, described varistor element 135 is on the aluminum oxide substrate of having fired, alternately lamination is by becoming the printed wiring layer that printed circuit board (PCB) (green sheet) that resistance material 131 makes and electrode cream printing form, afterwards, by firing together, can form the circuit board 101 that is built-in with varistor element 135.And, make the cream that constitutes by various materials, carry out silk screen printing with the cream of made, also can be at formation varistor element 135 on the aluminum oxide substrate etc.
And then, also can be additive method: after lamination is formed for tellite and the tellite that forms varistor element 135 of glass ceramic material that low temperature burns substrate (LTCC), by firing simultaneously, form the circuit board 101 of built-in varistor element 135.At this moment, varistor element 135 not only can be formed at the surface and the back side of circuit board 101, also can be formed at the internal layer portion of circuit board 101, on the surface of circuit board 101, for example also can the mounting core chip part etc., thereby can realize the high circuit board of design freedom 101.
And the change resistance material 131 as being used for described varistor element 135 preferably uses ZnO system to become the resistance material.Described ZnO becomes the resistance material, and preferably that containing ratio 80wt% (percentage by weight) is above ZnO uses Bi as principal component
2O
3, BaO, SrO, Pr
2O
3Deng as accessory ingredient.The containing ratio of ZnO is when 80wt% is above, and electrical insulation characteristics improves.And then, for improving non-ohm, more preferably add CoO, MnO, Al
2O
3Deng.And, in order under electric load or various environmental condition, to make the crystal grain boundary stabilisation, and improve reliability, preferably add Sb
2O
3, Cr
2O
3, glass dust or B
2O
3Deng.
And, on circuit board 101, form performance wiring and wiring pattern 102,103 as the termination electrode effect of surface mounting assembly.Described wiring pattern 102, the 103 preferred high conductive electrode materials such as alloy that use copper, nickel, silver or comprise described each composition.Described wiring pattern 102,103 can form by following: use photoetching method, galvanoplastic to be formed on that copper electrode on the circuit board 101 forms or coated with conductive cream forms.And the conductive paste that is used for this can use the conductive paste of being made by high conductive electrode material.And, also can be to use nano metal powder or organometallic conductivity favorable conductive cream.Described conductive paste can use the precious metal materials such as alloy of silver, gold, platinum and described each composition, perhaps uses the base metal materials such as alloy of copper, nickel, tungsten, molybdenum and described each composition.And, in becoming resistance electrode 132,133,134, also can use identical electrode, preferably select those electrode materials can not spread, and can not cause the electrode material of rheostat characteristic degradation to varistor element 135.Especially,, exist copper electrode that the situation of diffusion takes place, preferably suitably select can not make to become the electrode material that the resistance properties of materials worsens according to the material composition that becomes resistance material 131.
Secondly, the electrode of the varistor element 135 among Figure 15 and the wire structures of wiring pattern 102,103 are described.Among Figure 15, become resistance electrode 132 and be connected with wiring pattern 102.Described change resistance electrode 132 disposes with becoming resistance electrode 133 in opposite directions across becoming resistance material 131, forms the varistor element 135 with capacitor function thus.And, become resistance electrode 133 and dispose in opposite directions with becoming resistance electrode 134 across becoming resistance material 131, form varistor element 135 thus with capacitor function.Therefore, varistor element 135 shown in Figure 15 is two rheostatic structures of configured in series.Utilize described structure, can realize built-in rheostatic compact LED parts.
In addition, because varistor element 135 can be brought into play its function at circuit board 101 with at least one including components therein,, bring into play its effect so can form varistor element 135 on the one side top of circuit board 101 at least.
Secondly, be following structure: the central portion at described circuit board 101 is provided with through hole 112, at the described through hole 112 internal configurations heating panel 108 better than the thermal conductivity of circuit board 101.
Utilization has the adhesive 104 of conductivity, led chip 105 is engaged on the one side of described heating panel 108 by chip join, and pad and led chip 105 that 106 pairs in lead-in wires such as use gold are arranged on the part of wiring pattern 102,103 carry out wire-bonded, thereby pad is electrically connected with led chip 105.And, form the circuit structure that described led chip 105 and varistor element 135 are connected in parallel.
