WO2009081648A1 - Procédé de fabrication d'un substrat de montage d'élément - Google Patents

Procédé de fabrication d'un substrat de montage d'élément Download PDF

Info

Publication number
WO2009081648A1
WO2009081648A1 PCT/JP2008/068986 JP2008068986W WO2009081648A1 WO 2009081648 A1 WO2009081648 A1 WO 2009081648A1 JP 2008068986 W JP2008068986 W JP 2008068986W WO 2009081648 A1 WO2009081648 A1 WO 2009081648A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
adhesive layer
temporary fixing
fixing material
heated
Prior art date
Application number
PCT/JP2008/068986
Other languages
English (en)
Japanese (ja)
Inventor
Yuki Ito
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009546983A priority Critical patent/JP5282981B2/ja
Publication of WO2009081648A1 publication Critical patent/WO2009081648A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29005—Structure
    • H01L2224/29007—Layer connector smaller than the underlying bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/2902—Disposition
    • H01L2224/29034—Disposition the layer connector covering only portions of the surface to be connected
    • H01L2224/29036—Disposition the layer connector covering only portions of the surface to be connected covering only the central area of the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H01L2224/29191—The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H01L2224/83002—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus being a removable or sacrificial coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83136—Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/83138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8314—Guiding structures outside the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83905—Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
    • H01L2224/83907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method for manufacturing an element mounting substrate, and more particularly to a technique for temporarily fixing an element to a substrate when manufacturing the substrate on which the element is mounted.
  • a carrier tape 120 in which an electronic component 110 having a bottom surface with an adhesive 111 that generates adhesive force by heating at about 80 ° C. as an adhesive layer is accommodated in a recess 123 of a base tape 121.
  • the cover tape 122 of the carrier tape 120 is prepared, the electronic component 110 is taken out by a suction head (not shown), and the adhesive 111 is heat-treated and softened to generate an adhesive force, and then the adhesive 111 Is pressed against a printed circuit board (not shown) (see, for example, Patent Document 1).
  • an element to which a thermal adhesive sheet that generates an adhesive force when heated is placed on a substrate and heated while the thermal adhesive sheet is in contact with the substrate to cause the thermal adhesive sheet to generate an adhesive force. Then, the element is fixed to the substrate via the thermal bonding sheet.
  • the adhesive 111 may adhere to dust after being heated to generate adhesive force and before being pressed against the printed circuit board.
  • the thermal adhesive sheet When heating with the thermal adhesive sheet in contact with the substrate as in the latter, when the thermal adhesive sheet is exposed, it does not yet have adhesive force, so that no dust adheres to the thermal adhesive sheet.
  • the element can be fixed to the substrate. However, the element is not fixed by any member until the element to which the heat bonding sheet is attached is placed on the substrate and heated. Therefore, the position of the element may be shifted with respect to the substrate due to the movement or tilt of the substrate when the substrate is carried into the heating furnace. For this reason, it is necessary to carefully perform operations such as transporting the substrate, and it is difficult to improve work efficiency.
  • the present invention is intended to provide a method for manufacturing an element mounting substrate that can easily and efficiently fix the element to the substrate.
  • the present invention provides a method for manufacturing an element mounting substrate configured as follows.
  • a method for manufacturing an element mounting substrate includes (1) a first step of preparing an element on which an adhesive layer that generates adhesive force when heated and a substrate are prepared, and (2) disposing the element on the substrate.
  • the adhesive layer of the element is provided with a space to face the substrate.
