WO2009047075A1 - Procédé et dispositif de production d'au moins une plaquette de circuit imprimé - Google Patents

Procédé et dispositif de production d'au moins une plaquette de circuit imprimé Download PDF

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Publication number
WO2009047075A1
WO2009047075A1 PCT/EP2008/062053 EP2008062053W WO2009047075A1 WO 2009047075 A1 WO2009047075 A1 WO 2009047075A1 EP 2008062053 W EP2008062053 W EP 2008062053W WO 2009047075 A1 WO2009047075 A1 WO 2009047075A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
printed circuit
circuit board
electrically conductive
conductive material
Prior art date
Application number
PCT/EP2008/062053
Other languages
German (de)
English (en)
Inventor
Peter Kimmich
Stefan Keil
Quoc-Dat Nguyen
Christoph Ruf
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2009047075A1 publication Critical patent/WO2009047075A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Definitions

  • the invention relates to a method and a device for producing at least one printed circuit board from a foil of electrically conductive material and a carrier foil.
  • High density printed circuit boards are typically constructed of multiple electrically conductive layers separated by layers of dielectric material. Some of the conductive layers may be used as power and ground planes, while other conductive layers for electrical signal connections may be patterned between integrated circuit chips or other electronic components. For electrical interconnections between conductive layers, intervening layers are drilled. The electrical interconnections are also referred to as vias or vias. An electrical contact between the layers is by means of a
  • Coating method produced which means that a wall surface surrounding a hole is coated with copper.
  • the invention has for its object to provide a simple method and a simple device for producing at least one circuit board.
  • the two sheets of printed circuit board are the same length and the same width and close flush with their edges.
  • the thickness of both films is determined by the dielectric properties of the carrier film and the electrical properties of the film of electrically conductive material.
  • the webs of the film of electrically conductive material and arranged underneath parts of the carrier film are removed.
  • the interconnects are mutually free and isolated and the carrier film holds the free tracks at their predetermined location.
  • parts of both films are removed to create recesses in the circuit board. Through these recesses are arranged below this circuit board arranged further circuit boards.
  • At least one second film of electrically conductive material and a second carrier film are arranged on the film of electrically conductive material and the carrier film.
  • two printed circuit boards are stacked on each other, thus producing a multi-layer printed circuit board.
  • the films of electrically conductive material are separated by means of the dielectric carrier films.
  • parts of the film or of the printed circuit board can be removed by means of a laser. The laser works wear-free, so that a mass production with always identical parts is guaranteed. Other separation processes are punching and milling.
  • the films are arranged together by means of an adhesive coating. If the films are placed one above the other and pressed together, the films or the printed circuit boards stick together.
  • the adhesive coating is advantageously arranged on the carrier film.
  • the device for producing at least one printed circuit board from a foil of electrically conductive material and a carrier foil is characterized in that parts of the foil of electrically conductive material can be removed from the foil by means of a separating device, the foil of electrically conductive material can be arranged on the carrier foil and other parts of the foil of electrically conductive material and the carrier foil can be removed by means of a further separating device.
  • both the film of electrically conductive material and the carrier film as a film strip from a roll can be unwound.
  • Flexible printed circuit board strips that is to say a multiplicity of printed circuit boards, can be produced from film strips which can be unwound from rolls.
  • the method and the device are suitable for mass production of rigid and flexible printed circuit boards.
  • the printed circuit boards can be produced both in parallel and serially. Also possible is a production in which the printed circuit boards are arranged in parallel and in series. - A -
  • the film of electrically conductive material via a deflection roller of the separating device can be fed. If the film is unwound as a film strip from a spool, so the deflection roller guarantees a flat feed and a smooth passage through the separator.
  • the carrier film which has an adhesive coating, can be pressed against the film of electrically conductive material by means of a further deflection roller.
