DE8803653U1 - - Google Patents

Info

Publication number
DE8803653U1
DE8803653U1 DE8803653U DE8803653U DE8803653U1 DE 8803653 U1 DE8803653 U1 DE 8803653U1 DE 8803653 U DE8803653 U DE 8803653U DE 8803653 U DE8803653 U DE 8803653U DE 8803653 U1 DE8803653 U1 DE 8803653U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8803653U
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Landshut Silicon Foundry GmbH
Original Assignee
Hitachi Semiconductor Europe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Semiconductor Europe GmbH filed Critical Hitachi Semiconductor Europe GmbH
Priority to DE8803653U priority Critical patent/DE8803653U1/de
Publication of DE8803653U1 publication Critical patent/DE8803653U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE8803653U 1988-03-17 1988-03-17 Expired DE8803653U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8803653U DE8803653U1 (de) 1988-03-17 1988-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8803653U DE8803653U1 (de) 1988-03-17 1988-03-17

Publications (1)

Publication Number Publication Date
DE8803653U1 true DE8803653U1 (de) 1988-08-11

Family

ID=6821996

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8803653U Expired DE8803653U1 (de) 1988-03-17 1988-03-17

Country Status (1)

Country Link
DE (1) DE8803653U1 (de)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (de) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible traegerfolie
DE3912893A1 (de) * 1989-04-19 1990-10-25 Siemens Ag Als mikropack montierte halbleiteranordnung
DE4138131A1 (de) * 1991-10-19 1993-04-22 Provera Ges Fuer Projektierung Kontaktlose chip-karte mit integriertem mikroprozessor und vorrichtung zum lesen und eingeben von informationen
DE4337921A1 (de) * 1993-11-06 1995-05-11 Manfred Dr Michalk Kontaktlose Chipkarte mit Antennenspule und Verfahren zu ihrer Herstellung
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
DE10132525A1 (de) * 2001-07-09 2003-01-30 Orga Kartensysteme Gmbh Multi-Chip Modul für eine Chipkarte

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905657A1 (de) * 1989-02-24 1990-08-30 Telefunken Electronic Gmbh Flexible traegerfolie
DE3912893A1 (de) * 1989-04-19 1990-10-25 Siemens Ag Als mikropack montierte halbleiteranordnung
DE4138131A1 (de) * 1991-10-19 1993-04-22 Provera Ges Fuer Projektierung Kontaktlose chip-karte mit integriertem mikroprozessor und vorrichtung zum lesen und eingeben von informationen
DE4337921A1 (de) * 1993-11-06 1995-05-11 Manfred Dr Michalk Kontaktlose Chipkarte mit Antennenspule und Verfahren zu ihrer Herstellung
DE4337921C2 (de) * 1993-11-06 1998-09-03 Ods Gmbh & Co Kg Kontaktlose Chipkarte mit Antennenspule
DE19611237A1 (de) * 1996-03-21 1997-09-25 Siemens Ag Multichipkarte
DE10132525A1 (de) * 2001-07-09 2003-01-30 Orga Kartensysteme Gmbh Multi-Chip Modul für eine Chipkarte
DE10132525B4 (de) * 2001-07-09 2006-03-09 Orga Kartensysteme Gmbh Chipkarte mit einem Multi-Chip Modul

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