WO2008143042A1 - Procédé de traitement au laser et produit traité au laser - Google Patents
Procédé de traitement au laser et produit traité au laser Download PDFInfo
- Publication number
- WO2008143042A1 WO2008143042A1 PCT/JP2008/058692 JP2008058692W WO2008143042A1 WO 2008143042 A1 WO2008143042 A1 WO 2008143042A1 JP 2008058692 W JP2008058692 W JP 2008058692W WO 2008143042 A1 WO2008143042 A1 WO 2008143042A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- processing method
- processed product
- laser processing
- laser beam
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Prevention Of Fouling (AREA)
Abstract
La présente invention concerne un procédé de traitement au laser permettant de faciliter le traitement au laser avec un rendement élevé en réduisant de manière efficace la contamination d'une surface d'un matériau à traiter en par la matière décomposée dans le cas du traitement du matériau par un faisceau laser. Le procédé de traitement au laser permettant de traiter le matériau en appliquant le faisceau laser sur le matériau est caractérisé en ce que le matériau est traité au laser tout en retirant la matière décomposée, générée par irradiation par faisceau laser, par aspiration au voisinage de la partie irradiante.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007130532A JP5096040B2 (ja) | 2007-05-16 | 2007-05-16 | レーザー加工方法及びレーザー加工品 |
JP2007-130532 | 2007-05-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008143042A1 true WO2008143042A1 (fr) | 2008-11-27 |
Family
ID=40031751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/058692 WO2008143042A1 (fr) | 2007-05-16 | 2008-05-12 | Procédé de traitement au laser et produit traité au laser |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5096040B2 (fr) |
TW (1) | TW200848191A (fr) |
WO (1) | WO2008143042A1 (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014167875A1 (fr) * | 2013-04-08 | 2014-10-16 | 住友化学株式会社 | Dispositif d'usinage laser et système de production de dispositif d'affichage optique |
WO2016006547A1 (fr) * | 2014-07-09 | 2016-01-14 | 住友化学株式会社 | Dispositif ainsi que procédé de collage, et système ainsi que procédé de production de dispositif d'affichage optique |
CN109311122A (zh) * | 2016-03-24 | 2019-02-05 | 艾斯曼汽车德国有限责任公司 | 用于借助脉冲激光束通过在覆盖材料上进行材料去除来引入限定的弱化线的方法 |
US11167541B2 (en) | 2018-12-14 | 2021-11-09 | Tdk Corporation | Apparatus for manufacturing element array and apparatus for removing specific element |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5328424B2 (ja) * | 2009-03-02 | 2013-10-30 | 本田技研工業株式会社 | 穴あけ装置 |
WO2011016572A1 (fr) * | 2009-08-06 | 2011-02-10 | 住友化学株式会社 | Procédé de fabrication de plaques polarisantes |
JP5460176B2 (ja) * | 2009-08-18 | 2014-04-02 | キヤノン株式会社 | レーザ加工装置 |
KR101203106B1 (ko) * | 2010-04-05 | 2012-11-20 | 김원옥 | 씨오피층이 포함된 다층필름의 레이저 절단방법 |
TWI413566B (zh) * | 2010-05-28 | 2013-11-01 | Lg Chemical Ltd | 偏光片之製造方法 |
JP5481300B2 (ja) * | 2010-07-29 | 2014-04-23 | 住友化学株式会社 | 偏光板切断方法および当該方法によって切断された偏光板 |
