JP2002341322A - Method and apparatus for manufacturing liquid crystal display element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display element having an area without any overlapped part of substrates formed on a peripheral part by partly dividing a liquid crystal display element using the plastics substrates without causing a crack or mixing in of a foreign matter. SOLUTION: Incised lines 8 are formed on each of the two plastics substrates 2, 3 constructing a bonded substrate 20 with dicing machining, laser machining or high pressure water machining using a blade 1. The bonded substrate 2 is inserted into a gap between an upper roll 19 and a lower roll 29 respectively coated with elastic bodies 15, 16 having an elastic modulus lower than that of the plastics substrates 2, 3. The bonded substrate 20 is pressed while being conveyed by rotating the upper roll 19 and the lower roll 29 mutually in the reverse directions. Thereby cracks 17, 18 are developed on the incised line 8 parts of the plastics substrates 2, 3 and they are divided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display device including a step of dividing a liquid crystal display device using a plastic substrate into a predetermined size, and a manufacturing apparatus used for the method.

[0002]

2. Description of the Related Art A liquid crystal display element has an undercoat, IT
A pair of substrates on which an O electrode and an alignment film have been formed and which have been subjected to an alignment treatment are attached to each other so that their respective electrode surfaces face each other. In the outer peripheral portion of the liquid crystal cell, an area where the substrates do not overlap is formed, and in this non-overlapping area, a lead electrode connected to an electrode formed inside the liquid crystal cell is exposed, and The driver is connected to the extraction electrode in this area.

A glass substrate is generally used as the substrate, but in recent years, a plastic substrate has been developed in order to reduce the thickness and weight of a liquid crystal display device. For example, as a substrate used for an STN liquid crystal display element, a plastic substrate having a thickness of 0.1 mm to 0.3 mm has been developed, and polyether sulfone (hereinafter, referred to as “PES”), polycarbonate (hereinafter, referred to as “P”).
C ". ) Have been mass-produced. An acrylic resin or an epoxy resin is also known as a plastic substrate having better surface flatness than the above PES or PC (for example, see Japanese Patent Application Laid-Open No. H10-5).
No. 4980).

In manufacturing a liquid crystal display device, a process of partially dividing one of the substrates to form a non-overlapping area of the substrates on the outer peripheral portion of the liquid crystal cell as described above,
In order to form the liquid crystal panel to a predetermined size, it is necessary to perform an outer shape dividing process for dividing the outer shape of the liquid crystal cell.

When a glass substrate is used as a substrate for a liquid crystal display element, a scratch is made on the substrate surface along a cutting line with a diamond cutter or the like, and then a shock is applied to the cutting line by a breaker. Thus, the substrate can be divided.

[0006]

However, when a plastic substrate is used as a substrate of a liquid crystal display element,
Since the plastic substrate has a certain degree of elasticity against bending stress, it is not possible to perform a cutting process as in the case of the glass substrate.

In order to solve such a problem, for example, in Japanese Patent Application Laid-Open No. Hei 5-88136, after two plastic substrates having a thickness of 0.4 mm are bonded together, the same cutting line for the upper and lower substrates is cut. A liquid crystal cell, in which a cut is made by dicing to leave a thickness of about 50 μm, shavings and the like are removed by air blowing, and an outer portion that becomes the same dividing line of the upper and lower substrates is cut along a groove formed by the cut. Has been proposed.

However, according to this dividing method, even if the outer shape dividing processing in which the dividing lines of the upper and lower substrates of the liquid crystal cell are the same can be performed, a partial area for forming a non-overlapping area of the substrate on the outer peripheral portion of the liquid crystal cell can be obtained. There is a problem that the dividing process cannot be performed.

Further, as for a liquid crystal display device using a plastic substrate, as shown in JP-A-58-144886 and JP-A-59-119317, a portion where a terminal portion is opposed is cut in advance. There is a method of manufacturing a liquid crystal panel using a plastic substrate provided with an opening. However, according to this method, when an opening is formed in a plastic substrate, cracks may occur at the edge of the opening, or dust and the like may be mixed into the panel during assembly. Further, there is a disadvantage that the gap between the substrates of the liquid crystal panel may not be uniform due to the warpage of the plastic substrate generated when the opening is provided.