  • the carrier film and the film of electrically conductive material are glued together.
  • the printed circuit boards can be produced as rigid or flexible printed circuit boards.
  • the carrier foils of the rigid printed circuit boards are based on glass fiber mats, which are impregnated with an epoxy resin.
  • a foil of electrically conductive material a copper foil is used.
  • edge portions of the printed circuit board or of the printed circuit board strips serve as protection during production and during transport.
  • 1A shows a device configured to produce a structured flexible printed circuit strip from a copper foil strip and a carrier foil strip in a schematic illustration, 1 B, the structured flexible printed circuit board strip in plan view,
  • FIG. 2 is a schematic illustration of the apparatus adapted to fabricate a patterned flexible multilayer printed circuit board strip using the printed circuit board strip.
  • Fig. 3A shows a structured flexible multilayer printed circuit board with two
  • 3C shows the structured flexible multilayer printed circuit board with the two
  • the printed circuit board strip 15 are punched out. After processing, the printed circuit board strip 15 has a plurality of identical flexible printed circuit boards 2 or more flexible
  • Each printed circuit board 2 has a copper foil 16 and a carrier foil 17.
  • FIG. 1B shows the flexible printed circuit board strip 15, which is composed of the copper foil strips 13 and the carrier film strip 14.
  • both film strips 13 and 14 are formed as endless strips 13 and 14 and have a same width.
  • the endless strips 13 and 14 are flush at their edges 21 and 22.
  • the copper foil strip 13 is punched so that printed conductors 23 are formed and these printed conductors 23 are held to one another by means of webs 24 and to edge portions 25 of the copper foil strip 13.
  • the printed circuit board strip 15 has a multiplicity of identical printed circuit boards 2 or different flexible printed circuit boards 2.
  • the individual printed circuit boards 2 are separated from the printed circuit board strip 15 and the edge sections 25 are removed.
  • Carrier film strip 14 on the second roller 8 is provided on both sides with an adhesive coating.
  • the copper foil strip 13 is glued between the two punching devices 6 and 10 on one side of the carrier film strip 14 coated on both sides with the adhesive.
  • the carrier film strip 14 is a dielectric, that is made of an electrically insulating material, and provided with a double-sided adhesive coating, on one side of the copper foil strip 13 is attached.
  • the carrier film strip 14 is unwound from the second roller 8 and pressed against the copper foil strip 13 via the second deflection roller 9.
  • Carrier film strips 14 stick together and together form a flexible printed circuit board strip 15 having an outer adhesive coating.
  • the flexible printed circuit board strip 15 having an outer adhesive coating is fed to the second punching device 10, and parts of the flexible printed circuit board strip 15 having an outer adhesive coating are punched out. Thereafter, the flexible printed circuit board strip 15 having an outer adhesive coating is fed to a fourth roller 31. Between the second punching device 10 and the fourth roller 31 is another Receiving device 32 for the third roller 12 with the already finished printed circuit board strip 15 is arranged.
  • the unfoldable from the third roller 12 flexible circuit board strip 15 is by means of a guide roller 33 to the second adhesive-coated side of the flexible outer adhesive coating having a printed circuit board strip 15 can be pressed.
  • the flexible circuit board strip 15 and the flexible printed circuit board strip 15 having an outer adhesive coating are glued together to form a flexible multilayer circuit board strip 34.
  • FIGs 3A, 3B and 3C show a flexible multi-layer circuit board 41 with two copper foils 16, two carrier foils 17, four field effect transistors 42, referred to as MOSFETs for short, and four electrically conductive connection brackets 43.
  • the copper foils 16 and carrier foils 17 are alternately layered.
  • the field-effect transistors 42 have a control terminal 44, a discharge connection 45 and a source connection 46.
  • the control terminal 44 and the source terminal 46 are arranged on one side of the transistor 42, the discharge port 45 on the other side of the transistor 42.
  • the transistor 42 is arranged with the discharge port 45 on the lower copper foil 16, the four electrically conductive connection bracket 43 provide a electrical contact between the source terminal 46 and a conductor 23 forth.
  • the control terminal 44 is not busy. Recesses 47 within the upper three sheets 16 and 17 allow the assembly of the multi-layer printed circuit board 41 by means of the field effect transistors 42 and the connecting bracket 43rd

