JP2018065331A - Method for working laminate material - Google Patents

Method for working laminate material Download PDF

Info

Publication number
JP2018065331A
JP2018065331A JP2016206499A JP2016206499A JP2018065331A JP 2018065331 A JP2018065331 A JP 2018065331A JP 2016206499 A JP2016206499 A JP 2016206499A JP 2016206499 A JP2016206499 A JP 2016206499A JP 2018065331 A JP2018065331 A JP 2018065331A
Authority
JP
Japan
Prior art keywords
resin layer
metal foil
adhesive
laminate material
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016206499A
Other languages
Japanese (ja)
Inventor
健祐 永田
Kensuke Nagata
健祐 永田
勉 雁瀬
Tsutomu GANSE
勉 雁瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Packaging Corp
Original Assignee
Showa Denko Packaging Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Packaging Co Ltd filed Critical Showa Denko Packaging Co Ltd
Priority to JP2016206499A priority Critical patent/JP2018065331A/en
Priority to CN201710986914.3A priority patent/CN107972349A/en
Publication of JP2018065331A publication Critical patent/JP2018065331A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/162—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/116—Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material
    • H01M50/124—Primary casings, jackets or wrappings of a single cell or a single battery characterised by the material having a layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/10—Batteries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/16—Capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

PROBLEM TO BE SOLVED: To surely cut only a resin layer of a laminate material to form a metal exposed portion.SOLUTION: A method for working a laminate material includes spraying gas G to an easy-to-peel portion 20 having a weaker bonding force to a metal foil 11 than the peripheral portion of a resin layer 15 in a laminate material 1 in which the metal foil 11 and the resin layer 15 are bonded to each other and the easy-to-peel portion 20 is formed on the resin layer 15, irradiating the circumference of the easy-to-peel portion 20 with a laser beam L to cut the resin layer 15, and removing the cut easy-to-peel portion 20 to form a metal exposed portion 22 to which the metal foil 11 is exposed.SELECTED DRAWING: Figure 2

Description

本発明は、蓄電デバイスの外装体、食品や医薬品の包装材に用いられるラミネート材の加工方法に関する。   The present invention relates to a method for processing a laminate material used for an exterior body of an electricity storage device and a packaging material for foods and pharmaceuticals.

携帯通信端末機器用蓄電池、車載用蓄電池、回生エネルギー回収用蓄電池、キャパシタ、全固体電池等の電池は小型化、軽量化に伴い、従来使用されていた金属製の外装体に代えて、金属箔の両面に樹脂フィルムを接着剤で貼り合わせたラミネート材製の外装体が用いられることが多くなっている（特許文献１参照）。   Batteries such as storage batteries for mobile communication terminals, in-vehicle storage batteries, regenerative energy recovery storage batteries, capacitors, and all-solid-state batteries have been replaced with metal foil instead of metal exterior bodies that have been used conventionally. In many cases, an exterior body made of a laminate material in which resin films are bonded to each other with an adhesive is used (see Patent Document 1).

特許文献１に記載されたキャパシタ用ラミネートケースは、ケース内側の樹脂フィルム層を切り欠いて金属箔を露出させて電極接続部を形成し、ケース外側の樹脂フィルム層を切り欠いて金属箔を露出させて電極端子を形成したものである。このタイプのラミネートケースはタブリードを必要としないので、キャパシタの小型軽量化を図ることができる。   In the capacitor laminate case described in Patent Document 1, the resin film layer inside the case is cut out to expose the metal foil to form an electrode connection portion, and the resin film layer outside the case is cut out to expose the metal foil. Thus, electrode terminals are formed. Since this type of laminate case does not require a tab lead, the capacitor can be reduced in size and weight.

また、ラミネート材における金属箔の露出方法として、出願人は金属箔と樹脂フィルムの貼り合わせ工程において露出予定部に接着剤を塗布しない部分を形成し、貼り合わせ後に接着剤未塗布部上の樹脂フィルムを切除する方法を提案した（特許文献２参照）。この方法によれば、露出予定部は金属箔と樹脂フィルムとが接着されていないので容易に樹脂フィルムを切除でき、かつ金属箔表面が接着剤で汚損されることもない。   In addition, as a method for exposing the metal foil in the laminate material, the applicant forms a portion where the adhesive is not applied to the exposed portion in the bonding process of the metal foil and the resin film, and after bonding, the resin on the adhesive-uncoated portion A method for cutting the film was proposed (see Patent Document 2). According to this method, since the metal foil and the resin film are not bonded to each other in the exposed portion, the resin film can be easily removed, and the surface of the metal foil is not soiled with the adhesive.

また、金属箔と樹脂フィルムの貼り合わせ工程において、金属箔の露出予定部に易剥離シートを貼り付けた上で樹脂フィルムを貼り合わせ、その後樹脂フィルムを切除する際に易剥離シートを樹脂フィルムに接着させて除去する方法もある。   In addition, in the bonding process of the metal foil and the resin film, the resin film is bonded to the exposed portion of the metal foil, and then the resin film is bonded to the resin film. There is also a method of bonding and removing.

特開２０１３−１６１６７４号公報JP 2013-161694 A 特開２０１５−２０５５０４号公報JP-A-2015-205504

特許文献２においては、樹脂層の切断手段としてレーザーを推奨している。レーザーは出力を適正値に設定することで樹脂層だけを溶融して切断することができる。   In Patent Document 2, a laser is recommended as a means for cutting the resin layer. The laser can melt and cut only the resin layer by setting the output to an appropriate value.

ラミネート材を所要寸法に裁断する場合、即ちラミネート材の厚さ方向の全体を切断する場合は、溶融した樹脂が落下し、あるいは広範囲に蒸発するので、溶融した樹脂が再融着することなくラミネート材が切断される。また、樹脂の溶融不足が起こらないようにレーザーの出力を上げることによって確実に切断することができる。しかし、樹脂層だけを切断する場合は、金属箔に影響を及ぼさないためにレーザーの出力が制限されるので、完全に切断されないままに溶融した樹脂が再融着して切断不良が発生しやすい状況にある。しかも、溶融または蒸発した樹脂の逃げ場が狭いことも再融着が起こり易い原因となっている。   When the laminate material is cut to the required dimensions, that is, when the entire thickness of the laminate material is cut, the molten resin falls or evaporates over a wide area, so the laminated resin does not re-fuse. The material is cut. Moreover, it can cut | disconnect reliably by raising the output of a laser so that insufficient melting of resin may not occur. However, when only the resin layer is cut, the laser output is limited because it does not affect the metal foil, so that the resin melted without being completely cut is likely to be re-fused, resulting in poor cutting. Is in the situation. In addition, the narrow escape area of the melted or evaporated resin is also a cause of re-bonding.

本発明は、上述した背景技術に鑑み、ラミネート材の樹脂層だけを確実に切断して金属露出部を形成する方法を提供することを目的とする。   An object of this invention is to provide the method of cut | disconnecting only the resin layer of a laminate material and forming a metal exposure part in view of the background art mentioned above.

