WO2009052815A3 - Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben - Google Patents

Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben Download PDF

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Publication number
WO2009052815A3
WO2009052815A3 PCT/DE2008/001771 DE2008001771W WO2009052815A3 WO 2009052815 A3 WO2009052815 A3 WO 2009052815A3 DE 2008001771 W DE2008001771 W DE 2008001771W WO 2009052815 A3 WO2009052815 A3 WO 2009052815A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
microchannel heat
semiconductor elements
cooling semiconductor
treating
Prior art date
Application number
PCT/DE2008/001771
Other languages
English (en)
French (fr)
Other versions
WO2009052815A2 (de
Inventor
Dirk Lorenzen
Original Assignee
Dirk Lorenzen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dirk Lorenzen filed Critical Dirk Lorenzen
Publication of WO2009052815A2 publication Critical patent/WO2009052815A2/de
Publication of WO2009052815A3 publication Critical patent/WO2009052815A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Bei einer Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen besteht die Aufgabe, bei Nutzung der Vorteile, die mit einer Oberflächenverbesserung durch eine Anschlussmetallisierung verbunden sind, korrosionsbedingte Undichtheiten zu verhindern, ohne dass die thermische Effizienz der Mikrokanalwärmesenke gemindert wird. Das wird dadurch erreicht, dass auf Dichtflächen für Dichtelemente, die Kühlmitteleinlass- und Kühlmittelauslassöffnungen umschließen und auf Innenoberflächen eines Kühlmitteleinlasses und eines Kühlmittelauslasses wenigstens eine elektrisch isolierende anorganische Schutzschicht oder wenigstens eine abschließende Schutzschicht aus wenigstens einem Refraktärmetall aufgebracht ist.
PCT/DE2008/001771 2007-10-26 2008-10-26 Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben WO2009052815A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710051798 DE102007051798B3 (de) 2007-10-26 2007-10-26 Mikrokanalwärmesenke zur Kühlung von Halbleiterbauelementen und Verfahren zur Oberflächenbehandlung derselben
DE102007051798.1 2007-10-26

Publications (2)

Publication Number Publication Date
WO2009052815A2 WO2009052815A2 (de) 2009-04-30
WO2009052815A3 true WO2009052815A3 (de) 2009-08-27

Family

ID=40121764

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/001771 WO2009052815A2 (de) 2007-10-26 2008-10-26 Mikrokanalwärmesenke zur kühlung von halbleiterbauelementen und verfahren zur oberflächenbehandlung derselben

Country Status (2)

Country Link
DE (1) DE102007051798B3 (de)
WO (1) WO2009052815A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009009203U1 (de) 2009-04-08 2009-10-15 Lorenzen, Dirk, Dr. Konversionseinheit mit mehreren Konversionsmodulen und eine solche Konversionseinheit aufweisende optische Anordnung
CN104682189B (zh) * 2015-02-12 2017-10-24 中国科学院半导体研究所 一种高功率密度半导体激光器热沉
CN109121282A (zh) * 2018-08-06 2019-01-01 华进半导体封装先导技术研发中心有限公司 一种板体散热结构及其制作方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687053A (en) * 1982-11-26 1987-08-18 Fr. Kammerer Gmbh Heat exchanger panel and manufacturing method thereof
DE3835767A1 (de) * 1987-10-21 1989-05-03 Hitachi Ltd Kuehlvorrichtung fuer halbleitermodul
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JP2003273441A (ja) * 2002-03-15 2003-09-26 Hamamatsu Photonics Kk ヒートシンク並びにこれを用いた半導体レーザ装置及び半導体レーザスタック装置
US20050063161A1 (en) * 2003-09-18 2005-03-24 Fuji Electric Systems Co., Ltd. Heat sink and method for its production
DE112004000204T5 (de) * 2003-01-31 2006-06-01 Cooligy, Inc., Mountain View Verfahren und Vorrichtung zur Herstellung von preisgünstigen elektrokinetischen Pumpen
EP1696526A1 (de) * 2003-12-16 2006-08-30 Hamamatsu Photonics K. K. Halbleiterlaserbauelement und herstellungsverfahren dafür
US20070017658A1 (en) * 2005-07-19 2007-01-25 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component
DE112005001479T5 (de) * 2004-07-08 2007-06-06 Hamamatsu Photonics K.K., Hamamatsu Halbleiter-Laser-Vorrichtung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105429A (en) * 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687053A (en) * 1982-11-26 1987-08-18 Fr. Kammerer Gmbh Heat exchanger panel and manufacturing method thereof
DE3835767A1 (de) * 1987-10-21 1989-05-03 Hitachi Ltd Kuehlvorrichtung fuer halbleitermodul
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JP2003273441A (ja) * 2002-03-15 2003-09-26 Hamamatsu Photonics Kk ヒートシンク並びにこれを用いた半導体レーザ装置及び半導体レーザスタック装置
DE112004000204T5 (de) * 2003-01-31 2006-06-01 Cooligy, Inc., Mountain View Verfahren und Vorrichtung zur Herstellung von preisgünstigen elektrokinetischen Pumpen
US20050063161A1 (en) * 2003-09-18 2005-03-24 Fuji Electric Systems Co., Ltd. Heat sink and method for its production
EP1696526A1 (de) * 2003-12-16 2006-08-30 Hamamatsu Photonics K. K. Halbleiterlaserbauelement und herstellungsverfahren dafür
DE112005001479T5 (de) * 2004-07-08 2007-06-06 Hamamatsu Photonics K.K., Hamamatsu Halbleiter-Laser-Vorrichtung
US20070017658A1 (en) * 2005-07-19 2007-01-25 International Business Machines Corporation Cold plate apparatus and method of fabrication thereof with a controlled heat transfer characteristic between a metallurgically bonded tube and heat sink for facilitating cooling of an electronics component

Also Published As

Publication number Publication date
WO2009052815A2 (de) 2009-04-30
DE102007051798B3 (de) 2009-01-15

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