WO2009033716A4 - Leuchtvorrichtung und verfahren zur herstellung derselben - Google Patents
Leuchtvorrichtung und verfahren zur herstellung derselben Download PDFInfo
- Publication number
- WO2009033716A4 WO2009033716A4 PCT/EP2008/007587 EP2008007587W WO2009033716A4 WO 2009033716 A4 WO2009033716 A4 WO 2009033716A4 EP 2008007587 W EP2008007587 W EP 2008007587W WO 2009033716 A4 WO2009033716 A4 WO 2009033716A4
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- outer layer
- lighting device
- layer
- carrier
- plug
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/22—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
- B29C43/28—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/747—Lightning equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801065449A CN101803478B (zh) | 2007-09-12 | 2008-09-12 | 发光器件及其制造方法 |
EP08830134A EP2189049A1 (de) | 2007-09-12 | 2008-09-12 | Leuchtvorrichtung und verfahren zur herstellung derselben |
US12/677,828 US20100301378A1 (en) | 2007-09-12 | 2008-09-12 | Illumination device and method for the production thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007043401.6 | 2007-09-12 | ||
DE102007043401A DE102007043401A1 (de) | 2007-09-12 | 2007-09-12 | Leuchtvorrichtung und Verfahren zur Herstellung derselben |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009033716A1 WO2009033716A1 (de) | 2009-03-19 |
WO2009033716A4 true WO2009033716A4 (de) | 2009-05-22 |
Family
ID=40230053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/007587 WO2009033716A1 (de) | 2007-09-12 | 2008-09-12 | Leuchtvorrichtung und verfahren zur herstellung derselben |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100301378A1 (de) |
EP (1) | EP2189049A1 (de) |
CN (1) | CN101803478B (de) |
DE (1) | DE102007043401A1 (de) |
WO (1) | WO2009033716A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009020851A1 (de) * | 2009-05-12 | 2010-11-25 | Osram Gesellschaft mit beschränkter Haftung | Leuchtband und Verfahren zum Herstellen eines Leuchtbands |
DE102009047438A1 (de) * | 2009-12-03 | 2011-06-09 | Osram Gesellschaft mit beschränkter Haftung | Leuchtvorrichtung und Verfahren zum Kontaktieren einer Leuchtvorrichtung |
DE102010018260A1 (de) | 2010-01-29 | 2011-08-04 | OSRAM Opto Semiconductors GmbH, 93055 | Beleuchtungsvorrichtung |
DE102013017229A1 (de) * | 2013-10-17 | 2015-04-23 | Led-Linear Gmbh | LED-Streifen sowie Steckerelement |
CN103568180A (zh) * | 2013-10-21 | 2014-02-12 | 虞海香 | 一种荧光被摄物体的制造方法 |
DE202014105355U1 (de) * | 2014-11-07 | 2016-02-10 | Rehau Ag + Co. | Elektrische Anordnung und Gegenstand mit einer solchen elektrischen Anordnung |
EP3406962A1 (de) * | 2017-05-24 | 2018-11-28 | OSRAM GmbH | Beleuchtungsvorrichtung und zugehöriges verfahren |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD213555A1 (de) * | 1983-02-02 | 1984-09-12 | Werk Fernsehelektronik Veb | Verfahren zur herstellung von miniatur -led - zeilen und miniatur - led's |
US5927845A (en) * | 1995-08-28 | 1999-07-27 | Stantech | Integrally formed linear light strip with light emitting diodes |
FI108106B (fi) * | 1996-11-25 | 2001-11-15 | Modular Technology Group Engin | Menetelmä johde-elementin valmistamiseksi ja johde-elementti |
US6113248A (en) * | 1997-10-20 | 2000-09-05 | The Standard Products Company | Automated system for manufacturing an LED light strip having an integrally formed connector |
DE19926746B4 (de) * | 1999-06-11 | 2005-06-16 | Osram Opto Semiconductors Gmbh | Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten |
JP2001210755A (ja) * | 2000-01-28 | 2001-08-03 | Nec Corp | 半導体装置用基板および半導体装置の製造方法 |
JP4926337B2 (ja) * | 2000-06-28 | 2012-05-09 | アバゴ・テクノロジーズ・ジェネラル・アイピー(シンガポール)プライベート・リミテッド | 光源 |
DE10110835B4 (de) * | 2001-03-06 | 2005-02-17 | Osram Opto Semiconductors Gmbh | Beleuchtungsanordnung mit einer Mehrzahl von LED-Modulen auf einer Kühlkörperoberfläche |
US6833669B2 (en) * | 2001-06-25 | 2004-12-21 | E-Lite Technologies, Inc. | Method and apparatus for making large-scale laminated foil-back electroluminescent lamp material, as well as the electroluminescent lamps and strip lamps produced therefrom |
US7083311B2 (en) * | 2002-01-12 | 2006-08-01 | Schefenacker Vision Systems Germany Gmbh & Co. Kg | Conductor of flexible material, component comprising such flexible conductor, and method of manufacturing such conductor |
TW558622B (en) * | 2002-01-24 | 2003-10-21 | Yuan Lin | Lamp on sheet and manufacturing method thereof |
US7404751B2 (en) * | 2002-09-17 | 2008-07-29 | Dai Nippon Printing Co., Ltd. | Method of manufacturing a light emitting display panel and a light emitting display panel |
DE10250911B4 (de) * | 2002-10-31 | 2009-08-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Umhüllung und/oder zumindest eines Teiles eines Gehäuses eines optoelektronischen Bauelements |
US6860620B2 (en) * | 2003-05-09 | 2005-03-01 | Agilent Technologies, Inc. | Light unit having light emitting diodes |
DE10327500B4 (de) * | 2003-06-17 | 2007-03-15 | W.C. Heraeus Gmbh | Verfahren zur Herstellung von Elektrodenstrukturen sowie Elektrodenstruktur und deren Verwendung |
DE102004009284A1 (de) * | 2004-02-26 | 2005-09-15 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Anordnung für eine Hochleistungs-Leuchtdiode und Verfahren zur Herstellung einer Leuchtdioden-Anordnung |
US7052924B2 (en) * | 2004-03-29 | 2006-05-30 | Articulated Technologies, Llc | Light active sheet and methods for making the same |
US20050282307A1 (en) * | 2004-06-21 | 2005-12-22 | Daniels John J | Particulate for organic and inorganic light active devices and methods for fabricating the same |
DE602006017376D1 (de) * | 2005-07-28 | 2010-11-18 | Velcro Ind | Elektrische komponentenmontage |
-
2007
- 2007-09-12 DE DE102007043401A patent/DE102007043401A1/de not_active Withdrawn
-
2008
- 2008-09-12 WO PCT/EP2008/007587 patent/WO2009033716A1/de active Application Filing
- 2008-09-12 US US12/677,828 patent/US20100301378A1/en not_active Abandoned
- 2008-09-12 CN CN2008801065449A patent/CN101803478B/zh not_active Expired - Fee Related
- 2008-09-12 EP EP08830134A patent/EP2189049A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN101803478A (zh) | 2010-08-11 |
DE102007043401A1 (de) | 2009-03-19 |
EP2189049A1 (de) | 2010-05-26 |
US20100301378A1 (en) | 2010-12-02 |
CN101803478B (zh) | 2012-05-09 |
WO2009033716A1 (de) | 2009-03-19 |
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