CN103840065A - Transparent U-shaped LED light-emitting sheet with quick plug-in pins and LED bulb formed by the LED light-emitting sheet - Google Patents

Transparent U-shaped LED light-emitting sheet with quick plug-in pins and LED bulb formed by the LED light-emitting sheet Download PDF

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Publication number
CN103840065A
CN103840065A CN201410091307.7A CN201410091307A CN103840065A CN 103840065 A CN103840065 A CN 103840065A CN 201410091307 A CN201410091307 A CN 201410091307A CN 103840065 A CN103840065 A CN 103840065A
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led light
shaped
quartz crystal
positive
sheet
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CN201410091307.7A
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Chinese (zh)
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周有旺
周造轩
周红玉
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江苏华英光宝科技股份有限公司
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Publication of CN103840065A publication Critical patent/CN103840065A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

The invention discloses a transparent U-shaped LED light-emitting sheet with quick plug-in pins. The transparent U-shaped LED light-emitting sheet comprises a quartz crystal sheet (1), a plurality of LED chips (2) arranged on the quartz crystal sheet (1), silicon rubber layers (4) covering the LED chips (2), and a positive and negative electrode (5) arranged on the quartz crystal sheet (1), wherein the LED chips (2) are distributed on the quartz crystal sheet (1) in a U shape and are communicated with the positive and negative electrode (5) through a gold wire (3). The transparent U-shaped LED light-emitting sheet has the advantages of optimizing product structures, being capable of being produced in an efficient and massive mode easily, and reducing production cost and the reject ratio.

Description

具有快速插接引脚的透明U型LED发光片及构成的LED灯泡 Fast plug pin having a transparent sheet and a U-shaped configuration of the LED lighting LED bulbs

技术领域 FIELD

[0001 ] 本发明涉及LED技术领域。 [0001] The present invention relates to the field of LED technology.

背景技术 Background technique

[0002] 现有技术中的LED灯丝,也称为LED灯棒或LED灯柱,其采用打有芯片的非基板,在该基板的两端分别安装有正负电极,在生产加工过程中需要分别对两端进行电极的安装过程,生产过程较为复杂,难以大规模高效率生产,此外两端均带有电极造成使用安装过程中的不便利。 [0002] The prior art LED filament, also referred to as an LED lamp or LED lamp post rod, which uses a non-playing of the chip substrate, the substrate ends of the positive and negative electrodes are mounted, the production process requires respectively mounted on both ends of the electrode process, the production process is complicated, it is difficult to mass production of high efficiency, in addition at both ends with an electrode using the inconvenience caused by the installation process.

发明内容 SUMMARY

[0003] 为了克服现有技术存在的不足,本发明的目的在于提供一种全新构造的LED发光片,其具有创新性构造的引脚结构设置、LED芯片设置构造以及硅胶体结构。 [0003] In order to overcome the shortcomings of the prior art, an object of the present invention to provide a new structure of the LED light-emitting sheet having a pin structure disposed innovative configuration, LED chips disposed and configured silica structure.

[0004] 为达到以上目的,本发明提供了一种具有快速插接引脚的透明U型LED发光片,包括石英晶体片、设置在所述的石英晶体片上的多个LED芯片、覆盖在所述的LED芯片上的硅胶层、以及设置在所述的石英晶体片的正负电极,其中,所述的LED芯片在石英晶体片上呈U型分布并通过金线与正负电极相连通。 [0004] To achieve the above object, the present invention provides a quick connector having a U-shaped transparent plate emitting LED pin, including quartz crystal plate, a plurality of LED chips disposed on said quartz crystal plate and the cover silicone rubber layer on said LED chip, and the positive and negative electrodes disposed on said quartz crystal plate, wherein the LED chip is U-shaped profile in the quartz crystal plate and the negative electrode by a gold wire communicating.