  • the element is arranged on the substrate so that the element is in contact with the temporary fixing material.
  • the temporary fixing material is heated to disappear or deform, and the space between the adhesive layer of the element and the substrate disappears, and the adhesive layer of the element is in contact with the substrate.
  • the adhesive layer of the element is adhered to the substrate.
  • the temporary fixing material is heated to disappear or deform, and the adhesive layer of the element comes into contact with the substrate. Therefore, the element is bonded to the substrate by the adhesive force of the adhesive layer generated by heating.
  • the temporary fixing material having fluidity on the substrate in the second step. Since the temporary fixing material is heated and disappears or deforms in the third step, a complicated process such as removing the temporary fixing material after fixing the element to the substrate can be eliminated.
  • the element can be fixed to the substrate easily and efficiently.
  • the temporary fixing material in the second step, is liquid. In the third step, the temporary fixing material is heated and disappears.
  • the element can be temporarily fixed using the surface tension of the liquid temporary fixing material.
  • the temporary fixing material in a paste form.
  • the temporary fixing material is heated and deformed.
  • the temporary fixing material is, for example, a solder paste.
  • the temporary fixing material can be easily arranged on the substrate.
  • the temporary fixing material can be deformed by spreading the temporary fixing material in the third step.
  • the element has an external electrode.
  • the substrate has a pad.
  • the temporary fixing material is a solder paste, disposed on the pad of the substrate, and in contact with the external electrode of the element.
  • solder paste used as the temporary fixing material can also be used for electrical connection between the external electrode and the pad, and when the element is an electronic component, soldering after the element is fixed becomes unnecessary.
  • the temperature at which the temporary fixing material starts to deform or disappear is lower than the temperature at which the adhesive force is generated in the adhesive layer.
  • the third step after the temporary fixing material is deformed or disappeared and the adhesive layer of the element comes into contact with a predetermined region of the substrate, an adhesive force can be generated in the adhesive layer. Compared to the case where the adhesive layer is separated from the substrate when the adhesive force is generated in the layer, the surrounding dust is less likely to adhere to the adhesive layer.
  • the adhesive layer contains a thermosetting resin or a thermoplastic resin as a main component.
  • the device can be easily and efficiently fixed to the substrate by temporarily fixing the device with the temporary fixing material.
  • Example 1 A method of manufacturing an element mounting substrate of the first example will be described with reference to FIGS.
  • the element mounting substrate on which the element 20 is mounted is manufactured by mounting the element 20 on the substrate 10 according to the procedure shown in the cross-sectional views of FIGS.
  • a substrate 10 is prepared.
  • the substrate 10 has a pad 14 formed on the upper surface 12 a of the main body 12.
  • the pad 14 may not be provided.
  • the substrate 10 may be a printed circuit board, a flexible printed board, a ceramic substrate, or a metal plate.
  • an element 20 is prepared.
  • the element body 22 may be ceramic, resin, or semiconductor.
  • the element 20 has an adhesive layer 24 formed on the lower surface 22 a of the element body 22.
  • the adhesive layer 24 is formed smaller than the lower surface 22 a of the element body 22.
  • the adhesive layer 24 does not have adhesiveness at room temperature, and becomes adhesive when heated.
  • the adhesive layer 24 is formed by a method of applying an acrylic, epoxy, urethane, silicone, or polyimide resin, or affixing a thermal adhesive sheet.
  • the adhesive layer 24 is formed by applying a thermosetting resin or a thermoplastic resin to the element body 22 with the element body 22 turned upside down from the state of FIG. After heating, it is formed by returning to room temperature.
  • the adhesive layer 24 thus formed is in a semi-cured state. Although the semi-cured adhesive layer 24 is adhered to the element body 22 side, the exposed surface 24a is not so sticky that another member (including dust) is newly attached.