Secondly,, cover, make and bury lead-in wire 106 and led chip 105 underground with transparent resin 107 in order to bring into play as to the effect of led chip 105 and the insulation protection of lead-in wire 106 and as the effect of lens.Described transparent resin 107 preferred thermal-curable acrylic resin or the epoxy resin etc. of using.
Utilize described structure, when the noise of static etc. is failed led chip 105, the varistor element 135 that is connected in parallel will absorb static, thereby can prevent that led chip 105 is subjected to electrostatic breakdown, therefore can realize the small-sized surface mounting LED parts that antistatic property is good.And, importantly make the thermal conductivity of heating panel 108 be higher than the thermal conductivity of circuit board 101, described heating panel 108 is the good metal material of thermal conductivity more preferably, the good metal materials of thermal conductivity such as especially preferred aluminium, copper, silver.More preferably, use the good metal material of described thermal conductivity, and the ceramic substrate of use excellent heat resistance is as circuit board 101 as heating panel 108.
And then, ceramic substrates such as aluminium oxide that heating panel 108 use thermal endurances and insulating properties are good or forsterite, talcum, low-temperature sintered ceramics substrate, thus can realize thermal endurance and the better LED parts of insulating properties.And,, also can use ceramic materials such as the better aluminium nitride of thermal conductivity, carborundum, silicon nitride for requiring more high-cooling property and stable on heating purposes.
And, utilize structure as shown in figure 15, configuration forms the heat transmission copper coin on the circuit substrate that the LED parts are installed, on described copper coin, by good adhesive of thermal conductivity etc., the direct fixing back side of heating panel 108, thus the heat of dispersing from heating panel 108 directly can be distributed on the copper coin that is formed on the circuit substrate efficiently.
And then, by using metal material, can when the LED parts being installed on circuit substrate etc., be connected with circuit substrate ground connection across heating panel 108 as heating panel 108.And, utilize good adhesive of thermal conductivity or scolder fixedly heating panel 108 and circuit substrate, also can improve installation strength.
And, must when insulation between led chip 105 and the heating panel 108, preferably form thin dielectric film in the one side that heating panel 108 led chip 105, that be made of metal is installed.At this moment, because described dielectric film hinders thermal diffusivity, so the thickness of preferred dielectric film is thin as much as possible.
And, when utilizing lead-in wire 106 connecting wiring patterns 102,103, can utilize bond pad portion at wiring pattern 102,103 to carry out nickel plating or gold-plated reliability raising after making wire-bonded with led chip 105.
And, preferably, utilizing the soldering material with the LED part bonding on circuit substrate the time, with the solder bonds portion of laminations such as plated nickel film or tin-plated coating film, to prevent the electrode material of wiring pattern 102,103 being changed owing to the phase counterdiffusion of electrode material at wiring pattern 102,103.
Secondly, the structure of the LED parts of other examples shown in Figure 16 is described.
The difference of the mechanism of the structure of LED parts shown in Figure 2 and LED parts shown in Figure 15 is, thickness by making heating panel 108 is than the thin thickness of circuit board 101, make the lift-launch face of led chip 105 lower, thereby utilize the inside wall of the through hole 112 that is arranged on the circuit board 101 to form void structure than the plane of configuration substrate 1.Secondly, another difference is, the interior perimembranous that forms the through hole 112 of described void structure is provided with the conical surface, utilizes the structure of described conical surface reflecting surface 109 when luminous as led chip 105.And following point is also inequality: varistor element 135 is installed on the another side of the face that led chip 105 is installed of circuit board 101.
LED parts shown in Figure 16 are compared with LED parts shown in Figure 15, utilize to have the structure of reflecting surface 109, can realize the LED parts that luminous efficiency is better.And the shape of the conical surface that is arranged on the interior perimembranous of described through hole 112 is preferably processed to the shape that light is reflected efficiently, by being coniform, curve-like with described cone face process, can realize the LED parts that reflection efficiency is better.
And then, on the surface of the interior perimembranous of the through hole 112 that is provided with described reflecting surface 109, be provided with and use the good metal material of reflectivity and film forming reflectance coating 110.By described reflectance coating 110 is set, can and then realize the good LED parts of luminous efficiency.
In addition, described reflectance coating 110 also can be formed on the surface that led chip 105 is installed of heating panel 108, thus, can obtain the better LED parts of reflectivity.
