WO2009055959A1 - Panneau chauffant électrique, procédé de fabrication et utilisation de celui-ci - Google Patents

Panneau chauffant électrique, procédé de fabrication et utilisation de celui-ci Download PDF

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Publication number
WO2009055959A1
WO2009055959A1 PCT/CN2007/003073 CN2007003073W WO2009055959A1 WO 2009055959 A1 WO2009055959 A1 WO 2009055959A1 CN 2007003073 W CN2007003073 W CN 2007003073W WO 2009055959 A1 WO2009055959 A1 WO 2009055959A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive
generating
conductive heat
heat
Prior art date
Application number
PCT/CN2007/003073
Other languages
English (en)
French (fr)
Inventor
Boquan Wang
Original Assignee
Boquan Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boquan Wang filed Critical Boquan Wang
Priority to CNA2007800131059A priority Critical patent/CN101600911A/zh
Priority to PCT/CN2007/003073 priority patent/WO2009055959A1/zh
Priority to PCT/CN2008/000897 priority patent/WO2009055999A1/zh
Priority to CN2008800015781A priority patent/CN101690384B/zh
Publication of WO2009055959A1 publication Critical patent/WO2009055959A1/zh

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
    • E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
    • E04C2/44—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose
    • E04C2/52—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits
    • E04C2/521—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling
    • E04C2/525—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the purpose with special adaptations for auxiliary purposes, e.g. serving for locating conduits serving for locating conduits; for ventilating, heating or cooling for heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
    • F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
    • F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
    • E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/026—Heaters specially adapted for floor heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the invention relates to a conductive heating plate with electric heating as a heating source.
  • a conductive heating plate with electric heating as a heating source relates to a floor or wall panel which uses electric heating as a heating source and can emit far infrared waves which are beneficial to the human body under the action of electrothermal heating and a manufacturing method thereof.
  • the conductive heating plate can also be used to process furniture parts to prevent the furniture and the items stored therein from being damp, moldy or deteriorated when the environment continues to be wet.
  • the existing ground heating materials using electric energy as a heat source have constant power heating cables and infrared carbon thermal plastic films, all of which are single functional materials.
  • the structural structure of the constant power heating cable to warm the floor is shown in Fig. 1.
  • a 25 mm thick polystyrene foam board 7 is laid on the slab 8 and a steel mesh 3 is laid.
  • the constant power heating cable 4 is distributed in a serpentine manner and tied to the steel mesh 3, and a 30-40 mm thick fine stone is poured. ⁇ 2, After the concrete is solidified, the wooden floor is laid according to the conventional method.
  • the structural layer is generally thick, especially the constant power heating cable is buried in the fine stone raft, and the maintenance of the product is very difficult or even impossible.
  • FIG. 2 The structural structure of the infrared carbon thermal film used for floor heating is shown in Fig. 2.
  • a 25 mm thick polystyrene foam board 7 is laid on the slab 8 and then an infrared carbon heat film 6 in which the power cord 5 is embedded is laid.
  • the wooden floor 1 is laid on the infrared carbon heat film 6 in a conventional manner, although the overall The thickness is reduced, but the overall structural layer is still thick, and the far infrared rays generated by the infrared carbon hot sheets penetrate the floor.
  • the common shortcomings of the two are complex construction, reduced building clearance, long heat transfer path, slow heat transfer, high heat loss and high energy consumption; many types of materials involved and many types of work. Summary of the invention
  • the present invention provides a conductive heating plate.
  • the conductive heating plate has a simple structure, energy saving, fast heat transfer, and easy control of the surface temperature.
  • the conductive heating plate comprises a substrate and a conductive heat-generating layer attached to the substrate; wherein the substrate is a medium-density wood fiber board, a high-density wood fiber board, a solid wood composite board or a magnesium oxide board; and the conductive heat-generating layer comprises a conductive heating material.
  • the binder, the conductive heating material is selected from the group consisting of natural graphite, artificial graphite, and conductive carbon black; and the binder is a resin binder.
  • the conductive heating plate can be used to make a conductive heating floor.
  • the conductive heating floor includes at least one of a balancing layer, a heat diffusion layer, a decorative layer, and a wear layer in addition to the conductive heating plate.
  • the conductive heating floor further includes a far-infrared emitting layer. After connecting 220 volts AC or DC power, the conductive heat-generating layer generates heat, and the heat-dissipating layer transmits heat to the heating area, and the heat transfer path is short. The heat transfer is fast, the heat loss is small, and the energy saving is remarkable.
  • the far-infrared emitting layer generates a 4-16 micron far-infrared wave which has a health-care effect on the human body under the action of electric heating, without any blocking to the heating area.
  • the conductive heating plate can be used to make a conductive heating wall panel.
  • the conductive heat-generating wall panel includes at least one of a balance layer and a decorative layer in addition to the conductive heat-generating board.
