WO2009060943A1 - プラズマ処理装置および被処理物搬送方法 - Google Patents

プラズマ処理装置および被処理物搬送方法 Download PDF

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Publication number
WO2009060943A1
WO2009060943A1 PCT/JP2008/070314 JP2008070314W WO2009060943A1 WO 2009060943 A1 WO2009060943 A1 WO 2009060943A1 JP 2008070314 W JP2008070314 W JP 2008070314W WO 2009060943 A1 WO2009060943 A1 WO 2009060943A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing material
jetting
floating
gas
jetting ports
Prior art date
Application number
PCT/JP2008/070314
Other languages
English (en)
French (fr)
Inventor
Katsushi Kishimoto
Yusuke Fukuoka
Nobuyuki Tanigawa
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2009060943A1 publication Critical patent/WO2009060943A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

　被処理物の浮上精度を安定したものにすることができるとともに、被処理物に対して所望のプラズマ処理を行うことができるプラズマ処理装置を提供すること。 　ガイドプレート７には、搬送方向に直交する方向へ１列に７個、搬送方向に平行な方向へ１６列に配置された合計１１２個の円形ガス噴出孔８が形成されている。１１２個のガス噴出孔８は、２列である１４個ごとに独立した８つの帯状噴出孔群９に分けられている。制御機能部は、被処理物搬入室１、プラズマ処理室２および被処理物搬出室３における被処理物５，６の浮上に関与している噴出孔群９のガス噴出孔８から浮上用ガスを順次噴出させるとともに、被処理物５，６の浮上に関与しなくなった噴出孔群９ガス噴出孔８からの浮上用ガスの噴出を順次停止する。
PCT/JP2008/070314 2007-11-08 2008-11-07 プラズマ処理装置および被処理物搬送方法 WO2009060943A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-291183 2007-11-08
JP2007291183A JP4876055B2 (ja) 2007-11-08 2007-11-08 プラズマ処理装置および被処理物搬送方法

Publications (1)

Publication Number Publication Date
WO2009060943A1 true WO2009060943A1 (ja) 2009-05-14

Family

ID=40625829

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070314 WO2009060943A1 (ja) 2007-11-08 2008-11-07 プラズマ処理装置および被処理物搬送方法

Country Status (2)

Country Link
JP (1) JP4876055B2 (ja)
WO (1) WO2009060943A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228342A (ja) * 1994-02-17 1995-08-29 Hitachi Ltd 気流搬送装置およびその制御方法
JP2006264939A (ja) * 2005-03-25 2006-10-05 Tokyo Electron Ltd 基板の搬送システムおよび基板の搬送方法
JP2007182305A (ja) * 2006-01-06 2007-07-19 Tokyo Electron Ltd 基板搬送装置、基板搬送方法及びコンピュータプログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07228342A (ja) * 1994-02-17 1995-08-29 Hitachi Ltd 気流搬送装置およびその制御方法
JP2006264939A (ja) * 2005-03-25 2006-10-05 Tokyo Electron Ltd 基板の搬送システムおよび基板の搬送方法
JP2007182305A (ja) * 2006-01-06 2007-07-19 Tokyo Electron Ltd 基板搬送装置、基板搬送方法及びコンピュータプログラム

Also Published As

Publication number Publication date
JP4876055B2 (ja) 2012-02-15
JP2009117713A (ja) 2009-05-28

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