WO2009000611A2 - Subassembly comprising an asic and an asic housing - Google Patents

Subassembly comprising an asic and an asic housing

Info

Publication number
WO2009000611A2
WO2009000611A2 PCT/EP2008/056803 EP2008056803W WO2009000611A2 WO 2009000611 A2 WO2009000611 A2 WO 2009000611A2 EP 2008056803 W EP2008056803 W EP 2008056803W WO 2009000611 A2 WO2009000611 A2 WO 2009000611A2
Authority
WO
Grant status
Application
Patent type
Prior art keywords
asic
housing
assembly
according
mounted
Prior art date
Application number
PCT/EP2008/056803
Other languages
German (de)
French (fr)
Other versions
WO2009000611A3 (en )
Inventor
Wolfgang Hauer
Richard Muehlheim
Hubert Benzel
Roland Guenschel
Dirk Dittmann
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069Protection against electromagnetic or electrostatic interferences
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24Housings ; Casings for instruments
    • G01D11/245Housings for sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0084Electrical connection means to the outside of the housing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

The invention relates to a simple, compact, and inexpensive design of a subassembly (10) comprising at least one ASIC (1) and a housing for the ASIC (1). The housing is fitted with terminals (6) for externally connecting the ASIC (1) by means of electric lines, while at least one electronic component (7) is provided for protecting the ASIC (1) against electrostatic discharges (ESD protection) and suppressing disturbance voltages (EMC) induced by means of the lines or terminals (6). According to the invention, the at least one component (7) is disposed inside the housing and is connected to at least one terminal (6).

Description

description

Assembly having an ASIC and a housing for the ASIC

State of the art

The invention relates to an assembly with at least one ASIC and a housing for the ASIC, wherein the housing is equipped with terminals for external connection of the ASIC via electrical lines and wherein at least one electronic component to protect the ASIC to electrostatic discharge (ESD protection), and is provided for suppressing via lines or terminals induced noise voltages (EMC).

In the German Offenlegungsschrift DE 103 24 220 Al an assembly with a micromechanical sensor element and a special housing for this sensor element will be described. The sensor element is here mounted on a base of the housing bottom and are connected via bonding wires to contact pins which are guided for electrical contacting of the sensor element by the housing bottom to the outside. Above the sensor element is a cap-like second housing part is arranged and connected by means of a filling mass with the housing bottom.

To protect the sensor element such assemblies in practice are often equipped with an EMC / ESD protection. It is known to passive components such as capacitors, varistors or diodes to be mounted on a circuit board outside the housing. Thus high-frequency alternating voltages can be derived, which are induced on the leads and terminals, so that the sensor signal is not distorted in addition to electrostatic discharges that may occur at the leads and terminals.

This external wiring with passive components is problematic in several respects. The arrangement of the

Components outside the housing is an additional

Assembly step required in the production of the assembly. In addition, a suitable mounting surface for the components is required. Finally, the arrangement of the components outside the housing can also be difficult to reconcile with the general principle of miniaturization of such assemblies.

Disclosure of the Invention

With the present invention, a simple, space-saving and cost-effective construction of an assembly of the aforementioned type is proposed.

According to the invention the at least one device for the protection of the ASIC to electrostatic discharge (ESD protection) and for suppressing over lines or connections induced noise voltages (EMC) disposed within the housing and connected to at least one terminal.

According to the invention it has been recognized that it is possible by integration of an EMC / ESD protection components forming the housing of the ASIC achieve a particularly good protection, since the protective effect is all the better the smaller are the distances between the components and the ASIC , By integrating these components into the housing of the ASIC can be also realized in a simple way, a particularly compact and space-saving design for an assembly of the type mentioned.

It is particularly advantageous that the EMC / ESD protection of an assembly according to the invention can be realized using electronic devices usually used for this purpose, namely in particular by arranging at least one capacitor, a varistor and / or of a diode within the housing.

Another advantage is that the assembly according to the invention is already protected in the further processing by the integrated ESD protection.

Some EMC / ESD protection components forming in turn are protected by the integration into the housing against corrosion or damage.

Basically, there are various possibilities for the arrangement of electronic components in the housing of

ASIC. Thus, the ASIC and the at least one electronic component may be mounted on a common support. but the ASIC can be mounted on the housing bottom while the or the components are disposed on an additional carrier, which is mounted in the housing. Alternatively, the components can for the EMC / ESD

Protection also be mounted on the ASIC. Depending on the application and

Of operation of the assembly it may be advantageous if the guided through the housing terminals are each provided with a feedthrough capacitor.