  • the conductive heating wall panel further comprises a far-infrared emitting layer. After connecting 220 volts AC or DC, the conductive heating layer generates heat, and the heat is radiated to the heating area through the decorative layer, and the heat transfer path is short. Fast heat transfer, low heat loss and remarkable energy saving.
  • the far-infrared emitting layer generates 4-16 micron far-infrared waves that have health effects on the human body under the action of electric heat, and are emitted to the heating zone without any blocking. Far-infrared utilization rate high.
  • the conductive heating plate can also be used to process furniture parts to prevent the furniture and the things stored therein from being damp, mildewed or deteriorated when the environment continues to be wet.
  • the present invention also specifically discloses the above-described method for manufacturing an electrically conductive heating floor and a conductive heating wall panel.
  • FIG. 1 is a structural view of a conventional warm-up structure of a constant power heating cable
  • FIG. 2 is a structural view of another existing floor heating structure using an infrared carbon thermal film
  • FIG. 3 is a schematic structural view of a conductive heating plate of the present invention
  • Figure 4 is a structural exploded view of a conductive heating floor of the present invention.
  • Figure 5 is a cross-sectional view of the conductive heating floor of Figure 4 at the electrode position
  • Figure 6 is a structural exploded view of still another conductive heating floor of the present invention.
  • Figure 7 is a cross-sectional view of the conductive heating floor of Figure 6 at the electrode position
  • Figure 8 is a structural exploded view of a conductive heat-generating wall panel of the present invention.
  • Figure 9 is a structural exploded view of a furniture component made using the conductive heating plate of the present invention.
  • Figure 10 is a schematic view showing the structure of a furniture made using the furniture component of Figure 9. detailed description
  • the conductive heat generating plate includes a base material layer 10 and a conductive heat generating layer 20 attached to the base material layer 10.
  • the substrate layer 10 is a medium density wood fiber board, a high density wood fiber board, a solid wood composite board or a magnesium oxide board;
  • the conductive heat generating layer 20 comprises a conductive heat generating material and a binder, and the conductive heat generating material is selected from natural graphite, Artificial graphite, conductive carbon black;
  • the binder is a resin binder.
  • the conductive heat generating layer 20 should ensure that the conductive heat generating layer can be quickly turned on when the 220 volt DC or AC power source is turned on. It heats evenly and does not produce excessive temperatures (>50 ° C).
  • the conductive heat-generating material used in the present invention is selected from low-calorie materials such as natural graphite, artificial graphite, and conductive carbon black. Of course, it is also possible to use the one-day sticky triple-blocking carbon known to those skilled in the art.
  • the amount of the conductive heating material is the total weight of the main body of the conductive heating layer
  • the main body of the conductive heat generating layer is formulated as a conductive heat generating material and a binder.
  • the binder for bonding the conductive heat-generating material is a resin binder such as a resin binder selected from the group consisting of a modified phenol resin, an epoxy resin, a polyurethane resin, and a melamine resin.
  • the resin binder is used in an amount of from 15 to 80% by weight based on the total weight of the main body of the electrically conductive heat generating layer.
  • a silicon carbide fine powder or a calcined powder may be further added to the main body formulation, and the amount thereof is 0-101 of the total weight of the conductive heat-generating layer.
  • a suitable amount of chemical additives such as triethanolamine, hydroquinone, a coupling agent, a flame retardant, and a toughening agent may be added to different conductive heating materials and binders.
  • the coupling agent may be commercially available, for example, but not limited to, a coupling agent of the type KH-550 purchased from Huarong Chemical Company of Qufu City, Shandong province; the flame retardant may be, for example, but not limited to, from Jinan Xiangmeng
  • the antimony trioxide and its analogs purchased by the fuel materials company; the toughening agent may employ, for example, but not limited to, dioctyl phthalate and its analogs purchased from Qilu Plasticizer Company. 5-1. 0%;
  • the applicable amount of the suitable flame retardant is about 2-5 based on the total weight of the main body of the conductive heat generating layer, based on the total weight of the conductive heat generating layer body.
  • the suitable amount of the toughening agent is from about 2 to 5% based on the total weight of the conductive heat-generating layer body formulation. If desired, the appropriate amount of triethanolamine is from about 3 to 7% based on the total weight of the conductive heat-generating layer body formulation; the suitable amount of hydroquinone is from about 2 to 5% based on the total weight of the conductive heat-generating body body formulation. .
  • a conductive heat-generating coating is first prepared.
  • the resin binder and the anhydrous ethanol or acetone solvent are uniformly mixed, and the amount of the solvent is 100-300% of the amount of the resin binder, and then the conductive heating material is added or, if necessary, an appropriate amount of triethanolamine or hydroquinone is added.