即ち、本発明は下記［１］〜［４］に記載の構成を有する。   That is, this invention has the structure as described in following [1]-[4].

［１］金属箔と樹脂層が貼り合わされ、前記樹脂層に、金属箔に対する接合力が周囲よりも弱い易剥離部が形成されたラミネート材に対し、
前記樹脂層の易剥離部にガスを吹き付けながら、易剥離部の周縁にレーザーを照射して樹脂層を切断し、切断した易剥離部を除去して金属箔が露出する金属露出部を形成することを特徴とするラミネート材の加工方法。 [1] For a laminate material in which a metal foil and a resin layer are bonded together, and an easily peelable portion is formed on the resin layer.
While blowing gas to the easy peeling part of the resin layer, the periphery of the easy peeling part is irradiated with a laser to cut the resin layer, and the metal peeling part is formed by removing the cut easy peeling part and exposing the metal foil. A method for processing a laminate material.

［２］前記金属箔と樹脂層が接着剤層によって貼り合わされ、前記接着剤層は部分的に接着剤が塗布されていない接着剤未塗布部を有し、前記易剥離部が接着剤未塗布部に重なる部分に形成されている前項１に記載のラミネート材の加工方法。   [2] The metal foil and the resin layer are bonded together by an adhesive layer, the adhesive layer has an adhesive non-applied portion where the adhesive is not partially applied, and the easy peeling portion is not applied with the adhesive 2. The method for processing a laminate material according to item 1, wherein the laminate material is formed in a portion overlapping the portion.

［３］前記金属箔と樹脂層との間に金属箔に接触して離型材が配置され、前記易剥離部が離型材に重なる部分に形成されている前項１に記載のラミネート材の加工方法。   [3] The method for processing a laminate material according to item 1, wherein a release material is disposed between the metal foil and the resin layer in contact with the metal foil, and the easily peelable portion is formed in a portion overlapping the release material. .

［４］切断した易剥離部を吸引して除去する前項１〜３のうちのいずれか１項に記載のラミネート材の加工方法。   [4] The method for processing a laminate material according to any one of items 1 to 3, wherein the easily peelable portion that has been cut is removed by suction.

上記［１］に記載のラミネート材の加工方法によれば、レーザー照射によって溶融した樹脂がガスの吹き付けによって急速に冷却されて凝固する。このため、レーザーを照射した樹脂層の易剥離部の周縁は溶融した樹脂が融着することなく確実に切断される。そして、周囲を切断された易剥離部は容易に除去でき、易剥離部の除去によって金属露出部を形成できる。   According to the method for processing a laminate material described in [1] above, the resin melted by laser irradiation is rapidly cooled and solidified by gas blowing. For this reason, the periphery of the easy peeling part of the resin layer which irradiated the laser is cut | disconnected reliably, without fuse | melting molten resin. And the easily peelable part cut | disconnected the circumference | surroundings can be removed easily and a metal exposure part can be formed by removal of an easy peelable part.

また、溶融して樹脂層から離れた樹脂の微細片や蒸発した樹脂はガスに吹き飛ばされて切断部から離れるので、これらの樹脂が切断部に付着してバリとなったり、金属箔に付着することもない。   In addition, since the fine resin pieces that have melted away from the resin layer and the evaporated resin are blown away by the gas and leave the cut portion, these resins adhere to the cut portion and become burrs or adhere to the metal foil. There is nothing.

上記［２］に記載のラミネート加工方法によれば、易剥離部が接着剤未塗布部によって形成されているラミネート材において上記の効果が得られる。   According to the laminating method described in [2] above, the above-described effect can be obtained in the laminate material in which the easily peelable portion is formed by the adhesive-uncoated portion.

上記［３］に記載のラミネート加工方法によれば、易剥離部が離型材によって形成されているラミネート材において上記の効果が得られる。   According to the laminating method described in [3] above, the above-described effect can be obtained in a laminating material in which an easily peelable portion is formed of a release material.

上記［４］に記載のラミネート加工方法によれば、切断した易剥離部を散乱させることなく回収できる。   According to the laminating method described in [4] above, the cut easily peelable portion can be recovered without being scattered.

本発明の加工方法を適用するラミネート材の斜視図である。It is a perspective view of the laminate material to which the processing method of this invention is applied. 図１Ａの１Ｂ−１Ｂ線断面図である。It is the 1B-1B sectional view taken on the line of FIG. 1A. 図１Ａの１Ｃ−１Ｃ線断面図である。It is the 1C-1C sectional view taken on the line of FIG. 1A. 図１Ｂのラミネート材の加工方法を示す図である。It is a figure which shows the processing method of the laminate material of FIG. 1B. 図１Ｃのラミネート材の加工方法を示す図である。It is a figure which shows the processing method of the laminate material of FIG. 1C.

図１Ａ〜１Ｃに本発明の加工方法を適用する２種類のラミネート材１、２を示し、図２、３にこれらのラミネート材１、２の加工方法を模式的に示す。これらのラミネート材１、２は電池ケースの材料として用いられる。   1A to 1C show two types of laminate materials 1 and 2 to which the processing method of the present invention is applied, and FIGS. 2 and 3 schematically show the processing methods of these laminate materials 1 and 2. These laminate materials 1 and 2 are used as materials for battery cases.

以下の説明において、同一符号を付した部材は同一物または同等物を表しており、重複する説明を省略する。   In the following description, members denoted by the same reference numerals represent the same or equivalent members, and duplicate descriptions are omitted.

［ラミネート材］
図１Ａおよび図１Ｂのラミネート材１は、金属箔１１の一方の面に第１接着剤層１２を介してケースの外側層となる耐熱性樹脂層１３が積層されるとともに、前記金属箔層１１の他方の面に第２接着剤層１４を介してケースの内側層となる熱融着性樹脂層１５が積層され、金属箔１１の両面に樹脂層が積層されている。前記第２接着剤層１４には、接着剤が塗布されていない接着剤未塗布部１４ａ形成されている。前記接着剤未塗布部１４ａでは金属箔１１と熱融着性樹脂層１５とが接着されずに離れているので、接着剤が塗布されている部分よりも接合力が弱い。従って、前記ラミネート材１において、熱融着性樹脂層１５の易剥離部２０は接着剤未塗布部１４ａに重なる部分に形成されている。 [Laminate]
1A and 1B, the heat-resistant resin layer 13 serving as the outer layer of the case is laminated on one surface of the metal foil 11 via the first adhesive layer 12, and the metal foil layer 11 is laminated. A heat-fusible resin layer 15 serving as an inner layer of the case is laminated on the other surface of the metal foil 11 via a second adhesive layer 14, and resin layers are laminated on both surfaces of the metal foil 11. The second adhesive layer 14 is formed with an adhesive non-applied portion 14a to which no adhesive is applied. Since the metal foil 11 and the heat-fusible resin layer 15 are separated from each other in the adhesive-unapplied portion 14a, the bonding force is weaker than the portion where the adhesive is applied. Therefore, in the laminate 1, the easily peelable portion 20 of the heat-fusible resin layer 15 is formed in a portion that overlaps the adhesive-uncoated portion 14 a.