An object of the present invention is to solve the above problems and to provide a liquid crystal display device in which a plastic substrate is divided into an arbitrary shape without causing cracks in the substrate or inclusion of foreign matter into the panel. And

[0011]

In order to achieve the above object, a method of manufacturing a liquid crystal display device according to the present invention comprises the steps of: bonding two plastic substrates to form a bonded substrate; A cutting line is formed on each of the two plastic substrates along a part to be cut, leaving a predetermined thickness, and two rollers each covered with an elastic material having a lower elastic modulus than the plastic substrate are used. A gap having a thickness of about one plastic substrate is provided and arranged in parallel, the bonded substrate is inserted into the gap, and the two rollers are rotated in opposite directions to transport the bonded substrate. The two plastic substrates are separated from each other at the cut line portion by pressing.

According to this method, the bonded substrate having the cut line formed in the plastic substrate is inserted between two rollers covered with an elastic material having a lower elastic modulus than the plastic substrate, and pressed. The plastic substrate can be cut along a desired cut line without generating cracks or the like.

The formation of the cut line is based on blurring.
Dicing using CO, CO _TwoLaser as light source
Laser processing with a laser device, etc.
It can be realized by shooting.

Further, if dust and the like generated by the cut are removed by suction or jet air at the same time as the formation of the cut line, foreign matters can be prevented from being mixed into the panel, and the yield can be improved.

Further, in order to achieve the above object, a manufacturing apparatus for a liquid crystal display device according to the present invention provides a device for manufacturing a liquid crystal display device, comprising: Along, means for forming a cut line leaving a predetermined thickness uncut,
Two rollers, each covered with an elastic body having a lower elastic modulus than the plastic substrate and provided in parallel with a gap about the thickness of one plastic substrate, and a gap between the two rollers. By inserting the bonded substrate, rotating the two rollers in opposite directions, and pressing the transported substrate while transporting the bonded substrate, the two plastic substrates are separated at the cut line portion. And With this configuration, the above-described method for manufacturing a liquid crystal display element can be performed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing a liquid crystal display device and an apparatus therefor according to the present invention will be described with reference to specific embodiments.

(Embodiment 1) An embodiment of the present invention will be described with reference to FIGS. FIG.
(A)-(d) is explanatory drawing which shows the manufacturing process of the liquid crystal display element which concerns on this embodiment. FIG. 2 is a perspective view showing a finished shape of the liquid crystal display element of the present embodiment.

The liquid crystal display element of the present embodiment is manufactured by dividing a liquid crystal cell formed by bonding a plastic substrate 2 and a plastic substrate 3 by a dividing step shown in FIGS. 1 (a) to 1 (d). You. As a result, as shown in FIGS. 1D and 2, non-overlapping areas 11 a to 11 of the plastic substrates 2 and 3 are provided on the outer peripheral portion of the liquid crystal panel.
c is formed.

As shown in FIG. 2, an area 11a of the plastic substrate 2 is a region not facing the plastic substrate 3, and an extraction electrode 12a connected to an ITO electrode (not shown) formed inside the liquid crystal cell. , So as to be exposed. Area 11 of plastic substrate 3
b is a region which does not face the plastic substrate 2, and is provided so that the extraction electrode 12b connected to an ITO electrode (not shown) formed inside the liquid crystal cell is exposed. The area 11c of the plastic substrate 3 is also an area that does not face the plastic substrate 2, but no extraction electrode is formed in this area 11c. The extraction electrodes 12a, which are exposed in the areas 11a, 11b,
A liquid crystal display driver is formed by connecting a liquid crystal driving driver to each of the elements 12b.

As a material for the plastic substrate 2, an epoxy resin, an acrylic resin, PES, or PC can be used.

In the liquid crystal display device, first, a transparent electrode ITO (not shown) is formed on the plastic substrates 2 and 3 by sputtering and patterned by etching. Thereafter, an alignment film is formed and an alignment process is performed on each of the plastic substrates 2 and 3, spacers are scattered and arranged, a sealant 7 is formed, and the two plastic substrates 2 and 3 are bonded to face each other. Then, the bonded substrate 20 is obtained.