Secondly, use Figure 17～Figure 22 that the LED member manufacturing method shown in this 4th execution mode is described.At this, illustrate heating panel 108 as metal material, and use aluminum oxide substrate to constitute the LED member manufacturing method shown in Figure 16 of circuit board 101.
At first, shown in Figure 17 as first step as section, on aluminum oxide substrate, form reflecting surface 109 and be used to insert the through hole 112 of heating panel 108, make circuit board 101 (below, be sometimes referred to as aluminum oxide substrate 101) like this.
Secondly, as shown in figure 18, use silver paste, utilize silk screen print method, on the another side of aluminum oxide substrate 101, form and become resistance electrode 132,134.Next to cover the mode that becomes resistance electrode 132,134, with being processed into the another side of the change resistance material 131 compacting laminations of the ceramic printed-circuit board that becomes resistance composition formation at aluminum oxide substrate 101, makes its temporary joint.Afterwards, use silver paste, after utilizing silk screen printing to form to become resistance electrode 133, further compacting and lamination become the ceramic printed-circuit board that the resistance composition constitutes.Afterwards, respectively become resistance electrode 132,133,134 and become resistance material 131 after removing binding agent, under the firing temperature about 900 ℃, fire, make varistor element 135 thus described.
Afterwards, as shown in figure 19, high silver (Ag) cream of reflectivity that the light that coating is used to led chip 105 is sent on reflecting surface 109 reflects effectively heats, thereby forms reflectance coating 110 on aluminum oxide substrate 101.Especially, as the Ag cream that is used for this, preferred Ag resin acid fat or Ag nanometer cream etc. are at the material of the good reflecting surface 109 of metallising (metallization) back acquisition surface smoothing.And, when in reflectance coating 110, using copper cream, carry out silver-platedly on the surface of formed copper, can form good reflectance coating 110 thus.
Secondly, as shown in figure 20, Ag is that cream or gold (Au) are conductive pastes such as cream by the printing coating, will be used to connect and as wiring pattern 102,103 metallisings of termination electrode at aluminum oxide substrate 101.At this, Ag comprises Ag cream, Ag-Pt cream and Ag-Pd cream in the cream.And Au is in the cream, comprises Au-Pd cream and Au-Pt cream.
Secondly, as second step, metal material punch process such as the aluminium that thermal conductivity is good, copper are the heating panel 108 with regulation shape.
Secondly,, as shown in figure 21, described heating panel 108 is pressed into the inside of through hole 112, perhaps uses adhesive to engage and fix as third step.At this moment, thermal conductivity is reduced, so preferably use the good thermal hole of thermal diffusivity or chip join with electroconductive binder etc. because be used for the adhesive of the joint of heating panel 108.Also can use the high-temperature firing type adhesive of low melting point glass material as inorganic binder.Especially, be bonded on reliability height in the heatproof impact test by soldering.
And, when heating panel 108 uses copper, and aluminum oxide substrate 101 between, constitute the spinel structure of cupric aluminate by using the adhesive that can carry out chemical bond, can improve the heat shock resistance characteristic.
Secondly,, as shown in figure 22, use adhesive 104, led chip 105 is fixed on the one side of heating panel 108 as the 4th step.
Afterwards,, use lead wire connecting apparatus, between led chip 105 and the electrode pad portion that is arranged on the wiring pattern 102,103, utilize the lead-in wire 106 of gold to carry out the wire-bonded installation, led chip 105 is electrically connected with electrode pad portion as the 5th step.At this moment, led chip 105 is connected in parallel with varistor element 135.Utilize described circuit structure, can obtain the good LED parts of antistatic property.
Secondly; as the 6th step; by transparent resins 107 such as good acrylic resin of coating permeability or epoxy resin, can make LED parts shown in Figure 16, wherein transparent resin 107 performance insulation protection effects and make the effect of the lens of the optical convergence that sends from led chip 105.At this moment, can suitably select viscosity or coating process and make the shape of transparent resin 107 become the lens shape of regulation.And, utilize described transparent resin 107, can have the effect that engages reinforcement that realizes circuit board 101 and heating panel 108.
