DE602006017376D1 - Elektrische komponentenmontage - Google Patents

Elektrische komponentenmontage

Info

Publication number
DE602006017376D1
DE602006017376D1 DE602006017376T DE602006017376T DE602006017376D1 DE 602006017376 D1 DE602006017376 D1 DE 602006017376D1 DE 602006017376 T DE602006017376 T DE 602006017376T DE 602006017376 T DE602006017376 T DE 602006017376T DE 602006017376 D1 DE602006017376 D1 DE 602006017376D1
Authority
DE
Germany
Prior art keywords
light emitting
emitting diode
receive
mounting structure
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006017376T
Other languages
English (en)
Inventor
Howard A Kingsford
Kristel Ferry
Willliam P Clune
Mark A Clarner
Bryan Blackmon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Velcro Industries BV
Original Assignee
Velcro Industries BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Velcro Industries BV filed Critical Velcro Industries BV
Publication of DE602006017376D1 publication Critical patent/DE602006017376D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/44—Compression means for making articles of indefinite length
    • B29C43/46—Rollers
    • B29C2043/461—Rollers the rollers having specific surface features
    • B29C2043/465—Rollers the rollers having specific surface features having one or more cavities, e.g. for forming distinct products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/727—Fastening elements
    • B29L2031/729—Hook and loop-type fasteners
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE602006017376T 2005-07-28 2006-07-28 Elektrische komponentenmontage Active DE602006017376D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70333005P 2005-07-28 2005-07-28
PCT/US2006/029153 WO2007016224A1 (en) 2005-07-28 2006-07-28 Mounting electrical components

Publications (1)

Publication Number Publication Date
DE602006017376D1 true DE602006017376D1 (de) 2010-11-18

Family

ID=37312333

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006017376T Active DE602006017376D1 (de) 2005-07-28 2006-07-28 Elektrische komponentenmontage

Country Status (6)

