WO2009000611A2 - Module comprenant un asic et un boîtier pour l'asic - Google Patents

Module comprenant un asic et un boîtier pour l'asic Download PDF

Info

Publication number
WO2009000611A2
WO2009000611A2 PCT/EP2008/056803 EP2008056803W WO2009000611A2 WO 2009000611 A2 WO2009000611 A2 WO 2009000611A2 EP 2008056803 W EP2008056803 W EP 2008056803W WO 2009000611 A2 WO2009000611 A2 WO 2009000611A2
Authority
WO
WIPO (PCT)
Prior art keywords
asic
housing
assembly
electronic component
emc
Prior art date
Application number
PCT/EP2008/056803
Other languages
German (de)
English (en)
Other versions
WO2009000611A3 (fr
Inventor
Wolfgang Hauer
Richard Muehlheim
Hubert Benzel
Roland Guenschel
Dirk Dittmann
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2009000611A2 publication Critical patent/WO2009000611A2/fr
Publication of WO2009000611A3 publication Critical patent/WO2009000611A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069—Protection against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the invention relates to an assembly with at least one ASIC and a housing for the ASIC, wherein the housing is equipped with terminals for external connection of the ASIC via electrical lines and at least one electronic component for protecting the ASIC against electrostatic discharges (ESD protection) and is provided for the suppression of induced via the lines or connections interference voltages (EMC).
  • ESD protection electrostatic discharges
  • EMC interference voltages
  • German Offenlegungsschrift DE 103 24 220 A1 describes an assembly with a micromechanical sensor element and a special housing for this sensor element.
  • the sensor element is here mounted on a base of the housing bottom and connected via bonding wires with contact pins, which are guided for electrical contacting of the sensor element through the housing bottom to the outside.
  • a cap-like second housing part is arranged above the sensor element and connected to the housing bottom with the aid of a filling compound.
  • EMC / ESD protection To protect the sensor element such assemblies are often equipped in practice with an EMC / ESD protection. It is known to passive components, such as capacitors, varistors or diodes to mount on a circuit board outside the housing. Thus, in addition to electrostatic discharges that may occur at the supply lines and connections, high-frequency alternating voltages derived be induced via the leads and terminals, so that the sensor signal is not corrupted.
  • Components outside the housing is an additional one
  • the at least one component for protecting the ASIC against electrostatic discharges (ESD protection) and for suppressing induced via the lines or connections interference voltages (EMC) is disposed within the housing and connected to at least one terminal.
  • EMC / ESD protection of an assembly according to the invention can be realized using the electronic components usually used for this purpose, namely in particular by arranging at least one capacitor, a varistor and / or a diode within the housing.
  • a further advantage is that the assembly according to the invention is already protected during further processing by the integrated ESD protection.
  • the EMC / ESD protection forming components are in turn protected by the integration into the housing against corrosion or damage.
  • the ASIC and the at least one electronic component can be mounted on a common carrier.
  • the ASIC may also be mounted on the housing bottom, while the component or components are arranged on an additional carrier which is mounted in the housing.
  • Protection also be mounted on the ASIC. Depending on the application and
  • the guided through the housing wall connections are each provided with a feedthrough capacitor.
  • the inventive concept is particularly suitable for ASICs in conjunction with a micromechanical sensor element, in particular with a pressure sensor element.
  • Fig. Ia shows a section through the housing bottom of a first assembly 10 according to the invention in the region of a capacitor
  • FIG. 1b shows a top view of this housing bottom with the sectional profile Ia.
  • FIG. 2 a shows a section through the housing bottom of a second assembly 20 according to the invention in the region of a component carrier
  • FIG. 2 b shows a plan view of this housing bottom with the sectional profile II a.
  • FIG 3 shows a section through the housing bottom of a third assembly 30 according to the invention in the region of a feedthrough capacitor.
  • FIG 4 shows a section through the housing of a fourth assembly 40 according to the invention.
  • the assembly 10 illustrated in FIGS. 1a and 1b comprises an ASIC 1 with a micromechanical component in the form of a sensor membrane 11. Accordingly, the ASIC 1 could be a pressure sensor chip.
  • the ASIC 1 is arranged in a housing which here consists of a housing bottom 2 with an octagonal base 3 and a cap-like second housing part, not shown, which is plugged onto the base 3. Any gaps between the cap-like housing part and the housing bottom 2 are then filled with the aid of a filling compound to complete the housing.
  • the ASIC 1 is mounted on a glass base 12, which is arranged centrally in a recess 4 of the base 3.
  • the ASIC 1 is connected via bonding wires 5 to terminals in the form of connecting pins 6, which are guided in the region of the base 3 through the housing bottom 2. Since the housing is made of metal in the embodiment described here, the housing base 2 and the base 3 is provided with glass bushings 13 for electrical insulation of the pins 6. To the pins 6 electrical lines to the external terminal of the ASIC 1 can be connected. According to the invention, two capacitors 7 are arranged in corresponding recesses 8 in the region of the base 3. Each of the two capacitors 7 is connected via a bonding wire 9 with an adjacent pin 6. As a result, the capacitors 7 form an EMC / ESD protection for the ASIC 1.
  • the capacitors 7 are inside the housing, since the second cap-like housing part is plugged onto the base 3, so that it on the visible in Fig. Ib edge region of the housing bottom 2 is seated.
  • the ASIC 1 and the capacitors 7 are therefore mounted on a common carrier, namely the housing bottom 2.
  • the assembly 20 illustrated in FIGS. 2 a and 2 b differs from the assembly 10 only through the assembly Mounting form of the capacitors.
  • the EMC / ESD protection is indeed also formed by two capacitors 22, which are each connected via a bonding wire 9 with an adjacent pin 6.
  • these capacitors 22 are arranged on a separate support 21, which in turn is mounted in the region of the base 3 on the housing bottom, so that the capacitors 22 are arranged according to the invention in the housing of the assembly 20.
  • the assembly 30 illustrated in FIG. 3 comprises an ASIC 31 with a sensor membrane 311 which is arranged in a housing.
  • This housing has the same structure as the housings of the assemblies 10 and 20 and comprises a housing bottom 32 with a base 33 and a second, not shown here, cap-like housing part.
  • the ASIC 31 is mounted on a glass base 310, which is arranged in a recess 34 of the base 33 on the housing bottom 32.
  • the ASIC 31 is connected via bonding wires 35 with connecting pins 36, which are guided in the region of the base 33 through the housing bottom 32.
  • the EMC / ESD protection in the form of feedthrough capacitors 37 is realized on selected pins 36.
  • Bushing capacitors 37 are cylindrical, wherein the connecting pin 36 each forms the center electrode. Concentrically around the connecting pin 36, the outer electrode 38 is arranged, which is connected via an electrically conductive adhesive or solder 39 to the housing. The dielectric of the feedthrough capacitors 37 forms at the same time the electrically insulating separating layer between pin 36 and housing.
  • Components that provide EMV / ESD protection for the ASIC are mounted on a mounting surface adjacent to the ASIC and within the housing. In contrast to this is in
  • FIG. 4 shows a particularly space-saving variant, in which such a component 44 is arranged on the ASIC 41.
  • the ASIC 41 of the assembly 40 which also comprises a sensor membrane 411, is mounted on a printed circuit board 42 and connected via bonding wires 43 to printed conductors and through contacts of the printed circuit board 42, so that the ASIC 41 can be connected to external lines.
  • a capacitor 44 which was glued to the ASIC 41 by means of seal glass.
  • the electrical connection of the capacitor 44 is realized here by means of bonding wires 45.
  • such a capacitor can also be glued to the ASIC by means of conductive adhesive.
  • corresponding conductive connection areas must be formed on the ASIC for this purpose.
  • the printed circuit board 42 forms at least part of the housing bottom 46.
  • a second housing part 47 which is only partially shown here, is arranged like a cap over the ASIC 41 with the capacitor 44.
  • the housing is at least so far filled with a passivating gel layer 48 that ASIC 41 and capacitor 44 are completely embedded in the gel 48 together with the respective terminals.

