WO2009008310A1 - 接合膜付き基材、接合方法および接合体 - Google Patents

接合膜付き基材、接合方法および接合体 Download PDF

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Publication number
WO2009008310A1
WO2009008310A1 PCT/JP2008/062009 JP2008062009W WO2009008310A1 WO 2009008310 A1 WO2009008310 A1 WO 2009008310A1 JP 2008062009 W JP2008062009 W JP 2008062009W WO 2009008310 A1 WO2009008310 A1 WO 2009008310A1
Authority
WO
WIPO (PCT)
Prior art keywords
junction film
junction
base material
skeleton
base sheet
Prior art date
Application number
PCT/JP2008/062009
Other languages
English (en)
French (fr)
Inventor
Yasuhide Matsuo
Kenji Otsuka
Kazuo Higuchi
Kosuke Wakamatsu
Original Assignee
Seiko Epson Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008133673A external-priority patent/JP2009035721A/ja
Application filed by Seiko Epson Corporation filed Critical Seiko Epson Corporation
Priority to US12/668,126 priority Critical patent/US20100323193A1/en
Priority to CN200880023923A priority patent/CN101688086A/zh
Publication of WO2009008310A1 publication Critical patent/WO2009008310A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

　本発明の接合膜付き基材は、基板（基材）と、この基板上に設けられた接合膜とを有しており、対向基板（他の被着体）に対して接合可能なものである。このような接合膜は、シロキサン（Ｓｉ－Ｏ）結合を含みランダムな原子構造を有するＳｉ骨格と、このＳｉ骨格に結合する脱離基とを含む膜であり、かつＳｉ骨格の結晶化度は４５％以下である。また、この接合膜は、紫外線を照射することにより、脱離基がＳｉ骨格から脱離し、これにより接合膜の表面に、対向基板との接着性が発現し得るものである。
PCT/JP2008/062009 2007-07-11 2008-07-02 接合膜付き基材、接合方法および接合体 WO2009008310A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/668,126 US20100323193A1 (en) 2007-07-11 2008-07-02 Base member including bonding film, bonding method and bonded body
CN200880023923A CN101688086A (zh) 2007-07-11 2008-07-02 带有接合膜的基材、接合方法以及接合体

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007182677 2007-07-11
JP2007-182677 2007-07-11
JP2008-133673 2008-05-21
JP2008133673A JP2009035721A (ja) 2007-07-11 2008-05-21 接合膜付き基材、接合方法および接合体

Publications (1)

Publication Number Publication Date
WO2009008310A1 true WO2009008310A1 (ja) 2009-01-15

Family

ID=40228488

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062009 WO2009008310A1 (ja) 2007-07-11 2008-07-02 接合膜付き基材、接合方法および接合体

Country Status (1)

Country Link
WO (1) WO2009008310A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2255967A1 (en) * 2009-05-28 2010-12-01 Seiko Epson Corporation Bonding method and bonded structure
WO2014119418A1 (ja) * 2013-01-30 2014-08-07 コニカミノルタ株式会社 液滴吐出ヘッド基板及び液滴吐出ヘッドの製造方法
CN107077021A (zh) * 2014-11-27 2017-08-18 株式会社Lg化学 基板接合方法和由该基板接合方法制备的显示基板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366237A (ja) * 1986-09-09 1988-03-24 Tokyo Ohka Kogyo Co Ltd シリコ−ン系被膜の表面処理方法
JPH01207475A (ja) * 1988-02-10 1989-08-21 Kuraray Co Ltd ポリエステル布帛の製造方法
JPH05194770A (ja) * 1992-01-17 1993-08-03 Mitsubishi Kasei Corp 表面被覆プラスチックス製品
JPH0766549A (ja) * 1993-08-23 1995-03-10 Matsushita Electric Works Ltd 金属と有機物の接合方法および配線板の製造方法
JP2002524597A (ja) * 1998-09-04 2002-08-06 サイムド ライフ システムズ， インコーポレイテッド ポリマーを結合させる方法及びこの方法により結合された材料を備えている医療機器
JP2004532137A (ja) * 2001-03-01 2004-10-21 シーメンス　アクチエンゲゼルシヤフト 固体に表面層および接着フィルムをカバーする方法並びにこの方法に従った固体
JP2004325158A (ja) * 2003-04-23 2004-11-18 Ushio Inc 接合方法
JP2005246707A (ja) * 2004-03-02 2005-09-15 Seiko Epson Corp 成膜方法および膜

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6366237A (ja) * 1986-09-09 1988-03-24 Tokyo Ohka Kogyo Co Ltd シリコ−ン系被膜の表面処理方法
JPH01207475A (ja) * 1988-02-10 1989-08-21 Kuraray Co Ltd ポリエステル布帛の製造方法
JPH05194770A (ja) * 1992-01-17 1993-08-03 Mitsubishi Kasei Corp 表面被覆プラスチックス製品
JPH0766549A (ja) * 1993-08-23 1995-03-10 Matsushita Electric Works Ltd 金属と有機物の接合方法および配線板の製造方法
JP2002524597A (ja) * 1998-09-04 2002-08-06 サイムド ライフ システムズ， インコーポレイテッド ポリマーを結合させる方法及びこの方法により結合された材料を備えている医療機器
JP2004532137A (ja) * 2001-03-01 2004-10-21 シーメンス　アクチエンゲゼルシヤフト 固体に表面層および接着フィルムをカバーする方法並びにこの方法に従った固体
JP2004325158A (ja) * 2003-04-23 2004-11-18 Ushio Inc 接合方法
JP2005246707A (ja) * 2004-03-02 2005-09-15 Seiko Epson Corp 成膜方法および膜

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2255967A1 (en) * 2009-05-28 2010-12-01 Seiko Epson Corporation Bonding method and bonded structure
WO2014119418A1 (ja) * 2013-01-30 2014-08-07 コニカミノルタ株式会社 液滴吐出ヘッド基板及び液滴吐出ヘッドの製造方法
CN104955651A (zh) * 2013-01-30 2015-09-30 柯尼卡美能达株式会社 液滴排出头基板以及液滴排出头的制造方法
JPWO2014119418A1 (ja) * 2013-01-30 2017-01-26 コニカミノルタ株式会社 液滴吐出ヘッド基板及び液滴吐出ヘッドの製造方法
US10226927B2 (en) 2013-01-30 2019-03-12 Konica Minolta, Inc. Method for manufacturing droplet-discharge head substrate and droplet-discharging head
CN107077021A (zh) * 2014-11-27 2017-08-18 株式会社Lg化学 基板接合方法和由该基板接合方法制备的显示基板
CN107077021B (zh) * 2014-11-27 2020-10-02 株式会社Lg化学 基板接合方法和由该基板接合方法制备的显示基板

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