WO2008136285A1 - 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール - Google Patents

光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール Download PDF

Info

Publication number
WO2008136285A1
WO2008136285A1 PCT/JP2008/057616 JP2008057616W WO2008136285A1 WO 2008136285 A1 WO2008136285 A1 WO 2008136285A1 JP 2008057616 W JP2008057616 W JP 2008057616W WO 2008136285 A1 WO2008136285 A1 WO 2008136285A1
Authority
WO
WIPO (PCT)
Prior art keywords
photoelectric composite
substrate
optical waveguide
composite substrate
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/057616
Other languages
English (en)
French (fr)
Inventor
Tomoaki Shibata
Hiroshi Masuda
Atsushi Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007233295A external-priority patent/JP2009058923A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN2008800135073A priority Critical patent/CN101669053B/zh
Priority to US12/597,534 priority patent/US8244080B2/en
Publication of WO2008136285A1 publication Critical patent/WO2008136285A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

　本発明は、光導波路とシート状接着剤を貼り合わせる工程、該シート状接着剤の支持基材を剥離し、接着剤付き光導波路を作製する工程、該接着剤付き光導波路と電気配線基板を接着し、光導波路付き電気配線板を作製する工程、及び該光導波路付き電気配線基板の光導波路に光路変換ミラーを形成する工程を有する、生産性に優れた光電気複合基板の製造方法、該製造方法を用いて製造される光電気複合基板、及び該光電気複合基板を用いた光電気複合モジュールを提供する。
PCT/JP2008/057616 2007-04-27 2008-04-18 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール Ceased WO2008136285A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800135073A CN101669053B (zh) 2007-04-27 2008-04-18 光电复合基板的制造方法
US12/597,534 US8244080B2 (en) 2007-04-27 2008-04-18 Method for producing photoelectric composite substrate, photoelectric composite substrate produced by the method, and photoelectric composite module using the substrate

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007119538 2007-04-27
JP2007-119538 2007-04-27
JP2007204365 2007-08-06
JP2007-204365 2007-08-06
JP2007233295A JP2009058923A (ja) 2007-04-27 2007-09-07 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール
JP2007-233295 2007-09-07

Publications (1)

Publication Number Publication Date
WO2008136285A1 true WO2008136285A1 (ja) 2008-11-13

Family

ID=39943399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057616 Ceased WO2008136285A1 (ja) 2007-04-27 2008-04-18 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール

Country Status (1)

Country Link
WO (1) WO2008136285A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010058476A1 (ja) * 2008-11-21 2012-04-12 日立化成工業株式会社 光電気混載基板及び電子機器
JP2013228467A (ja) * 2012-04-24 2013-11-07 Nippon Mektron Ltd 光電気混載フレキシブルプリント配線板、及びその製造方法
JP2014219536A (ja) * 2013-05-08 2014-11-20 日立化成株式会社 光導波路