  • a chemical agent such as a coupling agent, a flame retardant, a toughening agent, and a silicon carbide fine powder or a calcined coke powder are uniformly mixed.
  • the uniformly conductive conductive heat-generating coating is uniformly adhered to the substrate by brushing, spraying, printing or other means well known to those skilled in the art.
  • Example 1 The following are a few specific examples of the composition and formulation of a conductive heat-generating coating (when no solvent is present).
  • Example 1 The following are a few specific examples of the composition and formulation of a conductive heat-generating coating (when no solvent is present).
  • the size of all the micropowders involved is 150-2500 mesh.
  • Fig. 4 is an exploded perspective view showing a conductive heat generating floor made by using the conductive heat generating sheet of the present invention.
  • the conductive heating floor comprises at least the above-mentioned conductive heating plate, which is composed of a substrate layer 102 and a conductive heat generating layer 103, an electrode 104 and a balancing layer 101 mounted on the conductive heating plate, and heat diffusion. At least one of the layer 106, the decorative layer 107, and the wear layer 108.
  • the conductive heating floor may also have at least one resin layer 105 containing far infrared powder, and the resin layer 105 containing far infrared powder may be applied to the conductive heating plate and/or the heat diffusion layer 106.
  • the resin layer 105 containing the far-infrared powder is first applied to the conductive heat-generating layer and/or the heat diffusion layer 106, and the conductive heat-generating plate and heat are applied.
  • the diffusion layer 106 is composited, and the balance layer 101, the conductive heating plate and the thermal diffusion layer 106 composite, the decorative layer 107 and the wear layer 108 are sequentially arranged, and the composite molding, slicing, guttering, inspection, packaging, and finished product storage are sequentially performed.
  • the far-infrared powder can be purchased on the market, such as far infrared powder purchased from the Institute of Ceramics of the Chinese Academy of Sciences, Shandong Weifang Litai Material Technology Co., Ltd., and the like.
  • the resin used is selected from the group consisting of modified phenolic resins, epoxy resins, polyurethane resins, and melamine resins.
  • the substrate layer 102 and the thermal diffusion layer 106 are preferably medium density or high density wood fiberboard, but other wood materials commonly used in the art may also be used.
  • the balancing layer 101, the decorative layer 107 and the abrasion resistant layer 108 are preferably melamine impregnated paper, but other materials commonly used in the art may also be used.
  • FIG. 5 is a cross-sectional view of the conductive heating floor of Figure 4 at the location of electrode 104.
  • the electrode 112 is mounted on the conductive heating plate by drilling a hole matching the size of the electrode 112 on the conductive heating plate, and the electrode 112 and the hole should be closely matched, such as an interference fit. And similar cooperation methods.
  • a wire 109 on the electrode 112 is mounted on a screw that mates with the electrode.
  • the insulating paste 110 is used to insulate the electrode 112 as shown, and is further insulated and fixed by a plastic protective cover 1 11 .
  • the insulating, fixing and wire bonding of the electrodes can also be carried out by other means well known to those skilled in the art.
  • Fig. 6 is a structural exploded view showing still another electrically conductive heated floor made using the electrically conductive heating plate of the present invention.
  • the base material layer 202 is made of solid wood composite floor, and the heat diffusion layer 206 is made of solid wood veneer.
  • the decorative layer 107 and the wear layer 108 of the electrically conductive heating floor of Fig. 4 are replaced by a wear resistant paint decorative layer 207.
  • Other configurations are substantially the same as those of the electrically conductive heating floor of Fig. 4.
  • the conductive heat-generating layer 203 is first coated on the base material layer 202, and the conductive heat-generating layer 203 is cured to form a conductive heat-generating plate, and the electrode holes are punched and mounted on the conductive heat-generating plate.
  • the electrode 204 is then coated with a resin layer 205 containing far infrared powder on the conductive heating plate and/or the thermal diffusion layer 206.
  • the resin layer 205 of the far-infrared powder is the same as the resin layer of the far-infrared powder described above.
  • the conductive heating plate and the thermal diffusion layer 206 are combined, slicing, guttering, sanding, inspection, packaging, and finished product storage.
  • FIG 7 is a cross-sectional view of the electrically conductive floor of Figure 6 at the electrode location.
  • the electrode 212 is mounted on the conductive heating plate by drilling a hole matching the size of the electrode 212 on the conductive heating plate, and the electrode 212 should be closely matched with the hole, such as an interference fit. And similar cooperation methods.
  • a wire 209 on the electrode 212 is mounted on a screw that mates with the electrode.
  • the electrode 212 is insulated by the insulating mud 210 as shown, and further insulated and fixed by the plastic protective cover 211.
  • the insulating, fixing and wire bonding of the electrodes can also be carried out by other means well known to those skilled in the art.
  • Fig. 8 is a structural exploded view showing a conductive heat-generating wall panel produced by using the conductive heat-generating plate of the present invention.
