WO2009000611A3 - Module comprenant un asic et un boîtier pour l'asic - Google Patents

Module comprenant un asic et un boîtier pour l'asic Download PDF

Info

Publication number
WO2009000611A3
WO2009000611A3 PCT/EP2008/056803 EP2008056803W WO2009000611A3 WO 2009000611 A3 WO2009000611 A3 WO 2009000611A3 EP 2008056803 W EP2008056803 W EP 2008056803W WO 2009000611 A3 WO2009000611 A3 WO 2009000611A3
Authority
WO
WIPO (PCT)
Prior art keywords
asic
housing
subassembly
terminals
lines
Prior art date
Application number
PCT/EP2008/056803
Other languages
German (de)
English (en)
Other versions
WO2009000611A2 (fr
Inventor
Wolfgang Hauer
Richard Muehlheim
Hubert Benzel
Roland Guenschel
Dirk Dittmann
Original Assignee
Bosch Gmbh Robert
Wolfgang Hauer
Richard Muehlheim
Hubert Benzel
Roland Guenschel
Dirk Dittmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Wolfgang Hauer, Richard Muehlheim, Hubert Benzel, Roland Guenschel, Dirk Dittmann filed Critical Bosch Gmbh Robert
Publication of WO2009000611A2 publication Critical patent/WO2009000611A2/fr
Publication of WO2009000611A3 publication Critical patent/WO2009000611A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/069—Protection against electromagnetic or electrostatic interferences
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

L'invention concerne un module (10) simple, peu encombrant et économique, comprenant au moins un ASIC (1) et un boîtier pour ledit ASIC (1), le boîtier étant pourvu de bornes (6) permettant la connexion externe de l'ASIC (1) par l'intermédiaire de lignes électriques et au moins un composant électronique (7) étant prévu pour protéger l'ASIC (1) contre les décharges électrostatiques et pour supprimer les tensions parasites (EMV) induites par l'intermédiaire des lignes ou des bornes (6). Selon l'invention, ledit au moins un composant (7) est placé à l'intérieur du boîtier et relié à au moins une borne (6).
PCT/EP2008/056803 2007-06-27 2008-06-03 Module comprenant un asic et un boîtier pour l'asic WO2009000611A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007029720A DE102007029720A1 (de) 2007-06-27 2007-06-27 Baugruppe mit einem ASIC und einem Gehäuse für den ASIC
DE102007029720.5 2007-06-27

Publications (2)

Publication Number Publication Date
WO2009000611A2 WO2009000611A2 (fr) 2008-12-31
WO2009000611A3 true WO2009000611A3 (fr) 2009-02-19

Family

ID=40070864

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/056803 WO2009000611A2 (fr) 2007-06-27 2008-06-03 Module comprenant un asic et un boîtier pour l'asic

Country Status (2)

Country Link
DE (1) DE102007029720A1 (fr)
WO (1) WO2009000611A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3206027B1 (fr) * 2016-02-11 2019-09-11 Sensirion AG Puce de capteur comprenant un élément de protection contre les décharges électrostatiques

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19731420A1 (de) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine und Verfahren zu ihrer Herstellung
WO2005088268A1 (fr) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Module de capteurs comportant une protection de compatibilite electromagnetique et contre les decharges electrostatiques a condensateurs
JP2006310658A (ja) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd 半導体装置および物理量センサ装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10324220A1 (de) 2003-05-28 2004-12-16 Robert Bosch Gmbh Sockeldesign zur Selbstzentrierung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19731420A1 (de) * 1997-07-22 1999-01-28 Bosch Gmbh Robert Vorrichtung zur Erfassung des Drucks und der Temperatur im Saugrohr einer Brennkraftmaschine und Verfahren zu ihrer Herstellung
WO2005088268A1 (fr) * 2004-03-12 2005-09-22 Robert Bosch Gmbh Module de capteurs comportant une protection de compatibilite electromagnetique et contre les decharges electrostatiques a condensateurs
JP2006310658A (ja) * 2005-04-28 2006-11-09 Fuji Electric Device Technology Co Ltd 半導体装置および物理量センサ装置

Also Published As

Publication number Publication date
WO2009000611A2 (fr) 2008-12-31
DE102007029720A1 (de) 2009-01-08

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