WO2009011234A1 - 焼結シリコンウエハ - Google Patents

焼結シリコンウエハ Download PDF

Info

Publication number
WO2009011234A1
WO2009011234A1 PCT/JP2008/062173 JP2008062173W WO2009011234A1 WO 2009011234 A1 WO2009011234 A1 WO 2009011234A1 JP 2008062173 W JP2008062173 W JP 2008062173W WO 2009011234 A1 WO2009011234 A1 WO 2009011234A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon wafer
sintered silicon
ratio
phase
strength
Prior art date
Application number
PCT/JP2008/062173
Other languages
English (en)
French (fr)
Inventor
Ryo Suzuki
Hiroshi Takamura
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to CN200880024488A priority Critical patent/CN101743195A/zh
Priority to US12/668,307 priority patent/US20100187661A1/en
Priority to EP08777888A priority patent/EP2168916A1/en
Priority to JP2009523600A priority patent/JPWO2009011234A1/ja
Publication of WO2009011234A1 publication Critical patent/WO2009011234A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B28/00—Production of homogeneous polycrystalline material with defined structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Silicon Compounds (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

 焼結シリコンウエハであって、Ｘ線回折で測定される（２２０）面の強度と（１１１）面の強度との比 ［Ｉ（２２０）／Ｉ（１１１）・・・（１）］が０．５以上、０．８以下であり、かつ（３１１）面の強度と（１１１）面の強度との比［Ｉ（３１１）／Ｉ（１１１）・・・（２）］が０．３以上、０．５以下であることを特徴とする焼結シリコンウエハ。平滑な表面を有する焼結シリコンウエハであり、単結晶シリコンと同等の表面粗さを保有する焼結シリコンウエハを提供することにある。
PCT/JP2008/062173 2007-07-13 2008-07-04 焼結シリコンウエハ WO2009011234A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880024488A CN101743195A (zh) 2007-07-13 2008-07-04 烧结硅晶片
US12/668,307 US20100187661A1 (en) 2007-07-13 2008-07-04 Sintered Silicon Wafer
EP08777888A EP2168916A1 (en) 2007-07-13 2008-07-04 Sintered silicon wafer
JP2009523600A JPWO2009011234A1 (ja) 2007-07-13 2008-07-04 焼結シリコンウエハ

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007184757 2007-07-13
JP2007-184757 2007-07-13
JP2008073586 2008-03-21
JP2008-073586 2008-03-21

Publications (1)

Publication Number Publication Date
WO2009011234A1 true WO2009011234A1 (ja) 2009-01-22

Family

ID=40259572

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062173 WO2009011234A1 (ja) 2007-07-13 2008-07-04 焼結シリコンウエハ

Country Status (7)

Country Link
US (1) US20100187661A1 (ja)
EP (1) EP2168916A1 (ja)
JP (1) JPWO2009011234A1 (ja)
KR (1) KR20100022514A (ja)
CN (1) CN101743195A (ja)
TW (1) TW200907123A (ja)
WO (1) WO2009011234A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8236428B2 (en) 2008-07-10 2012-08-07 Jx Nippon Mining & Metals Corporation Hybrid silicon wafer and method for manufacturing same
WO2012124596A1 (ja) * 2011-03-15 2012-09-20 Jx日鉱日石金属株式会社 多結晶シリコンウエハ

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100016144A1 (en) * 2007-07-13 2010-01-21 Nippon Mining & Metals Co., Ltd. Sintered Silicon Wafer
EP2497849A4 (en) 2009-11-06 2014-08-06 Jx Nippon Mining & Metals Corp HYBRID SILICON WAFER
KR101382918B1 (ko) 2009-11-06 2014-04-08 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 하이브리드 실리콘 웨이퍼
US8252422B2 (en) 2010-07-08 2012-08-28 Jx Nippon Mining & Metals Corporation Hybrid silicon wafer and method of producing the same
US8647747B2 (en) 2010-07-08 2014-02-11 Jx Nippon Mining & Metals Corporation Hybrid silicon wafer and method of producing the same
US9982334B2 (en) 2012-02-01 2018-05-29 Jx Nippon Mining & Metals Corporation Polycrystalline silicon sputtering target
US9053942B2 (en) 2012-03-12 2015-06-09 Jx Nippon Mining & Metals Corporation Polycrystalline silicon wafer
JP6502399B2 (ja) 2017-02-06 2019-04-17 Ｊｘ金属株式会社 単結晶シリコンスパッタリングターゲット
JP6546953B2 (ja) 2017-03-31 2019-07-17 Ｊｘ金属株式会社 スパッタリングターゲット−バッキングプレート接合体及びその製造方法
KR102633190B1 (ko) 2019-05-28 2024-02-05 삼성전자주식회사 반도체 패키지 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111613A (ja) * 1988-06-01 1990-04-24 Union Carbide Corp 寿命の長い単結晶シリコンを生成可能な多結晶シリコン
JPH05229812A (ja) * 1991-11-26 1993-09-07 Toshiba Corp 硅素焼結体およびこれを用いて形成したウェハ保持用ボード、スパッタリングターゲットおよびシリコンウェハ
JP2004289065A (ja) * 2003-03-25 2004-10-14 Nikko Materials Co Ltd シリコン焼結体及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2794382B2 (ja) * 1993-05-07 1998-09-03 株式会社ジャパンエナジー スパッタリング用シリサイドターゲット及びその製造方法
JP4238357B2 (ja) * 2003-08-19 2009-03-18 独立行政法人産業技術総合研究所 炭化珪素エピタキシャルウエハ、同ウエハの製造方法及び同ウエハ上に作製された半導体装置
US20100016144A1 (en) * 2007-07-13 2010-01-21 Nippon Mining & Metals Co., Ltd. Sintered Silicon Wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111613A (ja) * 1988-06-01 1990-04-24 Union Carbide Corp 寿命の長い単結晶シリコンを生成可能な多結晶シリコン
JPH05229812A (ja) * 1991-11-26 1993-09-07 Toshiba Corp 硅素焼結体およびこれを用いて形成したウェハ保持用ボード、スパッタリングターゲットおよびシリコンウェハ
JP2004289065A (ja) * 2003-03-25 2004-10-14 Nikko Materials Co Ltd シリコン焼結体及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8236428B2 (en) 2008-07-10 2012-08-07 Jx Nippon Mining & Metals Corporation Hybrid silicon wafer and method for manufacturing same
WO2012124596A1 (ja) * 2011-03-15 2012-09-20 Jx日鉱日石金属株式会社 多結晶シリコンウエハ
KR101356303B1 (ko) 2011-03-15 2014-01-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 다결정 실리콘 웨이퍼
JP5602298B2 (ja) * 2011-03-15 2014-10-08 Ｊｘ日鉱日石金属株式会社 多結晶シリコンウエハ

Also Published As

Publication number Publication date
US20100187661A1 (en) 2010-07-29
KR20100022514A (ko) 2010-03-02
JPWO2009011234A1 (ja) 2010-09-16
CN101743195A (zh) 2010-06-16
TW200907123A (en) 2009-02-16
EP2168916A1 (en) 2010-03-31

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