WO2009038135A1 - ナノ金属粒子担持方法及びナノ金属粒子担持基板 - Google Patents

ナノ金属粒子担持方法及びナノ金属粒子担持基板 Download PDF

Info

Publication number
WO2009038135A1
WO2009038135A1 PCT/JP2008/066869 JP2008066869W WO2009038135A1 WO 2009038135 A1 WO2009038135 A1 WO 2009038135A1 JP 2008066869 W JP2008066869 W JP 2008066869W WO 2009038135 A1 WO2009038135 A1 WO 2009038135A1
Authority
WO
WIPO (PCT)
Prior art keywords
nano particle
metal nano
metal
coupling agent
silane coupling
Prior art date
Application number
PCT/JP2008/066869
Other languages
English (en)
French (fr)
Inventor
Toru Imori
Yoshiyuki Hisumi
Junichi Ito
Tsukasa Torimoto
Kenichi Okazaki
Susumu Kuwabata
Original Assignee
Nippon Mining & Metals Co., Ltd.
Nagoya University
Osaka University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd., Nagoya University, Osaka University filed Critical Nippon Mining & Metals Co., Ltd.
Priority to US12/678,509 priority Critical patent/US8318313B2/en
Priority to JP2009533181A priority patent/JP5514548B2/ja
Publication of WO2009038135A1 publication Critical patent/WO2009038135A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Catalysts (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Conductive Materials (AREA)

Abstract

　ナノ金属粒子を基板上に均一に担持固定化する。 　基板上に一分子中に、イミダゾール基、アミノ基、ジアミノ基、メルカプト基及びビニル基等の金属捕捉能を持つ官能基を少なくとも１個有するシランカップリング剤を塗布した後に、金、白金、銀、銅、パラジウム、ニッケル及びコバルト等のナノ金属粒子と接触させるナノ金属粒子の担持方法であり、上記シランカップリング剤はアゾール系化合物とエポキシシラン系化合物との反応により得られてもよく、シランカップリング剤と接触するナノ金属粒子は、イオン性流体に覆われていることが好ましい方法、並びにその方法を行って得られるナノ金属粒子が担持された基板。
PCT/JP2008/066869 2007-09-18 2008-09-18 ナノ金属粒子担持方法及びナノ金属粒子担持基板 WO2009038135A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/678,509 US8318313B2 (en) 2007-09-18 2008-09-18 Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate
JP2009533181A JP5514548B2 (ja) 2007-09-18 2008-09-18 ナノ金属粒子担持方法及びナノ金属粒子担持基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-241533 2007-09-18
JP2007241533 2007-09-18

Publications (1)

Publication Number Publication Date
WO2009038135A1 true WO2009038135A1 (ja) 2009-03-26

Family

ID=40467945

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066869 WO2009038135A1 (ja) 2007-09-18 2008-09-18 ナノ金属粒子担持方法及びナノ金属粒子担持基板

Country Status (3)