[0005] 本发明的进一步改进在于,所述的硅胶层以套壳的形式包裹于整个石英晶体片、LED芯片的外面。 Further improve [0005] the present invention, the silicone rubber layer on the outside of the wrapping sheet throughout the quartz crystal, LED chips in the form of a sleeve.

[0006] 本发明的进一步改进在于,所述的LED芯片在石英晶体片上呈排嵌套的U型结构分布。 Further improve [0006] the present invention, the distribution of the LED chips form of nested U-shaped structure in the quartz crystal plate.

[0007] 本发明的进一步改进在于,所述的石英晶体片的一端被切割以形成个相互分离的电极安装部位。 Further improvement [0007] The present invention is characterized in that one end of said quartz crystal plate is cut to form an electrode mounting portion separated from each other.

[0008] 本发明的进一步改进在于,所述的正负电极包括涂覆在石英晶体片上的覆银区域。 Further improve [0008] the present invention, the positive and negative electrodes comprises a silver coated regions coated on a quartz plate.

[0009] 本发明的进一步改进在于,所述的正负电极通过注塑或压合在石英晶体片上,所述的正负电极具有顶部的开口,开口内部设置有弹性卡扣,所述的电极安装部位通过开口插入后弹性卡扣压紧锁定。 [0009] Further improvements of the present invention, the positive and negative electrodes on the quartz crystal plate, said positive and negative electrodes having an open top by injection molding or press-fit, snap-fit ​​within the opening provided with a resilient, the mounting electrodes site through the opening into the resilient snap-snap locking.

[0010] 本发明的进一步改进在于,所述的正负电极安装于一裤状结构的底端,该裤状结构套设于电极安装部位上。 Further improve [0010] the present invention, the positive and negative electrodes attached to the bottom end of a pant-like configuration, the pant-like structure is provided on the electrode mounting sleeve portion.

[0011] 本发明的进一步改进在于,所述的正负电极安装于一套状结构的底端,该套状结构套设于电极安装部位上,并在正负电极之间设置电介质。 [0011] Further improvements of the present invention, the positive and negative electrodes of a structure attached to the bottom end of the sleeve-like structure is provided on the electrode sleeve mounting portion, and a dielectric disposed between the positive and negative electrodes.

[0012] 本发明的进一步改进在于,所述的石英晶体片由钠钙硅浮法玻璃制成,所述的钠钙硅浮法玻璃包含质量百分比为70-73%的SiO,21.0-2.0%的Al2O3, 7-12%的CaO,1.0-4.5%的MgO, 13-15% 的R2O,以及0.08-0.14%Fe203。 [0012] Further improvements of the present invention, the quartz crystal plate is made of soda-lime-silica float glass, the soda-lime-silica float glass comprising 70-73% by mass percentage of SiO, 21.0-2.0% of Al2O3, 7-12% of CaO, 1.0-4.5% of MgO, 13-15% of R2O, and 0.08-0.14% Fe203.

[0013] 根据本发明的另一方面,还提供了一种LED灯泡,其具有如上所述的具有快速插接引脚的透明U型LED发光片。 [0013] According to another aspect of the present invention, there is provided an LED lamp having a transparent U-emitting LED chip having a flash plug pins as described above.

[0014] 本发明的有益效果是优化了产品结构,易于实现高效率批量化生产,降低了生产成本与不良率。 [0014] Advantageous effects of the present invention is to optimize the product structure, easy to realize mass production efficiency, reduce production costs and failure rates.

附图说明 BRIEF DESCRIPTION

[0015] 附图1为根据本发明的具有快速插接引脚的透明U型LED发光片的结构示意图; 附图2至附图8为根据本发明的具有快速插接引脚的透明U型LED发光片及构成的 [0015] FIG 1 is a schematic structural diagram of the present invention having a fast U-transparent plug pins of the LED light-emitting sheet; Figure 2 to Figure 8 according to the present invention having a U-shaped transparent flash plug pins LED light sheet and composed of

LED灯泡的各个实施例的示意图。 A schematic view of various embodiments of the LED light bulb.

