WO2009057632A1 - 用力供給部材の接続装置、ステージ装置、投影光学系の支持装置及び露光装置 - Google Patents
用力供給部材の接続装置、ステージ装置、投影光学系の支持装置及び露光装置 Download PDFInfo
- Publication number
- WO2009057632A1 WO2009057632A1 PCT/JP2008/069636 JP2008069636W WO2009057632A1 WO 2009057632 A1 WO2009057632 A1 WO 2009057632A1 JP 2008069636 W JP2008069636 W JP 2008069636W WO 2009057632 A1 WO2009057632 A1 WO 2009057632A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- medium supply
- supply member
- holding section
- optical system
- projection optical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F7/00—Vibration-dampers; Shock-absorbers
- F16F7/10—Vibration-dampers; Shock-absorbers using inertia effect
- F16F7/104—Vibration-dampers; Shock-absorbers using inertia effect the inertia member being resiliently mounted
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Theoretical Computer Science (AREA)
- Atmospheric Sciences (AREA)
- Mathematical Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
用力供給部材の接続装置は、保持部(41)と、駆動装置(43)と、計測装置(47)と、制御装置とを備える。保持部(41)は、第1部材(CL)に相対移動自在に支持され、第1部材(CL)と第2部材(15)との間で接続される用力供給部材(TB)の一部を保持する。駆動装置(43)は、保持部(41)を第1部材(CL)に対して相対移動させる。計測装置(47)は、保持部(41)と第2部材(15)との相対位置に関する情報を得る。制御装置は、計測装置(47)の計測結果に基づいて、駆動装置(43)を制御する。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-280623 | 2007-10-29 | ||
JP2007280623 | 2007-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009057632A1 true WO2009057632A1 (ja) | 2009-05-07 |
Family
ID=40591021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/069636 WO2009057632A1 (ja) | 2007-10-29 | 2008-10-29 | 用力供給部材の接続装置、ステージ装置、投影光学系の支持装置及び露光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090201484A1 (ja) |
TW (1) | TW200928609A (ja) |
WO (1) | WO2009057632A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103322104A (zh) * | 2013-05-16 | 2013-09-25 | 安徽微威胶件集团有限公司 | 悬臂式阻尼隔振器 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009024870A1 (de) * | 2008-06-10 | 2009-12-31 | Carl Zeiss Smt Ag | Optische Einrichtung mit einstellbarer Kraftwirkung auf ein optisches Modul |
TWI393601B (zh) * | 2009-12-18 | 2013-04-21 | Excetek Technologies Co Ltd | 線切割機自動尋找起割孔定位裝置 |
JP5641878B2 (ja) * | 2010-10-29 | 2014-12-17 | キヤノン株式会社 | 振動制御装置、リソグラフィー装置、および、物品の製造方法 |
JP2014513869A (ja) * | 2011-04-22 | 2014-06-05 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | ウェーハのようなターゲットを処理するためのリソグラフィシステム、及びウェーハのようなターゲットを処理するためのリソグラフィシステムを動作させる方法 |
JP5941705B2 (ja) * | 2012-02-29 | 2016-06-29 | ファスフォードテクノロジ株式会社 | 2軸駆動機構及びダイボンダ |
JP2015515758A (ja) * | 2012-04-26 | 2015-05-28 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィ装置及びデバイス製造方法 |
JP2014056979A (ja) * | 2012-09-13 | 2014-03-27 | Hitachi High-Tech Instruments Co Ltd | 水平軸駆動機構、2軸駆動機構及びダイボンダ |
JP6302305B2 (ja) * | 2014-03-18 | 2018-03-28 | キヤノン株式会社 | 振動低減装置、リソグラフィ装置、および物品の製造方法 |
WO2018153622A1 (en) * | 2017-02-27 | 2018-08-30 | Asml Netherlands B.V. | Lithographic apparatus, lithographic projection apparatus and device manufacturing method |
CN108508704B (zh) * | 2017-02-28 | 2020-04-10 | 上海微电子装备(集团)股份有限公司 | 光刻机和光刻机中吊框面型补偿方法 |
DE112020005518T5 (de) * | 2020-01-30 | 2022-09-01 | Hitachi High-Tech Corporation | Ladungsträgerstrahlvorrichtung und schwingungsunterdrückungsmechanismus |