  • the conductive heat-generating wall panel shown in Fig. 8 includes a balance layer 301, and the conductive heat-generating plate includes a base magnesium oxide plate 302 and a conductive heat-generating layer 303, an electrode 304 and a decorative layer 306 mounted on the conductive heat-generating plate.
  • the conductive heat-generating wallboard may further include a resin adhesive layer 305 coated with far-infrared powder coated on at least one side of both sides of the magnesium oxide sheet.
  • the resin layer 305 of the far-infrared powder is the same as the resin layer of the far-infrared powder described above.
  • the conductive heat-generating wall panel is made by the following process: First, a conductive heat-generating layer 303 is coated on the magnesium oxide plate 302. After the conductive heat-generating layer is solidified, a conductive heat-generating plate is formed, and the electrode hole is punched and the electrode 304 is mounted. If necessary, The resin glue layer 305 containing the far-infrared powder is coated on at least one side of the two sides of the magnesium oxide plate, and finally, the balance layer 301, the conductive heat-generating plate, and the decorative layer 306 are sequentially pressed and laminated, and the cutting line, the inspection, the packaging, and the finished product are printed.
  • the conductive heat-generating wall panel of the resin glue layer 305 with far-infrared powder can reach and maintain the surface temperature of the wall panel at 25-35 ° C in a short time (within 5 minutes) after power-on, which is remarkable in energy saving.
  • High far infrared utilization in particular, it integrates heating, health care and decoration, and can be widely used in homes, hotels, restaurants and other public places.
  • Fig. 9 is an exploded perspective view showing a decorative panel for a furniture component produced by using the electrically conductive heat-generating panel of the present invention.
  • the decorative panel shown in the figures includes a conductive heating plate and a decorative layer 407.