TW201207913A (en) * | 2010-08-13 | 2012-02-16 | Msscorps Co Ltd | Two-stage encapsulation removing method for semiconductor device and laser grooving device |
JP2012045581A (ja) * | 2010-08-27 | 2012-03-08 | Mitsubishi Materials Corp | レーザ加工方法 |
JP5663507B2 (ja) * | 2012-02-16 | 2015-02-04 | 信越化学工業株式会社 | ペリクルの製造方法 |
JP2014026186A (ja) * | 2012-07-30 | 2014-02-06 | Miyakoshi Printing Machinery Co Ltd | ラベル用紙のハーフカット型抜き加工方法 |
JP6057778B2 (ja) | 2013-02-27 | 2017-01-11 | 本田技研工業株式会社 | レーザ加工装置 |
JP2014121736A (ja) * | 2014-03-18 | 2014-07-03 | Sumitomo Chemical Co Ltd | レーザー光照射装置およびレーザー光照射方法 |
JP6814459B2 (ja) * | 2016-07-28 | 2021-01-20 | 三星ダイヤモンド工業株式会社 | レーザ加工方法 |
JP7242166B2 (ja) * | 2016-09-30 | 2023-03-20 | 住友化学株式会社 | 光学フィルム及び光学フィルムの製造方法 |
JP7021887B2 (ja) * | 2016-09-30 | 2022-02-17 | 住友化学株式会社 | 光学フィルムの製造方法 |
JP2018065331A (ja) * | 2016-10-21 | 2018-04-26 | 昭和電工パッケージング株式会社 | ラミネート材の加工方法 |
WO2022186767A1 (fr) * | 2021-03-03 | 2022-09-09 | Lim Meng Keong | Système intégré d'imagerie par rayons x et d'ablation au laser pour micro-usinage de précision |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001084579A (ja) * | 1999-09-10 | 2001-03-30 | Fuji Photo Film Co Ltd | 磁気テープ加工装置 |
JP2002341322A (ja) * | 2001-05-17 | 2002-11-27 | Matsushita Electric Ind Co Ltd | 液晶表示素子の製造方法および製造装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004268080A (ja) * | 2003-03-07 | 2004-09-30 | Sumitomo Heavy Ind Ltd | レーザ加工装置および加工方法 |
-
2007
- 2007-05-16 JP JP2007130532A patent/JP5096040B2/ja active Active
-
2008
- 2008-05-12 WO PCT/JP2008/058692 patent/WO2008143042A1/fr active Application Filing
- 2008-05-14 TW TW097117754A patent/TW200848191A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001084579A (ja) * | 1999-09-10 | 2001-03-30 | Fuji Photo Film Co Ltd | 磁気テープ加工装置 |
JP2002341322A (ja) * | 2001-05-17 | 2002-11-27 | Matsushita Electric Ind Co Ltd | 液晶表示素子の製造方法および製造装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014167875A1 (fr) * | 2013-04-08 | 2014-10-16 | 住友化学株式会社 | Dispositif d'usinage laser et système de production de dispositif d'affichage optique |
JP2014217879A (ja) * | 2013-04-08 | 2014-11-20 | 住友化学株式会社 | レーザー加工装置及び光学表示デバイスの生産システム |
WO2016006547A1 (fr) * | 2014-07-09 | 2016-01-14 | 住友化学株式会社 | Dispositif ainsi que procédé de collage, et système ainsi que procédé de production de dispositif d'affichage optique |
JP2016018105A (ja) * | 2014-07-09 | 2016-02-01 | 住友化学株式会社 | 貼合装置、貼合方法、光学表示デバイスの生産システム及び光学表示デバイスの生産方法 |
CN106663393A (zh) * | 2014-07-09 | 2017-05-10 | 住友化学株式会社 | 贴合装置、贴合方法、光学显示器件的生产系统以及光学显示器件的生产方法 |
CN109311122A (zh) * | 2016-03-24 | 2019-02-05 | 艾斯曼汽车德国有限责任公司 | 用于借助脉冲激光束通过在覆盖材料上进行材料去除来引入限定的弱化线的方法 |
CN109311122B (zh) * | 2016-03-24 | 2020-11-17 | 艾斯曼汽车德国有限责任公司 | 用于借助脉冲激光束通过在覆盖材料上进行材料去除来引入限定的弱化线的方法 |
US11167541B2 (en) | 2018-12-14 | 2021-11-09 | Tdk Corporation | Apparatus for manufacturing element array and apparatus for removing specific element |
Also Published As
Publication number | Publication date |
---|---|
JP2008284572A (ja) | 2008-11-27 |
TW200848191A (en) | 2008-12-16 |
JP5096040B2 (ja) | 2012-12-12 |
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