  • the adhesive layer 24 may be formed by attaching a thermal adhesive sheet.
  • a thermal adhesive sheet For example, the Toyo Ink TSU series thermal adhesive sheet is cut out, the element body 22 is placed upside down from the state of FIG. 1B, placed on the element body 22 and heated at 150 ° C. for 1 minute, paste.
  • the temporary fixing material 16 is disposed on the pad 14 of the substrate 10.
  • the temporary fixing material 16 is a liquid such as water, alcohol, or an organic solvent.
  • the temporary fixing material 16 may contain a solid component that disappears in a later heating step.
  • the temporary fixing material 16 rises from the pad 14 of the substrate 10 due to surface tension.
  • the temporary fixing material 16 may be provided in at least one place with respect to one element 20, and may be arranged in any manner. However, it is desirable to provide the temporary fixing material 16 symmetrically because the temporary fixing state is easily stabilized.
  • the element is placed on the substrate 10 with the element 20 in contact with the temporary fixing material 16.
  • the adhesive layer 24 of the element 20 faces the substrate 10
  • a space 26 is formed between the adhesive layer 24 of the element 20 and the substrate 10
  • the element 20 is supported in a state of floating from the substrate 10. To do. Since the movement of the element 20 is prevented by the surface tension of the temporary fixing material 16, the element 20 is temporarily fixed.
  • the element 20 is heated while being temporarily fixed to the substrate 10 with the temporary fixing material 16.
  • the liquid temporary fixing material 16 is vaporized and its volume decreases. For this reason, the space 26 between the substrate 10 and the adhesive layer 24 of the element 20 becomes narrow, and eventually the adhesive layer 24 of the element 20 comes into contact with the substrate 10 as shown in FIG.
  • the surface tension of the temporary fixing material 16 causes the element 20 to move toward the substrate 10 side.
  • the heading force acts. Therefore, the adhesive layer 24 of the element 20 is pressed to the substrate 10 side by the surface tension of the temporary fixing material 16 in addition to the weight of the element body 22.
  • the temporary fixing material 16 disappears completely as shown in FIG.
  • the adhesive layer 24 is a thermosetting resin
  • the adhesive layer 24 is completely cured by continuing the heating, and the adhesion with the substrate 10 is completed.
  • the adhesive layer 24 of the element 20 in contact with the substrate 10 generates an adhesive force by heating and is adhered to the substrate 10.
  • the timing at which the adhesive force is generated in the adhesive layer 24 may be before the adhesive layer 24 contacts the substrate 10 or after the adhesive layer 24 contacts the substrate 10.
  • the temperature T 1 at which the thermal adhesive sheet becomes sticky is about 120 ° C. to 200 ° C., and the temperature at which the liquid of the temporary fixing material 16 vaporizes. It is higher than T 0 (boiling point of water or alcohol). Therefore, when the temperature rises during the heating and reaches the temperature T 0 , the temporary fixing material 16 starts to vaporize and disappears. When the temporary fixing material 16 disappears completely, the adhesive layer 24 comes into contact with the substrate 10. At this time, no adhesive force is generated in the adhesive layer 24. Further, when the temperature reaches a temperature T 1 of rises, the adhesive layer 24 results in adhesion. When the temperature is maintained for a certain time (for example, about 30 minutes), the heat-bonding sheet of the adhesive layer 24 is fully cured and the bonding is completed.
  • T 0 boiling point of water or alcohol
  • the adhesive layer 24 has an adhesive force after coming into contact with the substrate 10, the adhesive layer 24 has no adhesive force until it comes into contact with the substrate 10, so that dust hardly adheres to the adhesive layer 24, preferable.
  • the adhesive layer 24 is a thermoplastic resin
  • the adhesive layer 24 is cured during cooling and the adhesion is completed.
  • Example 1 the element 20 having the adhesive layer 24 having no adhesiveness at room temperature can be temporarily fixed to the substrate 10 using the liquid temporary fixing material 16.