Citations (8)
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JPH08233964A (ja) * | 1994-10-19 | 1996-09-13 | Nikon Corp | 可動ステージ装置、該ステージ装置を搭載したマイクロリソグラフィ装置、及び流体冷却システム |
JP2000173884A (ja) * | 1998-12-02 | 2000-06-23 | Canon Inc | デバイス製造装置および方法ならびにデバイス製造装置の配線・配管実装方法 |
JP2001267227A (ja) * | 2000-03-21 | 2001-09-28 | Canon Inc | 除振システム、露光装置およびデバイス製造方法 |
JP2002043213A (ja) * | 2000-07-25 | 2002-02-08 | Nikon Corp | ステージ装置および露光装置 |
JP2004342987A (ja) * | 2003-05-19 | 2004-12-02 | Canon Inc | ステージ装置 |
JP2005046941A (ja) * | 2003-07-31 | 2005-02-24 | Canon Inc | ケーブル微動ユニット付きステージ装置 |
WO2006038952A2 (en) * | 2004-09-30 | 2006-04-13 | Nikon Corporation | Projection optical device and exposure apparatus |
JP2008042201A (ja) * | 2006-08-08 | 2008-02-21 | Asml Netherlands Bv | ケーブル接続、ケーブル接続用の制御システム、およびケーブル接続を経て振動が第1の対象から第2の対象へと伝達されることを軽減する方法 |
Family Cites Families (9)
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US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
CN1244018C (zh) * | 1996-11-28 | 2006-03-01 | 株式会社尼康 | 曝光方法和曝光装置 |
DE69735016T2 (de) * | 1996-12-24 | 2006-08-17 | Asml Netherlands B.V. | Lithographisches Gerät mit zwei Objekthaltern |
US6208407B1 (en) * | 1997-12-22 | 2001-03-27 | Asm Lithography B.V. | Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement |
TW449672B (en) * | 1997-12-25 | 2001-08-11 | Nippon Kogaku Kk | Process and apparatus for manufacturing photomask and method of manufacturing the same |
KR20010042133A (ko) * | 1998-03-26 | 2001-05-25 | 오노 시게오 | 노광방법, 노광장치, 포토마스크, 포토마스크의 제조방법,마이크로디바이스, 및 마이크로디바이스의 제조방법 |
WO1999066370A1 (fr) * | 1998-06-17 | 1999-12-23 | Nikon Corporation | Procede relatif a l'elaboration d'un masque |
JP4362862B2 (ja) * | 2003-04-01 | 2009-11-11 | 株式会社ニコン | ステージ装置及び露光装置 |
JP4655039B2 (ja) * | 2004-06-07 | 2011-03-23 | 株式会社ニコン | ステージ装置、露光装置及び露光方法 |
-
2008
- 2008-10-27 US US12/289,377 patent/US20090201484A1/en not_active Abandoned
- 2008-10-28 TW TW097141455A patent/TW200928609A/zh unknown
- 2008-10-29 WO PCT/JP2008/069636 patent/WO2009057632A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08233964A (ja) * | 1994-10-19 | 1996-09-13 | Nikon Corp | 可動ステージ装置、該ステージ装置を搭載したマイクロリソグラフィ装置、及び流体冷却システム |
JP2000173884A (ja) * | 1998-12-02 | 2000-06-23 | Canon Inc | デバイス製造装置および方法ならびにデバイス製造装置の配線・配管実装方法 |
JP2001267227A (ja) * | 2000-03-21 | 2001-09-28 | Canon Inc | 除振システム、露光装置およびデバイス製造方法 |
JP2002043213A (ja) * | 2000-07-25 | 2002-02-08 | Nikon Corp | ステージ装置および露光装置 |
JP2004342987A (ja) * | 2003-05-19 | 2004-12-02 | Canon Inc | ステージ装置 |
JP2005046941A (ja) * | 2003-07-31 | 2005-02-24 | Canon Inc | ケーブル微動ユニット付きステージ装置 |
WO2006038952A2 (en) * | 2004-09-30 | 2006-04-13 | Nikon Corporation | Projection optical device and exposure apparatus |
JP2008042201A (ja) * | 2006-08-08 | 2008-02-21 | Asml Netherlands Bv | ケーブル接続、ケーブル接続用の制御システム、およびケーブル接続を経て振動が第1の対象から第2の対象へと伝達されることを軽減する方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103322104A (zh) * | 2013-05-16 | 2013-09-25 | 安徽微威胶件集团有限公司 | 悬臂式阻尼隔振器 |
Also Published As
Publication number | Publication date |
---|---|
TW200928609A (en) | 2009-07-01 |
US20090201484A1 (en) | 2009-08-13 |
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