前記接着剤未塗布部１４ａを有するラミネート材１の製造方法は限定されず、例えば以下の方法で作製することができる。   The manufacturing method of the laminate material 1 having the adhesive non-applied portion 14a is not limited, and for example, it can be manufactured by the following method.

金属箔１１に、表面に凹凸を有するグラビアロールを用いて接着剤が塗布されない接着剤未塗布部１４ａを形成しながら接着剤を塗布した後、金属箔１１と熱融着性樹脂層１５を貼り合わせてエージング処理する。接着剤の塗布方法はロール塗布のほか、インクジェット方式で未塗布部を形成しつつ接着剤を吹き付け塗布する方法がある。易剥離部の無い耐熱性樹脂層１３は、金属箔１１と耐熱性樹脂層１３の合わせ面の全体に接着剤を塗布して第１接着剤層１２を形成し、これらを貼り合わせる。   The metal foil 11 and the heat-fusible resin layer 15 are pasted on the metal foil 11 after applying the adhesive while forming the adhesive-unapplied portion 14a to which the adhesive is not applied using a gravure roll having irregularities on the surface. Aging is also performed. As a method of applying the adhesive, there is a method of spraying and applying the adhesive while forming an unapplied portion by an ink jet method in addition to roll application. The heat-resistant resin layer 13 having no easily peelable portion is formed by applying an adhesive to the entire mating surface of the metal foil 11 and the heat-resistant resin layer 13 to form the first adhesive layer 12 and bonding them together.

図１Ａおよび図１Ｃのラミネート材２は、金属箔１１の一方の面に第１接着剤層１２を介してケースの外側層となる耐熱性樹脂層１３が積層されている。前記金属箔層１１の他方の面には所要位置にシート状の離型紙１６が配置され、離型紙１６上を含む全面に第２接着剤層１４が積層されて熱融着性樹脂層１５が貼り合わされている。前記離型紙１６は金属箔１１に対して接着性が無いかあるいは極めて接着性の低い材料で構成されたシートである。一方、前記離型紙１６と熱融着性樹脂層１５は第２接着剤層１４によって強く接着されている。このため、前記離型紙１６が配置された部分は周囲よりも金属箔１１と熱融着性樹脂層１５との接合力が弱い。従って、前記ラミネート材２において、熱融着性樹脂層１５の易剥離部２１は離型紙１６に重なる部分に形成されている。   1A and 1C has a heat-resistant resin layer 13 that is an outer layer of a case laminated on one surface of a metal foil 11 with a first adhesive layer 12 interposed therebetween. On the other surface of the metal foil layer 11, a sheet-like release paper 16 is disposed at a required position, and a second adhesive layer 14 is laminated on the entire surface including the release paper 16 to form a heat-fusible resin layer 15. It is pasted together. The release paper 16 is a sheet made of a material that has no or very low adhesion to the metal foil 11. On the other hand, the release paper 16 and the heat-fusible resin layer 15 are strongly bonded by the second adhesive layer 14. For this reason, the bonding force between the metal foil 11 and the heat-fusible resin layer 15 is weaker in the portion where the release paper 16 is disposed than in the surrounding area. Therefore, in the laminate material 2, the easily peelable portion 21 of the heat-fusible resin layer 15 is formed in a portion overlapping the release paper 16.

前記離型紙１６は金属箔１１と熱融着性樹脂層１５との接合力を弱めるための離型材の一種である。離型材は金属箔１１と熱融着性樹脂層１５との接合力を弱めることができるものであればよく、前記離型紙１６に代えて液状の離型剤を塗布することでも易剥離部を形成することができる。   The release paper 16 is a kind of release material for weakening the bonding force between the metal foil 11 and the heat-fusible resin layer 15. The release material may be any material that can weaken the bonding force between the metal foil 11 and the heat-fusible resin layer 15, and the easy release portion can be formed by applying a liquid release agent instead of the release paper 16. Can be formed.

前記ラミネート材２は、金属箔１１の所要位置に離型紙１６等の離型材を配置し、あるいは塗布し、離型材上を含む金属箔１１の全面に接着剤を塗布して第２接着剤層１４を形成し、熱融着性樹脂層１５を貼り合わせることによって作製することができる。前記金属箔１１と耐熱性樹脂層１３とは合わせ面の全体に接着剤を塗布して貼り合わせる。また、金属箔１１と熱融着性樹脂層１５は接着剤を用いずに熱融着性樹脂層１５自身の粘着力で金属箔１１に貼り合わせることもでき、離型材を用いることで接着剤層を介在させることなく易剥離部を形成できる。易剥離部の無い耐熱性樹脂層１３は、上記のラミネート材１と同じく、金属箔１１と耐熱性樹脂層１３の合わせ面の全体に接着剤を塗布して第１接着剤層１２を形成し、これらを貼り合わせる。   The laminate material 2 has a second adhesive layer in which a release material such as a release paper 16 is disposed or applied at a required position of the metal foil 11 and an adhesive is applied to the entire surface of the metal foil 11 including the release material. 14 and the heat-sealable resin layer 15 can be bonded together. The metal foil 11 and the heat resistant resin layer 13 are bonded together by applying an adhesive to the entire mating surface. Moreover, the metal foil 11 and the heat-fusible resin layer 15 can be bonded to the metal foil 11 by the adhesive force of the heat-fusible resin layer 15 itself without using an adhesive, and the adhesive can be obtained by using a release material. An easy peeling part can be formed without interposing a layer. The heat-resistant resin layer 13 having no easily peelable portion is formed with the first adhesive layer 12 by applying an adhesive to the entire mating surface of the metal foil 11 and the heat-resistant resin layer 13 in the same manner as the laminate material 1 described above. Paste these together.

