WO2009017088A1 - 静電チャック機構の製造方法 - Google Patents

静電チャック機構の製造方法 Download PDF

Info

Publication number
WO2009017088A1
WO2009017088A1 PCT/JP2008/063511 JP2008063511W WO2009017088A1 WO 2009017088 A1 WO2009017088 A1 WO 2009017088A1 JP 2008063511 W JP2008063511 W JP 2008063511W WO 2009017088 A1 WO2009017088 A1 WO 2009017088A1
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric layer
chuck
electrostatic chuck
chuck mechanism
manufacturing electrostatic
Prior art date
Application number
PCT/JP2008/063511
Other languages
English (en)
French (fr)
Inventor
Yoshinori Fujii
Katsuaki Nakano
Hidenori Fukumoto
Nobumasa Miyanaga
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880101558.1A priority Critical patent/CN101803000A/zh
Priority to US12/670,523 priority patent/US20100287768A1/en
Priority to KR1020107002186A priority patent/KR101531647B1/ko
Priority to JP2009525393A priority patent/JP5117500B2/ja
Publication of WO2009017088A1 publication Critical patent/WO2009017088A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

被チャック物を保持するときに当該被チャック物と接触する誘電層を、シリコーンゴムや樹脂から作製した場合、その作製時に表面或いは内部に残留した不純物の影響を受けずに、使用当初から性能のばらつきや脱離不良が生じることのない静電チャックの製造方法を提供する。誘電層(６)を、電極(５)を設けた基材(３)表面に組付ける前または当該基材(３)表面に組付けた後、前記誘電層(６)の接触面に、所定温度に加熱した加熱板(７)を押し付ける工程を実施する。
PCT/JP2008/063511 2007-08-02 2008-07-28 静電チャック機構の製造方法 WO2009017088A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880101558.1A CN101803000A (zh) 2007-08-02 2008-07-28 静电卡盘装置的制造方法
US12/670,523 US20100287768A1 (en) 2007-08-02 2008-07-28 Mehtod of manufacturing electrostatic chuck mechanism
KR1020107002186A KR101531647B1 (ko) 2007-08-02 2008-07-28 정전 척 기구의 제조 방법
JP2009525393A JP5117500B2 (ja) 2007-08-02 2008-07-28 静電チャック機構の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-201579 2007-08-02
JP2007201579 2007-08-02

Publications (1)

Publication Number Publication Date
WO2009017088A1 true WO2009017088A1 (ja) 2009-02-05

Family

ID=40304318

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063511 WO2009017088A1 (ja) 2007-08-02 2008-07-28 静電チャック機構の製造方法

Country Status (6)