At the time of cutting the bonded substrate 20,
The cutting process is performed using a dicing device having a blade 1 and a dust collecting nozzle 5 as shown in FIGS. 1 (a) and 1 (b). The blade 1 is a disk-shaped blade into which diamond particles are mixed, and separates the plastic substrates 2 and 3 by rotating at high speed. The dust collection nozzle 5
Foreign matter 4 such as dust generated at the time of division is removed by suction and dust collection.

In the cutting process of the bonded substrate 20, first, as shown in FIG. 1A, a cutting line 8 is formed on the plastic substrate 2 by dicing using a blade 1 along a not-shown dividing mark. Form. At this time, the bonded substrate 20 is adsorbed and fixed on a flat table (not shown) so as to have no irregularities.
The height of the blade 1 with respect to 0 is set so that a predetermined thickness remains without being cut even by dicing. In addition, as shown in FIG. 1A, foreign matter 4 such as shavings generated during dicing is removed by a dust collection nozzle 5.

Thereafter, the bonded substrate 20 is turned upside down, and a predetermined thickness is left on the plastic substrate 3 by dicing using the blade 1 as in the case of the plastic substrate 2 as shown in FIG. The cutting line 8 is formed.

Thereafter, the bonded substrate 20 having the cut lines 8 formed thereon is inserted between the upper roller 19 and the lower roller 29 as shown in FIG. The upper roller 19 is covered with an elastic body 15 having a lower elastic modulus than the plastic substrates 2 and 3, and the lower roller 29 is covered with an elastic body 16 having a lower elastic modulus than the plastic substrates 2 and 3. The upper roller 19 and the lower roller 29 are arranged in parallel with a gap of about one of the thickness of one of the plastic substrates 2 and 3 and rotate in opposite directions as indicated by broken arrows in FIG. 1C. As a result, the bonded substrate 20 inserted into the gap is pressed while being transported in the direction indicated by the solid arrow in FIG.

When the cut line 8 of the plastic substrate 3 passes between the upper roller 19 and the lower roller 29, the bonded substrate 20 is pressed against the elastic body 16 having a lower elastic modulus than the plastic substrates 2 and 3. The plastic substrate 3 is deformed and stress is concentrated on the cut line 8 of the plastic substrate 3, cracks 17 are formed in the plastic substrate 3 at the cut line 8, and the plastic substrate 3 is divided.

When the cut line 8 of the plastic substrate 2 passes between the upper roller 19 and the lower roller 29, the plastic substrate 2 is bonded to the elastic sheet 15 having a lower elastic modulus than the plastic substrates 2 and 3. 20 is pressed and deformed, stress concentrates on the cut line 8 portion of the plastic substrate 2, a crack 18 is formed in the plastic substrate 2 in the cut line 8 portion, and the plastic substrate 2 is divided.

If there is a cut line 8 portion (not shown) at a position facing both the plastic substrates 2 and 3, when this portion passes between the upper roller 19 and the lower roller 29, Substrates 2, 3
The bonded substrate 20 is pressed against the elastic sheets 15 and 16 having a lower elastic modulus and deformed, stress is concentrated on the cut lines 8 of both the plastic substrates 2 and 3, and the plastic substrates 2 and 3 in the cut lines 8 are formed. Cracks, and the plastic substrates 2 and 3 are separated.

By the above procedure, as shown in FIG. 1D, a liquid crystal display element 6 having a non-overlapping area of the substrate on the outer peripheral portion is formed.

Next, after injecting liquid crystal into the gap between the plastic substrates 2 and 3 of the liquid crystal display element 6 from the injection port, the injection port is sealed. Next, a liquid crystal display device is completed by attaching a polarizing plate and connecting a driver for driving a liquid crystal to the extraction electrode.

The plastic thicknesses, cut depths, and uncut lengths of the plastic substrates 2 and 3 are shown in Table 1 below, using an epoxy resin, an acrylic resin, PES, and PC, respectively. And the above-mentioned dividing process was performed, and particularly good results were obtained. Note that these values are merely examples, and embodiments of the present invention are not limited thereto.