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé et un dispositif de production d'au moins une plaquette de circuit imprimé (2) comprenant une feuille (16) en un matériau électroconducteur et une feuille support (17). Dans une première étape du procédé, des éléments de la feuille (16) en un matériau électroconducteur sont retirés de ladite feuille (16). Il se forme alors une structure comprenant des pistes conductrices qui sont maintenues entre elles au moyen de barrettes. La feuille (16) en un matériau électroconducteur est ensuite disposée sur la feuille support (17). Les barrettes sont alors retirées. De cette façon, les pistes conductrices sont libres et isolées les unes des autres, et la feuille support (17) maintient les pistes conductrices libres à leur emplacement prédéterminé.
PCT/EP2008/062053 2007-10-05 2008-09-11 Procédé et dispositif de production d'au moins une plaquette de circuit imprimé WO2009047075A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200710047708 DE102007047708A1 (de) 2007-10-05 2007-10-05 Verfahren und Vorrichtung zur Herstellung zumindest einer Leiterplatte
DE102007047708.4 2007-10-05

Publications (1)

Publication Number Publication Date
WO2009047075A1 true WO2009047075A1 (fr) 2009-04-16

Family

ID=40090010

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/062053 WO2009047075A1 (fr) 2007-10-05 2008-09-11 Procédé et dispositif de production d'au moins une plaquette de circuit imprimé

Country Status (2)

Country Link
DE (1) DE102007047708A1 (fr)
WO (1) WO2009047075A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018171955A1 (fr) * 2017-03-20 2018-09-27 Robert Bosch Gmbh Circuit de mesure pour module de batterie, procédé de fabrication d'un circuit de mesure et module de batterie

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010004112A1 (de) * 2009-06-29 2010-12-30 Bosch Solar Energy Ag Verfahren zur Herstellung eines folienartigen elektrischen Verbinders für Solarzellen, derartig hergestelltes Verbindungselement sowie Verfahren zum elektrischen Verbinden von mindestens zwei Solarzellen zu einem Solarmodul

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR403335A (fr) * 1909-05-25 1909-10-30 Alphonse Joseph Auguste Peltre Indicateur d'horizontalité pour aéroplanes et ballons dirigeables
DE1226182B (de) * 1960-11-10 1966-10-06 Siemens Ag Verfahren zur Herstellung von sogenannten gedruckten Schaltungen mit aus Metallfoliebestehenden Leiterzuegen
EP0469308A1 (fr) * 1990-08-01 1992-02-05 International Business Machines Corporation Plaquette de circuits à multicouches et son procédé de fabrication
FR2730657A1 (fr) * 1995-02-22 1996-08-23 Solaic Sa Procede et installation pour realiser des trous dans le film isolant d'une bande support pour modules de cartes electroniques

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR403335A (fr) * 1909-05-25 1909-10-30 Alphonse Joseph Auguste Peltre Indicateur d'horizontalité pour aéroplanes et ballons dirigeables
DE1226182B (de) * 1960-11-10 1966-10-06 Siemens Ag Verfahren zur Herstellung von sogenannten gedruckten Schaltungen mit aus Metallfoliebestehenden Leiterzuegen
EP0469308A1 (fr) * 1990-08-01 1992-02-05 International Business Machines Corporation Plaquette de circuits à multicouches et son procédé de fabrication
FR2730657A1 (fr) * 1995-02-22 1996-08-23 Solaic Sa Procede et installation pour realiser des trous dans le film isolant d'une bande support pour modules de cartes electroniques

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018171955A1 (fr) * 2017-03-20 2018-09-27 Robert Bosch Gmbh Circuit de mesure pour module de batterie, procédé de fabrication d'un circuit de mesure et module de batterie

Also Published As

Publication number Publication date
DE102007047708A1 (de) 2009-04-09

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