前記ラミネート材１、２は金属箔１１の両面に樹脂層が形成されているが、金属箔１１の一方の面にのみ樹脂層が形成されているラミネート材にも本発明の加工方法を適用できる。また、前記ラミネート材１、２は熱融着性樹脂層１５のみに易剥離部２０、２１が形成されているが、耐熱性樹脂層１３のみに易剥離部を設けることも、両面に易剥離部を設けることも自由に設定できる。耐熱性樹脂層１３の易剥離部を設ける方法は、上述した熱融着性樹脂層１５の易剥離部２０、２１の形成方法と同じである。また、易剥離部の形状および数も何ら制限されない。易剥離部は図示例の四角形の他、多角形、円形、楕円形、不定形等、任意形状に形成することができる。易剥離部は金属露出部の前段階の状態であるから、金属露出部の形状および数が何ら制限されないように、ラミネート材の用途に応じて易剥離部の形状および数を自由に設定できる。   The laminate materials 1 and 2 have resin layers formed on both surfaces of the metal foil 11, but the processing method of the present invention can also be applied to laminate materials in which the resin layer is formed only on one surface of the metal foil 11. . In addition, the laminate materials 1 and 2 are provided with the easily peelable portions 20 and 21 only on the heat-fusible resin layer 15, but it is also possible to provide an easily peelable portion only on the heat resistant resin layer 13. It is also possible to freely set the part. The method of providing the easy peeling part of the heat resistant resin layer 13 is the same as the method of forming the easy peeling parts 20 and 21 of the heat-fusible resin layer 15 described above. Further, the shape and number of the easy peeling portions are not limited at all. The easy peeling part can be formed in an arbitrary shape such as a polygon, a circle, an ellipse, and an indeterminate shape in addition to the quadrangle shown in the drawing. Since the easily peelable portion is a state before the metal exposed portion, the shape and number of the easily peelable portion can be freely set according to the use of the laminate material so that the shape and number of the metal exposed portion are not limited at all.

（ラミネート材の材料）
本発明はラミネート材を構成する各層の材料を限定するものではなく、ラミネート材の用途に応じて適宜選択する。以下は、電池ケースの好ましい材料の例である。 (Laminate material)
The present invention does not limit the material of each layer constituting the laminate material, and is appropriately selected according to the use of the laminate material. The following are examples of preferred materials for battery cases.

金属箔１１として、アルミニウム箔、ステンレス箔、ニッケル箔、銅箔、チタン箔、これらの金属のクラッド箔を例示でき、さらにはこれらの金属箔にめっきを施しためっき箔を例示できる。また、これらの金属箔に化成皮膜を形成することも好ましい。金属箔１１の厚さは７μｍ〜１５０μｍが好ましい。   Examples of the metal foil 11 include an aluminum foil, a stainless steel foil, a nickel foil, a copper foil, a titanium foil, and a clad foil of these metals, and further, a plating foil obtained by plating these metal foils. It is also preferable to form a chemical conversion film on these metal foils. The thickness of the metal foil 11 is preferably 7 μm to 150 μm.

耐熱性樹脂層１３を構成する耐熱性樹脂としては、ラミネート材をヒートシールする際のヒートシール温度で溶融しない耐熱性樹脂を用いる。前記耐熱性樹脂としては、熱融着性樹脂層１５を構成する熱可塑性樹脂の融点より１０℃以上高い融点を有する熱可塑性樹脂を用いるのが好ましく、熱可塑性樹脂の融点より２０℃以上高い融点を有する熱可塑性樹脂を用いるのが特に好ましい。例えば、ポリアミドフィルム、ポリエステルフィルム等が挙げられ、これらの延伸フィルムが好ましく用いられる。中でも、成形性および強度の点で、二軸延伸ポリアミドフィルムまたは二軸延伸ポリエステルフィルム、あるいはこれらを含む複層フィルムが特に好ましく、さらに二軸延伸ポリアミドフィルムと二軸延伸ポリエステルフィルムとが貼り合わされた複層フィルムを用いることが好ましい。前記ポリアミドフィルムとしては、特に限定されるものではないが、例えば、６−ポリアミドフィルム、６，６−ポリアミドフィルム、ＭＸＤポリアミドフィルム等が挙げられる。また、二軸延伸ポリエステルフィルムとしては、二軸延伸ポリブチレンテレフタレート（ＰＢＴ）フィルム、二軸延伸ポリエチレンテレフタレート（ＰＥＴ）フィルム等が挙げられる。また、耐熱性樹脂層１３は、単層で形成されていても良いし、あるいは、例えばＰＥＴフィルム／ポリアミドフィルムからなる複層で形成されていても良い。また、厚さは９μｍ〜５０μｍの範囲が好ましい。   As the heat-resistant resin constituting the heat-resistant resin layer 13, a heat-resistant resin that does not melt at the heat sealing temperature when heat-sealing the laminate material is used. As the heat-resistant resin, it is preferable to use a thermoplastic resin having a melting point higher by 10 ° C. or higher than the melting point of the thermoplastic resin constituting the heat-fusible resin layer 15, and a melting point higher by 20 ° C. or higher than the melting point of the thermoplastic resin. It is particularly preferable to use a thermoplastic resin having For example, a polyamide film, a polyester film, etc. are mentioned, These stretched films are used preferably. Among them, in terms of moldability and strength, a biaxially stretched polyamide film or a biaxially stretched polyester film, or a multilayer film containing these is particularly preferable, and the biaxially stretched polyamide film and the biaxially stretched polyester film are bonded together. It is preferable to use a multilayer film. The polyamide film is not particularly limited, and examples thereof include 6-polyamide film, 6,6-polyamide film, MXD polyamide film and the like. Examples of the biaxially stretched polyester film include a biaxially stretched polybutylene terephthalate (PBT) film and a biaxially stretched polyethylene terephthalate (PET) film. Moreover, the heat resistant resin layer 13 may be formed as a single layer or may be formed as a multilayer composed of, for example, a PET film / polyamide film. The thickness is preferably in the range of 9 μm to 50 μm.

熱融着性樹脂層１５を構成する熱可塑性樹脂としては、耐薬品性および熱封止性の点で、ポリエチレン、ポリプロピレン、オレフィン系共重合体、これらの酸変性物およびアイオノマーで構成されるのが好ましい。また、オレフィン系共重合体として、ＥＶＡ（エチレン・酢酸ビニル共重合体）、ＥＡＡ（エチレン・アクリル酸共重合体）、ＥＭＡＡ（エチレン・メタアクリル酸共重合体）を例示できる。また、ポリアミドフィルム（例えば１２ナイロン）やポリイミドフィルムも使用できる。また、厚さは２０μｍ〜８０μｍの範囲が好ましい。   The thermoplastic resin constituting the heat-fusible resin layer 15 is composed of polyethylene, polypropylene, an olefin copolymer, an acid-modified product thereof, and an ionomer in terms of chemical resistance and heat sealing properties. Is preferred. Examples of the olefin copolymer include EVA (ethylene / vinyl acetate copolymer), EAA (ethylene / acrylic acid copolymer), and EMAA (ethylene / methacrylic acid copolymer). A polyamide film (for example, 12 nylon) or a polyimide film can also be used. The thickness is preferably in the range of 20 μm to 80 μm.

耐熱性樹脂層１３側の第１接着剤１２としては、例えば、主剤としてのポリエステル樹脂と硬化剤としての多官能イソシアネート化合物とによる二液硬化型ポリエステル−ウレタン系樹脂、あるいはポリエーテル−ウレタン系樹脂を含む接着剤を用いることが好ましい。一方、熱融着性樹脂層１５側の第２接着剤１４としては、例えば、ポリウレタン系接着剤、アクリル系接着剤、エポキシ系接着剤、ポリオレフィン系接着剤、エラストマー系接着剤、フッ素系接着剤等により形成された接着剤が挙げられる。   As the first adhesive 12 on the heat resistant resin layer 13 side, for example, a two-component curable polyester-urethane resin or a polyether-urethane resin using a polyester resin as a main agent and a polyfunctional isocyanate compound as a curing agent is used. It is preferable to use an adhesive containing On the other hand, as the second adhesive 14 on the heat-fusible resin layer 15 side, for example, polyurethane adhesive, acrylic adhesive, epoxy adhesive, polyolefin adhesive, elastomer adhesive, fluorine adhesive, etc. An adhesive formed by, for example, is mentioned.