As mentioned above, the inside of the through hole 112 that on the part of the circuit board 101 that is equipped with led chip 105, forms, the good heating panel 108 of configuration thermal conductivity, in circuit board 101 in the built-in varistor element 135, become led chip 105 and the structure that varistor element 135 is connected in parallel, can realize surface mounting LED parts and manufacture method thereof that thermal diffusivity and antistatic property are good thus.
(the 5th execution mode)
Below, with reference to the LED parts in description of drawings the 5th execution mode of the present invention.
Figure 23 is the profile in order to the structure that the surface mounting LED parts in the 5th execution mode of the present invention are described, Figure 24 is in order to the profile of other examples to be described.
Among Figure 23, Figure 24, the structure of the LED parts in this 5th execution mode and the obvious difference of the 4th execution mode are the shapes of heating panel 108a, 108b.Especially obvious characteristics is on described heating panel 108a, 108b recess to be set, thereby forms void structure.
Form void structure by the good metals of thermal conductivity such as aluminium, copper or silver being formed processing, can make described heating panel 108a, 108b at an easy rate.Bottom surface at the void structure that is arranged on described heating panel 108a, 108b is provided with the space that led chip 105 can be installed.
And, in the interior perimembranous of the recess of the void structure that forms described heating panel 108a, 108b, use mould and be shaped, perhaps utilize polishing to wait the conical surface be set, and with the described conical surface as reflecting surface 109.The conical surface of described reflecting surface 109 is made as the angle of inclination of regulation, lift-launch is assembled efficiently at the light of led chip 105 radiation of the bottom surface of void structure, luminous efficiency is improved, and can control the luminance of LED parts with this.
In addition, will be in described recess the surperficial mirror-polishing of reflecting surface 109 of the taper that is provided with of perimembranous, can carry out reflection of light better with this.
And, for the light that makes led chip 105 more effectively reflects, use to electroplate or films such as evaporation form technology, form the reflectance coating 110 that constitutes by the material of high reflectance more on the surface of reflecting surface 109, can realize the LED parts that reflection characteristic is higher with this.
Secondly, the structure of the LED parts of other examples shown in Figure 24 is described.The feature of described LED parts is, utilizing mould molding to form claw 111 with metallic plate in as heating panel 108b.By described claw 111 is set, in the time of can inserting heating panel 108b at through hole 112, make the degree of depth of insertion keep being stabilized in certain depth to circuit board 101.
In addition, described claw 111 also can have the continuous projection as along portion.
As mentioned above, in this 5th execution mode, by in being equipped with heating panel 108a, the 108b of led chip 105, using metal material etc. to carry out machining, just can easily form void structure, and also can form reflecting surface 109 simultaneously, utilize described structure, can make the miniaturization of LED parts, can realize the LED parts that productivity ratio is good simultaneously.
In addition, also can use the good ceramic material of thermal conductivity to be configured as the shape of described heating panel 108a, 108b, at this moment, except that described effect, can realize the LED parts that thermal endurance is better.
(the 6th execution mode)
Below, with reference to LED parts and the manufacture method thereof in description of drawings the 6th execution mode of the present invention.
Figure 25 is the profile of the LED parts in this 6th execution mode.The structure of the basic structure of the surface mounting LED parts in this 6th execution mode and LED parts shown in Figure 23 is roughly the same, with the obvious difference of the 5th execution mode be the material of heating panel 108c.
Described heating panel 108c is made of the resin that comprises the good metallic stuffing of thermal conductivity.As metallic stuffing, use the metal dust of copper, aluminium, gold, silver etc.Make metal dust and epoxy resin etc. mixing, make resin plaster with this.After being filled in through hole 112 inside that are formed on the circuit board 101 by the resin plaster that will contain described metallic stuffing, carry out heat and form heating panel 108c together, simultaneously the heating panel 108c of made and engaging of circuit board 101 can be carried out, therefore the LED parts that productivity ratio is good can be realized.
And then, use inorganic filler by replacing described metallic stuffing, except that above-mentioned effect, can also obtain the good LED parts of insulating properties.And, as inorganic filler, use aluminium oxide, aluminium nitride, carborundum, magnesium oxide etc., can realize the LED parts that productivity ratio is good with this.That is, described heating panel 108c will be added with after thermal conductivity good metal powder or the ceramic powders resin plaster as heat filling is filled in the inside of through hole 112 of circuit board 101, and being heating and curing forms.About content in addition, so because have the structure omission explanation roughly the same with the 5th execution mode.