[Table 1] When a plastic substrate having a thickness of about 400 μm is used, the thickness of the blade 1 is preferably set to 200 to 300 μm. In this case, the width of the cut line 8 is 200 to 500 μm. When a plastic substrate having a thickness of about 200 μm is used, the thickness of the blade 1 is preferably set to 100 to 150 μm. In this case, the width of the cut line 8 is 100 to 250 μm.

As described above, according to the present embodiment, even if a plastic substrate is used, cracks are unlikely to occur on the substrate.
Dust and the like can be prevented from entering the liquid crystal panel during assembly, and it is easy to make the gap between the substrates of the liquid crystal panel uniform. Therefore, a higher quality liquid crystal panel can be obtained, and the production yield of the liquid crystal panel can be improved, which is of great industrial value.

(Embodiment 2) Another embodiment of the present invention will be described with reference to FIG. For convenience of explanation,
Members having the same configurations and functions as the members described in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

In the present embodiment, an epoxy resin,
As shown in FIGS. 3A and 3B, a laser processing device having a laser device 21 was used for a bonded substrate manufactured using a plastic substrate made of an acrylic resin, PES, or PC, respectively. Perform a splitting process.
The finished shape is as shown in FIG.

The laser processing apparatus uses, for example, a CO ₂ laser (25 W output, laser spot diameter 0.2 mmφ) as a light source, and controls the position of the laser spot of the laser beam 28 using a digital control servomotor. It is configured to be able to move and irradiate a laser to an arbitrary position. Further, this laser processing apparatus is provided with a dust collecting nozzle 25 for sucking and removing foreign matter 4 such as dust generated during processing.

In this embodiment, the bonded substrate 20 is divided by the following procedure. First, as shown in FIG. 3A, a cut line 8 is formed in the plastic substrate 2 by laser processing using the laser processing apparatus along a dividing mark (not shown). At this time, the bonded substrate 20 is arranged on a flat table (not shown) by suction fixing so as to have no irregularities, and the laser output and the speed at which the position of the laser spot is moved are adjusted by the bonded substrate 20.
Is set such that the portion forming the cut line 8 is not completely cut and a predetermined thickness remains. FIG.
As shown in (a), foreign matter 4 such as shavings generated during laser processing is removed by a dust collection nozzle 25.

After that, as shown in FIG. 3 (b), the plastic substrate 3 is cut into the plastic substrate 3 by laser processing so as to leave a predetermined thickness as shown in FIG. To form

Thereafter, the bonded substrate 20 having the cut lines 8 formed therein is inserted between the upper roller 19 and the lower roller 29 as shown in FIG. The upper roller 19 is covered with an elastic body 15 having a lower elastic modulus than the plastic substrates 2 and 3, and the lower roller 29 is covered with an elastic body 16 having a lower elastic modulus than the plastic substrates 2 and 3. The upper roller 19 and the lower roller 29 are arranged in parallel with a gap having a thickness of one of the plastic substrates 2 and 3 and rotated in opposite directions as indicated by broken arrows in FIG. As a result, the bonded substrate 20 inserted into the gap is pressed while being transported in the direction indicated by the solid arrow in FIG.

When the cut line 8 of the plastic substrate 3 passes between the upper roller 19 and the lower roller 29, the bonded substrate 20 is pressed against the elastic body 16 having a lower elastic modulus than the plastic substrates 2 and 3. The plastic substrate 3 is deformed and stress is concentrated on the cut line 8 of the plastic substrate 3, cracks 17 are formed in the plastic substrate 3 at the cut line 8, and the plastic substrate 3 is divided.

When the cut line 8 of the plastic substrate 2 passes between the upper roller 19 and the lower roller 29, the plastic substrate 2 is bonded to the elastic sheet 15 having a lower elastic modulus than the plastic substrates 2 and 3. 20 is pressed and deformed, stress concentrates on the cut line 8 portion of the plastic substrate 2, a crack 18 is formed in the plastic substrate 2 in the cut line 8 portion, and the plastic substrate 2 is divided.