［金属露出部の形成］
図２に示すように、前記ラミネート材１の熱融着性樹脂層１５側の面において、レーザー切断装置３０およびガスノズル３１を配置し、易剥離部２０にガスＧを吹き付けながらの易剥離部２０周縁に沿ってレーザーＬを照射し、熱融着性樹脂層１５を溶断する。レーザーＬが照射された部分は樹脂が溶融し、溶融した樹脂はガスＧによって急速に冷却されて凝固することによって切断される。照射部はガスＧによって急速に冷却されるので、溶融した樹脂が再融着することなく確実に切断される。また、溶融して熱融着性樹脂層１５から離れた樹脂の微細片や蒸発した樹脂はガスＧに吹き飛ばされて切断部から離れるので、これらの樹脂が切断部に付着してバリとなったり、金属箔１１に付着することもない。前記易剥離部２０の全周にレーザーＬが照射すると、樹脂層片となった易剥離部２０がラミネート材１から完全に切り離され、易剥離部２０を除去することによって金属箔１１が露出して金属露出部２２が形成される。易剥離部２０の直下は接着剤未塗布部１４ａであるから、易剥離部２０の除去によって金属箔１１を露出させることができる。 [Formation of exposed metal parts]
As shown in FIG. 2, a laser cutting device 30 and a gas nozzle 31 are arranged on the surface of the laminate material 1 on the heat-fusible resin layer 15 side, and the easy peeling part 20 while blowing the gas G to the easy peeling part 20. Laser L is irradiated along the periphery, and the heat-fusible resin layer 15 is fused. The portion irradiated with the laser L melts the resin, and the melted resin is rapidly cooled by the gas G and solidified to be cut. Since the irradiated portion is rapidly cooled by the gas G, the molten resin is reliably cut without being re-fused. In addition, since the fine resin pieces and the evaporated resin separated from the heat-fusible resin layer 15 after being melted are blown off by the gas G and separated from the cutting portion, these resins adhere to the cutting portion and become burrs. Also, it does not adhere to the metal foil 11. When the laser L irradiates the entire circumference of the easy peeling part 20, the easy peeling part 20 that has become a resin layer piece is completely separated from the laminate material 1, and the metal foil 11 is exposed by removing the easy peeling part 20. Thus, the exposed metal portion 22 is formed. Since the adhesive-unapplied part 14a is directly under the easy-release part 20, the metal foil 11 can be exposed by removing the easy-release part 20.

また、前記易剥離部２０を確実に切り離すには、易剥離部２０の周縁よりも僅かに内側を狙ってレーザーＬを照射し、照射位置が第２接着剤層１４に重ならないようにすることが好ましい。   Moreover, in order to cut | disconnect the said easily peelable part 20 reliably, it irradiates the laser L aiming a little inside rather than the periphery of the easily peelable part 20, and the irradiation position does not overlap the 2nd adhesive bond layer 14. FIG. Is preferred.

切り離した易剥離部２０は、吸引する、摘まむ、粘着シートを貼って引っ張る等の簡単な方法で除去できる。上述したように、易剥離部２０は周囲が確実に切断されているのでいずれも容易に除去することができる。図２に示すように、ガスノズル３１と対向する位置に吸引ノズル３２を配置して切断した易剥離部２０を吸引すれば、易剥離部２０がガスＧで吹き飛ばされても散乱させることなく回収できる。しかも、前記吸引ノズル３２によって溶融して熱融着性樹脂層１５から離れた樹脂の微細片や蒸発した樹脂も吸引されるので、これらがラミネート材１に付着することを防ぐことができる。   The separated easily peelable portion 20 can be removed by a simple method such as sucking, picking, or sticking and pulling an adhesive sheet. As described above, since the periphery of the easy peeling portion 20 is reliably cut, both can be easily removed. As shown in FIG. 2, if the easy-peeling portion 20 is sucked by disposing the suction nozzle 32 at a position facing the gas nozzle 31 and is cut, it can be recovered without being scattered even if the easy-peeling portion 20 is blown off by the gas G. . In addition, since fine pieces of the resin melted by the suction nozzle 32 and separated from the heat-fusible resin layer 15 and evaporated resin are also sucked, it is possible to prevent them from adhering to the laminate material 1.

図３に示すように、前記ラミネート材２も同じ方法でレーザーＬの照射とガスＧの吹き付けによって熱融着性樹脂層１５の易剥離部２１を切断する。レーザーＬは離型紙１６に到達するように照射して第２接着剤層１４も切断する。前記易剥離部２１の全周を切断すると、離型紙１６は第２接着剤層１４に強く接合されているので金属箔１１と離型紙１６との間で剥離する。そして、離型紙１６と一体となった易剥離部２１をラミネート材２から除去することによって金属露出部２２が形成される。切断した易剥離部２１は上述のラミネート材１の易剥離部２０と同じ方法で除去することができ、易剥離部２１の除去によって金属露出部２２が形成される。   As shown in FIG. 3, the laminating material 2 also cuts the easily peelable portion 21 of the heat-fusible resin layer 15 by laser L irradiation and gas G spraying in the same manner. The laser L is irradiated so as to reach the release paper 16, and the second adhesive layer 14 is also cut. When the entire circumference of the easy peeling portion 21 is cut, the release paper 16 is strongly bonded to the second adhesive layer 14, and thus peels between the metal foil 11 and the release paper 16. And the metal exposure part 22 is formed by removing the easy peeling part 21 integrated with the release paper 16 from the laminate material 2. The easily peelable portion 21 that has been cut can be removed by the same method as the easy peel portion 20 of the laminate 1 described above, and the metal exposed portion 22 is formed by removing the easily peelable portion 21.

易剥離部２０、２１の切断に使用するレーザーＬは、樹脂層の吸収波長に合わせたレーザー種を用い、出力を調節することで金属箔に影響を与えずに樹脂層のみを切断することができる。例えば、ポリオレフィンフィルムに対してはＣＯ２レーザーが適している。 The laser L used for cutting the easily peelable portions 20 and 21 can cut only the resin layer without affecting the metal foil by adjusting the output by using a laser type that matches the absorption wavelength of the resin layer. it can. For example, a CO 2 laser is suitable for a polyolefin film.