Utilize described structure, can in being heating and curing of resin plaster, carry out engaging of circuit board 101 and heating panel 108c.And, by changing the material composition of resin plaster, can control the coefficient of expansion of circuit board 101 and heating panel 108c.
And, as the material that forms heating panel 108c, narrated metallic stuffing or inorganic filler have been blended in the situation that makes its curing in the epoxy resin, but also can replace epoxy resin, use the high-temperature firing type cream of the use inorganic binder as glass dust.
As mentioned above, the LED parts shown in this 6th execution mode can form the good heating panel 108c of productivity ratio on the circuit board 101 that is equipped with led chip 105.Compare with the manufactured goods of employed heating panel 108a, 108b in the 5th execution mode, heating panel 108c can use silk screen printing to be formed in the through hole 112.Therefore, can be easily corresponding to variform through hole 112.Therefore, need not prepare to be processed as heating panel 108a, the 108b of each size, when can be in the kind of the shape of through hole 112 a lot, realize the raising of productivity ratio.
Secondly, use Figure 26 that the structure of the LED parts of other examples is described.Described LED parts, as shown in figure 26, in the bottom surface of the recess of the heating panel 108d that constitutes by the resin plaster that comprises the good filler of thermal conductivity, have flatness and thermal conductivity better by metal or ceramic material and the heating panel 140 that forms.Utilize described structure, the flatness of the installed surface of led chip 105 is improved, and help the maximization of led chip 105.
And, can use metal materials such as the good gold, silver of thermal conductivity, aluminium and copper in the heating panel 140, or ceramic material such as aluminium oxide, aluminium nitride, carborundum, magnesium oxide.
Secondly, use Figure 27～Figure 32 that LED member manufacturing method shown in Figure 25 is described.
At first, as first step, as shown in figure 27, be produced on the circuit board 101 that the optional position is formed with through hole 112.Secondly, as shown in figure 28, utilize the method identical with the 4th execution mode, lamination forms varistor element 135 by firing after forming and becoming resistance electrode 132,133,134 and become resistance material 131.
Secondly, as shown in figure 29, after printing forms wiring pattern 102,103,, make the circuit board 101 that is built-in with varistor element 135 by firing together.
Secondly, as second step, as shown in figure 30, utilize silk screen print method, the resin plaster 122 that will contain the good metallic stuffing of thermal conductivity such as aluminium, copper or silver is filled in the through hole 112.
Secondly,, as shown in figure 31, the resin plaster 122 of the metallic stuffing that contains filling is heating and curing, thereby forms heating panel 108c, simultaneously, engage heating panel 108c and circuit board 101 as third step.Metal dust as the good gold, silver of the preferred thermal conductivity of the metallic stuffing that is used for this, aluminium, copper etc.And then, by changing the containing ratio of described metallic stuffing, heating panel 108c that can design code.
And, except metallic stuffing, can use inorganic filler.As inorganic filler, use the good ceramic powders of thermal conductivity such as aluminium oxide, aluminium nitride, carborundum, magnesium oxide, can realize good LED parts such as thermal endurance, moisture-proof with this.
In addition, preferably in described resin plaster 122, use the few material of cure shrinkage.And the resin plaster 122 that is heated curing also can utilize machining to form the shape of heating panel 108c as shown in figure 31.And, the shape of heating panel 108c of this moment can have with the 5th execution mode in illustrated heating panel 108a identical functions.
Afterwards,, shown in figure 32, use adhesive 104, led chip 105 is fixed on the recess bottom surface of heating panel 108c as the 4th step.
Secondly,, use lead wire connecting apparatus, between the welding disk and led chip 105 of a part that is arranged at wiring pattern 102,103, utilize the lead-in wire 106 of gold to carry out wire-bonded, thereby make its electrical connection as the 5th step.At this moment, led chip 105 is connected in parallel with varistor element 135.
Secondly, as the 6th step,, use the good transparent resin 107 of permeability to apply in order to bring into play protection led chip 105 and the effect of lead-in wire 106 and the effect of bringing into play the lens that the light that sends is assembled.So, can make the surface mounting LED parts.