具体实施方式 Detailed ways

[0016] 下面对本发明的较佳实施例进行详细阐述,以使本发明的优点和特征能更易于被本领域技术人员理解,从而对本发明的保护范围做出更为清楚明确的界定。 [0016] The following preferred embodiments of the present invention will be described in detail, so that the advantages and features of the present invention can be more readily understood by those skilled in the art, in order to make more clearly the scope of clearly defined in the present invention.

[0017] 参见附图1所示,为根据本发明的具有快速插接引脚的透明U型LED发光片的结构示意图,其包括石英晶体片1、设置在石英晶体片I上的多个LED芯片2、覆盖在LED芯片2上的硅胶层4、以及设置在石英晶体片I的正负电极5。 [0017] Referring shown in Figure 1, a schematic view of a structure having a U-shaped transparent flash plug pins of the LED light emission sheet of the present invention, which comprises a quartz crystal plate 1, disposed on a plurality of quartz crystal LED chip I 2 chip, covering the LED chip 2 in the silicone rubber layer 4, 5 and the positive and negative electrodes disposed in the quartz crystal plate I.

[0018] 本发明的一个核心点在于采用了钠钙硅浮法玻璃材料作为石英晶体片1,因而使得石英晶体片I的透光性能与稳定性能得到了极大地加强,并且由于易于将产品制得非常薄,使得最终产品精巧轻便。 [0018] a core point of the present invention is the use of soda lime silica float glass material as a quartz crystal plate 1, so that light transmitting performance and stability quartz crystal plate I has been greatly strengthened, and due to ease of the product prepared very thin, making the final product compact and lightweight. 下面分别以表一与表二的形式描述其化学成分与物理特性。 The following describe the chemical composition and physical properties in the form of a table and Table II.

[0019] (I)、化学成分(wt.%) [0019] (I), chemical composition (wt.%)

Figure CN103840065AD00041

表一 Table I

(2)、物理特性 (2) Physical properties

Figure CN103840065AD00042

表二 Table II

实施例一参见附图2所示,LED芯片2在石英晶体片I上呈U型分布并通过金线3与正负电极5相连通,正负电极5通过注塑或压合在石英晶体片I上,图中硅胶层4仅覆盖于呈U型分布的LED芯片2上。 Referring first embodiment shown in the drawings, LED chip 2 is U-shaped quartz crystal pieces distributed on I and 2 by a gold wire 3 and the negative electrode 5 is connected through the positive and negative electrodes 5 by injection molding or pressing in quartz slice I on silica gel layer 4 in FIG. 2 only covers the U-shaped distribution of the LED chip. 在另一个实施例中,LED芯片2在石英晶体片I上呈2排嵌套的U型结构分布,每排分布27个,共计54颗芯片。 In another embodiment, LED chips 22 of nested U-shaped structure in the form of distributed quartz crystal plate I, each row of the distribution of 27, a total of 54 chips.

[0020] 实施例二 [0020] Second Embodiment

参见附图3所示,在本实施例中硅胶层4覆盖整个石英晶体片I的表面,此外,石英晶体片I的一端被切割以形成2个相互分离的电极安装部位,易于正负电极5的安装固定。 Referring to Figure 3, in this embodiment, the silica gel layer 4 covers the entire surface of the quartz crystal plate I and, in addition, one end of the quartz crystal plate is cut to form I 2 electrode mounting portion separated from each other, positive and negative electrodes easily 5 fixed installation.

[0021] 实施例三 [0021] Example three

参见附图4所示,本实施例中硅胶层4以套壳的形式包裹于整个石英晶体片1、LED芯片2的外面,其在安装过程中只需要整体向下套装即可;本实施例中的正负电极5具有顶部的开口,开口内部设置有弹性卡扣,电极安装部位通过开口插入后弹性卡扣压紧锁定即可。 Referring to Figure 4, the outer layer of silica in Example 4 wrapped quartz crystal plate in the form of whole shell sleeve 1, LED chips 2 of the present embodiment, which only need to set down the whole installation process; the present embodiment the positive and negative electrodes 5 having an open top, an opening is provided inside an elastic snap, through openings in the electrode mounting part is inserted to the elastic snap locking snap.

