WO2009060767A1 - 導電性リール - Google Patents

導電性リール Download PDF

Info

Publication number
WO2009060767A1
WO2009060767A1 PCT/JP2008/069647 JP2008069647W WO2009060767A1 WO 2009060767 A1 WO2009060767 A1 WO 2009060767A1 JP 2008069647 W JP2008069647 W JP 2008069647W WO 2009060767 A1 WO2009060767 A1 WO 2009060767A1
Authority
WO
WIPO (PCT)
Prior art keywords
adapter
core portion
reel
abrasion
dust
Prior art date
Application number
PCT/JP2008/069647
Other languages
English (en)
French (fr)
Inventor
Satoru Kudose
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to US12/734,514 priority Critical patent/US20100252671A1/en
Priority to CN2008801151463A priority patent/CN101855155B/zh
Priority to KR1020107010303A priority patent/KR101131406B1/ko
Publication of WO2009060767A1 publication Critical patent/WO2009060767A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04—Kinds or types
    • B65H75/08—Kinds or types of circular or polygonal cross-section
    • B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2601/00—Problem to be solved or advantage achieved
    • B65H2601/50—Diminishing, minimizing or reducing
    • B65H2601/52—Diminishing, minimizing or reducing entities relating to handling machine
    • B65H2601/522—Wear of friction surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/37—Tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/50—Storage means for webs, tapes, or filamentary material
    • B65H2701/51—Cores or reels characterised by the material
    • B65H2701/515—Cores or reels characterised by the material assembled from parts made of different materials
    • B65H2701/5152—End flanges and barrel of different material
    • B65H2701/51528—Plastic barrel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)

Abstract

　リール（１００）は、軸穴（１０４）を有するアダプタ（１０１）と、内周側にてアダプタ（１０１）を保持する円筒型のコア部（１０２）と、コア部（１０２）の各端部から、コア部（１０２）の軸を中心として放射円状に形成されている円板型の２つのフランジ部（１０３）とにより構成され、アダプタ（１０１）の材料は、コア部（１０２）およびフランジ部（１０３）の材料とは異なる、１０００サイクルのテーバー磨耗試験（荷重１kgf，磨耗輪ＣＳ－１７）による磨耗損失量が１５ｍｇ以下の材料である構成である。これにより、発塵し易い箇所の発塵を抑制することができる導電性リールを提供する。
PCT/JP2008/069647 2007-11-09 2008-10-29 導電性リール WO2009060767A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/734,514 US20100252671A1 (en) 2007-11-09 2008-10-29 Conductive reel
CN2008801151463A CN101855155B (zh) 2007-11-09 2008-10-29 导电卷盘
KR1020107010303A KR101131406B1 (ko) 2007-11-09 2008-10-29 도전성 릴

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007292615A JP4633778B2 (ja) 2007-11-09 2007-11-09 樹脂材料を使用するｔａｂテープ用導電性リール
JP2007-292615 2007-11-09

Publications (1)

Publication Number Publication Date
WO2009060767A1 true WO2009060767A1 (ja) 2009-05-14

Family

ID=40625661

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069647 WO2009060767A1 (ja) 2007-11-09 2008-10-29 導電性リール

Country Status (6)

Country Link
US (1) US20100252671A1 (ja)
JP (1) JP4633778B2 (ja)
KR (1) KR101131406B1 (ja)
CN (1) CN101855155B (ja)
TW (1) TWI364395B (ja)
WO (1) WO2009060767A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104276453A (zh) * 2014-09-30 2015-01-14 无锡市新颖密封材料厂 一种四氟缠绕盘
CN107365451A (zh) * 2017-08-31 2017-11-21 东莞市胜跃实业发展有限公司 一种以pp塑料为主材的并用于收纳led灯条的卷盘及其制备方法
CN107459789A (zh) * 2017-08-31 2017-12-12 东莞市胜跃实业发展有限公司 一种以pet塑料为主材的高性能的led灯条卷盘及其生产工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0678365U (ja) * 1993-04-16 1994-11-04 浦和ポリマー株式会社 トップカバーテープ用巻き芯
JPH08310735A (ja) * 1995-05-19 1996-11-26 Sony Corp テープ巻取り構造
JP2002280424A (ja) * 2001-03-22 2002-09-27 Kobe Steel Ltd スポーク型電子部品実装用フィルムキャリアテープ用リール
JP2004075385A (ja) * 2002-06-20 2004-03-11 Atect Corp テープリール
JP2005075536A (ja) * 2003-08-29 2005-03-24 Daiichi:Kk リール
JP2005217019A (ja) * 2004-01-28 2005-08-11 Kyushu Seimitsu Kiki Kk フィルムキャリアテープの巻回リール

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1819707A (en) * 1929-04-10 1931-08-18 Taylor Shantz Company Construction and method of manufacturing reels
US3334402A (en) * 1963-08-16 1967-08-08 Angelo C Cuva Method of manufacturing tape reels
US3275257A (en) * 1965-03-01 1966-09-27 Bell & Howell Co Spindle adapter for super 8 supply reel
US3520486A (en) * 1967-10-03 1970-07-14 Eastman Kodak Co Reel for information bearing web material
JPS6151267A (ja) * 1984-08-20 1986-03-13 Fujitsu Ltd 帳票データの演算方法
US4629140A (en) * 1984-11-06 1986-12-16 Lacasse Steven B Film reel assembly
DE4336915C2 (de) * 1993-10-28 1996-09-12 Renk Ag Gleitlager-Kombination
JPH08157146A (ja) * 1994-12-05 1996-06-18 Daishinku Co 電子部品用テーピングリール
JP2001297549A (ja) * 2000-04-10 2001-10-26 Nitto Denko Corp 制振材連続供給体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0678365U (ja) * 1993-04-16 1994-11-04 浦和ポリマー株式会社 トップカバーテープ用巻き芯
JPH08310735A (ja) * 1995-05-19 1996-11-26 Sony Corp テープ巻取り構造
JP2002280424A (ja) * 2001-03-22 2002-09-27 Kobe Steel Ltd スポーク型電子部品実装用フィルムキャリアテープ用リール
JP2004075385A (ja) * 2002-06-20 2004-03-11 Atect Corp テープリール
JP2005075536A (ja) * 2003-08-29 2005-03-24 Daiichi:Kk リール
JP2005217019A (ja) * 2004-01-28 2005-08-11 Kyushu Seimitsu Kiki Kk フィルムキャリアテープの巻回リール

Also Published As

Publication number Publication date
TW200942483A (en) 2009-10-16
KR101131406B1 (ko) 2012-04-03
CN101855155B (zh) 2012-06-27
JP2009161256A (ja) 2009-07-23
KR20100066581A (ko) 2010-06-17
TWI364395B (en) 2012-05-21
JP4633778B2 (ja) 2011-02-16
CN101855155A (zh) 2010-10-06
US20100252671A1 (en) 2010-10-07

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