WO2009035073A1 - 研磨装置、研磨方法及びこの研磨方法を用いて基板の研磨加工を行う基板の製造方法 - Google Patents

研磨装置、研磨方法及びこの研磨方法を用いて基板の研磨加工を行う基板の製造方法 Download PDF

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Publication number
WO2009035073A1
WO2009035073A1 PCT/JP2008/066529 JP2008066529W WO2009035073A1 WO 2009035073 A1 WO2009035073 A1 WO 2009035073A1 JP 2008066529 W JP2008066529 W JP 2008066529W WO 2009035073 A1 WO2009035073 A1 WO 2009035073A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
substrate
rotating
pad
slurry
Prior art date
Application number
PCT/JP2008/066529
Other languages
English (en)
French (fr)
Inventor
Tadao Isami
Takehiko Ueda
Hiroshi Eguchi
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2009532235A priority Critical patent/JPWO2009035073A1/ja
Publication of WO2009035073A1 publication Critical patent/WO2009035073A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

基板（Ｗ）を保持して回転させる基板チャック（１０）の回転軸（１３）、及び研磨パッド（２２）を保持して回転させる研磨ヘッド（２０）の回転軸を偏芯状態で同一方向に同一回転数で回転させながら基板（Ｗ）を研磨パッド（２２）とを所定圧力で押接させる押圧回転機構（５０）と、基板と研磨パッドとの押接部にスラリーを供給するスラリー供給機構（３０）とを備え、研磨パッド（２２）は端部がパッド表面に開口し内部において相互に繋がる連続的な空隙を多数有するパッドを用いて形成され、スラリー供給機構（３０）がセリア系のスラリーを供給して研磨加工するように研磨装置が構成される。
PCT/JP2008/066529 2007-09-13 2008-09-12 研磨装置、研磨方法及びこの研磨方法を用いて基板の研磨加工を行う基板の製造方法 WO2009035073A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009532235A JPWO2009035073A1 (ja) 2007-09-13 2008-09-12 研磨装置、研磨方法及びこの研磨方法を用いて基板の研磨加工を行う基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-238554 2007-09-13
JP2007238554 2007-09-13

Publications (1)

Publication Number Publication Date
WO2009035073A1 true WO2009035073A1 (ja) 2009-03-19

Family

ID=40452079

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/066529 WO2009035073A1 (ja) 2007-09-13 2008-09-12 研磨装置、研磨方法及びこの研磨方法を用いて基板の研磨加工を行う基板の製造方法

Country Status (2)

Country Link
JP (1) JPWO2009035073A1 (ja)
WO (1) WO2009035073A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105196135A (zh) * 2015-08-24 2015-12-30 浙江省仙居县华润贸易有限公司 木质灯笼表面打磨工具及木质灯笼制作方法
CN106334990A (zh) * 2016-08-29 2017-01-18 夏爱玉 一种水磨石抛光工艺
JP2019160848A (ja) * 2018-03-07 2019-09-19 株式会社東京精密 研磨装置
CN113814888A (zh) * 2020-06-19 2021-12-21 Skc索密思株式会社 研磨片、其制造方法以及利用其的半导体器件的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103433842A (zh) * 2013-09-23 2013-12-11 南通龙源电站阀门有限公司 阀体偏心研磨磨具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10329011A (ja) * 1997-03-21 1998-12-15 Canon Inc 精密研磨装置及び方法
JP2002520174A (ja) * 1998-07-10 2002-07-09 キャボット マイクロエレクトロニクス コーポレイション 半導体基板用研磨パッド
JP2006121111A (ja) * 1999-11-16 2006-05-11 Denso Corp メカノケミカル研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10329011A (ja) * 1997-03-21 1998-12-15 Canon Inc 精密研磨装置及び方法
JP2002520174A (ja) * 1998-07-10 2002-07-09 キャボット マイクロエレクトロニクス コーポレイション 半導体基板用研磨パッド
JP2006121111A (ja) * 1999-11-16 2006-05-11 Denso Corp メカノケミカル研磨装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105196135A (zh) * 2015-08-24 2015-12-30 浙江省仙居县华润贸易有限公司 木质灯笼表面打磨工具及木质灯笼制作方法
CN106334990A (zh) * 2016-08-29 2017-01-18 夏爱玉 一种水磨石抛光工艺
JP2019160848A (ja) * 2018-03-07 2019-09-19 株式会社東京精密 研磨装置
CN113814888A (zh) * 2020-06-19 2021-12-21 Skc索密思株式会社 研磨片、其制造方法以及利用其的半导体器件的制造方法

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Publication number Publication date
JPWO2009035073A1 (ja) 2010-12-24

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