Country Link
US (1) US7556405B2 (de)
EP (1) EP1908339B1 (de)
CN (1) CN101278605B (de)
AT (1) ATE484181T1 (de)
DE (1) DE602006017376D1 (de)
WO (1) WO2007016224A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101240650B1 (ko) * 2006-01-18 2013-03-08 삼성디스플레이 주식회사 발광 다이오드 모듈, 이를 구비한 백라이트 어셈블리 및이를 구비한 표시 장치
CN101795860B (zh) * 2007-09-04 2015-01-21 皇家飞利浦电子股份有限公司 光输出器件
DE102007043401A1 (de) * 2007-09-12 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zur Herstellung derselben
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US8851356B1 (en) 2008-02-14 2014-10-07 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US8143631B2 (en) 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8007286B1 (en) 2008-03-18 2011-08-30 Metrospec Technology, Llc Circuit boards interconnected by overlapping plated through holes portions
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method
US8410720B2 (en) 2008-04-07 2013-04-02 Metrospec Technology, LLC. Solid state lighting circuit and controls
US8061886B1 (en) * 2008-04-30 2011-11-22 Velcro Industries B.V. Securing electrical devices
DE102008054288A1 (de) * 2008-11-03 2010-05-06 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines flexiblen Leuchtbands
TW201025675A (en) * 2008-12-31 2010-07-01 Jess Link Products Co Ltd Light emitting diode light strip and method of making the same
DE102009007430A1 (de) 2009-02-04 2010-08-12 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
US20120000104A1 (en) * 2009-03-17 2012-01-05 Koninklijke Philips Electronics N.V. Led strip for small channel letters
US20110044040A1 (en) * 2009-08-19 2011-02-24 Wen-Chung Chin Lighting device and manufacturing method thereof
DE102009047438A1 (de) * 2009-12-03 2011-06-09 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zum Kontaktieren einer Leuchtvorrichtung
US8592844B2 (en) * 2010-01-29 2013-11-26 Nitto Denko Corporation Light-emitting diode device
TW201203477A (en) 2010-01-29 2012-01-16 Nitto Denko Corp Power module
CN102011965A (zh) * 2010-12-11 2011-04-13 郭小华 一种高效传散热的led光源结构
US9508905B2 (en) * 2010-12-22 2016-11-29 Linxens Holding Circuit for a light emitting component and method of manufacturing the same
CN102881780B (zh) * 2011-07-15 2015-04-01 展晶科技(深圳)有限公司 发光模组及其制造方法
CN103128390B (zh) * 2011-11-30 2016-06-08 亚企睦自动设备有限公司 焊接环的预固定装置及焊接环的预固定方法
US8721074B2 (en) * 2011-11-30 2014-05-13 Johnson & Johnson Vision Care, Inc. Electrical interconnects in an electronic contact lens
US9117991B1 (en) * 2012-02-10 2015-08-25 Flextronics Ap, Llc Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof
DE102012213309A1 (de) * 2012-07-30 2014-01-30 Osram Gmbh Verfahren zum Herstellen eines Leuchtbands und Leuchtband
DE102012112393B4 (de) * 2012-12-17 2018-05-03 Phoenix Contact Gmbh & Co. Kg Elektrische Baugruppe
JP2016511508A (ja) * 2013-02-04 2016-04-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 照明デバイス及びその組立て方法
ITRN20130032A1 (it) * 2013-08-10 2015-02-11 Rebernig Supervisioni Srl Dispositivo elettrico e/o elettronico comprendente almeno un circuito stampato.
GB2523145A (en) * 2014-02-14 2015-08-19 Nokia Technologies Oy A circuit board and associated apparatus and methods
US9648750B2 (en) * 2014-09-30 2017-05-09 Rsm Electron Power, Inc. Light emitting diode (LED) assembly and flexible circuit board with improved thermal conductivity
CN106469767B (zh) * 2015-08-18 2017-12-01 江苏诚睿达光电有限公司 一种基于串联滚压的有机硅树脂光转换体贴合封装led的装备系统
MX2018012533A (es) * 2016-04-13 2019-02-25 Tactotek Oy Estructura multicapa iluminada con fuentes de luz de area incorporadas.
CN106402686B (zh) * 2016-11-29 2018-05-15 盐城市新亚自控设备股份有限公司 一种led阵列器件的冷却装置
CN108426178B (zh) * 2018-02-02 2020-07-28 深圳市奥拓电子股份有限公司 Led灯珠及led显示结构
JP7009263B2 (ja) * 2018-03-02 2022-01-25 キヤノン株式会社 アクセサリシュー装置及び電子機器
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
CN109714891B (zh) * 2018-11-06 2019-11-08 庆鼎精密电子（淮安）有限公司 连接基板以及应用该连接基板的电路板连接方法
US11161283B2 (en) * 2018-12-20 2021-11-02 Velcro Ip Holdings Llc Molding fastener products
WO2023156921A1 (en) * 2022-02-16 2023-08-24 Avery Dennison Retail Information Services Llc Bus structure systems and methods

