WO2009017017A1 - 高輝度発光ダイオ-ド及びその製造方法 - Google Patents
高輝度発光ダイオ-ド及びその製造方法 Download PDFInfo
- Publication number
- WO2009017017A1 WO2009017017A1 PCT/JP2008/063250 JP2008063250W WO2009017017A1 WO 2009017017 A1 WO2009017017 A1 WO 2009017017A1 JP 2008063250 W JP2008063250 W JP 2008063250W WO 2009017017 A1 WO2009017017 A1 WO 2009017017A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- window layer
- type gap
- gap window
- high brightness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
Landscapes
- Led Devices (AREA)
Abstract
反りが小さくチップ工程での加工割れの無い厚い窓層を備えた高輝度発光ダイオード、及びその高輝度発光ダイオードを安定して製造できる方法を提供する。 GaAs基板上に成長せしめられたAlGaInPの4元発光層と、前記AlGaInPの4元発光層の表層に成長せしめられた発光光の取り出し用のp型GaP窓層と、前記GaAs基板をエッチング除去した前記AlGaInPの4元発光層の裏面に気相成長せしめられた発光光の取り出し用のn型GaP窓層とを有し、前記裏面のn型GaP窓層と前記表層のp型GaP窓層の材質の組成を同一としかつ前記裏面のn型GaP窓層厚さ/前記表層のp型GaP窓層厚さの比Xを所定の範囲に設定するようにした。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009525361A JPWO2009017017A1 (ja) | 2007-07-31 | 2008-07-24 | 高輝度発光ダイオ−ド及びその製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-199627 | 2007-07-31 | ||
| JP2007199627 | 2007-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009017017A1 true WO2009017017A1 (ja) | 2009-02-05 |
Family
ID=40304247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/063250 Ceased WO2009017017A1 (ja) | 2007-07-31 | 2008-07-24 | 高輝度発光ダイオ-ド及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2009017017A1 (ja) |
| TW (1) | TW200924240A (ja) |
| WO (1) | WO2009017017A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009043983A (ja) * | 2007-08-09 | 2009-02-26 | Shin Etsu Handotai Co Ltd | 高輝度発光ダイオードの製造方法 |
| WO2013041279A1 (de) * | 2011-09-23 | 2013-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender halbleiterchip |
| KR101412142B1 (ko) | 2012-09-13 | 2014-06-25 | 광전자 주식회사 | 엔형 질화갈륨 윈도우층을 가진 알루미늄갈륨인듐인계 발광다이오드 및 그 제조 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04315479A (ja) * | 1991-04-12 | 1992-11-06 | Mitsubishi Cable Ind Ltd | 半導体発光素子とその製造方法 |
| JP2004281825A (ja) * | 2003-03-17 | 2004-10-07 | Hitachi Cable Ltd | 発光ダイオードの製造方法 |
| WO2006129595A1 (ja) * | 2005-05-31 | 2006-12-07 | Shin-Etsu Handotai Co., Ltd. | 発光素子の製造方法 |
-
2008
- 2008-07-24 JP JP2009525361A patent/JPWO2009017017A1/ja active Pending
- 2008-07-24 WO PCT/JP2008/063250 patent/WO2009017017A1/ja not_active Ceased
- 2008-07-31 TW TW097129062A patent/TW200924240A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04315479A (ja) * | 1991-04-12 | 1992-11-06 | Mitsubishi Cable Ind Ltd | 半導体発光素子とその製造方法 |
| JP2004281825A (ja) * | 2003-03-17 | 2004-10-07 | Hitachi Cable Ltd | 発光ダイオードの製造方法 |
| WO2006129595A1 (ja) * | 2005-05-31 | 2006-12-07 | Shin-Etsu Handotai Co., Ltd. | 発光素子の製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009043983A (ja) * | 2007-08-09 | 2009-02-26 | Shin Etsu Handotai Co Ltd | 高輝度発光ダイオードの製造方法 |
| WO2013041279A1 (de) * | 2011-09-23 | 2013-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender halbleiterchip |
| KR101412142B1 (ko) | 2012-09-13 | 2014-06-25 | 광전자 주식회사 | 엔형 질화갈륨 윈도우층을 가진 알루미늄갈륨인듐인계 발광다이오드 및 그 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200924240A (en) | 2009-06-01 |
| JPWO2009017017A1 (ja) | 2010-10-21 |
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