WO2008143042A1 - Laser processing method and laser-processed product - Google Patents

Laser processing method and laser-processed product Download PDF

Info

Publication number
WO2008143042A1
WO2008143042A1 PCT/JP2008/058692 JP2008058692W WO2008143042A1 WO 2008143042 A1 WO2008143042 A1 WO 2008143042A1 JP 2008058692 W JP2008058692 W JP 2008058692W WO 2008143042 A1 WO2008143042 A1 WO 2008143042A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing method
processed product
laser processing
laser beam
Prior art date
Application number
PCT/JP2008/058692
Other languages
French (fr)
Japanese (ja)
Inventor
Naoyuki Matsuo
Kanji Nishida
Atsushi Hino
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Publication of WO2008143042A1 publication Critical patent/WO2008143042A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Abstract

Provided is a laser processing method for performing laser processing easily with high production efficiency by effectively reducing contamination of a surface of a material to be processed due to decomposed matter in the case of processing the material by a laser beam. The laser processing method for processing the material by applying the laser beam to the material is characterized in that the material is laser-processed while removing the decomposed matter, which is generated by laser beam irradiation, by suction at the vicinity of the irradiating portion.
PCT/JP2008/058692 2007-05-16 2008-05-12 Laser processing method and laser-processed product WO2008143042A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007130532A JP5096040B2 (en) 2007-05-16 2007-05-16 Laser processing method and laser processed product
JP2007-130532 2007-05-16

Publications (1)

Publication Number Publication Date
WO2008143042A1 true WO2008143042A1 (en) 2008-11-27

Family

ID=40031751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058692 WO2008143042A1 (en) 2007-05-16 2008-05-12 Laser processing method and laser-processed product

Country Status (3)

Country Link
JP (1) JP5096040B2 (en)
TW (1) TW200848191A (en)
WO (1) WO2008143042A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014167875A1 (en) * 2013-04-08 2014-10-16 住友化学株式会社 Laser machining device and system for producing optical display device
WO2016006547A1 (en) * 2014-07-09 2016-01-14 住友化学株式会社 Bonding apparatus, bonding method, optical-display-device production system, and optical-display-device production method
CN109311122A (en) * 2016-03-24 2019-02-05 艾斯曼汽车德国有限责任公司 Method for introducing the weakened line of restriction by carrying out material removal in covering material by pulse laser beam
US11167541B2 (en) 2018-12-14 2021-11-09 Tdk Corporation Apparatus for manufacturing element array and apparatus for removing specific element

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JP5328424B2 (en) * 2009-03-02 2013-10-30 本田技研工業株式会社 Drilling device
WO2011016572A1 (en) * 2009-08-06 2011-02-10 住友化学株式会社 Method for manufacturing polarizing plate
JP5460176B2 (en) * 2009-08-18 2014-04-02 キヤノン株式会社 Laser processing equipment
KR101203106B1 (en) * 2010-04-05 2012-11-20 김원옥 Laser cutting method for multilayer film having cop layer
WO2011149142A1 (en) * 2010-05-28 2011-12-01 주식회사 엘지화학 Method for manufacturing polarizing plate
JP5481300B2 (en) 2010-07-29 2014-04-23 住友化学株式会社 Polarizing plate cutting method and polarizing plate cut by the method
TW201207913A (en) * 2010-08-13 2012-02-16 Msscorps Co Ltd Two-stage encapsulation removing method for semiconductor device and laser grooving device
JP2012045581A (en) * 2010-08-27 2012-03-08 Mitsubishi Materials Corp Laser processing method
JP5663507B2 (en) * 2012-02-16 2015-02-04 信越化学工業株式会社 Pellicle manufacturing method
JP2014026186A (en) * 2012-07-30 2014-02-06 Miyakoshi Printing Machinery Co Ltd Half-cut type punch processing method for label paper
JP6057778B2 (en) 2013-02-27 2017-01-11 本田技研工業株式会社 Laser processing equipment
JP2014121736A (en) * 2014-03-18 2014-07-03 Sumitomo Chemical Co Ltd Laser light irradiation apparatus and laser light irradiation method
JP6814459B2 (en) * 2016-07-28 2021-01-20 三星ダイヤモンド工業株式会社 Laser processing method
JP7021887B2 (en) * 2016-09-30 2022-02-17 住友化学株式会社 Optical film manufacturing method
JP7242166B2 (en) * 2016-09-30 2023-03-20 住友化学株式会社 Optical film and method for producing optical film
JP2018065331A (en) * 2016-10-21 2018-04-26 昭和電工パッケージング株式会社 Method for working laminate material
WO2022186767A1 (en) * 2021-03-03 2022-09-09 Lim Meng Keong An integrated x-ray imaging and laser ablating system for precision micromachining

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001084579A (en) * 1999-09-10 2001-03-30 Fuji Photo Film Co Ltd Magnetic tape machining device
JP2002341322A (en) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing liquid crystal display element

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004268080A (en) * 2003-03-07 2004-09-30 Sumitomo Heavy Ind Ltd Device and method for laser beam machining

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001084579A (en) * 1999-09-10 2001-03-30 Fuji Photo Film Co Ltd Magnetic tape machining device
JP2002341322A (en) * 2001-05-17 2002-11-27 Matsushita Electric Ind Co Ltd Method and apparatus for manufacturing liquid crystal display element

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014167875A1 (en) * 2013-04-08 2014-10-16 住友化学株式会社 Laser machining device and system for producing optical display device
JP2014217879A (en) * 2013-04-08 2014-11-20 住友化学株式会社 Laser processing apparatus and production system for optical display device
WO2016006547A1 (en) * 2014-07-09 2016-01-14 住友化学株式会社 Bonding apparatus, bonding method, optical-display-device production system, and optical-display-device production method
JP2016018105A (en) * 2014-07-09 2016-02-01 住友化学株式会社 Pasting device, pasting method, production system of optical display device, and production method of optical display device
CN106663393A (en) * 2014-07-09 2017-05-10 住友化学株式会社 Bonding apparatus, bonding method, optical-display-device production system, and optical-display-device production method
CN109311122A (en) * 2016-03-24 2019-02-05 艾斯曼汽车德国有限责任公司 Method for introducing the weakened line of restriction by carrying out material removal in covering material by pulse laser beam
CN109311122B (en) * 2016-03-24 2020-11-17 艾斯曼汽车德国有限责任公司 Method for introducing a defined weakening line by material removal on a covering material by means of a pulsed laser beam
US11167541B2 (en) 2018-12-14 2021-11-09 Tdk Corporation Apparatus for manufacturing element array and apparatus for removing specific element

Also Published As

Publication number Publication date
JP2008284572A (en) 2008-11-27
JP5096040B2 (en) 2012-12-12
TW200848191A (en) 2008-12-16

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