[0022] 实施例四 [0022] Fourth Embodiment

参见附图5所示,本实施例中的正负电极5安装于一裤状结构6的底端,该裤状结构6的外形与2个相互分离的电极安装部位的外形相互匹配,从而正好可以套设于电极安装部位上,此时位于底端的正负电极5通过弹性卡扣压紧恰好锁定。 Referring to Figure 5, the positive and negative electrodes of the present embodiment 5 is attached to the bottom end of the embodiment of a pant-like structure 6, 6 of the pant-like shape structure with two mutually separated mounting portion electrode shape match each other, so that just It can be sleeved on the mounting portion of the electrodes, the positive and negative electrode case 5 at a bottom end by just pressing the elastic snap locking.

[0023] 实施例五 [0023] Embodiment V

参见附图6所示,正负电极5安装于一套状结构8的底端,该套状结构8自下而上套设于电极安装部位上,并在正负电极5之间设置电介质7以保持正负电极5的强度。 Referring to Figure 6, the positive and negative electrodes 5 is attached to the bottom end 8 of a structure, the sleeve-like structure 8 is provided on the bottom-electrode mounting sleeve portion, and a dielectric disposed between the positive and negative electrodes 7 5 5 to maintain the strength of the positive and negative electrodes.

[0024] 实施例六 [0024] Sixth Embodiment

参见附图7与附图8所示,正负电极5包括涂覆在石英晶体片上的覆银区域,在该种方案下,本发明的U型LED发光片只需要整体插入如图中所示的基座中即可,该基座上具有对应的插座相配合,从而使得整个LED灯泡的制造安装过程简单快捷,极大的降低了生产成本,加速了LED照明技术的普及。 7 with reference to the drawings, the negative electrode 5 comprises a silver-coated quartz crystal regions coated on the sheet, in the kinds of programs, U-type LED light emission sheet of the present invention requires only reference the entire insert 8 shown in FIG. to the base, the base having a corresponding socket on the mate, so that the entire process of manufacturing the LED bulb mounted simple and quick, greatly reducing the production costs, accelerating the adoption of LED lighting technology.

[0025] 以上实施方式只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人了解本发明的内容并加以实施,并不能以此限制本发明的保护范围,凡根据本发明精神实质所做的等效变化或修饰均涵盖在本发明的保护范围内。 [0025] To illustrate the above embodiment, the technical concept and features of the invention, the purpose is to just let the person skilled in the art to understand the present invention and implemented, and thus can not limit the scope of the present invention, where under this spirit of the invention essence equivalent variations or modifications made are encompassed within the scope of the present invention.

Claims (10)