The inventive concept is particularly suitable for ASICs in combination with a micromechanical sensor element, in particular a pressure sensor element. Brief Description of Drawings

As discussed above, there are various possibilities for configuring and further developing the teaching of the present invention advantageously. For this purpose, on the one hand on the other hand referred to the independent patent claims subordinate to claim 1 and to the following description of several embodiments of the invention with reference to the drawings.

Fig. Ia shows a section through the housing base a first assembly 10 of the invention in the area of ​​a capacitor and

Fig. Ib shows a top view of this housing base having the cut pattern Ia.

Fig. 2a shows a section through the housing base a second assembly according to the invention 20 in the region of a component carrier, and Fig. 2b shows a plan view of this housing base having the cut pattern IIa.

Fig. 3 shows a section through the housing base of a third assembly according to the invention 30 in the region of a feedthrough capacitor.

Fig. 4 shows a section through the casing of a fourth assembly according to the invention 40th

Embodiments of the invention

The assembly 10 shown in the Figures Ia and Ib includes an ASIC 1 with a micromechanical component in the form of a sensor membrane 11. Accordingly, it could be in the ASIC 1 to a pressure sensor chip. The ASIC 1 is arranged in a housing which here consists of a housing bottom 2 with an octagonal base 3 and a second housing part, not shown, cap-like, that is attached to the socket. 3 Any gaps between the cap-like housing part and the housing base 2 are then filled with a filler material to complete the enclosure. The ASIC 1 is mounted on a glass base 12, which is arranged centrally in a recess 4 of the pedestal. 3 In addition, the ASIC 1 is connected by bonding wires 5 to terminals in the form of terminal pins 6 which are guided in the region of the base 3 through the case bottom. 2 Since the housing is made of metal in the embodiment described here, the housing base 2 and the socket 3 is provided with glass feedthroughs 13 for electrical insulation of the terminal pins. 6 electrical leads for external connection of the ASIC 1 can be connected to the terminal pins. 6 According to the invention two capacitors 7 are arranged in corresponding recesses 8 in the region of the base. 3 Each of the capacitors 7 is connected via a bonding wire 9 with an adjacent pin. 6 7 thereby forming the capacitors an EMC / ESD protection for the ASIC 1. Because of their arrangement in the region of the pedestal 3, the capacitors 7 are located within the housing, since the second cup-like housing part is fitted onto the socket 3, so that it on the visible in Fig. Ib edge region of the housing base 2 rests. In the example shown in the figures Ia and Ib exemplary embodiment of the ASIC 1 and the capacitors are thus 7 on a common carrier, namely the housing base 2 is mounted.

The assembly 20 shown in Figures 2a and 2b differs from the assembly 10 only by the shape of the mounting capacitors. For an explanation of the remaining components of the assembly 20 which are provided with the same reference numerals as in Figures Ia and Ib, reference is therefore made to the description of the figures Ia and Ib. In the case of the assembly 20 of the EMC / ESD protection is likewise formed by two capacitors 22, each connected via a bonding wire 9 with an adjacent pin. 6 These capacitors 22 but are arranged on a separate support 21 which is in turn mounted in the region of the base 3 on the housing bottom, so that the capacitors 22 are arranged according to the invention in the housing of the assembly twentieth

The assembly 30 shown in Fig. 3 comprises an ASIC 31 with a sensor membrane 311, which is arranged in a housing. This housing is constructed the same as the housings of the assemblies 10 and 20 and includes a housing base 32 having a base 33 and a second, not shown here, cap-like housing part. Also, the ASIC 31 is mounted on a glass base 310, which is arranged in a recess 34 of the socket 33 on the housing bottom 32nd In addition, the ASIC 31 is connected via bonding wires 35 to pins 36 which are guided in the region of the base 33 through the housing bottom 32nd In the illustrated in Fig. 3 embodiment, the EMI / ESD-protection in the form of feed-through capacitors 37 is realized at selected connection pins 36. The

Feedthrough capacitors 37 are formed cylindrical, the pin 36 in each case forms the center electrode. Concentrically around the pin 36, the outer electrode 38 is arranged, which is connected via an electrically conductive adhesive or solder 39 to the housing. The dielectric of the feedthrough capacitors 37 simultaneously forms the electrically insulating separating layer between the terminal pin 36 and the housing.