  • the adhesive layer 24 of the element 20 is not in contact with the substrate 10, but when heated, the temporary fixing material 16 starts to disappear, and when the temporary fixing material 16 completely disappears, the adhesive layer 24 of the element 20 is removed from the substrate 10. Therefore, the element 20 can be bonded to the substrate 10. In the process in which the temporary fixing material 16 disappears, the adhesive layer 24 is pressed toward the substrate 10 by the surface tension of the temporary fixing material 16, so that sufficient adhesive strength can be obtained.
  • the electrode can be protected by covering the electrode with the adhesive layer 24.
  • Example 2 A second example will be described with reference to FIG.
  • the element 20 is fixed to the substrate 10 in substantially the same procedure as in the first embodiment.
  • the second embodiment is different from the first embodiment in that a solder paste is used as the temporary fixing material 17.
  • the same reference numerals are used for the same parts as in the first embodiment, and differences from the first embodiment will be mainly described.
  • a substrate 10 and an element 20 are prepared.
  • the solder paste is used for the temporary fixing material 17, it is necessary to provide the pads 14 on the substrate 10.
  • solder paste as a temporary fixing material 17 is arranged in a raised shape. Since the solder paste is paste-like and highly viscous, it is easy to arrange in a raised shape.
  • the temporary fixing material 17 is not limited to the solder paste, but may be any paste that can be deformed by heat.
  • the element 20 is arranged on the substrate.
  • the adhesive layer 24 of the element 20 faces the substrate 10
  • the temporary fixing material 17 contacts the element 20
  • a space 26 is formed between the adhesive layer 24 of the element 20 and the substrate 10. It is supported in a state where it floats from 10. Since the element 20 is supported by the temporary fixing material 17 and is prevented from moving, the element 20 is temporarily fixed.
  • heating is performed in a state where the element 20 is temporarily fixed to the substrate 10 with the temporary fixing material 17.
  • the solder paste of the temporary fixing material 17 is liquefied and spreads wet on the pads 14 of the substrate 10. Further, the flux component contained in the solder paste of the temporary fixing material 17 evaporates, and the volume of the temporary fixing material 17 decreases. Therefore, the solder paste of the temporary fixing material 17 is deformed, and the space 26 between the substrate 10 and the adhesive layer 24 of the element 20 is narrowed, and eventually the adhesive layer 24 of the element 20 is formed as shown in FIG. The state comes into contact with the substrate 10.
  • the volume of the temporary fixing material 17 is further reduced by heating, and as shown in FIG.
  • the resin is cured in a state separated from the element 20.
  • the adhesive layer 24 of the element 20 generates an adhesive force by heating.
  • the timing at which the adhesive force is generated in the adhesive layer 24 may be before the adhesive layer 24 contacts the substrate 10 or after the adhesive layer 24 contacts the substrate 10.
  • the temperature T 1 at which the thermal adhesive sheet becomes sticky is about 120 ° C. to 200 ° C., and the solder paste of the temporary fixing material 17 melts and starts to deform.
  • Temperature T 2 (for example, 200 ° C. or higher). Therefore, the temperature is increased during heating, reaches a temperature T 1, the adhesive strength to the adhesive layer 24 before temporary fixing member 17 is deformed occurs, reaches a temperature T 2 temperature further rises, the temporary The stopper 17 is deformed and the adhesive layer 24 is in contact with the substrate 10.
  • the thermal adhesive sheet of the adhesive layer 24 is fully cured and bonding is completed. To do.
  • Example 2 the element 20 having the adhesive layer 24 that is not sticky at room temperature can be temporarily fixed to the substrate 10 using the paste-like temporary fixing material 17.
  • the adhesive layer 24 of the element 20 is not in contact with the substrate 10.
  • the temporary fixing material 17 is melted and wetted to spread or the volume is reduced, so that the adhesive layer 24 of the element 20 comes into contact with the substrate 10 and can be bonded to the substrate 10.
  • the adhesive layer 24 is pressed toward the substrate 10 by the surface tension of the liquid temporary fixing material 17, so that sufficient adhesive strength by the adhesive layer 24 can be obtained.
  • the electrode can be protected by covering the electrode with the adhesive layer 24. .
