WO2009066571A1 - レーザ光照射装置 - Google Patents

レーザ光照射装置 Download PDF

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Publication number
WO2009066571A1
WO2009066571A1 PCT/JP2008/070319 JP2008070319W WO2009066571A1 WO 2009066571 A1 WO2009066571 A1 WO 2009066571A1 JP 2008070319 W JP2008070319 W JP 2008070319W WO 2009066571 A1 WO2009066571 A1 WO 2009066571A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser light
terminal
application device
light
optical fiber
Prior art date
Application number
PCT/JP2008/070319
Other languages
English (en)
French (fr)
Inventor
Takahiro Nagashima
Hideo Miura
Original Assignee
Miyachi Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyachi Corporation filed Critical Miyachi Corporation
Priority to US12/734,704 priority Critical patent/US8378255B2/en
Priority to JP2009542520A priority patent/JP5391077B2/ja
Publication of WO2009066571A1 publication Critical patent/WO2009066571A1/ja

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/24—Seam welding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/14—Mode converters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features

Abstract

【課題】レーザ光のオーバーラップ率を低下させても、照射箇所に対して均一幅を有する線状の溶接を精密に行なうことができるレーザ光照射装置を提供すること。 【解決手段】レーザ光ＬＺを出力するレーザ光発生手段３０と、入光端１０ａから入光されたレーザ光ＬＺを伝送してその出光端１０ｂから出光する光ファイバ１０と、レーザ光発生手段から出力されたレーザ光ＬＺを入光端１０ａに入光させる入射光学ユニット６と、出光端１０ｂから出光されたレーザ光ＬＺを照射箇所ＬＰに照射する出射光学ユニット１１を備えたレーザ光照射装置２０において、光ファイバ１０は、そのコア断面が光ファイバ１０の全域またはその出光端１０ｂから一定の距離の領域において矩形状、好ましくは長方形状に形成されており、そのコア断面が矩形状に形成された領域の長さは、３ｍ以上に設定されていることが好ましい。
PCT/JP2008/070319 2007-11-19 2008-11-07 レーザ光照射装置 WO2009066571A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/734,704 US8378255B2 (en) 2007-11-19 2008-11-07 Laser beam irradiation apparatus
JP2009542520A JP5391077B2 (ja) 2007-11-19 2008-11-07 レーザ光照射装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-299121 2007-11-19
JP2007299121 2007-11-19
JP2008035817 2008-02-18
JP2008-035817 2008-02-18

Publications (1)

Publication Number Publication Date
WO2009066571A1 true WO2009066571A1 (ja) 2009-05-28

Family

ID=40667396

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070319 WO2009066571A1 (ja) 2007-11-19 2008-11-07 レーザ光照射装置

Country Status (5)

Country Link
US (1) US8378255B2 (ja)
JP (1) JP5391077B2 (ja)
KR (1) KR101587941B1 (ja)
TW (1) TW200930490A (ja)
WO (1) WO2009066571A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061153A (ja) * 2009-09-14 2011-03-24 Omron Corp レーザ加工装置およびレーザ加工方法
JP2011167723A (ja) * 2010-02-18 2011-09-01 Shibaura Mechatronics Corp レーザ照射装置およびレーザ照射方法
JP2015521545A (ja) * 2012-06-22 2015-07-30 アイピージー フォトニクス コーポレーション レーザー掘削方法及び形状化された孔を生成するシステム
WO2016128705A1 (en) * 2015-02-09 2016-08-18 Spi Lasers Uk Limited Apparatus and method for overlap laser welding

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010138747A2 (en) * 2009-05-27 2010-12-02 Ceramoptec Industries, Inc. Precisely-shaped core fibers and method of manufacture
US10828089B2 (en) 2013-08-02 2020-11-10 Biosense Webster (Israel) Ltd. Catheter with improved irrigated tip electrode having two-piece construction, and method of manufacturing therefor
JP6732627B2 (ja) 2016-10-19 2020-07-29 浜松ホトニクス株式会社 レーザ光照射装置
JP6524992B2 (ja) * 2016-12-22 2019-06-05 トヨタ自動車株式会社 レーザ溶接方法およびレーザ溶接装置
CN111468829B (zh) * 2020-04-17 2021-08-06 中南大学 Coc光纤自动耦合封装设备

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JPH0364707A (ja) * 1989-08-02 1991-03-20 Hitachi Cable Ltd スポットサイズ変換光ファイバの製造方法
JP2006305601A (ja) * 2005-04-28 2006-11-09 Fuji Electric Holdings Co Ltd レーザ加工方法

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JPH07183605A (ja) * 1993-12-22 1995-07-21 Hitachi Ltd 固体レーザ装置
JPH09201689A (ja) * 1996-01-25 1997-08-05 Nikon Corp 焦点位置検出装置及びそれを用いるレーザ加工装置
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JP2000310745A (ja) * 1999-04-27 2000-11-07 Fuji Photo Film Co Ltd 画像記録装置及び光ファイバー
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JP2007190560A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
JP2009168914A (ja) * 2008-01-11 2009-07-30 Mitsubishi Cable Ind Ltd 光ファイバ及びその製造方法
WO2010138747A2 (en) * 2009-05-27 2010-12-02 Ceramoptec Industries, Inc. Precisely-shaped core fibers and method of manufacture
WO2011130131A1 (en) * 2010-04-12 2011-10-20 Lockheed Martin Corporation Beam diagnostics and feedback system and method for spectrally beam-combined lasers

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0364707A (ja) * 1989-08-02 1991-03-20 Hitachi Cable Ltd スポットサイズ変換光ファイバの製造方法
JP2006305601A (ja) * 2005-04-28 2006-11-09 Fuji Electric Holdings Co Ltd レーザ加工方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061153A (ja) * 2009-09-14 2011-03-24 Omron Corp レーザ加工装置およびレーザ加工方法
JP2011167723A (ja) * 2010-02-18 2011-09-01 Shibaura Mechatronics Corp レーザ照射装置およびレーザ照射方法
JP2015521545A (ja) * 2012-06-22 2015-07-30 アイピージー フォトニクス コーポレーション レーザー掘削方法及び形状化された孔を生成するシステム
WO2016128705A1 (en) * 2015-02-09 2016-08-18 Spi Lasers Uk Limited Apparatus and method for overlap laser welding
US10668565B2 (en) 2015-02-09 2020-06-02 Spi Lasers Uk Limited Apparatus and method for overlap laser welding

Also Published As

Publication number Publication date
US8378255B2 (en) 2013-02-19
KR101587941B1 (ko) 2016-01-22
TW200930490A (en) 2009-07-16
JP5391077B2 (ja) 2014-01-15
US20100254418A1 (en) 2010-10-07
JPWO2009066571A1 (ja) 2011-04-07
TWI450785B (ja) 2014-09-01
KR20100102117A (ko) 2010-09-20

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