When there is a cut line 8 portion (not shown) at a position facing each of the plastic substrates 2 and 3, when this portion passes between the upper roller 19 and the lower roller 29, Substrates 2, 3
The bonded substrate 20 is pressed against the elastic sheets 15 and 16 having a lower elastic modulus and deformed, stress is concentrated on the cut lines 8 of both the plastic substrates 2 and 3, and the plastic substrates 2 and 3 in the cut lines 8 are formed. Cracks, and the plastic substrates 2 and 3 are separated.

By the above procedure, as shown in FIG. 3D, a liquid crystal display element 6 having a non-overlapping area of the substrate on the outer peripheral portion is formed.

Next, after injecting liquid crystal into the gap between the plastic substrates 2 and 3 of the liquid crystal display element 6 from the injection port, the injection port is sealed. Next, a liquid crystal display device is completed by attaching a polarizing plate and connecting a driver for driving a liquid crystal to the extraction electrode.

The plastic substrates 2, 3 are made of epoxy resin, acrylic resin, PES, and PC, respectively, and the board thickness, cut amount, and uncut amount of each substrate are shown in Table 2 below. And the above-mentioned dividing process was performed, and particularly good results were obtained. Note that these values are merely examples, and embodiments of the present invention are not limited thereto. As for the setting of the laser output and the speed at which the position of the laser spot is moved, the plastic substrates 2 and 3 are not deformed due to heat or the like, and the predetermined thickness remains without completely cutting the plastic substrates 2 and 3. Any degree is acceptable.

[Table 2] As described above, according to the present embodiment, even if a plastic substrate is used, cracks are unlikely to occur in the substrate, dust and the like can be prevented from being mixed into the liquid crystal panel during assembly, and the gap between the substrates of the liquid crystal panel can be uniform. It will also be easier to do. Therefore, a higher quality liquid crystal panel can be obtained, and the production yield of the liquid crystal panel can be improved, which is of great industrial value.

(Embodiment 3) Still another embodiment of the present invention will be described with reference to FIG.

For the sake of convenience, members having the same configuration and function as those of the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted.

In this embodiment, FIGS. 4A and 4B show a liquid crystal display device manufactured using a plastic substrate made of an epoxy resin, an acrylic resin, PES, or PC, respectively. As shown, the high-pressure water injection device 3
The cutting process is performed by using the high-pressure water processing apparatus having No. 1 to perform a cutting process. The finished shape is as shown in FIG.

The high-pressure water processing device includes a high-pressure water injection device 31.
(200 MPa, ejection spot diameter 0.2 mmφ) and an air blow nozzle 35. The high-pressure water injection device 31
Digitally control the position of the high-pressure water injection spot
The control is performed by using a servomotor, and the injection / stop of the high-pressure water 38 is controlled by a switching automatic valve, so that the high-pressure water 38 is injected to an arbitrary position. In addition, the air blow nozzle 35 is disposed near the injection spot portion injected from the high-pressure water injection device 31 and has a function of blowing air to remove foreign substances 4 such as debris generated in high-pressure water processing. I have.

In this embodiment, the bonded substrate 20 is divided by the following procedure. First, as shown in FIG. 4A, a cutting line 8 is formed in the plastic substrate 2 by high-pressure water processing along a dividing mark (not shown). At this time, the bonded substrate 20 is disposed on a flat table (not shown) by suction and fixation so as not to have irregularities, and the bonded substrate 20 is controlled by the high-pressure water pressure and the speed at which the position of the high-pressure water jet spot is moved. It is set so that a predetermined thickness remains without being completely cut. In addition, as shown in FIG. 4A, foreign matter 4 such as shavings generated during high-pressure water processing is removed by an air blow nozzle 35.

Thereafter, as shown in FIG. 4B, the plastic substrate 3 is cut into the plastic substrate 3 by high-pressure water processing while leaving a predetermined thickness, as shown in FIG. 8 is formed.

Thereafter, the bonded substrate 20 having the cut lines 8 is inserted between the upper roller 19 and the lower roller 29, as shown in FIG. The upper roller 19 is covered with an elastic body 15 having a lower elastic modulus than the plastic substrates 2 and 3, and the lower roller 29 is covered with an elastic body 16 having a lower elastic modulus than the plastic substrates 2 and 3. The upper roller 19 and the lower roller 29 are arranged in parallel with a gap of approximately one of the thickness of one of the plastic substrates 2 and 3, and rotate in opposite directions as indicated by broken arrows in FIG. As a result, the bonded substrate 20 inserted into the gap is pressed while being transported in the direction indicated by the solid arrow in FIG.