易剥離部２０、２１に吹き付けるガスＧは、溶融した樹脂を急速に凝固させるために３０℃以下であることが好ましい。また、ガス種は空気、窒素ガス等の不活性ガスを用いることができる。但し、温度を下げすぎると結露が起こり易くなるため、作業環境雰囲気で露点以上であることが好ましい。特に好ましいガスＧの温度は−５０℃〜２５℃である。また、前記ガスノズル３１は直径０．１ｍｍ以上１００ｍｍ未満が好ましい。ガス圧は０．０５ＭＰａ以上１５ＭＰａ未満が好ましく、ガス流量は０．０１リットル／ｍｉｎ以上１０００リットル／ｍｉｎ未満が好ましい。   It is preferable that the gas G sprayed to the easy peeling parts 20 and 21 is 30 degrees C or less in order to solidify the molten resin rapidly. As the gas species, an inert gas such as air or nitrogen gas can be used. However, if the temperature is lowered too much, condensation tends to occur. Therefore, it is preferable that the dew point is higher than the working environment atmosphere. A particularly preferable temperature of the gas G is -50 ° C to 25 ° C. The gas nozzle 31 preferably has a diameter of 0.1 mm or more and less than 100 mm. The gas pressure is preferably 0.05 MPa or more and less than 15 MPa, and the gas flow rate is preferably 0.01 liter / min or more and less than 1000 liter / min.

下記の材料を用いて、図１Ａ〜図１Ｃに参照される２種類のラミネート材１、２作製した。   Two types of laminate materials 1 and 2 referred to FIG. 1A to FIG. 1C were prepared using the following materials.

金属箔層１１：厚さ４０μｍの軟質アルミニウム箔（ＪＩＳ Ｈ４１６０ Ａ８０７９Ｈ）の片面に厚さ１μｍの錫めっき皮膜を形成したもの
耐熱性樹脂層１３：厚さ２５μｍの延伸ナイロンフィルム
熱融着性樹脂層１５：厚さ３０μｍの未延伸ポリプロピレンフィルム
第１接着剤層１２：二液硬化型ポリエステル−ウレタン系接着剤
第２接着剤層１４：二液硬化型酸変性ポリプロピレン系接着剤
前記ラミネート材１、２は、いずれも１５０ｍｍ×１９０ｍｍの長方形であり、熱融着性樹脂層１５の中央に４０ｍｍ×３０ｍｍでコーナー部のＲが１ｍｍの長方形の易剥離部２０、２１を有している。 Metal foil layer 11: 40 μm thick soft aluminum foil (JIS H4160 A8079H) with a 1 μm thick tin-plated film Heat-resistant resin layer 13: 25 μm thick stretched nylon film Heat-fusible resin layer 15: Unstretched polypropylene film having a thickness of 30 μm First adhesive layer 12: Two-component curable polyester-urethane adhesive Second adhesive layer 14: Two-component curable acid-modified polypropylene adhesive The laminate materials 1 and 2 Are both rectangular of 150 mm × 190 mm, and have easily peelable portions 20, 21 having a rectangular shape of 40 mm × 30 mm and a corner portion R of 1 mm in the center of the heat-fusible resin layer 15.

ラミネート材１は、グラビアロールを用いて４０ｍｍ×３０ｍｍ（コーナー部Ｒ：１ｍｍ）の接着剤未塗布部１４ａを形成しつつ第２接着剤層１４により金属箔１１と熱融着性樹脂層１５を貼り合わせて易剥離部２０を形成し、金属箔１１と耐熱性樹脂層１３は全面に第１接着剤層１２を形成して貼り合わせた。   The laminating material 1 uses the gravure roll to form the 40 mm × 30 mm (corner portion R: 1 mm) adhesive non-applied portion 14 a while the metal foil 11 and the heat-fusible resin layer 15 are formed by the second adhesive layer 14. The easy peeling part 20 was formed by bonding, and the metal foil 11 and the heat resistant resin layer 13 were bonded together by forming the first adhesive layer 12 on the entire surface.

ラミネート材２は、金属箔１１上に４０ｍｍ×３０ｍｍ（コーナー部Ｒ：１ｍｍ）の離型紙１６を配置し、第２接着剤層１４を形成して熱融着性樹脂層１５を貼り合わせて易剥離部２１を形成し、金属箔１１と耐熱性樹脂層１３は全面に第１接着剤層１２を形成して貼り合わせた。   The laminating material 2 is easily formed by disposing a release paper 16 of 40 mm × 30 mm (corner portion R: 1 mm) on the metal foil 11, forming a second adhesive layer 14, and bonding the heat-fusible resin layer 15 together. The peeling part 21 was formed, and the metal foil 11 and the heat-resistant resin layer 13 were bonded together by forming the first adhesive layer 12 over the entire surface.