Country Link
US (1) US20100287768A1 (ja)
JP (1) JP5117500B2 (ja)
KR (1) KR101531647B1 (ja)
CN (1) CN101803000A (ja)
TW (1) TWI453857B (ja)
WO (1) WO2009017088A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013027584A1 (ja) * 2011-08-19 2015-03-19 株式会社アルバック 真空処理装置及び真空処理方法
US20150062772A1 (en) * 2013-08-27 2015-03-05 Varian Semiconductor Equipment Associates, Inc Barrier Layer For Electrostatic Chucks
JP6217303B2 (ja) * 2013-10-17 2017-10-25 株式会社シンコーモールド 導電性シリコーンゴム製電極パターンの作製方法並びにオールシリコーンゴム製静電チャック及びその製造方法
US20170047867A1 (en) * 2015-08-12 2017-02-16 Applied Materials, Inc. Electrostatic chuck with electrostatic fluid seal for containing backside gas
TWI583554B (zh) * 2016-04-11 2017-05-21 Usun Technology Co Ltd Soft suction fit platform
KR20230133408A (ko) * 2018-10-11 2023-09-19 닛폰 하츠죠 가부시키가이샤 스테이지, 성막 장치 및 막 가공 장치
JP2020064841A (ja) * 2018-10-11 2020-04-23 日本発條株式会社 ステージ、成膜装置、および膜加工装置
KR20230008342A (ko) 2021-07-07 2023-01-16 주식회사 시에스언리밋 반도체 웨이퍼 지지장치의 정전척용 전원회로
KR20230008343A (ko) 2021-07-07 2023-01-16 주식회사 시에스언리밋 정전척 캐리어
KR20230172837A (ko) 2022-06-16 2023-12-26 주식회사 시에스언리밋 쌍극형 정전척 캐리어
KR20230172838A (ko) 2022-06-16 2023-12-26 주식회사 시에스언리밋 쌍극형 정전척 캐리어의 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167643A (ja) * 1994-12-14 1996-06-25 Hitachi Ltd 試料保持装置及びその塵埃除去方法
JPH08321447A (ja) * 1995-05-25 1996-12-03 Hitachi Ltd 異物除去機能付きウエハ処理方法
JPH10189699A (ja) * 1996-12-27 1998-07-21 Kyocera Corp 静電チャックの洗浄方法
JPH1187457A (ja) * 1997-09-16 1999-03-30 Hitachi Ltd 異物除去機能付き静電吸着装置を備えた半導体製造装置
JP2006287210A (ja) * 2005-03-07 2006-10-19 Ngk Insulators Ltd 静電チャック及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071630A (en) * 1996-03-04 2000-06-06 Shin-Etsu Chemical Co., Ltd. Electrostatic chuck
US5671119A (en) * 1996-03-22 1997-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Process for cleaning an electrostatic chuck of a plasma etching apparatus
JP4753460B2 (ja) * 2000-08-16 2011-08-24 株式会社クリエイティブ テクノロジー 静電チャック及びその製造方法
JP4482472B2 (ja) * 2005-03-24 2010-06-16 日本碍子株式会社 静電チャック及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167643A (ja) * 1994-12-14 1996-06-25 Hitachi Ltd 試料保持装置及びその塵埃除去方法
JPH08321447A (ja) * 1995-05-25 1996-12-03 Hitachi Ltd 異物除去機能付きウエハ処理方法
JPH10189699A (ja) * 1996-12-27 1998-07-21 Kyocera Corp 静電チャックの洗浄方法
JPH1187457A (ja) * 1997-09-16 1999-03-30 Hitachi Ltd 異物除去機能付き静電吸着装置を備えた半導体製造装置
JP2006287210A (ja) * 2005-03-07 2006-10-19 Ngk Insulators Ltd 静電チャック及びその製造方法

Also Published As

Publication number Publication date
JP5117500B2 (ja) 2013-01-16
TWI453857B (zh) 2014-09-21
TW200921839A (en) 2009-05-16
KR20100055397A (ko) 2010-05-26
CN101803000A (zh) 2010-08-11
US20100287768A1 (en) 2010-11-18
KR101531647B1 (ko) 2015-06-25
JPWO2009017088A1 (ja) 2010-10-21

Similar Documents

Publication Publication Date Title
WO2009017088A1 (ja) 静電チャック機構の製造方法
EP2312620A4 (en) FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
WO2009001771A1 (ja) 接着フィルム、接続方法及び接合体
WO2008082978A3 (en) Electrostatic chuck and method of forming
WO2009012239A3 (en) Reduced cycle time manufacturing processes for thick film resistive devices
WO2008112101A3 (en) Packaging methods for imager devices
EP2323079A3 (en) Electrical device manufacturing techniques
WO2009035797A3 (en) Ultra-thin film electrodes and protective layer for high temperature device applications
WO2009063973A1 (ja) 光電変換素子用電極基板、光電変換素子用電極基板の製造方法、および光電変換素子
TW200727438A (en) Multi-layered anisotropic conductive film
WO2008146793A1 (ja) 電気装置、接続方法及び接着フィルム
WO2008117679A1 (ja) 抵抗変化素子およびその製造方法、並びに電子デバイス
WO2009008407A1 (ja) 有機半導体素子の製造方法、有機半導体素子及び有機半導体装置
MY146437A (en) Method of manufacturing glass strip
WO2010044546A3 (ko) 저항막 방식 터치 시트, 터치 패널 및 그 제조 방법
WO2008082977A3 (en) Electrostatic chuck and method of forming
WO2008021227A3 (en) High profile contacts for microelectromechanical systems
WO2008129738A1 (ja) パターン形成方法および電子素子の製造方法
WO2009034926A1 (ja) 電子装置の製造方法
JP2011525437A5 (ja)
WO2008126696A1 (ja) 半導体発光装置
WO2009022581A1 (ja) 半導体装置の製造方法、半導体装置の製造装置、及び、記憶媒体
WO2009054159A1 (ja) 表示装置及び表示装置の製造方法
WO2011126293A3 (en) Apparatus and method for manufacturing prism sheet
WO2009063583A1 (ja) フレキシブル半導体装置の製造方法及びフレキシブル半導体装置

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880101558.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08791746

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009525393

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20107002186

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 12670523

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 08791746

Country of ref document: EP

Kind code of ref document: A1