WO2009011430A1 - 熱電変換モジュールおよび熱電変換モジュールの製造方法 - Google Patents

熱電変換モジュールおよび熱電変換モジュールの製造方法 Download PDF

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Publication number
WO2009011430A1
WO2009011430A1 PCT/JP2008/063060 JP2008063060W WO2009011430A1 WO 2009011430 A1 WO2009011430 A1 WO 2009011430A1 JP 2008063060 W JP2008063060 W JP 2008063060W WO 2009011430 A1 WO2009011430 A1 WO 2009011430A1
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WO
WIPO (PCT)
Prior art keywords
thermoelectric conversion
conversion material
conversion module
type thermoelectric
element part
Prior art date
Application number
PCT/JP2008/063060
Other languages
English (en)
French (fr)
Inventor
Masahiro Sasaki
Takanori Nakamura
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2009523690A priority Critical patent/JP5007748B2/ja
Publication of WO2009011430A1 publication Critical patent/WO2009011430A1/ja
Priority to US12/687,908 priority patent/US20100101622A1/en
Priority to US12/963,710 priority patent/US8465998B2/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

　熱電変換材料の占有率を高めるため、ｐ型熱電変換材料層およびｎ型熱電変換材料層の厚みを厚くした場合にも、積みずれや変形が生じず、小型で出力や起電力の高い熱電変換モジュール、およびその製造方法を提供する。 　複数の熱電構成体１を積層した積層体１０を備えた熱電変換モジュール２０において、熱電構成体が、絶縁層２と、絶縁層上にｐ型熱電変換材料層３とｎ型熱電変換材料層４とを直列接続となるように配設された熱電変換素子部５を備えており、熱電変換素子部を構成するｐ型熱電変換材料層とｎ型熱電変換材料層の周囲の、積層方向に隣り合う絶縁層に挟まれた領域Ｒには、熱電変換素子部と、その周囲との段差を解消するための段差解消用絶縁材料層６が配設された構成とする。 　熱電変換素子部５を蛇行形状とする。 　熱電変換素子部を構成するｐ型およびｎ型熱電変換材料層の厚みを、絶縁層の厚みより厚くする。
PCT/JP2008/063060 2007-07-19 2008-07-18 熱電変換モジュールおよび熱電変換モジュールの製造方法 WO2009011430A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009523690A JP5007748B2 (ja) 2007-07-19 2008-07-18 熱電変換モジュールおよび熱電変換モジュールの製造方法
US12/687,908 US20100101622A1 (en) 2007-07-19 2010-01-15 Thermoelectric conversion module and method for manufacturing thermoelectric conversion module
US12/963,710 US8465998B2 (en) 2007-07-19 2010-12-09 Thermoelectric conversion module and method for manufacturing thermoelectric conversion module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007188029 2007-07-19
JP2007-188029 2007-07-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/687,908 Continuation US20100101622A1 (en) 2007-07-19 2010-01-15 Thermoelectric conversion module and method for manufacturing thermoelectric conversion module

Publications (1)

Publication Number Publication Date
WO2009011430A1 true WO2009011430A1 (ja) 2009-01-22

Family

ID=40259756

Family Applications (1)

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PCT/JP2008/063060 WO2009011430A1 (ja) 2007-07-19 2008-07-18 熱電変換モジュールおよび熱電変換モジュールの製造方法

Country Status (3)

Country Link
US (2) US20100101622A1 (ja)
JP (1) JP5007748B2 (ja)
WO (1) WO2009011430A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199276A (ja) * 2009-02-25 2010-09-09 Konica Minolta Holdings Inc 熱電変換素子およびその製造方法
US20110155201A1 (en) * 2009-12-28 2011-06-30 Stmicroelectronics S.R.L Process for realizing a system for recovering heat, in particular based on the seebeck's effect, and corresponding system
CN102557448A (zh) * 2010-12-24 2012-07-11 株式会社日立制作所 热电转换材料

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012105743A1 (de) * 2012-06-29 2014-01-02 Elringklinger Ag Wärmeabschirmvorrichtung mit thermoelektrischer Energienutzung
JP5999066B2 (ja) * 2013-06-04 2016-09-28 株式会社デンソー 振動検出器
JP6024642B2 (ja) * 2013-10-25 2016-11-16 株式会社デンソー 熱電変換装置およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263176A (ja) * 1985-05-15 1986-11-21 Rasa Kogyo Kk 積層熱電素子の製造方法
JPH11177154A (ja) * 1997-12-09 1999-07-02 Murata Mfg Co Ltd 熱電変換基板及び当該熱電変換基板を用いた電気回路装置
JP2003298127A (ja) * 2002-04-02 2003-10-17 Sony Corp 熱電変換装置及びその製造方法、並びに熱電発電装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1052345C (zh) * 1994-05-16 2000-05-10 时至准钟表股份有限公司 温差发电装置的制造方法
US6127619A (en) * 1998-06-08 2000-10-03 Ormet Corporation Process for producing high performance thermoelectric modules
US20060243315A1 (en) * 2005-04-29 2006-11-02 Chrysler Gregory M Gap-filling in electronic assemblies including a TEC structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61263176A (ja) * 1985-05-15 1986-11-21 Rasa Kogyo Kk 積層熱電素子の製造方法
JPH11177154A (ja) * 1997-12-09 1999-07-02 Murata Mfg Co Ltd 熱電変換基板及び当該熱電変換基板を用いた電気回路装置
JP2003298127A (ja) * 2002-04-02 2003-10-17 Sony Corp 熱電変換装置及びその製造方法、並びに熱電発電装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199276A (ja) * 2009-02-25 2010-09-09 Konica Minolta Holdings Inc 熱電変換素子およびその製造方法
US20110155201A1 (en) * 2009-12-28 2011-06-30 Stmicroelectronics S.R.L Process for realizing a system for recovering heat, in particular based on the seebeck's effect, and corresponding system
US9105811B2 (en) * 2009-12-28 2015-08-11 Stmicroelectronics S.R.L. Process for realizing a system for recovering heat, in particular based on the Seebeck's effect, and corresponding system
US10510941B2 (en) 2009-12-28 2019-12-17 Stmicroelectronics S.R.L. Process for realizing a system for recovering heat, in particular based on the seebeck's effect, and corresponding system
US11594667B2 (en) 2009-12-28 2023-02-28 Stmicroelectronics S.R.L. Process for realizing a system for recovering heat, in particular based on the Seebeck's effect, and corresponding system
CN102557448A (zh) * 2010-12-24 2012-07-11 株式会社日立制作所 热电转换材料

Also Published As

Publication number Publication date
JP5007748B2 (ja) 2012-08-22
JPWO2009011430A1 (ja) 2010-09-24
US8465998B2 (en) 2013-06-18
US20100101622A1 (en) 2010-04-29
US20110081741A1 (en) 2011-04-07

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