Country Link
US (1) US8318313B2 (ja)
JP (1) JP5514548B2 (ja)
WO (1) WO2009038135A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016060099A1 (ja) * 2014-10-17 2016-04-21 信越化学工業株式会社 有機ケイ素化合物及びその製造方法、並びにそれを用いる金属表面処理剤
WO2017034029A1 (ja) * 2015-08-27 2017-03-02 国立大学法人大阪大学 金属ナノ粒子製造方法、金属ナノ粒子担持担体製造方法、及び金属ナノ粒子担持担体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06256358A (ja) * 1993-03-01 1994-09-13 Japan Energy Corp 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere
JP2002068782A (ja) * 2000-08-29 2002-03-08 Mitsuboshi Belting Ltd ガラス基板表面のパターンメッキ方法及びこれを用いてパターンメッキを施したガラス基板
WO2006132308A1 (ja) * 2005-06-10 2006-12-14 Bridgestone Corporation 超微粒子又は超微粒子集合体の製造方法
JP2007231306A (ja) * 2006-02-27 2007-09-13 Univ Nagoya ナノ粒子の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045461B2 (en) 2000-01-07 2006-05-16 Nikkon Materials Co., Ltd. Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06256358A (ja) * 1993-03-01 1994-09-13 Japan Energy Corp 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere
JP2002068782A (ja) * 2000-08-29 2002-03-08 Mitsuboshi Belting Ltd ガラス基板表面のパターンメッキ方法及びこれを用いてパターンメッキを施したガラス基板
WO2006132308A1 (ja) * 2005-06-10 2006-12-14 Bridgestone Corporation 超微粒子又は超微粒子集合体の製造方法
JP2007231306A (ja) * 2006-02-27 2007-09-13 Univ Nagoya ナノ粒子の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016060099A1 (ja) * 2014-10-17 2016-04-21 信越化学工業株式会社 有機ケイ素化合物及びその製造方法、並びにそれを用いる金属表面処理剤
US10442822B2 (en) 2014-10-17 2019-10-15 Shin-Etsu Chemical Co., Ltd. Organosilicon compound, method for producing same and metal surface treatment agent using same
WO2017034029A1 (ja) * 2015-08-27 2017-03-02 国立大学法人大阪大学 金属ナノ粒子製造方法、金属ナノ粒子担持担体製造方法、及び金属ナノ粒子担持担体
JPWO2017034029A1 (ja) * 2015-08-27 2018-08-09 国立大学法人大阪大学 金属ナノ粒子製造方法、金属ナノ粒子担持担体製造方法、及び金属ナノ粒子担持担体

Also Published As

Publication number Publication date
JP5514548B2 (ja) 2014-06-04
US8318313B2 (en) 2012-11-27
JPWO2009038135A1 (ja) 2011-01-06
US20100215970A1 (en) 2010-08-26

Similar Documents

Publication Publication Date Title
WO2007133866A3 (en) Adjustable mounting bracket
TW200942644A (en) Anti-tarnish coating
Chang et al. Fabrication of copper patterns on flexible substrate by patterning–adsorption–plating process
WO2009054462A1 (ja) 複合粒子担持物、該複合粒子担持物の製造方法、及び該複合粒子担持物を化学合成用の触媒として用いた化合物の製造方法
WO2007028762A3 (de) Dispersion enthaltend zwei verschiedene metalle zum aufbringen einer metallschicht
WO2009007920A3 (en) Delivery systems for delivering functional compounds to substrates and processes of using the same
EP1693478A3 (en) Diffusion barrier for assemblies with metallic and silicon containing components and method therefor
JP2005336612A5 (ja)
WO2009044144A3 (en) Method of manufacture of an electrode for a fuel cell
WO2004099466A3 (en) Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation
PL2283170T3 (pl) Kąpiele elektrolitowe PD i PD-NI
DK2098548T3 (da) Sammensætning med forbedret vedhæftning til poröse substrater
TW200702856A (en) Copper wire or copper electrode protected by silver thin layer and liquid crystal display device having the wire or electrode
JP2010508141A5 (ja)
WO2009009641A3 (en) Coating for decorative metals with improved mar and scratch resistance and methods of application
WO2010019339A3 (en) Method for an improved chemical mechanical polishing system
WO2007033188A3 (en) Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes
RU2013121570A (ru) Способ нанесения покрытия на наночастицы
WO2010110778A3 (en) Method and apparatus for forming an electrical connection on a solar cell
WO2006031846A3 (en) Self-assembled monolayers on the surface of gold coated microcantilevers for application to chemical sensing and method of operation
WO2009127518A3 (de) Verfahren zum elektrochemischen beschichten eines substrates durch brush plating und vorrichtung zur durchführung dieses verfahrens
WO2009038135A1 (ja) ナノ金属粒子担持方法及びナノ金属粒子担持基板
WO2006074902A3 (de) Verfahren zur abscheidung von palladiumschichten und palladiumbad hierfür
WO2010080602A3 (en) Flow-through substrates and methods for making and using them
Lu et al. Selective electroless deposition of copper on organic thin films with improved morphology

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08831647

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2009533181

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 12678509

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 08831647

Country of ref document: EP

Kind code of ref document: A1