As mentioned above, in this 6th execution mode, can on the circuit board 101 that is equipped with led chip 105, form heating panel 108c, and can realize the good surface mounting LED parts and the manufacture method thereof of antistatic property of miniaturization with high production rate.
(the 7th execution mode)
Below, with reference to LED parts and the manufacture method thereof in description of drawings the 7th execution mode of the present invention.
Figure 33 is the profile of the LED parts in this 7th execution mode, and Figure 34～Figure 38 is in order to the profile of its manufacture method to be described.
Among Figure 33, the structure of the basic structure of the surface mounting LED parts in this 7th execution mode and LED parts shown in Figure 25 is roughly the same.With the obvious difference of LED parts shown in Figure 25 be, the installation method of led chip 105 is not a terminal conjunction method, but the flip-chip method of hyperbatic led chip 105a.Therefore, in the LED parts in this 7th execution mode, heating panel 108e and wiring pattern 102,103 must electric insulations.Therefore, for example, when making heating panel 108e, preferably form thin dielectric film on the top layer of heating panel 108e with metal.In the pad portion that is formed at the wiring pattern 102,103 on the heating panel 108e, flip chip type led chip 105a is installed.And, utilize with inorganic filler as main component, and the insulating material that adds glass powder with low melting point therein constitutes described heating panel 108e with good thermal conductivity, can form the good heating panel 108e of insulating properties with this.As inorganic filler, preferably with aluminium oxide, aluminium nitride, carborundum, magnesium oxide etc. as inorganic binder, utilize organic carrier, the material after the low melting point glass insulation livering of the silicide of boron system, bismuth system or zinc system etc. is fired and is formed.So, by using insulating paste, can be filled into efficiently in the through hole 112 of different shape, thereby can realize the LED parts that productivity ratio is good.And, have on the heating panel 108e of described good insulation performance, form wiring pattern 102,103, can salient point welding flip chip type led chip 105a.
Utilize aforesaid structure, can realize the LED parts of miniaturization, described LED parts can obtain the raising of productivity ratio by effective installation steps.
Secondly, use Figure 34～Figure 38 illustrates the LED member manufacturing method in this 7th execution mode.
At first, as first step, as shown in figure 34, optional position at circuit board 101 forms through hole 112, identical with the 6th execution mode, another side lamination at circuit board 101 forms change resistance electrode 132,133,134 and becomes resistance material 131, makes the circuit board 101 that is built-in with varistor element 135 thus.
Secondly, as second step, as shown in figure 35, utilize silk screen print method, the inorganic filler that thermal conductivity such as aluminium nitride or carborundum is good is filled in the through hole 112 as the insulating paste 123 of main component.Be used for the inorganic filler of insulating paste 123, can use the good ceramic powders of thermal conductivity such as aluminium oxide, aluminium nitride, carborundum, magnesium oxide, can realize the good LED parts of wear properties such as thermal endurance, moisture-proof.
Afterwards,, solidify or fire the insulating paste 123 of being filled and make heating panel 108, simultaneously, the heating panel 108 of made is engaged with circuit board 101 as third step.In addition, as described insulating paste 123, preferably use cure shrinkage little or fire and shrink little material.
Secondly, if necessary, insulating paste 123 machinings behind curing or the sintering are formed the shape of heating panel 108e as shown in figure 36.By forming the shape of heating panel 108e of this moment, can have with the 6th execution mode in illustrated heating panel 108c identical functions.
Afterwards,, as shown in figure 37, use conductive paste, utilize silk screen print method or thin film technique to form wiring pattern 102,103 as the 4th step.In this, wiring pattern 102,103 is formed on circuit board 101 and the heating panel 108e.On heating panel 108e, wiring pattern 102,103 forms the pattern of shape that can carry out the pad electrode of salient point welding with upside-down mounting with led chip 105a.
Secondly,, as shown in figure 38, use the au bump 136 that is formed on the led chip 105a, utilize salient point that the recess bottom surface that led chip 105a is fixed on heating panel 108e is installed as the 5th step.
So, use au bump 136 to carry out the bump pad portion that salient point welds the part of the wiring pattern 102,103 that is electrically connected led chip 105a and is arranged on circuit board 101.At this moment, led chip 105a and varistor element 135 are connected in parallel.