  • the decorative component for the furniture component is made by the following process: First, a conductive heat-generating layer 406 is applied on the substrate plate 404, and the conductive heat-generating layer 406 is cured to form a conductive heating plate, and the electrode hole is punched and the electrode 405 is mounted, and then The decorative layer 407 is pressed against at least one surface of both surfaces of the conductive heating plate to form a decorative sheet for a furniture part as shown.
  • the decorative panel for the furniture part shown in Fig. 9 can be used to make a transverse shelf 1000, a back panel 2000 or a vertical partition 3000 in the furniture, as shown in FIG.
  • the conductive heating plate can be heated by the wires connected to the electrodes to remove moisture and prevent moisture, mold or deterioration of the items stored in the furniture.

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  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Central Heating Systems (AREA)
  • Floor Finish (AREA)
  • Surface Heating Bodies (AREA)

Description

导电发热板及其制造方法和用途 技术领域
本发明涉及一种以电热为采暖热源的导电发热板。 特别是涉及一种以电热为采暖热源并 可在电热作用下发射对人体有益的远红外波的地板或墙板及其制造方法。 所述的导电发热板 还可以用来加工家具部件， 从而在环境持续潮湿时防止家具及存放在其内的东西受潮、 发霉 或变质。 技术背景
现有的以电能为热源建筑地面采暖材料， 有恒定功率发热电缆和红外碳热塑料薄膜， 均 为单一功能材料。 其中， 恒定功率发热电缆地暖的结构构造如图 1。 图中， 在砼楼板 8上铺 设 25mm厚聚苯乙烯泡沫板 7， 再铺设钢丝网 3， 将恒定功率发热电缆 4以蛇形方式分布并绑 扎在钢丝网 3上， 浇筑 30- 40mm厚细石砼 2， 砼凝固后按照常规方法铺设木地板 1， 结构层总 体较厚， 尤其是恒定功率发热电缆埋在细石砼当中， 产品的维修十分困难甚至是不可能的。 红外碳热薄膜用于地暖的结构构造如图 2。 图中， 在砼楼板 8上铺设 25mm厚聚苯乙烯泡沫板 7， 然后铺设嵌有电源线 5的红外碳热薄膜 6， 最后在红外碳热薄膜 6上按照常规方法铺设木 地板 1， 虽然总体厚度有所减小， 但结构层总体仍然较厚， 红外碳热薄片产生的远红外线穿 透地板是不可能的。 二者的共同缺点是构造复杂， 减小了建筑净空高度， 而且热量传递路径 长， 传热慢， 热损大， 能耗高； 涉及的材料种类多， 工种多。 发明内容
为了克服现有以电能为热源建筑材料的缺点， 本发明提供一种导电发热板。 该导电发热 板结构简单、 节能、 传热快， 表面温度容易控制。 所述的导电发热板包括基材， 附着在基材 上的导电发热层； 其中的基材为中密度木质纤维板、 高密度木质纤维板、 实木复合板或氧化 镁板； 导电发热层包括导电发热材料和粘结剂， 所述的导电发热材料选自天然石墨、 人造石 墨、 导电碳黑； 所述的粘结剂为树脂粘结剂。
所述的导电发热板可以用来制成导电发热地板。 该导电发热地板除了导电发热板外， 还 包括平衡层、 热扩散层、 装饰层、 耐磨层中的至少一层。 在一个优选的具体实施方式中， 所 述的导电发热地板还包括远红外发射层， 连接 220伏交流或直流电后， 导电发热层发热， 透 过热扩散层向采暖区散发热量， 热量传递路径短， 传热快， 热损小， 节能显著， 同时远红外 发射层在电热作用下， 产生对人体有保健作用的 4-16微米远红外波， 不受任何阻挡向采暖区 发射， 远红外利用率高。
所述的导电发热板可以用来制成导电发热墙板。 该导电发热墙板除了导电发热板外， 还 包括平衡层、 装饰层中的至少一层。 在一个优选的具体实施方式中， 所述的导电发热墙板还 包括远红外发射层， 连接 220伏交流或直流电后， 导电发热层发热， 透过装饰层向采暖区散 发热量， 热量传递路径短， 传热快， 热损小， 节能显著， 同时远红外发射层在电热作用下， 产生对人体有保健作用的 4-16微米远红外波，不受任何阻挡向采暖区发射，远红外利用率高。
所述的导电发热板还可以用来加工家具部件， 从而在环境持续潮湿时防止家具及存放在 其内的东西受潮、 发霉或变质。
本发明还具体公开了上述的导电发热地板和导电发热墙板的制造方法。