In the three above-described embodiments of an assembly according to the invention, the electronic

with which an EMC / ESD protection is implemented for the ASIC, mounted on a mounting surface adjacent to the ASIC, and components within the housing. In contrast, in

Fig. 4 shows a particularly space-saving variant in which such a component 44 is disposed on the ASIC 41st

The ASIC 41 of the assembly 40, which also comprises a sensor diaphragm 411 is mounted on a circuit board 42 and connected via bonding wires 43 to circuit traces and vias of the circuit board 42, so that the ASIC 41 can be connected to external lines. There is a capacitor 44 that has been glued to the ASIC 41 by means of sealing glass on the ASIC 41st The electrical connection of the capacitor 44 is realized by means of bonding wires 45 here. Alternatively, such a capacitor can be glued to the ASIC by means of conductive adhesive. However, having to be formed on the ASIC corresponding conductive connection regions. The circuit board 42 forms at least a part of the housing bottom 46. A second housing part 47, which is shown here only partially, is arranged like a cap above the ASIC 41 to the capacitor 44th The housing is filled at least in so far with a passivating layer of gel 48 that ASIC 41 and capacitor 44 are embedded together with the respective terminals in the gel completely 48th

Claims

claims
1. assembly with at least one ASIC (1) and a housing for the ASIC (1), said housing having terminals (6) for external connection of the ASIC (1) via electrical lines and is equipped with at least one electronic component (7) to protect the ASIC (1) against electrostatic discharge (ESD protection) and for suppressing via lines or terminals (6) induced noise voltages (EMC) is provided, characterized in that the at least one component (7) is arranged within the housing and is connected to at least one connection (6).
2. An assembly according to claim 1, characterized in that at least one capacitor (7), a varistor and / or a diode as an electronic component to protect the ASIC (1) against electrostatic discharge (ESD protection) and for suppressing over lines or terminals induced noise voltages (EMC) disposed within the housing.
3. The assembly (10) according to one of claims 1 or 2, characterized in that the ASIC (1) and the at least one electronic component (7) on a common carrier (2) are mounted.
4. Assembly (20) according to any one of claims 1 or 2, characterized in that the ASIC (1) on the
Housing base (2) is mounted and that an additional support (21) for the at least one electronic component (7) is provided, which is mounted in the housing.
5. Assembly (40) according to any one of claims 1 or 2, characterized in that the at least one electronic component (44) is mounted on the ASIC (41).
6. assembly (30) according to any one of claims 1 or 2, characterized in that at least one connection (36) is provided with a feedthrough capacitor (37).
7. An assembly according to one of claims 1 to 6 having a micromechanical sensor element, in particular with a pressure sensor element.
PCT/EP2008/056803 2007-06-27 2008-06-03 Subassembly comprising an asic and an asic housing WO2009000611A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102007029720.5 2007-06-27
DE200710029720 DE102007029720A1 (en) 2007-06-27 2007-06-27 Assembly having an ASIC and a housing for the ASIC

Publications (2)

Publication Number Publication Date
WO2009000611A2 true true WO2009000611A2 (en) 2008-12-31
WO2009000611A3 true WO2009000611A3 (en) 2009-02-19

Family

ID=40070864

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/056803 WO2009000611A3 (en) 2007-06-27 2008-06-03 Subassembly comprising an asic and an asic housing

Country Status (2)

Country Link
DE (1) DE102007029720A1 (en)
WO (1) WO2009000611A3 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3206027A1 (en) * 2016-02-11 2017-08-16 Sensirion AG Sensor chip comprising electrostatic discharge protection element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (en) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Pressure sensor in a plastics housing and method for its production
DE19731420A1 (en) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Means for detecting the pressure and temperature in the intake manifold of an internal combustion engine, and processes for their preparation
WO2005088268A1 (en) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Sensor module provided with capacitor emc and esd protection
JP2006310658A (en) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd Semiconductor device and physical quantity sensor apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10324220A1 (en) 2003-05-28 2004-12-16 Robert Bosch Gmbh Socket Design for self

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (en) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Pressure sensor in a plastics housing and method for its production
DE19731420A1 (en) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Means for detecting the pressure and temperature in the intake manifold of an internal combustion engine, and processes for their preparation
WO2005088268A1 (en) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Sensor module provided with capacitor emc and esd protection
JP2006310658A (en) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd Semiconductor device and physical quantity sensor apparatus

Also Published As

Publication number Publication date Type
WO2009000611A3 (en) 2009-02-19 application
DE102007029720A1 (en) 2009-01-08 application

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