作製したラミネート材１、２は下記の条件で易剥離部２０、２１を切断した。
（実施例１）
図２に示すように、ラミネート材１に対してレーザーＬが角度９０°で照射されるようにレーザー切断装置３０を配置し、角度４５°でガスＧを吹き付けるようにガスノズル３１を配置した。前記レーザーＬは波長１０．６μｍ、出力６０ＷのＣＯ２レーザーである。前記ガスノズル３１は先端の開口直径が１ｍｍのノズルを１６連に繋げたものであり、０．２ＭＰａに加圧した２５℃のドライエア（露点−１７℃）を流量３００リットル／ｍｉｎで吹き付けた。前記易剥離部２０周縁から０．５ｍｍ内側にレーザーＬが照射されるように１ｍｍ／ｍｉｎで走査し、レーザー照射位置にガスＧが供給されるようにガスノズル３１の位置を調整し、ガスを吹き付けながら易剥離部２０を３９ｍｍ×２９ｍｍの寸法で切断した。
（実施例２）
図３に示すように、ラミネート材２に対してレーザーＬが角度９０°で照射されるようにレーザー切断装置３０を配置し、角度４５°でガスＧを吹き付けるようにガスノズル３１を配置した。前記レーザーＬは波長１０．６μｍ、出力６０ＷのＣＯ２レーザーである。前記ガスノズル３１は先端の開口直径が１ｍｍのノズルを１６連に繋げたものであり、０．２ＭＰａに加圧した２５℃のドライエア（露点−１７℃）を流量３００リットル／ｍｉｎで吹き付けた。前記易剥離部２１周縁の０．５ｍｍ内側にレーザーＬが照射されるように１ｍｍ／ｍｉｎで走査し、レーザー照射位置にガスＧが供給されるようにガスノズル３１の位置を調整し、ガスを吹き付けながら易剥離部２1を３９ｍｍ×２９ｍｍの寸法で切断した。
（実施例３）
ラミネート材１に対し、ガスＧとして５℃のドライエア（露点−３１℃）を用いたことを除いて実施例１と同じ方法で易剥離部２０を切断した。
（実施例４）
ラミネート材２に対し、ガスＧとして５℃のドライエア（露点−３１℃）を用いたことを除いて実施例２と同じ方法で易剥離部２１を切断した。
（実施例５）
ラミネート材１に対し、ガスＧとして−５０℃の窒素（露点−８６℃）を用いたことを除いて実施例１と同じ方法で易剥離部２０を切断した。
（実施例６）
ラミネート材２に対し、ガスＧとして−５０℃の窒素（露点−８６℃）を用いたことを除いて実施例２と同じ方法で易剥離部２１を切断した。
（比較例１）
ラミネート材１に対し、ガスＧを供給しなかったことを除いて実施例１と同じ方法で易剥離部２０を切断した。
（比較例２）
ラミネート材２に対し、ガスＧを供給しなかったことを除いて実施例２と同じ方法で易剥離部２１を切断した。 The produced laminate materials 1 and 2 were cut off the easy peeling portions 20 and 21 under the following conditions.
Example 1
As shown in FIG. 2, the laser cutting device 30 was arranged so that the laser L was applied to the laminate material 1 at an angle of 90 °, and the gas nozzle 31 was arranged so as to blow the gas G at an angle of 45 °. The laser L is a CO 2 laser having a wavelength of 10.6 μm and an output of 60 W. The gas nozzle 31 is composed of 16 nozzles with an opening diameter of 1 mm at the tip, and 25 ° C. dry air (dew point−17 ° C.) pressurized to 0.2 MPa was blown at a flow rate of 300 liters / min. Scanning at 1 mm / min so that the laser L is irradiated 0.5 mm inward from the periphery of the easy peeling portion 20, adjusting the position of the gas nozzle 31 so that the gas G is supplied to the laser irradiation position, and blowing the gas However, the easy peeling part 20 was cut | disconnected by the dimension of 39 mm x 29 mm.
(Example 2)
As shown in FIG. 3, the laser cutting device 30 was arranged so that the laser L was irradiated to the laminate material 2 at an angle of 90 °, and the gas nozzle 31 was arranged to blow the gas G at an angle of 45 °. The laser L is a CO 2 laser having a wavelength of 10.6 μm and an output of 60 W. The gas nozzle 31 are those apertures the diameter of the tip by connecting the nozzle of 1mm to 16 stations, sprayed 0.2MPa to pressurized 25 ° C. in dry air (the dew point -17 ° C.) at a flow rate of 300 l / min. Scanning at 1 mm / min so that the laser L is irradiated 0.5 mm inside the periphery of the easy peeling portion 21, adjusting the position of the gas nozzle 31 so that the gas G is supplied to the laser irradiation position, and blowing the gas However, the easy peeling part 21 was cut in a size of 39 mm × 29 mm.
(Example 3)
The easy peeling part 20 was cut | disconnected by the same method as Example 1 except having used 5 degreeC dry air (dew point -31 degreeC) as the gas G with respect to the laminate material 1. FIG.
Example 4
The easy peeling part 21 was cut | disconnected by the same method as Example 2 except having used 5 degreeC dry air (dew point -31 degreeC) as the gas G with respect to the laminate material 2. FIG.
(Example 5)
The easy peeling part 20 was cut | disconnected by the same method as Example 1 except having used -50 degreeC nitrogen (dew point -86 degreeC) as the gas G with respect to the laminate material 1. FIG.
(Example 6)
The easy peeling part 21 was cut | disconnected by the same method as Example 2 except having used -50 degreeC nitrogen (dew point -86 degreeC) as the gas G with respect to the laminate material 2. FIG.
(Comparative Example 1)
The easy peeling part 20 was cut | disconnected by the same method as Example 1 except not having supplied gas G with respect to the laminate material 1. FIG.
(Comparative Example 2)
The easy peeling part 21 was cut | disconnected by the same method as Example 2 except not having supplied gas G with respect to the laminate material 2. FIG.

易剥離部２０、２１の周縁を切断したラミネート材１、２に対し、易剥離部２０、２１に粘着テープを貼り、粘着テープを引っ張って易剥離部２０、２１を剥離することによって金属露出部２２を形成した。前記粘着テープは粘着強度の異なる３種類を使用し、剥離の難易性によって下記の基準で評価した。
◎：易剥離部が完全に切断されており、易剥離部を容易に剥離できた
○：僅かに樹脂の再融着があったが、易剥離部を剥離できた
×：樹脂の融着があり、粘着テープが易剥離部から外れたために易剥離部を剥離できなかった
さらに、３種類の粘着テープによる剥離の難易に基づいて、総合的に剥離の難易を◎、○、×の３段階で相対的に評価した。 For the laminates 1 and 2 obtained by cutting the peripheral edges of the easy peeling portions 20 and 21, a metal exposed portion is obtained by applying an adhesive tape to the easy peeling portions 20 and 21 and peeling the easy peeling portions 20 and 21 by pulling the adhesive tape. 22 was formed. Three types of the adhesive tapes having different adhesive strengths were used, and the following criteria were evaluated according to the difficulty of peeling.
◎: Easy peelable part was completely cut and easy peelable part was easily peeled ○: Resin was slightly refused, but easy peelable part was peeled x: Resin fused Yes, the easy peeling part could not be peeled because the adhesive tape was removed from the easy peeling part. Furthermore, based on the difficulty of peeling with three types of adhesive tapes, the peeling difficulty was comprehensively divided into three stages: ◎, ○, × It was evaluated relatively.

また、易剥離部２０、２１を除去した後に、切断部および金属露出部を目視観察してバリの発生および金属箔への樹脂の付着を調べ、バリが発生しなかったもの、樹脂の付着の無かったものをそれぞれ〇、バリの発生が見られたもの、樹脂の付着が見られたものをそれぞれ×として判定した。   In addition, after removing the easily peelable portions 20 and 21, the cut portion and the exposed metal portion were visually observed to check for the occurrence of burrs and adhesion of the resin to the metal foil. The case where there was no ◯, the case where generation of burrs was observed, and the case where adhesion of resin was observed were determined as x, respectively.

表１に、加工条件の概要および評価結果を示す。   Table 1 shows an overview of the processing conditions and the evaluation results.

Figure 2018065331
Figure 2018065331

表１に示したように、照射部にガスを吹き付けることによって、金属箔を傷つけることなく確実に易剥離部を切断できることを確認した。   As shown in Table 1, it was confirmed that the easily peelable part could be reliably cut without damaging the metal foil by blowing gas to the irradiated part.

本発明は、電池やコンデンサのケース等用いられるラミネート材の加工に利用できる。   INDUSTRIAL APPLICABILITY The present invention can be used for processing a laminate material used for a battery or a capacitor case.