  • Example 3 will be described with reference to FIG.
  • a solder paste is used as the temporary fixing material 17x as in the second embodiment. Below, it demonstrates centering on difference with Example 2. FIG.
  • the element 20x is an electronic component having an external electrode 23x at the end of the element body 22x.
  • the element 20x is disposed such that the external electrode 23x is in contact with the solder paste disposed as the temporary fixing material 17x on the pad 14 of the substrate 10.
  • the adhesive layer 24 is separated from the substrate 10.
  • the element 20x is temporarily fixed to the substrate 10 and then heated.
  • the solder paste of the temporary fixing material 17x is heated and melted, wets and spreads on the external electrode 23x of the element 20x and the pad 14 of the substrate 10, and the adhesive layer 24 of the element 20x contacts the substrate 10.
  • the temporary fixing material 17x remains in contact with the external electrode 23x of the element 20x, and even after being cooled and cured after heating, as shown in the cross-sectional view of FIG. Is also in contact with the external electrode 23x of the element 20. Thereby, the temporary fixing material 17x electrically connects the external electrode 23x of the element 20x and the pad 14 of the substrate 10.
  • the solder paste used as the temporary fixing material 17x is also used for electrical connection between the external electrode 23x of the element 20x and the substrate 10 pad 14, thereby fixing the element when the element 20x is an electronic component. No later soldering is required. Further, since the adhesive layer 24 is formed in the gap between the element 20x and the substrate 10, it is possible to prevent the temporary fixing materials 17x at both ends of the element 20x from coming into contact with each other to cause a short circuit.
  • the present invention is effective as a method for fixing any element to a substrate (including a sheet-like substrate), and can be widely applied to a method for manufacturing a substrate on which an element is mounted.
  • the present invention can be applied when manufacturing a wireless IC device (RF-ID device) in which a power supply circuit board on which an IC chip is mounted is bonded to a sheet including a radiation plate that functions as an antenna.
  • a feeding circuit board (the “element” of the present invention) on which a chip is mounted by arranging a liquid or paste-like temporary fixing material on a sheet including the radiation plate (corresponding to the “substrate” of the present invention). Is temporarily fixed, and then heated and cooled, and a thermal adhesive sheet (corresponding to the “adhesive layer” of the present invention) formed in advance on the bottom surface of the feeder circuit board is adhered to the radiation plate sheet.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un substrat de montage d'élément, un élément étant simplement et efficacement fixé sur un substrat. Le procédé comporte une première étape consistant à préparer un élément (20), sur lequel est formée une couche adhésive (24) générant une force adhésive en cas de chauffage, et un substrat (10) ; une deuxième étape consistant à disposer l'élément (20) sur le substrat (10) ; et une troisième étape consistant à coller la couche adhésive (24) sur le substrat (10) par chauffage, puis à refroidir la couche adhésive dans un état où l'élément (20) est disposé sur le substrat (10). Dans la deuxième étape, après avoir disposé un matériau de maintien temporaire (16) présentant une fluidité sur une partie dans une région prescrite du substrat (10) sur lequel l'élément (20) doit être disposé, l'élément (20) est disposé sur le substrat (10) de sorte que la couche adhésive (24) fasse face au substrat (10) en aménageant un espace (26) et de sorte que l'élément (20) soit amené en contact avec le matériau de maintien temporaire (16). Dans la troisième étape, le matériau de maintien temporaire (16) disparaît ou est déformé par chauffage, l'espace (26) entre la couche adhésive (24) et le substrat (10) est supprimé pour permettre que la couche adhésive (24) soit mise en contact avec le substrat (10) et la couche adhésive (24) est liée au substrat (10).
PCT/JP2008/068986 2007-12-21 2008-10-20 Procédé de fabrication d'un substrat de montage d'élément WO2009081648A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009546983A JP5282981B2 (ja) 2007-12-21 2008-10-20 素子搭載基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-329856 2007-12-21
JP2007329856 2007-12-21

