WO2008149837A1 - 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム - Google Patents

難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム Download PDF

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Publication number
WO2008149837A1
WO2008149837A1 PCT/JP2008/060135 JP2008060135W WO2008149837A1 WO 2008149837 A1 WO2008149837 A1 WO 2008149837A1 JP 2008060135 W JP2008060135 W JP 2008060135W WO 2008149837 A1 WO2008149837 A1 WO 2008149837A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
flame
curing
retardant adhesive
phosphorus
Prior art date
Application number
PCT/JP2008/060135
Other languages
English (en)
French (fr)
Inventor
Shigeaki Tauchi
Tetsunori Satou
Katsuyuki Aida
Original Assignee
Tohto Kasei Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohto Kasei Co., Ltd. filed Critical Tohto Kasei Co., Ltd.
Publication of WO2008149837A1 publication Critical patent/WO2008149837A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Abstract

　硬化前のフィルム状態において、ワレ、ハガレなどがなく作業性に優れ、かつ硬化後のピール接着力、ハンダ耐熱性等の接着剤特性に優れ、非ハロゲン化を実現した難燃性の接着剤樹脂組成物を開示する。 　この難燃性接着剤樹脂組成物は、（A）エポキシ樹脂、（B）硬化剤、（C）硬化促進剤、並びに（D）有機リン化合物又はリン含有樹脂を必須成分として含有し、該樹脂組成物の熱硬化前でのガラス転移温度が０～５０°C、熱硬化後のガラス転移温度が１００°C以上であり、且つ該樹脂組成物１００重量部に対し、有機リン化合物又はリン含有樹脂をリンとして０．５～５重量部を含有する。この難燃性接着剤樹脂組成物は、カバーレイフィルムやボンディングフィルムに好適に使用される。
PCT/JP2008/060135 2007-06-05 2008-06-02 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム WO2008149837A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-149099 2007-06-05
JP2007149099 2007-06-05

Publications (1)

Publication Number Publication Date
WO2008149837A1 true WO2008149837A1 (ja) 2008-12-11

Family

ID=40093653

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060135 WO2008149837A1 (ja) 2007-06-05 2008-06-02 難燃性接着剤樹脂組成物及びそれを用いた接着剤フィルム

Country Status (3)

Country Link
JP (1) JP2009013399A (ja)
TW (1) TW200916547A (ja)
WO (1) WO2008149837A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107815277A (zh) * 2016-09-14 2018-03-20 广东广山新材料股份有限公司 一种阻燃电子材料
CN109254141A (zh) * 2017-07-13 2019-01-22 松下知识产权经营株式会社 热固化性树脂的状态监视方法以及状态监视系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09143252A (ja) * 1995-11-21 1997-06-03 Hitachi Chem Co Ltd 回路用接続部材
JP2000219851A (ja) * 1999-02-01 2000-08-08 Hitachi Cable Ltd Ｔａｂテープへのフィルム状接着剤の張り付け方法
JP2001237552A (ja) * 2000-02-25 2001-08-31 Kyocera Corp 接着材およびこれを用いた電子部品
JP2005314604A (ja) * 2004-04-30 2005-11-10 Shin Etsu Chem Co Ltd 難燃性接着剤組成物およびこれを用いた接着剤シート
JP2006232985A (ja) * 2005-02-24 2006-09-07 Shin Etsu Chem Co Ltd 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09143252A (ja) * 1995-11-21 1997-06-03 Hitachi Chem Co Ltd 回路用接続部材
JP2000219851A (ja) * 1999-02-01 2000-08-08 Hitachi Cable Ltd Ｔａｂテープへのフィルム状接着剤の張り付け方法
JP2001237552A (ja) * 2000-02-25 2001-08-31 Kyocera Corp 接着材およびこれを用いた電子部品
JP2005314604A (ja) * 2004-04-30 2005-11-10 Shin Etsu Chem Co Ltd 難燃性接着剤組成物およびこれを用いた接着剤シート
JP2006232985A (ja) * 2005-02-24 2006-09-07 Shin Etsu Chem Co Ltd 非ハロゲン系接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107815277A (zh) * 2016-09-14 2018-03-20 广东广山新材料股份有限公司 一种阻燃电子材料
CN109254141A (zh) * 2017-07-13 2019-01-22 松下知识产权经营株式会社 热固化性树脂的状态监视方法以及状态监视系统

Also Published As

Publication number Publication date
JP2009013399A (ja) 2009-01-22
TW200916547A (en) 2009-04-16

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