Secondly, as the 6th step, for the effect of bringing into play protection led chip 105a and as the effect of the lens that the light that sends is assembled, the good transparent resin 107 of coating permeability.Formed transparent resin 107 covers the part of whole LED chip 105a and the connecting portion that is equivalent to led chip 105a and circuit board 101 on wiring pattern 102,103.
Utilize technology discussed above, can make surface mounting LED parts shown in Figure 33.
And LED parts shown in Figure 39 are profiles of LED parts of other examples of this 7th execution mode.The feature of described LED parts is on heating panel 108f recess not to be set.LED parts shown in Figure 39 are applicable to that the irradiates light of led chip 105a shines the situation of polarizers of big angle scope.
As mentioned above, in this 7th execution mode, can utilize upside-down mounting that led chip 105a is installed, and can on circuit board 101, form productivity ratio high heating panel 108e, 108f, thereby can realize miniaturization LED parts.
Utilizability on the industry
According to the present invention, can form the good heat sink of thermal conductivity that will be equipped with led chip Join the structure of the through hole inside that is arranged on the circuit board to, with this diverging LED effectively The heat that produces during chip light emitting. And by built-in varistor element, the present invention is applicable to height The LED parts of brightness and autofrettage aspect thereof, the LED parts of described high brightness can have When effect ground utilizes the erection space of led chip, minimizing led chip 105 because of surge or Static etc. and the unfavorable condition that causes.
Claims (37)
1. LED parts comprise:
Be provided with the circuit board of through hole;
Be accommodated in the heating panel of the inboard of described through hole;
Be installed in the led chip on the described heating panel;
Be electrically connected the connecting portion of described led chip and described circuit board; With
Cover the transparent resin of described led chip and described connecting portion.
2. LED parts according to claim 1, described connecting portion are metal lead wire.
3. LED parts according to claim 1, the thickness of described heating panel are than the thin thickness of described circuit board, and described led chip is configured in the recess that is formed by described heating panel and described circuit board.
4. LED parts according to claim 3, the interior perimembranous of described through hole is provided with the conical surface.
5. LED parts according to claim 4, further comprise be arranged on described in the reflectance coating of conical surface of perimembranous.
6. LED parts according to claim 1 be provided with recess in the part of described heating panel, and the wall of the interior perimembranous of described recess are taper.
7. LED parts according to claim 6 further comprise the reflectance coating on the described wall of the interior perimembranous that is arranged on described heating panel.
8. LED parts according to claim 1 have the conductive adhesive that engages described heating panel and described circuit board.
9. LED parts according to claim 1 is characterized in that: the thermal conductivity of described heating panel is higher than the thermal conductivity of described circuit board.
10. LED parts according to claim 1, described heating panel are metal.
11. LED parts according to claim 1, described heating panel are pottery.
12. LED parts according to claim 1, described heating panel are the resin that contains metallic stuffing.
13. LED parts according to claim 12, described metallic stuffing are at least one that select from copper, aluminium, silver and gold.
14. LED parts according to claim 1, described heating panel are the resins that contains inorganic filler.
15. LED parts according to claim 14, described inorganic filler are at least one that select from aluminium oxide, aluminium nitride, carborundum and magnesium oxide.
16. LED parts according to claim 1, described circuit board are the circuit boards that is built-in with varistor element, described led chip and described varistor element are connected in parallel.
17. LED parts according to claim 16, varistor element is by containing ZnO, Bi
2O
3, Sb
2O
3Material constitute, and the containing ratio of ZnO is more than the 80wt%.
18. LED parts according to claim 16, described led chip is connected by upside-down method of hull-section construction with the circuit board that is built-in with described varistor element.
19. a LED member manufacturing method comprises:
First step, patterning case and through hole on circuit board;
Second step, making can be configured in the heating panel of described through hole inside;
Third step arrives the inside of described through hole by described heating panel being pressed into or utilizing adhesive bond, engages with described circuit board;
The 4th step is used the chip join adhesive, and led chip is engaged with the one side of described heating panel;
The 5th step connects described led chip and described circuit board; And
The 6th step uses transparent resin to bury described led chip underground.
20. LED member manufacturing method according to claim 19, described the 5th step are to use lead-in wire to connect the step of described led chip and circuit board, in described the 6th step, use described transparent resin to bury described led chip and described lead-in wire underground.