Abstract

L'invention concerne un module (10) simple, peu encombrant et économique, comprenant au moins un ASIC (1) et un boîtier pour ledit ASIC (1), le boîtier étant pourvu de bornes (6) permettant la connexion externe de l'ASIC (1) par l'intermédiaire de lignes électriques et au moins un composant électronique (7) étant prévu pour protéger l'ASIC (1) contre les décharges électrostatiques et pour supprimer les tensions parasites (EMV) induites par l'intermédiaire des lignes ou des bornes (6). Selon l'invention, ledit au moins un composant (7) est placé à l'intérieur du boîtier et relié à au moins une borne (6).
PCT/EP2008/056803 2007-06-27 2008-06-03 Module comprenant un asic et un boîtier pour l'asic WO2009000611A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007029720.5 2007-06-27
DE102007029720A DE102007029720A1 (de) 2007-06-27 2007-06-27 Baugruppe mit einem ASIC und einem Gehäuse für den ASIC

Publications (2)

Publication Number Publication Date
WO2009000611A2 true WO2009000611A2 (fr) 2008-12-31
WO2009000611A3 WO2009000611A3 (fr) 2009-02-19

Family

ID=40070864

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/056803 WO2009000611A2 (fr) 2007-06-27 2008-06-03 Module comprenant un asic et un boîtier pour l'asic

Country Status (2)

Country Link
DE (1) DE102007029720A1 (fr)
WO (1) WO2009000611A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108603873A (zh) * 2016-02-11 2018-09-28 盛思锐汽车解决方案股份公司 具有静电放电保护元件的传感器芯片

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19731420A1 (de) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine und Verfahren zu ihrer Herstellung
WO2005088268A1 (fr) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Module de capteurs comportant une protection de compatibilite electromagnetique et contre les decharges electrostatiques a condensateurs
JP2006310658A (ja) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd 半導体装置および物理量センサ装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10324220A1 (de) 2003-05-28 2004-12-16 Robert Bosch Gmbh Sockeldesign zur Selbstzentrierung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19731420A1 (de) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine und Verfahren zu ihrer Herstellung
WO2005088268A1 (fr) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Module de capteurs comportant une protection de compatibilite electromagnetique et contre les decharges electrostatiques a condensateurs
JP2006310658A (ja) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd 半導体装置および物理量センサ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108603873A (zh) * 2016-02-11 2018-09-28 盛思锐汽车解决方案股份公司 具有静电放电保护元件的传感器芯片
CN108603873B (zh) * 2016-02-11 2021-08-27 盛思锐股份公司 具有静电放电保护元件的传感器芯片

Also Published As

Publication number Publication date
WO2009000611A3 (fr) 2009-02-19
DE102007029720A1 (de) 2009-01-08

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