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007461A (ja) * 1999-06-24 2001-01-12 Toppan Printing Co Ltd 光・電気配線基板及び実装基板
JP2001166165A (ja) * 1999-12-08 2001-06-22 Hitachi Cable Ltd 接着シート付き導波路フィルム及びその実装方法
JP2006022317A (ja) * 2004-06-07 2006-01-26 Matsushita Electric Works Ltd エポキシ樹脂フィルム、光導波路、光電気複合基板、光通信モジュール
JP2006039390A (ja) * 2004-07-29 2006-02-09 Sony Corp 光電子装置およびその製造方法
JP2006084488A (ja) * 2004-09-14 2006-03-30 Mitsui Chemicals Inc 光導波路基板、および光電気混載基板
JP2006091500A (ja) * 2004-09-24 2006-04-06 Mitsui Chemicals Inc 光導波路が嵌め込まれた光導波路基板および光電気混載基板
JP2007108228A (ja) * 2005-10-11 2007-04-26 Nitto Denko Corp 光電気混載基板およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007461A (ja) * 1999-06-24 2001-01-12 Toppan Printing Co Ltd 光・電気配線基板及び実装基板
JP2001166165A (ja) * 1999-12-08 2001-06-22 Hitachi Cable Ltd 接着シート付き導波路フィルム及びその実装方法
JP2006022317A (ja) * 2004-06-07 2006-01-26 Matsushita Electric Works Ltd エポキシ樹脂フィルム、光導波路、光電気複合基板、光通信モジュール
JP2006039390A (ja) * 2004-07-29 2006-02-09 Sony Corp 光電子装置およびその製造方法
JP2006084488A (ja) * 2004-09-14 2006-03-30 Mitsui Chemicals Inc 光導波路基板、および光電気混載基板
JP2006091500A (ja) * 2004-09-24 2006-04-06 Mitsui Chemicals Inc 光導波路が嵌め込まれた光導波路基板および光電気混載基板
JP2007108228A (ja) * 2005-10-11 2007-04-26 Nitto Denko Corp 光電気混載基板およびその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010058476A1 (ja) * 2008-11-21 2012-04-12 日立化成工業株式会社 光電気混載基板及び電子機器
JP2013228467A (ja) * 2012-04-24 2013-11-07 Nippon Mektron Ltd 光電気混載フレキシブルプリント配線板、及びその製造方法
JP2014219536A (ja) * 2013-05-08 2014-11-20 日立化成株式会社 光導波路

Similar Documents

Publication Publication Date Title
TWI456274B (zh) 光電複合基板的製造方法、以該方法製造的光電複合基板、以及使用該光電複合基板的光電複合模組
WO2009041212A1 (ja) 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール
WO2008036726A3 (en) Optical interconnect device and method for manufacturing the same
WO2010021669A3 (en) Monolithic coherent optical detectors
WO2005102156A3 (en) Surface mount multi-channel optocoupler
WO2008143773A3 (en) Single crystal phosphor light conversion structures for light emitting devices
EP2214201A4 (en) Process for producing substrate for power module, substrate for power module, and power module
WO2012021196A3 (en) Method for manufacturing electronic devices and electronic devices thereof
WO2009013409A3 (fr) Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple
WO2007128022A3 (de) Leiterplattenelement und methode der herstellung
WO2010013936A3 (en) Semiconductor device, light emitting device and method of manufacturing the same
WO2008102266A3 (en) Method and apparatus for rapid fabrication of functional printed circuit board
WO2009133176A3 (de) Dünnschicht-solarmodul als verbundsicherheitsglas
WO2009001461A1 (ja) 光サブアセンブリの製造方法、光サブアセンブリ、光インタコネクト用デバイス、ｗｄｍ発振器および受信回路
WO2009093718A3 (en) Method of producing a patterned birefringent product and birefringent product
TW200623993A (en) Methods of forming printed circuit boards
WO2009025016A1 (ja) 部品実装装置及び方法
WO2009008217A1 (ja) 層間接続導体用孔の形成方法、樹脂基板及び部品内蔵基板の製造方法、並びに樹脂基板及び部品内蔵基板
WO2008145364A3 (de) Verfahren zur herstellung eines optischen elementes mit hilfe von abformung, optisches element hergestellt nach diesem verfahren, kollektor und beleuchtungssystem
EP1898226A3 (en) Method of manufacturing solar cell panel
CN104716081A (zh) 柔性装置及其制作方法
WO2008078680A1 (ja) 光電気混載基板およびその製造方法
WO2008136285A1 (ja) 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール
WO2009008106A1 (ja) 受光装置および受光装置の製造方法
WO2011057811A3 (de) Verfahren zur herstellung einer optischen baugruppe, optische baugruppe sowie splitterkaskade

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880013507.3

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08740663

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20097022059

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12597534

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08740663

Country of ref document: EP

Kind code of ref document: A1