附图说明
图 1是现有的一种恒定功率发热电缆地暖结构的构造图；
图 2是现有的另一种采用红外碳热薄膜的地暖结构的构造图；
图 3为本发明一种导电发热板的结构示意图
图 4 为本发明的一种导电发热地板的结构分解图；
图 5 为图 4中导电发热地板在电极位置的剖视图；
图 6为本发明的又一种导电发热地板的结构分解图；
图 7为图 6中导电发热地板在电极位置的剖视图；
图 8为本发明一种导电发热墙板的结构分解图；
图 9为采用本发明的导电发热板制成的家具部件的结构分解图；
图 10为采用图 9中的家具部件制成的家具的结构示意图。 具体实施方式
下面结合附图对本发明做进一步说明。 应该清楚， 附图中所描述的本发明的具体实施方 式仅为说明本发明用， 并不构成对本发明的限制。 本发明的保护范围由所附的权利要求书进 行限定。
图 3为本发明一种导电发热板的结构示意图。 如图 3所示， 该导电发热板包括基材层 10 和附着在基材层 10上的导电发热层 20。 所述的基材层 10为中密度木质纤维板、 高密度木质 纤维板、 实木复合板或氧化镁板； 导电发热层 20包括导电发热材料和粘结剂， 所述的导电发 热材料选自天然石墨、 人造石墨、 导电碳黑； 所述的粘结剂为树脂粘结剂。
所述的导电发热层 20应能保证在接通 220伏的直流或交流电源时，导电发热层能够很快 均匀发热且不致产生过高的温度（>50°C )。 为达到这一目的， 本发明采用的导电发热材料选 自天然石墨、 人造石墨、 导电碳黑等低发热量的材料。 当然也可以采用本领域技术人员熟知 偶天粘三增阻碳
的其它低发 ¾联然燃靭结乙热量的导电发热材料。 所述的导电发热材料的用量占导电发热层主体配方总重量
§剂石剂醇剂剂
的 20-85%。 导电发热层的主体配方为导电发热材料和粘结剂。
用来使所述导电发热材料粘结起来的粘结剂采用树脂粘结剂， 如选自改性酚醛树脂、 环 氧树脂、 聚胺酯树脂、 三聚氰胺树脂的树脂粘结剂。 所述树脂粘结剂的用量占导电发热层 主体配方总重量的 15-80%。
为提高上述导电发热材料的发热性能， 还可以在主体配方中进一步加入碳化硅微粉或煅 焦粉， 其存在量占导电发热层总重量的 0-101
为了改善导电发热层涂料的性能， 还可以针对不同的导电发热材料和粘结剂加入适量的 三乙醇胺、 对苯二酚、 偶联剂、 阻燃剂、 增韧剂等化学助剂。 所述的偶联剂可以从市场上购 买， 例如但不限于从山东曲阜市华荣化工公司购买的型号为 KH-550的偶联剂； 阻燃剂可采用 例如但不限于从济南湘蒙阻燃材料公司购买的三氧化二锑及其类似物； 增韧剂可采用例如但 不限于从齐鲁增塑剂公司购买的邻苯二甲酸二辛酯及其类似物。 适宜的偶联剂的外加量为基 于导电发热层主体配方总重量的大约 0. 5-1. 0%； 适宜的阻燃剂的外加量为基于导电发热层主 体配方总重量的大约 2-5%;适宜的增韧剂的外加量为基于导电发热层主体配方总重量的大约 2-5%。 如果需要， 适宜的三乙醇胺的外加量为基于导电发热层主体配方总重量的大约 3 - 7%; 适宜的对苯二酚的外加量为基于导电发热层主体配方总重量的大约 2-5%。
为了获得导电发热层， 首先制备导电发热涂料。 将树脂粘结剂和无水乙醇或丙酮溶剂混 合均匀， 溶剂的甩量为树脂粘结剂用量的 100-300%， 然后加入导电发热材料或根据需要选择 加入适量三乙醇胺、 对苯二酚、 偶联剂、 阻燃剂、 增韧剂等化学助剂及碳化硅微粉或煅焦粉， 混合均匀。 最后将混合均匀的导电发热涂料采用涂刷、 喷涂、 印刷或本领域技术人员熟知的 其它方式均匀附着在所述的基材上。
以下是导电发热涂料的构成和配方的几个具体实施例 （不含溶剂时）。 实施例 1
200 -— 3000目 20— 75% 微粉 0— 10%
15—80% 胺 3—7% (外加）
0.5% (外加） 2—5% (外加） 2—5% (外加） 实施例 2 粘粘偶附偶 ¾增对增阻偶阻锻增粘阻 200—- 1000目 30~85% ¾ W喊 J ¾ ^结联 ¾ ^联燃韧苯燃扨联焦燃石剂 15—70% 剂剂剂剂剂剂剂二剂粉剂剂剂
JOO墨 0.5% (外加）
2—5% (外加） 2—5% (外加） 实施例 3 导电炭黑 20—75% 碳化硅
Figure imgf000006_0001
0—5%
20—80%
2—5% (外加） 0.5% (外加） 2—5% (外加） 2—5% (外加） 实施例 4
200—- 3000目 20—50% 200 -— 1000目 5—20%
200—- 1000目 0—10%
20—75% 0.5% (外加） 2—5% (外加） 2—5% (外加） 实施例 5
200—- 3000目 20—75% 微粉 5—10%
15—75% 2—5% (外加） 0.5% (外加） 2—5% (外加) 2—5% (外加) 其中所有涉及的微粉的尺寸为 150-2500目。
所述的导电发热层 20固化后， 可在导电发热板上打电极孔并安装电极 30， 从而通过导 线将电极 30连接到外部电源上。 当然， 也可以通过本领域技术人员熟知的其它方式将导电发 热层 20连接到外部电源上。 外部电源可为直流电源或交流电源， 电压可为 220V， 也可以采 用其它电压。 ， 图 4为采用本发明的导电发热板制成的一种导电发热地板的结构分解图。 从图中可以看 出， 所述的导电发热地板至少包括上述的导电发热板， 它由基材层 102和导电发热层 103构 成， 安装在导电发热板上的电极 104及平衡层 101、 热扩散层 106、 装饰层 107、 耐磨层 108 中的至少一层。