21. LED member manufacturing method according to claim 19 in the described first step, is formed with the reflecting surface of taper in the interior perimembranous of described through hole.
22. LED member manufacturing method according to claim 21 in the described first step, on the surface of the reflecting surface of the interior perimembranous of described through hole, further forms the film reflectance coating with gloss.
23. LED member manufacturing method according to claim 19, in described second step, at the one side formation recess of described heating panel, and then, at the interior perimembranous formation taper reflecting surface of described recess.
24. LED member manufacturing method according to claim 23 in described second step, on the surface of the reflecting surface of described heating panel, further forms the film reflectance coating with gloss.
25. LED member manufacturing method according to claim 19, described first step are included in the step that forms varistor element on the described circuit board, in described the 5th step, described led chip and described varistor element are connected in parallel.
26. a LED member manufacturing method comprises:
First step forms wiring pattern and through hole on circuit board;
Second step uses the resin plaster that contains the thermal conductivity filler to fill the inside of the described through hole of described circuit board, forms heating panel with this;
Third step, the described resin plaster that is filled that is heating and curing engages described circuit board and described heating panel with this;
The 4th step uses chip join with adhesive led chip to be engaged with the one side of described heating panel;
The 5th step connects described led chip and described circuit board; And
The 6th step uses transparent resin to bury described led chip underground.
27. LED member manufacturing method according to claim 26, described the 5th step are to use lead-in wire to connect the step of described led chip and described circuit board, in described the 6th step, utilize described transparent resin to bury described led chip and described lead-in wire underground.
28. LED member manufacturing method according to claim 26, in the described first step, the interior perimembranous of described through hole is provided with the conical surface.
29. LED member manufacturing method according to claim 28 in the described first step, on the surface of the interior perimembranous of the described through hole that is provided with the described conical surface, forms the reflectance coating of the film with gloss.
30. LED member manufacturing method according to claim 26 in second step, forms recess in the one side of heating panel, further is formed with the conical surface in the interior perimembranous of described recess.
31. LED member manufacturing method according to claim 30 in described second step, on the surface of the interior perimembranous of the recess of the described heating panel that is formed with the described conical surface, forms the reflectance coating of the film with gloss.
32. LED member manufacturing method according to claim 26, described first step are included in the step that forms varistor element on the described circuit board, in described the 5th step, described led chip and described varistor element are connected in parallel.
33. a LED member manufacturing method comprises:
First step forms varistor element and through hole on circuit board;
Second step is filled insulating paste in the inside of described through hole, described insulating paste is main component with the thermal conductivity filler and is inorganic binder with the low-melting glass;
Third step forms heating panel by the insulating paste of firing described filling, and engages described heating panel and described circuit board;
The 4th step forms the wiring pattern with the electrode pad that is used to install led chip on the one side of described heating panel;
The 5th step is bonded on described led chip salient point on the described electrode pad, with this be connected in parallel described led chip and described varistor element; And
The 6th step uses transparent resin to bury described led chip underground.
34. LED member manufacturing method according to claim 33 in the described first step, forms the reflecting surface of taper in the interior perimembranous of described through hole.
35. LED member manufacturing method according to claim 34 in the described first step, further forms reflectance coating on the surface of described reflecting surface.
36. LED member manufacturing method according to claim 33 is in described second step, at the one side formation recess of described heating panel, at the interior perimembranous formation taper reflecting surface of described recess.
37. LED member manufacturing method according to claim 36 in described second step, further forms reflectance coating on the surface of described reflecting surface.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005105873A JP4915052B2 (en) | 2005-04-01 | 2005-04-01 | LED component and manufacturing method thereof |
| JP105873/2005 | 2005-04-01 | ||
| JP165112/2005 | 2005-06-06 |
Publications (2)
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| CN100479212C CN100479212C (en) | 2009-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB200680000435XA Expired - Fee Related CN100479212C (en) | 2005-04-01 | 2006-03-31 | LED component and method for manufacturing same |
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| JP (1) | JP4915052B2 (en) |
| CN (1) | CN100479212C (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2006287020A (en) | 2006-10-19 |
| CN100479212C (en) | 2009-04-15 |
| JP4915052B2 (en) | 2012-04-11 |
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