Publications (1)

Publication Number Publication Date
WO2009081648A1 true WO2009081648A1 (fr) 2009-07-02

Family

ID=40800964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068986 WO2009081648A1 (fr) 2007-12-21 2008-10-20 Procédé de fabrication d'un substrat de montage d'élément

Country Status (2)

Country Link
JP (1) JP5282981B2 (fr)
WO (1) WO2009081648A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017013808A1 (fr) * 2015-07-23 2017-01-26 ルネサスエレクトロニクス株式会社 Dispositif à semi-conducteurs et procédé de fabrication associé
EP3276652A3 (fr) * 2015-04-02 2018-04-25 Heraeus Deutschland GmbH & Co. KG Procédé de fabrication d'un agencement de substrat avec un moyen de pré-fixation à colle, agencement de substrat correspondant, procédé de connexion d'un composant électronique avec un agencement de substrat utilisant un moyen de pré-fixation à colle formé sur le composant électronique et/ou l'agencement de substrat et composant électronique connecté avec un agencement de substrat

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636121A (en) * 1979-08-31 1981-04-09 Matsushita Electric Works Ltd Method of mounting condenser
JPS63149864U (fr) * 1987-03-25 1988-10-03
JPH0888464A (ja) * 1994-09-20 1996-04-02 Sony Corp フリップチップ実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636121A (en) * 1979-08-31 1981-04-09 Matsushita Electric Works Ltd Method of mounting condenser
JPS63149864U (fr) * 1987-03-25 1988-10-03
JPH0888464A (ja) * 1994-09-20 1996-04-02 Sony Corp フリップチップ実装方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3276652A3 (fr) * 2015-04-02 2018-04-25 Heraeus Deutschland GmbH & Co. KG Procédé de fabrication d'un agencement de substrat avec un moyen de pré-fixation à colle, agencement de substrat correspondant, procédé de connexion d'un composant électronique avec un agencement de substrat utilisant un moyen de pré-fixation à colle formé sur le composant électronique et/ou l'agencement de substrat et composant électronique connecté avec un agencement de substrat
WO2017013808A1 (fr) * 2015-07-23 2017-01-26 ルネサスエレクトロニクス株式会社 Dispositif à semi-conducteurs et procédé de fabrication associé
US10262927B2 (en) 2015-07-23 2019-04-16 Renesas Electronics Corporation Semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
JPWO2009081648A1 (ja) 2011-05-06
JP5282981B2 (ja) 2013-09-04

Similar Documents

Publication Publication Date Title
US7833831B2 (en) Method of manufacturing an electronic component and an electronic device
JPH11191569A (ja) フリップチップ実装方法および半導体装置
JP2016184612A (ja) 半導体装置の実装方法
US20090126980A1 (en) Printed wiring board
US20100327044A1 (en) Method for manufacturing electronic component module
JP5282981B2 (ja) 素子搭載基板の製造方法
JP4596034B2 (ja) 電子部品モジュールの製造方法
JP2006245554A (ja) 電気部品の実装方法
JP2004363220A (ja) 実装構造体の製造方法及び接続体
JP2000012609A (ja) 回路基板への半導体チップの実装方法
JP2006513579A (ja) 半導体部品の垂直マウント方法
JP2009259998A (ja) 電子部品モジュールの製造方法
JP3075231B2 (ja) 半導体装置及びその製造方法
JP2002026071A (ja) 半導体装置及びその製造方法、回路基板並びに電子機器
JP5003651B2 (ja) 放熱構造体の製造方法
US7666714B2 (en) Assembly of thin die coreless package
JP2008235656A (ja) 回路基板の実装体
JP2005026501A (ja) 電子部品実装構造および電子部品実装方法ならびに電子部品用接着剤
JP4144553B2 (ja) 半導体装置の製造方法
JP3138779B2 (ja) チップ部品の装着方法
JP2000101013A (ja) ベアチップ部品を含む混載部品の実装方法および混載回路基板
TWI300615B (en) Reeier substrarte capable of avoiding shift of a die thereon
JP2007214330A (ja) 導体ペーストの供給方法
JPH11186325A (ja) 半導体装置の製造方法
JP2008078280A (ja) 電子回路素子の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08865382

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009546983

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08865382

Country of ref document: EP

Kind code of ref document: A1