所述的导电发热地板还可以带有至少一层含有远红外粉的树脂胶层 105， 含有远红外粉 的树脂胶层 105可涂刷在导电发热板和 /或热扩散层 106上。在制作带有含有远红外粉的树脂 胶层的导电发热地板时， 先将含有远红外粉的树脂胶层 105涂刷在导电发热层和 /或热扩散层 106上， 将导电发热板、 热扩散层 106复合， 再将平衡层 101、 导电发热板和热扩散层 106复 合体、 装饰层 107和耐磨层 108依次排列， 一次复合成型， 切片、 幵槽、 检验、 包装、 成品 入库。
所述的远红外粉可以在市场上购买， 如从中科院硅酸盐研究所、 山东潍坊立泰材料科技 有限公司等公司购买的远红外粉。 所采用的树脂选自改性酚醛树脂、 环氧树脂、 聚胺酯树 脂、 三聚氰胺树脂。
所述的基材层 102和热扩散层 106优选中密度或高密度木质纤维板， 但也可选用本领域 常用的其它木质材料。 所述的平衡层 101、 装饰层 107和耐磨层 108优选三聚氰胺浸渍纸， 但也可选用本领域常用的其它材料。
图 5为图 4中导电发热地板在电极 104位置的剖视图。 从图中可以看出， 电极 112通过 在导电发热板上钻与电极 112尺寸相配合的孔将电极安装到导电发热板上， 电极 112与所述 孔之间应紧密配合， 如采用过盈配合及类似配合方式。 电极 112上的导线 109安装在与电极 配合的螺丝上。 为绝缘之目的， 采用绝缘泥 110如图所示对电极 112进行绝缘， 并采用塑料 保护盖 1 11进一步绝缘和固定。 当然， 对电极进行绝缘、 固定和导线连接也可以采用本领域 技术人员熟知的其它方式进行。
图 6示出了采用本发明的导电加热板制作的又一种导电加热地板的结构分解图。 其中的 基材层 202采用实木复合地板， 热扩散层 206采用实木单板。 采用耐磨油漆装饰层 207代替 图 4中导电发热地板的装饰层 107和耐磨层 108。 其它和图 4中导电发热地板的构造基本相 同。
在制作如图 6中所示的发热导电地板时， 首先在基材层 202上涂刷导电发热层 203， 导 电发热层 203固化后制成导电发热板， 在导电发热板上打电极孔并安装电极 204， 然后将含 有远红外粉的树脂胶层 205涂在导电发热板和 /或热扩散层 206上。 远红外粉的树脂胶层 205 和上述的远红外粉的树脂胶层相同。 最后将导电发热板和热扩散层 206复合， 切片、 幵槽、 砂光油漆、 检验、 包装、 成品入库。 图 7为图 6中导电加热地板在电极位置的剖视图。 从图中可以看出， 电极 212通过在导 电发热板上钻与电极 212尺寸相配合的孔将电极安装到导电发热板上， 电极 212与所述孔之 间应紧密配合， 如采用过盈配合及类似配合方式。 电极 212上的导线 209安装在与电极配合 的螺丝上。 为绝缘之目的， 采用绝缘泥 210如图所示对电极 212进行绝缘， 并采用塑料保护 盖 211进一步绝缘和固定。 当然， 对电极进行绝缘、 固定和导线连接也可以采用本领域技术 人员熟知的其它方式进行。
图 8示出了采用本发明的导电发热板制作的导电发热墙板的结构分解图。 图 8中所示的 导电发热墙板包括平衡层 301、导电发热板包括基材氧化镁板 302和导电发热层 303、安装在 导电发热板上的电极 304和装饰层 306。 所述的导电发热墙板还可以包括涂在氧化镁板两面 的至少一面含有远红外粉的树脂胶层 305。 远红外粉的树脂胶层 305和上述的远红外粉的树 脂胶层相同。 所述的导电发热墙板采用下列工艺制成： 首先在氧化镁板 302上涂刷导电发热 层 303， 导电发热层固化后， 制成导电发热板， 打电极孔并安装电极 304， 如果需要， 将含有 远红外粉的树脂胶层 305涂在氧化镁板两面的至少一面， 最后将平衡层 301、 导电发热板、 装饰层 306依次压贴复合， 印刷切割线、 检验、 包装、 成品入库。
所述的带有远红外粉的树脂胶层 305的导电发热墙板可以在通电后的短时间内 （5 分 钟内）， 使墙板上表面温度达到并保持在 25-35°C， 节能显著， 远红外利用率高； 特别是它将 采暖、 保健和装饰融为一体， 可广泛地应用于家庭、 宾馆、 饭店及其它公共场合。
图 9为采用本发明的导电发热板制作的一种家具部件用装饰板的结构分解图。 图中所 示的装饰板包括导电加热板和装饰层 407。 所述的家具部件用装饰板采用下列工艺制成： 首 先在基材板 404上涂刷导电发热层 406， 导电发热层 406固化后制成导电加热板， 打电极孔 并安装电极 405， 然后再在导电加热板的两面的至少一面压贴装饰层 407， 制成图中所示的家 具部件用装饰板。
图 9中所示的家具部件用装饰板可以制作家具中的横搁板 1000、 背板 2000或竖隔板 3000， 如图 10所示。 在持续潮湿季节， 可以通过连接到电极上的导线供电， 使导电加热板发 热， 驱除潮气， 防止存放在家具中的物件受潮、 发霉或变质。
基于对本发明优选实施方式的描述， 应该清楚， 由所附的权利要求书所限定的本发明并 不仅仅局限于上面说明书中所阐述的特定细节， 未脱离本发明宗旨或范围的对本发明的许多 显而易见的改变同样可能达到本发明的目的。

