WO2009037875A1 - 線幅測定装置の検査方法 - Google Patents

線幅測定装置の検査方法 Download PDF

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Publication number
WO2009037875A1
WO2009037875A1 PCT/JP2008/054163 JP2008054163W WO2009037875A1 WO 2009037875 A1 WO2009037875 A1 WO 2009037875A1 JP 2008054163 W JP2008054163 W JP 2008054163W WO 2009037875 A1 WO2009037875 A1 WO 2009037875A1
Authority
WO
WIPO (PCT)
Prior art keywords
focusing
stage
focusing operation
variation
calculated
Prior art date
Application number
PCT/JP2008/054163
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Satoshi Hirokawa
Shogo Kosuge
Shigenobu Otsuka
Original Assignee
Hitachi Kokusai Electric Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc. filed Critical Hitachi Kokusai Electric Inc.
Publication of WO2009037875A1 publication Critical patent/WO2009037875A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/045—Correction of measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
PCT/JP2008/054163 2007-09-19 2008-03-07 線幅測定装置の検査方法 WO2009037875A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007242361A JP5096852B2 (ja) 2007-09-19 2007-09-19 線幅測定装置および線幅測定装置の検査方法
JP2007-242361 2007-09-19

Publications (1)

Publication Number Publication Date
WO2009037875A1 true WO2009037875A1 (ja) 2009-03-26

Family

ID=40467701

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054163 WO2009037875A1 (ja) 2007-09-19 2008-03-07 線幅測定装置の検査方法

Country Status (3)

Country Link
JP (1) JP5096852B2 (enrdf_load_stackoverflow)
KR (1) KR101067996B1 (enrdf_load_stackoverflow)
WO (1) WO2009037875A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075970A (zh) * 2012-12-27 2013-05-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
KR20160037192A (ko) * 2013-07-25 2016-04-05 케이엘에이-텐코 코포레이션 다이별 검사를 위한 오토포커스 시스템 및 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012111603A1 (ja) * 2011-02-17 2012-08-23 シャープ株式会社 線幅測定装置
CN103837085B (zh) * 2014-03-07 2016-07-06 哈尔滨工业大学 基于激光跟踪仪逐点标定的目标位移矢量测量装置及方法
JP2023037323A (ja) * 2021-09-03 2023-03-15 シャープ株式会社 撮像システムおよび合焦位置判定方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228411A (ja) * 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置
JP2004294358A (ja) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp 欠陥検査方法および装置
JP2004347521A (ja) * 2003-05-23 2004-12-09 Mitsubishi Heavy Ind Ltd 形状計測システム及び方法
JP2006179532A (ja) * 2004-12-20 2006-07-06 Disco Abrasive Syst Ltd 焦点調整方法
JP2007121981A (ja) * 2005-09-30 2007-05-17 Matsushita Electric Ind Co Ltd 基板検査方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228411A (ja) * 2001-02-05 2002-08-14 Hitachi Kokusai Electric Inc 二次元測定装置
JP2004294358A (ja) * 2003-03-28 2004-10-21 Hitachi High-Technologies Corp 欠陥検査方法および装置
JP2004347521A (ja) * 2003-05-23 2004-12-09 Mitsubishi Heavy Ind Ltd 形状計測システム及び方法
JP2006179532A (ja) * 2004-12-20 2006-07-06 Disco Abrasive Syst Ltd 焦点調整方法
JP2007121981A (ja) * 2005-09-30 2007-05-17 Matsushita Electric Ind Co Ltd 基板検査方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103075970A (zh) * 2012-12-27 2013-05-01 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
WO2014101311A1 (zh) * 2012-12-27 2014-07-03 深圳市华星光电技术有限公司 测长装置直交度补偿方法及使用该方法的测长装置
US9080865B2 (en) 2012-12-27 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Orthogonality compensation method for length measurement device and length measurement device using same
KR20160037192A (ko) * 2013-07-25 2016-04-05 케이엘에이-텐코 코포레이션 다이별 검사를 위한 오토포커스 시스템 및 방법
JP2016534550A (ja) * 2013-07-25 2016-11-04 ケーエルエー−テンカー コーポレイション ダイツーダイ検査のためのオートフォーカスシステム及び方法
KR102102018B1 (ko) 2013-07-25 2020-04-17 케이엘에이 코포레이션 다이별 검사를 위한 오토포커스 시스템 및 방법

Also Published As

Publication number Publication date
KR101067996B1 (ko) 2011-09-26
KR20100034038A (ko) 2010-03-31
JP2009074849A (ja) 2009-04-09
JP5096852B2 (ja) 2012-12-12

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