WO2009011140A1 - 半導体パッケージとその製造方法 - Google Patents

半導体パッケージとその製造方法 Download PDF

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Publication number
WO2009011140A1
WO2009011140A1 PCT/JP2008/050584 JP2008050584W WO2009011140A1 WO 2009011140 A1 WO2009011140 A1 WO 2009011140A1 JP 2008050584 W JP2008050584 W JP 2008050584W WO 2009011140 A1 WO2009011140 A1 WO 2009011140A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor package
manufacturing
space
workpiece
wall part
Prior art date
Application number
PCT/JP2008/050584
Other languages
English (en)
French (fr)
Inventor
Sayaka Hirafune
Tatsuo Suemasu
Original Assignee
Fujikura Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007188241A external-priority patent/JP2008047889A/ja
Application filed by Fujikura Ltd. filed Critical Fujikura Ltd.
Priority to CN200880024605A priority Critical patent/CN101689534A/zh
Priority to EP08703434A priority patent/EP2172970A4/en
Publication of WO2009011140A1 publication Critical patent/WO2009011140A1/ja
Priority to US12/688,563 priority patent/US20100117220A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

　半導体パッケージは、少なくとも一方の面にデバイスを備えるワークと、前記デバイスの外周に沿って離間して設けられた壁部と、前記デバイス上方に第一空間をなすように配され、前記壁部を介して前記ワークに支持されたカバー部材と、を少なくとも備え、前記第一空間は、外部空間と連通する第二空間を少なくとも１以上備える。
PCT/JP2008/050584 2007-07-19 2008-01-18 半導体パッケージとその製造方法 WO2009011140A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880024605A CN101689534A (zh) 2007-07-19 2008-01-18 半导体封装体及其制造方法
EP08703434A EP2172970A4 (en) 2007-07-19 2008-01-18 SEMICONDUCTOR HOUSING AND METHOD FOR MANUFACTURING THE SAME
US12/688,563 US20100117220A1 (en) 2007-07-19 2010-01-15 Semiconductor package and manufacturing method for the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007188241A JP2008047889A (ja) 2006-07-20 2007-07-19 半導体パッケージとその製造方法
JP2007-188241 2007-07-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/688,563 Continuation US20100117220A1 (en) 2007-07-19 2010-01-15 Semiconductor package and manufacturing method for the same

Publications (1)

Publication Number Publication Date
WO2009011140A1 true WO2009011140A1 (ja) 2009-01-22

Family

ID=40259486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050584 WO2009011140A1 (ja) 2007-07-19 2008-01-18 半導体パッケージとその製造方法

Country Status (5)