Claims

权 利 要 求
1、 一种导电发热板， 包括基材， 附着在基材上的导电发热层， 其中的基材为中密度木质纤维 板、 高密度木质纤维板、 实木复合板材或氧化镁板； 导电发热层包括导电发热材料和粘结 剂， 所述的导电发热材料选自天然石墨、 人造石墨、 导电碳黑； 所述的粘结剂为树脂粘结 剂。
2、 权利要求 1中的导电发热板，其中所述的导电发热材料的用量占导电发热层主体配方总重 量的 20-85%; 树脂粘结剂选自改性酚醛树脂、 环氧树脂、 聚胺酯树脂、 三聚氰胺树脂， 用量占导电发热层主体配方总重量的 15-80%; 导电发热层的主体配方为导电发热材料和 粘结剂。
3、 权利要求 2中的导电发热板， 还包括固定在所述导电发热板上的电极。
4、 权利要求 2中的导电发热板，其中的导电发热层还进一步包括碳化硅或煅焦粉中的至少一 种， 其存在量占导电发热层总重量的 0-10%。
5、 权利要求 1、 2、 3、 4任一权利要求中的导电发热板， 其中的导电发热层还包括三乙醇胺、 对苯二酚、 偶联剂、 阻燃剂、 增韧剂中的至少一种。
6、 一种导电发热地板： 至少包括：
导电发热板， 包括基材， 附着在基材上的导电发热层， 其中的基材为中密度木质纤维 板、 高密度木质纤维板、 实木复合板材； 导电发热层包括导电发热材料和粘结剂， 所述的 导电发热材料选自天然石墨、 人造石墨、 导电碳黑； 所述的粘结剂为树脂粘结剂；
固定在所述导电发热板上的电极；
平衡层、 热扩散层、 装饰层、 耐磨层中的至少一层。
7、权利要求 6中的导电发热地板， 其中所述的电加热材料的用量占导电发热层主体配方总重 量的 20-85%; 树脂粘结剂选自改性酚醛树脂、 环氧树脂、 聚胺酯树脂、 三聚氰胺树脂， 用 量占导电发热层主体配方总重量的 15-80%。
8、权利要求 9中的导电发热地板， 其中的导电发热层还进一步包括碳化硅或煅焦粉中的至少 一种， 其存在量占导电发热层总重量的 0-10%。
9、权利要求 6、 7、 8中任一权利要求中的导电发热地板，其中的导电发热层还包括三乙醇胺、 对苯二酚、 偶联剂、 阻燃剂、 增韧剂中的至少一种。
10、 权利要求 6、 7、 8、 9任一权利要求中的导电发热地板， 还包括至少一层含有远红外粉的 树脂胶层， 所述的含有远红外粉的脂胶层附着在导电发热层和 /或热扩散层上。
11、 一种导电发热墙板， 至少包括： 导电发热板，包括基材，附着在基材上的导电发热层，其中的基材为中密度木质纤维板、 高密度木质纤维板、 实木复合板材或氧化镁板； 导电发热层包括导电发热材料和粘结剂， 所 述的导电发热材料选自天然石墨、 人造石墨、 导电碳黑； 所述的粘结剂为树脂粘结剂；
固定在所述导电发热板上的电极；
平衡层、 装饰层中的至少一层。
12、权利要求 11中的导电发热墙板， 其中所述的导电发热材料的用量占导电发热层主体配方 总重量的 20-85%; 树脂粘结剂选自改性酚醛树脂、 环氧树脂、 聚胺酯树脂、三聚氰胺树脂， 用量占导电发热层主体配方总重量的 15-80%。
13、 权利要求 12 中的导电发热墙板， 其中的导电发热层还进一步包括碳化硅或煅焦粉中的 至少一种， 其存在量占导电发热层总重量的 0-10%。
14、 权利要求 11、 12、 13任一权利要求中的导电发热墙板， 其中的导电发热层还包括三乙醇 胺、 对苯二酚、 偶联剂、 阻燃剂、 增韧剂中的至少一种。
15、 权利要求 11、 12、 13、 14任一权利要求中的导电发热墙板， 还包括至少一层含有远红外 粉的树脂胶层； 所述的含有远红外粉的树脂胶层至少附着导电发热层上。
16、 权利要求 10中的导电发热地板的制造方法， 包括以下步骤：
准备导电发热板包括在基材层上喷涂、 涂刷或印刷导电发热层， 导电发热层固化后， 在 基材层上打电极孔并安装电极；
将含有远红外粉的树脂胶层涂刷在地板的导电发热板有导电发热层的板面上和 /或热扩 散层上， 将基材层、 热扩散层复合， 再将平衡层、 基材层和热扩散层复合体、 装饰层、 耐磨 层依次排列， 一次复合成型； 和
切片、 幵槽制成导电发热地板。
17、 权利要求 15中的导电发热墙板的制造方法， 包括以下步骤：
准备导电发热板包括在基材上涂刷或印刷导电发热层， 导电发热层固化后， 打电极 孔并安装电极；
将含有远红外粉的树脂胶层至少涂刷在基材上导电发热层的一面或装饰层的背面， 再按平衡层、 基材板、 导电发热层、 含有远红外粉的树脂胶层、 装饰层依次排列， 一次复合 成型； 和
印刷切割线制成导电发热墙板。
18、 权利要求 17中的导电发热墙板的制造方法， 其中的基材为氧化锾板。
19、 采用权利要求 1-5任一权利要求中的导电发热板制成的家具。
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EP3892062A1 (de) * 2018-12-06 2021-10-13 Alexander Slawinski Geschützte infrarot-wandflächenheizung mit flexiblem heizgewebe

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