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857397A (en) * 1972-11-27 1974-12-31 Custom Materials Inc Electrically conductive wrist strap
US4164008A (en) * 1977-02-24 1979-08-07 Stanley M. Meyer Illuminated article of clothing
US4281211A (en) * 1979-04-13 1981-07-28 Southern Weaving Company Woven cover for electrical transmission cable
US4794028A (en) * 1984-04-16 1988-12-27 Velcro Industries B.V. Method for continuously producing a multi-hook fastner member and product of the method
US4602191A (en) * 1984-07-23 1986-07-22 Xavier Davila Jacket with programmable lights
US4709307A (en) * 1986-06-20 1987-11-24 Mcknight Road Enterprises, Inc. Clothing with illuminated display
GB2256977A (en) 1990-10-19 1992-12-23 Eric Pilkington Connecting wires to electric plug using hook-and-loop strip
GB9115888D0 (en) * 1991-07-23 1991-09-04 Bicc Plc Electric & communications cables
US5260015A (en) * 1991-08-16 1993-11-09 Velcro Industries, B.V. Method for making a laminated hook fastener
WO1993023596A1 (en) * 1992-05-08 1993-11-25 Gates Formed-Fibre Products, Inc. Improved nonwoven moldable composite and method of manufacture
US5550408A (en) * 1992-11-18 1996-08-27 Matsushita Electronics Corporation Semiconductor device
US5455749A (en) * 1993-05-28 1995-10-03 Ferber; Andrew R. Light, audio and current related assemblies, attachments and devices with conductive compositions
US5836673A (en) * 1994-08-12 1998-11-17 Lo; Robin Strip sport light
US5569549A (en) * 1995-03-17 1996-10-29 Tv Interactive Data Corporation Method and structure for attaching a battery to an electrical device
JPH08298032A (ja) * 1995-04-25 1996-11-12 Nippon Unicar Co Ltd 架橋ポリエチレン絶縁電力ケーブルの製造方法
US5945193A (en) * 1995-12-06 1999-08-31 Velcro Industries B.V. Touch fastener with porous metal containing layer
DE19623575A1 (de) 1996-06-13 1997-12-18 Volkswagen Ag Vorverkabeltes Auskleidungsteil für die Innenauskleidung eines Fahrzeuges
DE19650227C1 (de) * 1996-12-04 1997-11-27 Webasto Karosseriesysteme Fahrzeugdach mit Kabelverbindung
US6688528B2 (en) * 1997-07-15 2004-02-10 Silverbrook Research Pty Ltd Compact display assembly
US6210771B1 (en) * 1997-09-24 2001-04-03 Massachusetts Institute Of Technology Electrically active textiles and articles made therefrom
US6106303A (en) * 1998-05-27 2000-08-22 Lear Automotive Dearborn, Inc. Trim panel having grooves with integrally formed electrical circuits
US6395121B1 (en) * 1999-02-04 2002-05-28 Chartpak, Inc. Method for making fabric-based, adhesively mounted printed circuit for upholstered seats and the like
JP2001029433A (ja) 1999-07-15 2001-02-06 Taisei Kako Co Ltd Ｐｅｓ製インジェクションブロー成形ほ乳瓶、並びに、その製造方法
US6640434B1 (en) * 2000-04-11 2003-11-04 Lear Corporation Method of forming an electrical circuit on a substrate
US6402336B1 (en) * 2000-09-02 2002-06-11 Donald Reese Lights in a blanket
BE1013728A6 (nl) * 2000-09-29 2002-07-02 Lemmens Wim Klittebandledsocketset.
AU2002225863A1 (en) * 2000-10-25 2002-05-06 Velcro Industries B.V. Securing electrical conductors
DE10116008A1 (de) * 2001-03-30 2002-10-02 Mannesmann Vdo Ag Elektromechanische Vorrichtung zur Montage einer elektronischen Baugruppe auf einem Baugruppenträger, insbesondere zur Montage eines in einer Armaturentafel eingesenkten Anzeigeinstruments
US7358929B2 (en) * 2001-09-17 2008-04-15 Philips Solid-State Lighting Solutions, Inc. Tile lighting methods and systems
TW558622B (en) * 2002-01-24 2003-10-21 Yuan Lin Lamp on sheet and manufacturing method thereof
US6668380B2 (en) * 2002-02-28 2003-12-30 Koninklijke Philips Electronics N.V. Selectively detachable and wearable electrode/sensors
US7273987B2 (en) * 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
US6846094B2 (en) * 2002-08-26 2005-01-25 Altman Stage Lighting, Co., Inc. Flexible LED lighting strip
DE10245596B3 (de) 2002-09-30 2004-06-17 Johnson Controls Gmbh Vorverkabeltes Ausstattungsteil, Leitungsstrang und Verfahren zu seiner Herstellung
US7105117B2 (en) * 2003-01-06 2006-09-12 General Motors Corporation Manufacturing method for increasing thermal and electrical conductivities of polymers
US7155819B2 (en) * 2003-06-30 2007-01-02 Intel Corporation System for making a conductive circuit on a substantially non-conductive substrate
US20050098454A1 (en) * 2003-08-20 2005-05-12 Gallant Christopher M. Holders for fastening digital media discs to fabric surfaces
US7303711B2 (en) * 2004-02-24 2007-12-04 Velcro Industries B.V. Fastener products
US20060050492A1 (en) * 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7452610B2 (en) * 2005-06-29 2008-11-18 Du Pont Toray Company Limited Multi-layer polyimide films and flexible circuit substrates therefrom

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CN101278605A (zh) 2008-10-01
EP1908339A1 (de) 2008-04-09
EP1908339B1 (de) 2010-10-06
WO2007016224A1 (en) 2007-02-08
US20070025108A1 (en) 2007-02-01
ATE484181T1 (de) 2010-10-15
CN101278605B (zh) 2011-05-25

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