When the cut line 8 of the plastic substrate 3 passes between the upper roller 19 and the lower roller 29, the bonded substrate 20 is pressed against the elastic body 16 having a lower elastic modulus than the plastic substrates 2 and 3. The plastic substrate 3 is deformed and stress is concentrated on the cut line 8 of the plastic substrate 3, cracks 17 are formed in the plastic substrate 3 at the cut line 8, and the plastic substrate 3 is divided.

When the cut line 8 of the plastic substrate 2 passes between the upper roller 19 and the lower roller 29, the plastic substrate 2 is bonded to the elastic sheet 15 having a lower elastic modulus than the plastic substrates 2 and 3. 20 is pressed and deformed, stress concentrates on the cut line 8 portion of the plastic substrate 2, a crack 18 is formed in the plastic substrate 2 in the cut line 8 portion, and the plastic substrate 2 is divided.

When there is a cut line 8 portion (not shown) at a position facing both of the plastic substrates 2 and 3, when this portion passes between the upper roller 19 and the lower roller 29, Substrates 2, 3
The bonded substrate 20 is pressed against the elastic sheets 15 and 16 having a lower elastic modulus and deformed, stress is concentrated on the cut lines 8 of both the plastic substrates 2 and 3, and the plastic substrates 2 and 3 in the cut lines 8 are formed. Cracks, and the plastic substrates 2 and 3 are separated.

By the above procedure, as shown in FIG. 4D, a liquid crystal display element 6 having a non-overlapping area of the substrate on the outer peripheral portion is formed.

Next, after injecting liquid crystal into the gap between the plastic substrates 2 and 3 of the liquid crystal display element 6 from the injection port, the injection port is sealed. Next, a liquid crystal display device is completed by attaching a polarizing plate and connecting a driver for driving a liquid crystal to the extraction electrode.

The plastic substrates 2, 3 are made of epoxy resin, acrylic resin, PES, and PC, respectively, and the board thickness, cut depth, and uncut length of each substrate are shown in Table 3 below. And the above-mentioned dividing process was performed, and particularly good results were obtained. Note that these values are merely examples, and embodiments of the present invention are not limited thereto. Also, high pressure water pressure,
The setting of the speed at which the position of the high-pressure water jet spot is moved may be such that the plastic substrates 2 and 3 are not deformed due to stress or the like and the predetermined thickness remains without completely cutting the plastic substrates 2 and 3. .

[Table 3] In addition, although it produced using the plastic substrate which consists of an epoxy-type resin, an acrylic-type resin, PES, and PC, respectively, it is not restricted to this, If it is a plastic substrate, it can also be divided similarly.

As described above, according to the present embodiment, even if a plastic substrate is used, cracks are unlikely to occur on the substrate.
Dust and the like can be prevented from entering the liquid crystal panel during assembly, and it is easy to make the gap between the substrates of the liquid crystal panel uniform. Therefore, a higher quality liquid crystal panel can be obtained, and the production yield of the liquid crystal panel can be improved, which is of great industrial value.

Further, in the first to third embodiments, FIGS. 1, 3 and 4 show examples in which the rotation axes of the upper roller 19 and the lower roller 29 are substantially parallel to the cutting line 8. The present invention is not limited to this, and similar effects can be obtained in other directions.

In the first to third embodiments, the thickness of the substrate, the cut depth, and the uncut length are shown in Tables 1, 2 and 3 respectively.
Although the cutting process was performed with the settings shown in (1), the present invention is not limited to these, and any setting may be used as long as a crack is formed in the plastic substrate 2 or 3 at the cut line 8 and cut.

The liquid crystal display device described here can be used as a display unit and applied to various image display application devices.

[0062]

As described above, according to the present invention, in a liquid crystal display device using a plastic substrate, the plastic substrate can be arbitrarily formed without causing cracks on the substrate or foreign matter such as dust entering the liquid crystal panel. Can be easily processed, and a thin and lightweight liquid crystal display device can be obtained.