１、２…ラミネート材
１１…金属箔
１２…第１接着剤層
１３…耐熱性樹脂層
１４…第２接着剤層
１４ａ…接着剤未塗布部
１５…熱融着性樹脂層
１６…離型紙
２０、２１…易剥離部
２２…金属露出部
３０…レーザー切断装置
３１…ガスノズル
３２…吸引ノズル
Ｌ…レーザー
Ｇ…ガス DESCRIPTION OF SYMBOLS 1, 2 ... Laminate 11 ... Metal foil 12 ... 1st adhesive layer 13 ... Heat-resistant resin layer 14 ... 2nd adhesive layer 14a ... Adhesive non-application part 15 ... Thermal-fusion-bonding resin layer 16 ... Release paper 20 , 21 ... easy peeling part 22 ... metal exposed part 30 ... laser cutting device 31 ... gas nozzle 32 ... suction nozzle L ... laser G ... gas

Claims (4)

金属箔と樹脂層が貼り合わされ、前記樹脂層に、金属箔に対する接合力が周囲よりも弱い易剥離部が形成されたラミネート材に対し、
前記樹脂層の易剥離部にガスを吹き付けながら、易剥離部の周縁にレーザーを照射して樹脂層を切断し、切断した易剥離部を除去して金属箔が露出する金属露出部を形成することを特徴とするラミネート材の加工方法。 For the laminate material in which the metal foil and the resin layer are bonded, and the resin layer has an easily peelable portion where the bonding force to the metal foil is weaker than the surroundings.
While blowing gas to the easy peeling part of the resin layer, the periphery of the easy peeling part is irradiated with a laser to cut the resin layer, and the metal peeling part is formed by removing the cut easy peeling part and exposing the metal foil. A method for processing a laminate material. 前記金属箔と樹脂層が接着剤層によって貼り合わされ、前記接着剤層は部分的に接着剤が塗布されていない接着剤未塗布部を有し、前記易剥離部が接着剤未塗布部に重なる部分に形成されている請求項１に記載のラミネート材の加工方法。   The metal foil and the resin layer are bonded together by an adhesive layer, the adhesive layer has an adhesive non-applied portion where the adhesive is not partially applied, and the easy-peeling portion overlaps the adhesive non-applied portion. The method for processing a laminate material according to claim 1, wherein the laminate material is formed in a portion. 前記金属箔と樹脂層との間に金属箔に接触して離型材が配置され、前記易剥離部が離型材に重なる部分に形成されている請求項１に記載のラミネート材の加工方法。   The processing method of the laminate material according to claim 1, wherein a release material is disposed between the metal foil and the resin layer in contact with the metal foil, and the easily peelable portion is formed in a portion overlapping the release material. 切断した易剥離部を吸引して除去する請求項１〜３のうちのいずれか１項に記載のラミネート材の加工方法。
The processing method of the laminate material according to any one of claims 1 to 3, wherein the easily peelable portion that has been cut is removed by suction.
JP2016206499A 2016-10-21 2016-10-21 Method for working laminate material Pending JP2018065331A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016206499A JP2018065331A (en) 2016-10-21 2016-10-21 Method for working laminate material
CN201710986914.3A CN107972349A (en) 2016-10-21 2017-10-20 The processing method of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016206499A JP2018065331A (en) 2016-10-21 2016-10-21 Method for working laminate material

Publications (1)

Publication Number Publication Date
JP2018065331A true JP2018065331A (en) 2018-04-26

Family

ID=62012560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016206499A Pending JP2018065331A (en) 2016-10-21 2016-10-21 Method for working laminate material

Country Status (2)

Country Link
JP (1) JP2018065331A (en)
CN (1) CN107972349A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10833135B2 (en) 2018-10-16 2020-11-10 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible organic light emitting diode display device and method of fabricating same
CN109494315A (en) * 2018-10-16 2019-03-19 武汉华星光电半导体显示技术有限公司 Flexible OLED display and preparation method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04356385A (en) * 1991-05-30 1992-12-10 Hitachi Chem Co Ltd Laser beam machining method for synthetic resin formed part
JP2008284572A (en) * 2007-05-16 2008-11-27 Nitto Denko Corp Laser beam machining method and article machined by laser beam
US20150325819A1 (en) * 2014-05-08 2015-11-12 Showa Denko Packaging Co., Ltd. Electrochemical device
JP2015205504A (en) * 2014-04-07 2015-11-19 昭和電工パッケージング株式会社 Method for producing laminate exterior material
JP2016031829A (en) * 2014-07-29 2016-03-07 昭和電工パッケージング株式会社 Insulation quality inspection method of electrochemical device
KR20160086264A (en) * 2015-01-09 2016-07-19 쇼와 덴코 패키징 가부시키가이샤 Outer body for electrical storage device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2677079Y (en) * 2003-02-11 2005-02-09 星云电脑股份有限公司 Laser processing machine blowing spray nozzle

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04356385A (en) * 1991-05-30 1992-12-10 Hitachi Chem Co Ltd Laser beam machining method for synthetic resin formed part
JP2008284572A (en) * 2007-05-16 2008-11-27 Nitto Denko Corp Laser beam machining method and article machined by laser beam
JP2015205504A (en) * 2014-04-07 2015-11-19 昭和電工パッケージング株式会社 Method for producing laminate exterior material
US20150325819A1 (en) * 2014-05-08 2015-11-12 Showa Denko Packaging Co., Ltd. Electrochemical device
JP2015228365A (en) * 2014-05-08 2015-12-17 昭和電工パッケージング株式会社 Electrochemical device
JP2016031829A (en) * 2014-07-29 2016-03-07 昭和電工パッケージング株式会社 Insulation quality inspection method of electrochemical device
KR20160086264A (en) * 2015-01-09 2016-07-19 쇼와 덴코 패키징 가부시키가이샤 Outer body for electrical storage device

Also Published As

Publication number Publication date
CN107972349A (en) 2018-05-01

Similar Documents

Publication Publication Date Title
US11059281B2 (en) Method of producing laminate material
JP2018065331A (en) Method for working laminate material
JP2016122495A (en) Battery manufacturing method
CN105742714B (en) Method for manufacturing battery
JP6738171B2 (en) Exterior material for power storage device and power storage device
WO2017212984A1 (en) Laminate material
JP6594738B2 (en) Film outer battery
TWI710459B (en) Laminated packaging material
JP2009283382A (en) Method for manufacturing for package material of battery case
JP6586783B2 (en) Packaging bag
JP6680526B2 (en) Laminate packaging
JPH10291082A (en) Method for joining laminated composite material
JP2006341869A (en) Multi-layered container
JP6813336B2 (en) Laminating material processing method
JP5463846B2 (en) Lead member for nonaqueous electrolyte power storage device and nonaqueous electrolyte power storage device
CN106560321B (en) Laminated outer packaging part
JP6878039B2 (en) Gazette bag
JP5509551B2 (en) Method for manufacturing laminate for Rondel molded body, method for manufacturing Rondel molded body, and method for manufacturing tube container
JP6649099B2 (en) Laminate packaging material
JP2018177377A (en) Roll shape laminating material
JPH02219651A (en) Scoring method for laminate and scored laminate
JP2018177440A (en) Winding core and roll shape laminating material
JPH01241435A (en) Forming method of sticking part of envelope in paper vessel
JPS59106928A (en) Preparation of laminated body

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190807

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200625

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200707

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20210105