WO2009028484A1 - 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 - Google Patents

半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 Download PDF

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Publication number
WO2009028484A1
WO2009028484A1 PCT/JP2008/065164 JP2008065164W WO2009028484A1 WO 2009028484 A1 WO2009028484 A1 WO 2009028484A1 JP 2008065164 W JP2008065164 W JP 2008065164W WO 2009028484 A1 WO2009028484 A1 WO 2009028484A1
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Prior art keywords
semiconductor device
manufacturing
adhesive sheet
sheet
adhesive
Prior art date
Application number
PCT/JP2008/065164
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English (en)
French (fr)
Inventor
Yasuhiro Amano
Sadahito Misumi
Takeshi Matsumura
Naohide Takamoto
Original Assignee
Nitto Denko Corporation
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Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to CN200880101005A priority Critical patent/CN101765909A/zh
Priority to US12/675,433 priority patent/US20100236689A1/en
Publication of WO2009028484A1 publication Critical patent/WO2009028484A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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Abstract

　接着シートが薄層化した場合にも、当該接着シートの有無を容易に識別することを可能にし、これにより製造装置のダウンタイムを短縮して、歩留まりの向上を可能にする半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法を提供する。本発明の半導体装置製造用の接着シートは、半導体素子を被着体に接着させる半導体装置製造用の接着シートであって、波長域が２９０～４５０ｎｍの範囲内にある光を吸収又は反射させる顔料を含有することを特徴とする。
PCT/JP2008/065164 2007-08-31 2008-08-26 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法 WO2009028484A1 (ja)

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CN200880101005A CN101765909A (zh) 2007-08-31 2008-08-26 半导体装置制造用的胶粘片及使用其的半导体装置的制造方法
US12/675,433 US20100236689A1 (en) 2007-08-31 2008-08-26 Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheet

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JP2007-226282 2007-08-31
JP2007226282A JP4975564B2 (ja) 2007-08-31 2007-08-31 半導体装置製造用の接着シート、及びそれを用いた半導体装置の製造方法

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JP2015013946A (ja) * 2013-07-05 2015-01-22 日東電工株式会社 接着剤組成物及び接着シート
JP2018016705A (ja) * 2016-07-27 2018-02-01 古河電気工業株式会社 電子デバイス用テープ

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US8004078B1 (en) * 2009-03-17 2011-08-23 Amkor Technology, Inc. Adhesive composition for semiconductor device
JP5632695B2 (ja) * 2009-11-26 2014-11-26 日東電工株式会社 ダイシングフィルム付き接着フィルム、及び、該ダイシングフィルム付き接着フィルムを用いた半導体装置の製造方法
JP6045773B2 (ja) * 2009-11-26 2016-12-14 日立化成株式会社 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP4845063B2 (ja) * 2009-12-18 2011-12-28 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
JP5996836B2 (ja) 2010-02-25 2016-09-21 タレックス光学工業株式会社 眼鏡用合わせガラスレンズ
JP2011253911A (ja) * 2010-06-01 2011-12-15 Shinko Electric Ind Co Ltd 配線基板
JP5408571B2 (ja) * 2010-10-06 2014-02-05 古河電気工業株式会社 ウエハ加工用テープ及びその製造方法
JP5023225B1 (ja) * 2011-03-10 2012-09-12 日東電工株式会社 半導体装置用フィルムの製造方法
JP5036887B1 (ja) * 2011-03-11 2012-09-26 日東電工株式会社 保護フィルム付きダイシングフィルム
DE102011077684A1 (de) * 2011-06-17 2012-12-20 Robert Bosch Gmbh Abdeckmaterial für einen Mikrochip, Mikrochip mit Abdeckmaterial sowie Verfahren zur Bereitstellung eines solchen Mikrochips
CN102842512A (zh) * 2011-06-22 2012-12-26 日东电工株式会社 半导体装置的制造方法
RU2476471C1 (ru) * 2011-10-20 2013-02-27 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Волгоградский государственный технический университет" (ВолгГТУ) Способ крепления резин друг к другу
JP6379389B2 (ja) * 2014-12-15 2018-08-29 リンテック株式会社 ダイシングダイボンディングシート
JP6983200B2 (ja) * 2019-07-11 2021-12-17 日東電工株式会社 ダイボンドフィルム及びダイシングダイボンドフィルム
JP2021075620A (ja) 2019-11-08 2021-05-20 リンテック株式会社 接着フィルム及び接着複合シート
WO2021193942A1 (ja) 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート
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JP2018016705A (ja) * 2016-07-27 2018-02-01 古河電気工業株式会社 電子デバイス用テープ

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