WO2009047849A1 - フレキシブル配線基板の製造装置 - Google Patents

フレキシブル配線基板の製造装置 Download PDF

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Publication number
WO2009047849A1
WO2009047849A1 PCT/JP2007/069781 JP2007069781W WO2009047849A1 WO 2009047849 A1 WO2009047849 A1 WO 2009047849A1 JP 2007069781 W JP2007069781 W JP 2007069781W WO 2009047849 A1 WO2009047849 A1 WO 2009047849A1
Authority
WO
WIPO (PCT)
Prior art keywords
production device
wiring board
flexible wiring
movable punch
plate
Prior art date
Application number
PCT/JP2007/069781
Other languages
English (en)
French (fr)
Inventor
Shinici Hanyu
Original Assignee
Beac Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beac Co., Ltd. filed Critical Beac Co., Ltd.
Priority to JP2009536890A priority Critical patent/JP5197620B2/ja
Priority to PCT/JP2007/069781 priority patent/WO2009047849A1/ja
Publication of WO2009047849A1 publication Critical patent/WO2009047849A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/08—Means for actuating the cutting member to effect the cut
    • B26D5/16—Cam means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

　本発明は、薄いプラスチックフィルムから所定の形状の大きさの補強板またはカバーレイフィルムを切り取ることができるフレキシブル配線基板の製造装置を提供するものである。 　本発明のフレキシブル配線基板の製造装置は、固定ダイスプレート２２と、固定ダイスプレート２２の上からプラスチックフィルムに向かって動かされる可動ポンチプレート２１と、可動ポンチプレート２１を固定ダイスプレート２２に向かって導く案内装置と、可動ポンチプレート２１を固定ダイスプレート２２に対して押し込む押圧装置とを有し、可動ポンチプレート２１には切断後の加工品が通過可能な取り出し口が設けられ、この取り出し口の入り口の内周縁には切断刃が形成されている。
PCT/JP2007/069781 2007-10-10 2007-10-10 フレキシブル配線基板の製造装置 WO2009047849A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009536890A JP5197620B2 (ja) 2007-10-10 2007-10-10 フレキシブル配線基板の製造装置
PCT/JP2007/069781 WO2009047849A1 (ja) 2007-10-10 2007-10-10 フレキシブル配線基板の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/069781 WO2009047849A1 (ja) 2007-10-10 2007-10-10 フレキシブル配線基板の製造装置

Publications (1)

Publication Number Publication Date
WO2009047849A1 true WO2009047849A1 (ja) 2009-04-16

Family

ID=40549004

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/069781 WO2009047849A1 (ja) 2007-10-10 2007-10-10 フレキシブル配線基板の製造装置

Country Status (2)

Country Link
JP (1) JP5197620B2 (ja)
WO (1) WO2009047849A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013128999A (ja) * 2011-12-20 2013-07-04 Fujifilm Corp 医療シート切断方法及び切断治具
TWI465167B (ja) * 2013-06-24 2014-12-11
EP2845701A1 (de) * 2013-09-09 2015-03-11 DIEFFENBACHER GMBH Maschinen- und Anlagenbau Vorrichtung und Verfahren zum Zuschneiden und Handhaben eines flächenhaften Zuschnittes, insbesondere zur Herstellung von Bauteilen aus Faserverbundwerkstoff
CN105904513A (zh) * 2016-05-31 2016-08-31 弘益泰克自动化设备（惠州）有限公司 覆盖膜自动冲压机
CN107053318A (zh) * 2017-02-15 2017-08-18 丽水市莲都区几友电子商务工作室 具有自动换取模具功能的电路板表面冲孔设备
CN108124385A (zh) * 2017-12-21 2018-06-05 上达电子（深圳）股份有限公司 柔性线路板成型方法及模具
CN114158198A (zh) * 2021-12-16 2022-03-08 东莞市复欣智能科技有限公司 Pcb板自动烘烤定位上料机

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101433646B1 (ko) * 2013-03-07 2014-08-25 주식회사 솔텍코리아 패턴 형성용 필름의 천공장치
CN113752331B (zh) * 2021-08-06 2023-04-18 苏州维信电子有限公司 柔板冲切模具及电路板产品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01106195U (ja) * 1988-01-11 1989-07-17
JPH0382195U (ja) * 1989-12-11 1991-08-21
JPH08186369A (ja) * 1994-12-28 1996-07-16 Fujikura Ltd プリント配線板の製造方法
JP2004050332A (ja) * 2002-07-18 2004-02-19 Ibm Japan Business Logistics Co Ltd 発泡材裁断装置
JP2006269589A (ja) * 2005-03-23 2006-10-05 Sumitomo Bakelite Co Ltd フレキシブル回路基板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61249298A (ja) * 1985-04-26 1986-11-06 アイダエンジニアリング株式会社 プリント基板の供給装置
JPH0665473B2 (ja) * 1986-01-30 1994-08-24 東成産業株式会社 成形シ−トのトリミング方法および装置
JP2000065996A (ja) * 1998-08-19 2000-03-03 Konica Corp 積層体の断裁方法および輝尽性蛍光体プレートの断裁方法
JP2002226127A (ja) * 2001-01-31 2002-08-14 Canon Aptex Inc ダイカット装置及びラベル製造装置
JP4525170B2 (ja) * 2004-05-17 2010-08-18 パナソニック株式会社 フレキシブルプリント配線板の製造方法及びそれを用いて製造されたフレキシブルプリント配線板
JP2007007829A (ja) * 2005-07-04 2007-01-18 Meiko:Kk プレス金型

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01106195U (ja) * 1988-01-11 1989-07-17
JPH0382195U (ja) * 1989-12-11 1991-08-21
JPH08186369A (ja) * 1994-12-28 1996-07-16 Fujikura Ltd プリント配線板の製造方法
JP2004050332A (ja) * 2002-07-18 2004-02-19 Ibm Japan Business Logistics Co Ltd 発泡材裁断装置
JP2006269589A (ja) * 2005-03-23 2006-10-05 Sumitomo Bakelite Co Ltd フレキシブル回路基板の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013128999A (ja) * 2011-12-20 2013-07-04 Fujifilm Corp 医療シート切断方法及び切断治具
TWI465167B (ja) * 2013-06-24 2014-12-11
EP2845701A1 (de) * 2013-09-09 2015-03-11 DIEFFENBACHER GMBH Maschinen- und Anlagenbau Vorrichtung und Verfahren zum Zuschneiden und Handhaben eines flächenhaften Zuschnittes, insbesondere zur Herstellung von Bauteilen aus Faserverbundwerkstoff
CN105904513A (zh) * 2016-05-31 2016-08-31 弘益泰克自动化设备（惠州）有限公司 覆盖膜自动冲压机
CN107053318A (zh) * 2017-02-15 2017-08-18 丽水市莲都区几友电子商务工作室 具有自动换取模具功能的电路板表面冲孔设备
CN108124385A (zh) * 2017-12-21 2018-06-05 上达电子（深圳）股份有限公司 柔性线路板成型方法及模具
CN114158198A (zh) * 2021-12-16 2022-03-08 东莞市复欣智能科技有限公司 Pcb板自动烘烤定位上料机
CN114158198B (zh) * 2021-12-16 2024-01-30 东莞市复欣智能科技有限公司 Pcb板自动烘烤定位上料机

Also Published As

Publication number Publication date
JP5197620B2 (ja) 2013-05-15
JPWO2009047849A1 (ja) 2011-02-17

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