1.一种具有快速插接引脚的透明U型LED发光片,其特征在于:包括石英晶体片(I)、设置在所述的石英晶体片(I)上的多个LED芯片(2)、覆盖在所述的LED芯片(2)上的硅胶层(4)、以及设置在所述的石英晶体片(I)的正负电极(5),其中,所述的LED芯片(2)在石英晶体片(I)上呈U型分布并通过金线(3)与正负电极(5)相连通。 An LED light emission having a U-shaped transparent plate fast plug pin, characterized by: a quartz substrate (the I), a plurality of LED chips disposed on the quartz crystal substrate (I) (2) covering the silicone rubber layer of the LED chip (4) on (2), and a quartz crystal disposed in said sheet (I) of the positive and negative electrodes (5), wherein the LED chip (2) quartz crystal plate is U-shaped profile (I), and using a gold wire (3) and the negative electrode (5) communicating.
2.根据权利要求1所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的硅胶层(4)以套壳的形式包裹于整个石英晶体片(I)、LED芯片(2)的外面。 According to claim 1 having a U-shaped transparent flash plug pin piece LED light emission, wherein: said silicone rubber layer (4) wrapped in a sheet throughout the quartz crystal (I) in the form of a sleeve, outside of the LED chip (2).
3.根据权利要求1所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的LED芯片(2)在石英晶体片(I)上呈2排嵌套的U型结构分布。 According to claim 1 having a U-shaped transparent flash plug pins LED light emission sheet, wherein: the LED chip (2) form two rows of nested U on the quartz crystal substrate (I) distribution structure.
4.根据权利要求1所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的石英晶体片(I)的一端被切割以形成2个相互分离的电极安装部位。 According to claim 1 having a U-shaped transparent flash plug pins LED light emission sheet, wherein: one end of the quartz crystal substrate (I) is cut to form two mutually isolated electrode mounting portion .
5.根据权利要求4所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的正负电极(5)包括涂覆在石英晶体片(I)上的覆银区域。 According to claim 4, wherein the U-shaped having a transparent flash plug pin piece LED light emission, wherein: said positive and negative electrodes (5) comprises a silver-coated quartz crystal coated sheet (I) is region.
6.根据权利要求4所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的正负电极(5)通过注塑或压合在石英晶体片(I)上,所述的正负电极(5)具有顶部的开口,开口内部设置有弹性卡扣,所述的电极安装部位通过开口插入后弹性卡扣压紧锁定。 According to claim 4, wherein the U-shaped having a transparent flash plug pin piece LED light emission, wherein: said positive and negative electrodes (5) by injection molding or quartz sheet in the nip (the I), the positive and negative electrodes (5) having an open top, an opening is provided inside with a resilient latch, said electrode mounting portion is inserted through openings in the resilient snap-snap locking.
7.根据权利要求4所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的正负电极(5)安装于一裤状结构的底端,该裤状结构套设于电极安装部位上。 According to claim 4, wherein the U-shaped having a transparent flash plug pin piece LED light emission, wherein: said positive and negative electrodes (5) is attached to the bottom end of a pant-like configuration, the pant-like structure sleeve disposed on the electrode mounting portion.
8.根据权利要求4所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的正负电极(5 )安装于一套状结构的底端,该套状结构套设于电极安装部位上,并在正负电极(5)之间设置电介质。 According to claim 4, wherein the U-shaped having a transparent flash plug pin piece LED light emission, wherein: said positive and negative electrodes (5) is attached to the bottom end of a like structure, the sleeve-like structure sleeved on the mounting portion of the electrode, and a dielectric disposed between the positive and negative electrodes (5).
9.根据权利要求1所述的具有快速插接引脚的透明U型LED发光片,其特征在于:所述的石英晶体片(I)由钠钙硅浮法玻璃制成,所述的钠钙硅浮法玻璃包含质量百分比为70-73% 的SiO, 21.0-2.0% 的Al2O3, 7-12% 的CaO, 1.0-4.5% 的MgO, 13-15% 的R2O,以及0.08_0.14%Fe203o Fast connected U-shaped transparent plate emitting LED pin, characterized by a claimed in claim 1: said quartz crystal plate (I) made of soda-lime-silica float glass, the sodium lime-silica float glass comprising 70-73% by mass percentage of SiO, 21.0-2.0% of Al2O3, 7-12% of CaO, 1.0-4.5% of MgO, 13-15% of R2O, and 0.08_0.14% Fe203o
10.一种LED灯泡,其特征在于:具有如权利要求1-9中任一所述的具有快速插接引脚的透明U型LED发光片。 10. An LED bulb, comprising: a transparent as claimed in claim having a U-shaped piece LED light emission of a rapid insertion of the pin in claims 1-9.
CN201410091307.7A 2014-03-13 2014-03-13 Transparent U-shaped LED light-emitting sheet with quick plug-in pins and LED bulb formed by the LED light-emitting sheet CN103840065A (en)

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