WO2008146641A1 - 研磨用組成物 - Google Patents

研磨用組成物 Download PDF

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Publication number
WO2008146641A1
WO2008146641A1 PCT/JP2008/059143 JP2008059143W WO2008146641A1 WO 2008146641 A1 WO2008146641 A1 WO 2008146641A1 JP 2008059143 W JP2008059143 W JP 2008059143W WO 2008146641 A1 WO2008146641 A1 WO 2008146641A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
polishing composition
composition
constitution
disclosed
Prior art date
Application number
PCT/JP2008/059143
Other languages
English (en)
French (fr)
Inventor
Shingo Kikuchi
Yasunori Numata
Hiroaki Takahashi
Original Assignee
Yushiro Chemical Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yushiro Chemical Industry Co., Ltd. filed Critical Yushiro Chemical Industry Co., Ltd.
Publication of WO2008146641A1 publication Critical patent/WO2008146641A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

　脆性材料を研磨するための研磨用組成物において、砥粒と研磨促進剤としての水酸化セリウムとを含有する構成とすることで、研磨速度を向上させることができると共に、表面研磨傷を防止することができる研磨用組成物を提供する。
PCT/JP2008/059143 2007-05-24 2008-05-19 研磨用組成物 WO2008146641A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007137803A JP5281758B2 (ja) 2007-05-24 2007-05-24 研磨用組成物
JP2007-137803 2007-05-24

Publications (1)

Publication Number Publication Date
WO2008146641A1 true WO2008146641A1 (ja) 2008-12-04

Family

ID=40074905

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/059143 WO2008146641A1 (ja) 2007-05-24 2008-05-19 研磨用組成物

Country Status (2)

Country Link
JP (1) JP5281758B2 (ja)
WO (1) WO2008146641A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014069308A (ja) * 2012-09-27 2014-04-21 Tadamasa Fujimura 研磨材。
WO2020021680A1 (ja) * 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
US11352523B2 (en) 2018-03-22 2022-06-07 Showa Denko Materials Co., Ltd. Polishing liquid, polishing liquid set and polishing method
US11566150B2 (en) 2017-03-27 2023-01-31 Showa Denko Materials Co., Ltd. Slurry and polishing method
US11773291B2 (en) 2017-03-27 2023-10-03 Resonac Corporation Polishing liquid, polishing liquid set, and polishing method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111421A1 (ja) 2010-03-12 2011-09-15 日立化成工業株式会社 スラリ、研磨液セット、研磨液及びこれらを用いた基板の研磨方法
US9881801B2 (en) 2010-11-22 2018-01-30 Hitachi Chemical Company, Ltd. Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
CN103497733B (zh) 2010-11-22 2016-11-23 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基板的研磨方法及基板
JP6044630B2 (ja) 2012-02-21 2016-12-14 日立化成株式会社 研磨剤、研磨剤セット及び基体の研磨方法
US9346977B2 (en) 2012-02-21 2016-05-24 Hitachi Chemical Company, Ltd. Abrasive, abrasive set, and method for abrading substrate
US9932497B2 (en) 2012-05-22 2018-04-03 Hitachi Chemical Company, Ltd. Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate
CN104335331B (zh) * 2012-05-22 2016-09-14 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基体的研磨方法及基体
CN104321852B (zh) * 2012-05-22 2016-12-28 日立化成株式会社 悬浮液、研磨液套剂、研磨液、基体的研磨方法及基体
JP5943072B2 (ja) * 2012-05-22 2016-06-29 日立化成株式会社 スラリー、研磨液セット、研磨液及び基体の研磨方法
JP6352174B2 (ja) * 2014-12-26 2018-07-04 昭和電工株式会社 炭化珪素単結晶インゴットの側面加工方法
JP6756460B2 (ja) 2014-12-26 2020-09-16 株式会社フジミインコーポレーテッド 研磨方法及びセラミック製部品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192645A (ja) * 2000-01-14 2001-07-17 Asahi Kasei Corp 半導体装置製造用の研磨用組成物
WO2002067309A1 (fr) * 2001-02-20 2002-08-29 Hitachi Chemical Co., Ltd. Pate a polir et procede de polissage d'un substrat
JP2002544318A (ja) * 1999-05-06 2002-12-24 エム・ピィ・エム・リミテッド 磁性研磨流体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002544318A (ja) * 1999-05-06 2002-12-24 エム・ピィ・エム・リミテッド 磁性研磨流体
JP2001192645A (ja) * 2000-01-14 2001-07-17 Asahi Kasei Corp 半導体装置製造用の研磨用組成物
WO2002067309A1 (fr) * 2001-02-20 2002-08-29 Hitachi Chemical Co., Ltd. Pate a polir et procede de polissage d'un substrat

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014069308A (ja) * 2012-09-27 2014-04-21 Tadamasa Fujimura 研磨材。
US11566150B2 (en) 2017-03-27 2023-01-31 Showa Denko Materials Co., Ltd. Slurry and polishing method
US11814548B2 (en) 2017-03-27 2023-11-14 Resonac Corporation Polishing liquid, polishing liquid set, and polishing method
US11773291B2 (en) 2017-03-27 2023-10-03 Resonac Corporation Polishing liquid, polishing liquid set, and polishing method
US11767448B2 (en) 2018-03-22 2023-09-26 Resonac Corporation Polishing liquid, polishing liquid set, and polishing method
US11352523B2 (en) 2018-03-22 2022-06-07 Showa Denko Materials Co., Ltd. Polishing liquid, polishing liquid set and polishing method
US11572490B2 (en) 2018-03-22 2023-02-07 Showa Denko Materials Co., Ltd. Polishing liquid, polishing liquid set, and polishing method
US11492526B2 (en) 2018-07-26 2022-11-08 Showa Denko Materials Co., Ltd. Slurry, method for producing polishing liquid, and polishing method
US11505731B2 (en) 2018-07-26 2022-11-22 Showa Denko Materials Co., Ltd. Slurry and polishing method
US11518920B2 (en) 2018-07-26 2022-12-06 Showa Denko Materials Co., Ltd. Slurry, and polishing method
US11499078B2 (en) 2018-07-26 2022-11-15 Showa Denko Materials Co., Ltd. Slurry, polishing solution production method, and polishing method
TWI771603B (zh) * 2018-07-26 2022-07-21 日商昭和電工材料股份有限公司 研漿及研磨方法
JPWO2020022290A1 (ja) * 2018-07-26 2021-08-12 昭和電工マテリアルズ株式会社 スラリ及び研磨方法
WO2020022290A1 (ja) * 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
WO2020021680A1 (ja) * 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法

Also Published As

Publication number Publication date
JP2008290183A (ja) 2008-12-04
JP5281758B2 (ja) 2013-09-04

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