WO2009008308A1 - 接合体および接合方法 - Google Patents

接合体および接合方法 Download PDF

Info

Publication number
WO2009008308A1
WO2009008308A1 PCT/JP2008/062007 JP2008062007W WO2009008308A1 WO 2009008308 A1 WO2009008308 A1 WO 2009008308A1 JP 2008062007 W JP2008062007 W JP 2008062007W WO 2009008308 A1 WO2009008308 A1 WO 2009008308A1
Authority
WO
WIPO (PCT)
Prior art keywords
junction
skeleton
junction film
film
junction structure
Prior art date
Application number
PCT/JP2008/062007
Other languages
English (en)
French (fr)
Inventor
Yasuhide Matsuo
Kenji Otsuka
Kazuo Higuchi
Kosuke Wakamatsu
Original Assignee
Seiko Epson Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008133671A external-priority patent/JP4337935B2/ja
Application filed by Seiko Epson Corporation filed Critical Seiko Epson Corporation
Priority to US12/668,094 priority Critical patent/US20100151231A1/en
Priority to CN200880023893A priority patent/CN101688084A/zh
Publication of WO2009008308A1 publication Critical patent/WO2009008308A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

　本発明の接合体は、第１の基材と、第１の基材上に設けられ、Ｓｉ骨格と、Ｓｉ骨格に結合する脱離基とを含む第１の接合膜とを有する第１の被着体と、第２の基材と、第２の基材上に設けられ、Ｓｉ骨格と、Ｓｉ骨格に結合する脱離基とを含む第２の接合膜とを有する第２の被着体とを有する。これら第１の接合膜および第２の接合膜において、Ｓｉ骨格は、シロキサン結合を含むランダムな原子構造を有している。そして、第１の接合膜および第２の接合膜にエネルギーを付与すると、接着性が発現し、これにより第１の被着体と第２の被着体との間が接合され、接合体が得られる。
PCT/JP2008/062007 2007-07-11 2008-07-02 接合体および接合方法 WO2009008308A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/668,094 US20100151231A1 (en) 2007-07-11 2008-07-02 Bonded body and bonding method
CN200880023893A CN101688084A (zh) 2007-07-11 2008-07-02 接合体以及接合方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-182677 2007-07-11
JP2007182677 2007-07-11
JP2008-133671 2008-05-21
JP2008133671A JP4337935B2 (ja) 2007-07-11 2008-05-21 接合体および接合方法

Publications (1)

Publication Number Publication Date
WO2009008308A1 true WO2009008308A1 (ja) 2009-01-15

Family

ID=40228486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062007 WO2009008308A1 (ja) 2007-07-11 2008-07-02 接合体および接合方法

Country Status (1)

Country Link
WO (1) WO2009008308A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9022571B2 (en) 2011-04-15 2015-05-05 Seiko Epson Corporation Optical device with adhesive bonding layer and siloxane bonding layer with leaving group, projection-type imaging apparatus utilizing optical device, and method for producing optical device
WO2015092685A1 (en) 2013-12-20 2015-06-25 Geico Spa Plant for the immersion treatment of bodyworks
WO2020105601A1 (ja) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366237A (ja) * 1986-09-09 1988-03-24 Tokyo Ohka Kogyo Co Ltd シリコ−ン系被膜の表面処理方法
JPH01207475A (ja) * 1988-02-10 1989-08-21 Kuraray Co Ltd ポリエステル布帛の製造方法
JPH05194770A (ja) * 1992-01-17 1993-08-03 Mitsubishi Kasei Corp 表面被覆プラスチックス製品
JPH0766549A (ja) * 1993-08-23 1995-03-10 Matsushita Electric Works Ltd 金属と有機物の接合方法および配線板の製造方法
JPH09324152A (ja) * 1996-06-06 1997-12-16 Toray Dow Corning Silicone Co Ltd 同種もしくは異種の基材からなる接着構造体の製造方法
JP2002524597A (ja) * 1998-09-04 2002-08-06 サイムド ライフ システムズ， インコーポレイテッド ポリマーを結合させる方法及びこの方法により結合された材料を備えている医療機器
JP2003238808A (ja) * 2002-02-15 2003-08-27 Shin Etsu Chem Co Ltd 放射線硬化性シリコーンゴム組成物および接着性シリコーンエラストマーフィルム
JP2004532137A (ja) * 2001-03-01 2004-10-21 シーメンス　アクチエンゲゼルシヤフト 固体に表面層および接着フィルムをカバーする方法並びにこの方法に従った固体
JP2004325158A (ja) * 2003-04-23 2004-11-18 Ushio Inc 接合方法
JP2005246707A (ja) * 2004-03-02 2005-09-15 Seiko Epson Corp 成膜方法および膜
JP2007161912A (ja) * 2005-12-15 2007-06-28 Kagawa Univ 接着方法とそれを用いて製作したバイオケミカルチップと光学部品

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366237A (ja) * 1986-09-09 1988-03-24 Tokyo Ohka Kogyo Co Ltd シリコ−ン系被膜の表面処理方法
JPH01207475A (ja) * 1988-02-10 1989-08-21 Kuraray Co Ltd ポリエステル布帛の製造方法
JPH05194770A (ja) * 1992-01-17 1993-08-03 Mitsubishi Kasei Corp 表面被覆プラスチックス製品
JPH0766549A (ja) * 1993-08-23 1995-03-10 Matsushita Electric Works Ltd 金属と有機物の接合方法および配線板の製造方法
JPH09324152A (ja) * 1996-06-06 1997-12-16 Toray Dow Corning Silicone Co Ltd 同種もしくは異種の基材からなる接着構造体の製造方法
JP2002524597A (ja) * 1998-09-04 2002-08-06 サイムド ライフ システムズ， インコーポレイテッド ポリマーを結合させる方法及びこの方法により結合された材料を備えている医療機器
JP2004532137A (ja) * 2001-03-01 2004-10-21 シーメンス　アクチエンゲゼルシヤフト 固体に表面層および接着フィルムをカバーする方法並びにこの方法に従った固体
JP2003238808A (ja) * 2002-02-15 2003-08-27 Shin Etsu Chem Co Ltd 放射線硬化性シリコーンゴム組成物および接着性シリコーンエラストマーフィルム
JP2004325158A (ja) * 2003-04-23 2004-11-18 Ushio Inc 接合方法
JP2005246707A (ja) * 2004-03-02 2005-09-15 Seiko Epson Corp 成膜方法および膜
JP2007161912A (ja) * 2005-12-15 2007-06-28 Kagawa Univ 接着方法とそれを用いて製作したバイオケミカルチップと光学部品

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9022571B2 (en) 2011-04-15 2015-05-05 Seiko Epson Corporation Optical device with adhesive bonding layer and siloxane bonding layer with leaving group, projection-type imaging apparatus utilizing optical device, and method for producing optical device
WO2015092685A1 (en) 2013-12-20 2015-06-25 Geico Spa Plant for the immersion treatment of bodyworks
WO2020105601A1 (ja) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
JPWO2020105601A1 (ja) * 2018-11-20 2021-02-15 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

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