WO2009017001A1 - 回路部材の接続構造 - Google Patents
回路部材の接続構造 Download PDFInfo
- Publication number
- WO2009017001A1 WO2009017001A1 PCT/JP2008/063170 JP2008063170W WO2009017001A1 WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1 JP 2008063170 W JP2008063170 W JP 2008063170W WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit
- circuit member
- connecting structure
- electrode
- circuit electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880022959.8A CN101690425A (zh) | 2007-07-27 | 2008-07-23 | 电路部件的连接结构 |
JP2009525351A JPWO2009017001A1 (ja) | 2007-07-27 | 2008-07-23 | 回路部材の接続構造 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-195764 | 2007-07-27 | ||
JP2007195764 | 2007-07-27 | ||
JP2008-144852 | 2008-06-02 | ||
JP2008144852 | 2008-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009017001A1 true WO2009017001A1 (ja) | 2009-02-05 |
Family
ID=40304233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/063170 WO2009017001A1 (ja) | 2007-07-27 | 2008-07-23 | 回路部材の接続構造 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2009017001A1 (zh) |
KR (1) | KR20100039419A (zh) |
CN (1) | CN101690425A (zh) |
TW (1) | TW200924569A (zh) |
WO (1) | WO2009017001A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011012180A (ja) * | 2009-07-02 | 2011-01-20 | Hitachi Chem Co Ltd | 回路接続材料及び回路接続構造体 |
JP2011066015A (ja) * | 2010-12-21 | 2011-03-31 | Sony Chemical & Information Device Corp | 導電性粒子、異方性導電材料及び接続構造体 |
JP2012155950A (ja) * | 2011-01-25 | 2012-08-16 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
EP2230687A3 (de) * | 2009-03-18 | 2012-12-05 | Smartrac IP B.V. | Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen |
WO2018168627A1 (ja) * | 2017-03-14 | 2018-09-20 | パナソニックIpマネジメント株式会社 | タッチセンサ |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018030438A1 (ja) * | 2016-08-08 | 2018-02-15 | 積水化学工業株式会社 | 導通検査装置用部材及び導通検査装置 |
CN114371578A (zh) * | 2021-12-23 | 2022-04-19 | 长沙惠科光电有限公司 | 显示面板及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000171823A (ja) * | 1998-12-03 | 2000-06-23 | Casio Comput Co Ltd | 液晶表示素子 |
JP2000340926A (ja) * | 1999-05-26 | 2000-12-08 | Process Lab Micron:Kk | 金属・プラスチックハイブリッド構造印刷版の製造方法 |
JP2005166438A (ja) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | 回路接続材料、及びこれを用いた回路部材の接続構造 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007242307A (ja) * | 2006-03-06 | 2007-09-20 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
-
2008
- 2008-07-23 KR KR1020107004355A patent/KR20100039419A/ko not_active Application Discontinuation
- 2008-07-23 CN CN200880022959.8A patent/CN101690425A/zh active Pending
- 2008-07-23 JP JP2009525351A patent/JPWO2009017001A1/ja not_active Withdrawn
- 2008-07-23 WO PCT/JP2008/063170 patent/WO2009017001A1/ja active Application Filing
- 2008-07-25 TW TW97128438A patent/TW200924569A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000171823A (ja) * | 1998-12-03 | 2000-06-23 | Casio Comput Co Ltd | 液晶表示素子 |
JP2000340926A (ja) * | 1999-05-26 | 2000-12-08 | Process Lab Micron:Kk | 金属・プラスチックハイブリッド構造印刷版の製造方法 |
JP2005166438A (ja) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | 回路接続材料、及びこれを用いた回路部材の接続構造 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2230687A3 (de) * | 2009-03-18 | 2012-12-05 | Smartrac IP B.V. | Schaltungsanordnung, Verfahren zum elektrischen und/oder mechanischen Verbinden und Vorrichtung zum Aufbringen von Verbindungselementen |
JP2011012180A (ja) * | 2009-07-02 | 2011-01-20 | Hitachi Chem Co Ltd | 回路接続材料及び回路接続構造体 |
JP2011066015A (ja) * | 2010-12-21 | 2011-03-31 | Sony Chemical & Information Device Corp | 導電性粒子、異方性導電材料及び接続構造体 |
JP2012155950A (ja) * | 2011-01-25 | 2012-08-16 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
WO2018168627A1 (ja) * | 2017-03-14 | 2018-09-20 | パナソニックIpマネジメント株式会社 | タッチセンサ |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009017001A1 (ja) | 2010-10-21 |
KR20100039419A (ko) | 2010-04-15 |
CN101690425A (zh) | 2010-03-31 |
TW200924569A (en) | 2009-06-01 |
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