WO2009060662A1 - ボンディングワイヤ - Google Patents

ボンディングワイヤ Download PDF

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Publication number
WO2009060662A1
WO2009060662A1 PCT/JP2008/066442 JP2008066442W WO2009060662A1 WO 2009060662 A1 WO2009060662 A1 WO 2009060662A1 JP 2008066442 W JP2008066442 W JP 2008066442W WO 2009060662 A1 WO2009060662 A1 WO 2009060662A1
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WO
WIPO (PCT)
Prior art keywords
mass ppm
mass
bonding wire
alloy
gold
Prior art date
Application number
PCT/JP2008/066442
Other languages
English (en)
French (fr)
Inventor
Hiroshi Murai
Jun Chiba
Fujio Amada
Original Assignee
Tanaka Denshi Kogyok. K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyok. K. filed Critical Tanaka Denshi Kogyok. K.
Priority to KR1020097014130A priority Critical patent/KR101124612B1/ko
Priority to CN2008801134966A priority patent/CN101842505B/zh
Priority to US12/740,588 priority patent/US20110058979A1/en
Priority to EP08846565A priority patent/EP2208801B1/en
Priority to AT08846565T priority patent/ATE552358T1/de
Publication of WO2009060662A1 publication Critical patent/WO2009060662A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

　Mg５～１００質量ppm、In５～２０質量ppm、Al5～20 質量ppm、Yb５～２０質量ppm、残部純度９９．９９５質量％以上の金合金、又は更にCa５～２０質量ppm やLa５～２０質量ppm、Ｌｕ５～２０質量ppm、Sn５～１００質量ppm、Sr５～１００質量ppm の一種以上を添加し、或いは、さらにこれらの金合金において、Pd０．０１～１．２質量％含有させてなる、添加元素酸化物の付着に起因するセカンド接合不良を解消した金合金ボンディングワイヤ。
PCT/JP2008/066442 2007-11-06 2008-09-11 ボンディングワイヤ WO2009060662A1 (ja)

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KR1020097014130A KR101124612B1 (ko) 2007-11-06 2008-09-11 본딩 와이어
CN2008801134966A CN101842505B (zh) 2007-11-06 2008-09-11 接合线
US12/740,588 US20110058979A1 (en) 2007-11-06 2008-09-11 Bonding wire
EP08846565A EP2208801B1 (en) 2007-11-06 2008-09-11 Bonding wire
AT08846565T ATE552358T1 (de) 2007-11-06 2008-09-11 Abbindedraht

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JP2007289091A JP4150752B1 (ja) 2007-11-06 2007-11-06 ボンディングワイヤ
JP2007-289091 2007-11-06

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CN102484080B (zh) * 2009-06-18 2015-07-22 罗姆股份有限公司 半导体装置
WO2012117512A1 (ja) * 2011-03-01 2012-09-07 田中電子工業株式会社 金（Ａｕ）合金ボンディングワイヤ
JP5053456B1 (ja) * 2011-12-28 2012-10-17 田中電子工業株式会社 半導体装置接続用高純度銅細線
TWI528481B (zh) * 2014-02-13 2016-04-01 新川股份有限公司 球形成裝置、打線裝置以及球形成方法
US9889521B2 (en) * 2014-12-02 2018-02-13 Asm Technology Singapore Pte Ltd Method and system for pull testing of wire bonds
CN113584355A (zh) * 2021-08-03 2021-11-02 上杭县紫金佳博电子新材料科技有限公司 一种键合用铝基合金母线及其制备方法

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JP2009114499A (ja) 2009-05-28
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US20110058979A1 (en) 2011-03-10
CN101842505B (zh) 2012-12-26
TWI390056B (zh) 2013-03-21
EP2208801A1 (en) 2010-07-21
JP4150752B1 (ja) 2008-09-17
EP2369023A1 (en) 2011-09-28
KR20090087123A (ko) 2009-08-14
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