WO2008146626A1 - 反射防止膜形成用組成物、及びこれを用いたレジストパターン形成方法 - Google Patents
反射防止膜形成用組成物、及びこれを用いたレジストパターン形成方法 Download PDFInfo
- Publication number
- WO2008146626A1 WO2008146626A1 PCT/JP2008/059046 JP2008059046W WO2008146626A1 WO 2008146626 A1 WO2008146626 A1 WO 2008146626A1 JP 2008059046 W JP2008059046 W JP 2008059046W WO 2008146626 A1 WO2008146626 A1 WO 2008146626A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- antireflection film
- formation
- film formation
- resist pattern
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0276—Photolithographic processes using an anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Spectroscopy & Molecular Physics (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020097025265A KR101115119B1 (ko) | 2007-06-01 | 2008-05-16 | 반사 방지막 형성용 조성물, 및 이것을 이용한 레지스트 패턴 형성방법 |
CN2008800155842A CN101681112B (zh) | 2007-06-01 | 2008-05-16 | 防反射膜形成用组合物、以及使用该组合物的光刻胶图案形成方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007147411A JP4928356B2 (ja) | 2007-06-01 | 2007-06-01 | 反射防止膜形成用組成物、及びこれを用いたレジストパターン形成方法 |
JP2007-147411 | 2007-06-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008146626A1 true WO2008146626A1 (ja) | 2008-12-04 |
Family
ID=40074891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/059046 WO2008146626A1 (ja) | 2007-06-01 | 2008-05-16 | 反射防止膜形成用組成物、及びこれを用いたレジストパターン形成方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4928356B2 (ja) |
KR (1) | KR101115119B1 (ja) |
CN (1) | CN101681112B (ja) |
TW (1) | TW200915006A (ja) |
WO (1) | WO2008146626A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015178387A1 (ja) * | 2014-05-21 | 2015-11-26 | アーゼット・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | 上層膜形成用組成物およびそれを用いたレジストパターン形成方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017169569A1 (ja) * | 2016-03-30 | 2017-10-05 | 富士フイルム株式会社 | 保護膜形成用組成物、保護膜形成用組成物の製造方法、パターン形成方法、および、電子デバイスの製造方法 |
TWI755723B (zh) * | 2020-05-05 | 2022-02-21 | 力晶積成電子製造股份有限公司 | 圖案化方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007043556A1 (ja) * | 2005-10-14 | 2007-04-19 | Tokyo Ohka Kogyo Co., Ltd. | ホトレジスト上層膜形成用材料 |
WO2007049637A1 (ja) * | 2005-10-27 | 2007-05-03 | Jsr Corporation | 上層膜形成組成物およびフォトレジストパターン形成方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002012574A (ja) * | 2000-06-29 | 2002-01-15 | Nippon Shokubai Co Ltd | 芳香族フッ素化合物の抽出方法 |
JP4196822B2 (ja) * | 2003-12-22 | 2008-12-17 | パナソニック株式会社 | 水溶性材料及びそれを用いたパターン形成方法 |
-
2007
- 2007-06-01 JP JP2007147411A patent/JP4928356B2/ja active Active
-
2008
- 2008-05-16 CN CN2008800155842A patent/CN101681112B/zh active Active
- 2008-05-16 KR KR1020097025265A patent/KR101115119B1/ko active IP Right Grant
- 2008-05-16 WO PCT/JP2008/059046 patent/WO2008146626A1/ja active Application Filing
- 2008-05-28 TW TW97119773A patent/TW200915006A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007043556A1 (ja) * | 2005-10-14 | 2007-04-19 | Tokyo Ohka Kogyo Co., Ltd. | ホトレジスト上層膜形成用材料 |
WO2007049637A1 (ja) * | 2005-10-27 | 2007-05-03 | Jsr Corporation | 上層膜形成組成物およびフォトレジストパターン形成方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015178387A1 (ja) * | 2014-05-21 | 2015-11-26 | アーゼット・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | 上層膜形成用組成物およびそれを用いたレジストパターン形成方法 |
JPWO2015178387A1 (ja) * | 2014-05-21 | 2017-04-20 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | 上層膜形成用組成物およびそれを用いたレジストパターン形成方法 |
US10268117B2 (en) | 2014-05-21 | 2019-04-23 | Az Electronic Materials (Luxembourg) S.A.R.L. | Top-layer membrane formation composition and method for forming resist pattern using same |
Also Published As
Publication number | Publication date |
---|---|
TWI370954B (ja) | 2012-08-21 |
JP4928356B2 (ja) | 2012-05-09 |
KR101115119B1 (ko) | 2012-03-13 |
TW200915006A (en) | 2009-04-01 |
KR20100009580A (ko) | 2010-01-27 |
CN101681112B (zh) | 2012-05-30 |
CN101681112A (zh) | 2010-03-24 |
JP2008299223A (ja) | 2008-12-11 |
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