Country Link
US (1) US20100117220A1 (ja)
EP (1) EP2172970A4 (ja)
KR (1) KR20100032857A (ja)
CN (1) CN101689534A (ja)
WO (1) WO2009011140A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142059A1 (ja) * 2010-05-12 2011-11-17 パナソニック株式会社 半導体装置及びその製造方法
JP2013110593A (ja) * 2011-11-21 2013-06-06 Mitsumi Electric Co Ltd カメラモジュール
JP7327715B1 (ja) * 2022-12-27 2023-08-16 三菱電機株式会社 半導体装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104000548B (zh) * 2013-02-22 2017-08-04 深圳先进技术研究院 用于三维尺寸测量的双目光电式内窥镜及内窥系统
CN103178023B (zh) * 2013-02-28 2016-11-16 格科微电子（上海）有限公司 混合基板、半导体器件的封装方法和封装结构
US9664874B2 (en) * 2013-07-30 2017-05-30 Kyocera Corporation Substrate for mounting imaging element, and imaging device
CN107851646A (zh) * 2015-07-10 2018-03-27 凸版印刷株式会社 配线基板及其制造方法
CN105655365B (zh) * 2016-03-14 2020-03-24 苏州晶方半导体科技股份有限公司 半导体芯片封装结构及其封装方法
US10658255B2 (en) * 2017-01-03 2020-05-19 Advanced Semsconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189794A (ja) * 1996-12-26 1998-07-21 Citizen Electron Co Ltd 固体イメージセンサ装置の透明カバー接着部構造
JPH11126835A (ja) 1997-10-24 1999-05-11 Nec Corp 半導体装置
JP2002076154A (ja) * 2000-08-23 2002-03-15 Kyocera Corp 半導体装置
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
EP1239519A2 (en) 2001-03-05 2002-09-11 Canon Kabushiki Kaisha Image pickup model and image pickup device
US20030094665A1 (en) 2001-11-22 2003-05-22 Fumikazu Harazono Solid-state imaging apparatus and manufacturing method thereof
JP2004342992A (ja) * 2003-05-19 2004-12-02 Seiko Epson Corp 光デバイス及びその製造方法、光モジュール並びに電子機器
JP2005020687A (ja) * 2003-05-30 2005-01-20 Matsushita Electric Ind Co Ltd 撮像装置およびその製造方法
EP1596438A2 (en) 2004-05-10 2005-11-16 Sharp Kabushiki Kaisha Semiconductor device, manufacturing method of semiconductor device and module for optical device
JP2006147864A (ja) * 2004-11-19 2006-06-08 Fujikura Ltd 半導体パッケージ及びその製造方法
US20060237829A1 (en) 2005-04-26 2006-10-26 Eiichi Hosomi Method and system for a semiconductor package with an air vent
JP2007128987A (ja) 2005-11-01 2007-05-24 Sharp Corp 半導体パッケージおよびこれを用いた半導体装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189794A (ja) * 1996-12-26 1998-07-21 Citizen Electron Co Ltd 固体イメージセンサ装置の透明カバー接着部構造
JPH11126835A (ja) 1997-10-24 1999-05-11 Nec Corp 半導体装置
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
JP2002076154A (ja) * 2000-08-23 2002-03-15 Kyocera Corp 半導体装置
EP1239519A2 (en) 2001-03-05 2002-09-11 Canon Kabushiki Kaisha Image pickup model and image pickup device
US20030094665A1 (en) 2001-11-22 2003-05-22 Fumikazu Harazono Solid-state imaging apparatus and manufacturing method thereof
JP2004342992A (ja) * 2003-05-19 2004-12-02 Seiko Epson Corp 光デバイス及びその製造方法、光モジュール並びに電子機器
JP2005020687A (ja) * 2003-05-30 2005-01-20 Matsushita Electric Ind Co Ltd 撮像装置およびその製造方法
EP1631060A1 (en) 2003-05-30 2006-03-01 Matsushita Electric Industrial Co., Ltd. Imaging device and its manufacturing method
EP1596438A2 (en) 2004-05-10 2005-11-16 Sharp Kabushiki Kaisha Semiconductor device, manufacturing method of semiconductor device and module for optical device
JP2006147864A (ja) * 2004-11-19 2006-06-08 Fujikura Ltd 半導体パッケージ及びその製造方法
US20060237829A1 (en) 2005-04-26 2006-10-26 Eiichi Hosomi Method and system for a semiconductor package with an air vent
JP2007128987A (ja) 2005-11-01 2007-05-24 Sharp Corp 半導体パッケージおよびこれを用いた半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2172970A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142059A1 (ja) * 2010-05-12 2011-11-17 パナソニック株式会社 半導体装置及びその製造方法
JP2013110593A (ja) * 2011-11-21 2013-06-06 Mitsumi Electric Co Ltd カメラモジュール
JP7327715B1 (ja) * 2022-12-27 2023-08-16 三菱電機株式会社 半導体装置
WO2024142212A1 (ja) * 2022-12-27 2024-07-04 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
CN101689534A (zh) 2010-03-31
EP2172970A1 (en) 2010-04-07
KR20100032857A (ko) 2010-03-26
US20100117220A1 (en) 2010-05-13
EP2172970A4 (en) 2012-04-04

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