[Brief description of the drawings]

FIGS. 1A to 1D are explanatory views showing a procedure of a dividing process of a liquid crystal display element in Embodiment 1 of the present invention.

FIG. 2 is a perspective view showing a configuration of a liquid crystal display element according to the first to third embodiments.

FIGS. 3A to 3D are explanatory views showing a procedure of a dividing process of a liquid crystal display element according to a second embodiment of the present invention.

FIGS. 4A to 4D are explanatory diagrams showing a procedure of a dividing process of a liquid crystal display element in Embodiment 3 of the present invention.

[Explanation of symbols]

 Reference Signs List 1 blade 2, 3 plastic substrate 4 foreign matter 5, 25 dust collecting nozzle 8 cutting line 15, 16 elastic body 19 upper roller 20 bonded substrate 21 laser device 28 laser beam 29 lower roller 31 high-pressure water jetting device 35 air blow nozzle 38 high-pressure water

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B26F 3/00 B26F 3/00 RS G02F 1/13 101 G02F 1/13 101 G09F 9/00 338 G09F 9 / 00 338 H01L 21/301 B23K 101: 40 // B23K 101: 40 H01L 21/78 BF L (72) Inventor Ikuhiro Hosokawa 1006 Ojidoma, Kadoma City, Osaka Prefecture F term in Matsushita Electric Industrial Co., Ltd. 2H088 FA07 FA10 FA11 FA17 FA24 FA29 FA30 MA16 2H090 JA03 JA11 JB03 JC02 JC13 JC18 JC19 3C060 AA04 CB08 CB14 CE23 CE28 4E068 AD00 CG01 CG02 DA10 DB10 5G435 AA17 BB12 EE33 KK05 KK10

Claims (12)

[Claims] 1. A laminated substrate obtained by laminating two plastic substrates, and cutting each of the two plastic substrates of the laminated substrate along a portion to be cut, leaving a predetermined thickness uncut. A line is formed, and two rollers each covered with an elastic body having a lower elastic modulus than the plastic substrate are arranged in parallel with a gap having a thickness of about one plastic substrate, and the adhesive is applied to the gap. By inserting a laminated substrate, rotating the two rollers in opposite directions, and pressing while transporting the laminated substrate, the two plastic substrates are separated at the cut line portion. , A method of manufacturing a liquid crystal display element. 2. The method for manufacturing a liquid crystal display element according to claim 1, wherein the cutting line is formed by dicing using a blade. 3. The method for manufacturing a liquid crystal display element according to claim 1, wherein the cut line is formed by laser processing. 4. The method according to claim 3, wherein said laser processing is performed by a laser device using a CO ₂ laser as a light source. 5. The method for manufacturing a liquid crystal display device according to claim 1, wherein the cut line is formed by using jet water. 6. The method for manufacturing a liquid crystal display device according to claim 1, wherein dust generated by the cut is removed by suction or jet air simultaneously with the formation of the cut line. 7. The method according to claim 1, wherein the plastic substrate is made of an epoxy resin, an acrylic resin, polyether sulfone, or polycarbonate. 8. A means for forming a cut line in each of the plastic substrates of a bonded substrate obtained by laminating two plastic substrates, along a portion to be cut, leaving a predetermined thickness uncut. Two rollers, each covered with an elastic body having a lower elastic modulus than the substrate and provided in parallel with a gap of about the thickness of one plastic substrate, wherein the adhesive is applied to the gap between the two rollers. Insert the laminated board,
Manufacturing the liquid crystal display device, wherein the two rollers are rotated in opposite directions to each other and pressed while transporting the bonded substrate, whereby the two plastic substrates are separated at the cut line portion. apparatus. 9. The means for forming the cut line includes:
9. A dicing machine using a blade.
An apparatus for manufacturing a liquid crystal display element as described in the above. 10. An apparatus for manufacturing a liquid crystal display element according to claim 8, wherein said means for forming said cut line is a laser processing apparatus. 11. The apparatus according to claim 10, wherein the laser processing apparatus has a CO ₂ laser as a light source. 12. The apparatus for manufacturing a liquid crystal display device according to claim 8, wherein said means for forming said cut line is a water jetting device.