TWI456274B - 光電複合基板的製造方法、以該方法製造的光電複合基板、以及使用該光電複合基板的光電複合模組 - Google Patents

光電複合基板的製造方法、以該方法製造的光電複合基板、以及使用該光電複合基板的光電複合模組 Download PDF

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Publication number
TWI456274B
TWI456274B TW097115051A TW97115051A TWI456274B TW I456274 B TWI456274 B TW I456274B TW 097115051 A TW097115051 A TW 097115051A TW 97115051 A TW97115051 A TW 97115051A TW I456274 B TWI456274 B TW I456274B
Authority
TW
Taiwan
Prior art keywords
optoelectronic composite
composite substrate
manufacturing
adhesive
substrate
Prior art date
Application number
TW097115051A
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English (en)
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TW200848814A (en
Inventor
Tomoaki Shibata
Hiroshi Masuda
Atsushi Takahashi
Original Assignee
Hitachi Chemical Co Ltd
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Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200848814A publication Critical patent/TW200848814A/zh
Application granted granted Critical
Publication of TWI456274B publication Critical patent/TWI456274B/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Integrated Circuits (AREA)

Claims (3)

  1. 一種光電複合基板的製造方法，此製造方法包括：第1步驟，將光波導與薄片狀接著劑相貼合；第2步驟，剝離該薄片狀接著劑的支持基材，製作附帶接著劑的光波導；第3步驟，將此附帶接著劑的光波導與電氣配線基板相互接著，以製作附帶光波導的電氣配線板；以及第4步驟，於此藉由接著劑接著的附帶光波導的電氣配線基板的光波導中形成光路轉換鏡面。
  2. 一種光電複合基板，該光電複合基板是使用如申請專利範圍第1項所述之製造方法來製造。
  3. 一種光電複合模組，此光電複合模組使用如申請專利範圍第2項所述之光電複合基板。
TW097115051A 2007-04-27 2008-04-24 光電複合基板的製造方法、以該方法製造的光電複合基板、以及使用該光電複合基板的光電複合模組 TWI456274B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007119538 2007-04-27
JP2007204365 2007-08-06
JP2007233295A JP2009058923A (ja) 2007-04-27 2007-09-07 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール

Publications (2)

Publication Number Publication Date
TW200848814A TW200848814A (en) 2008-12-16
TWI456274B true TWI456274B (zh) 2014-10-11

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Family Applications (1)

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TW097115051A TWI456274B (zh) 2007-04-27 2008-04-24 光電複合基板的製造方法、以該方法製造的光電複合基板、以及使用該光電複合基板的光電複合模組

Country Status (5)

Country Link
US (1) US8244080B2 (zh)
JP (1) JP2009058923A (zh)
KR (1) KR20100015794A (zh)
CN (1) CN101669053B (zh)
TW (1) TWI456274B (zh)

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KR20110089408A (ko) 2008-11-21 2011-08-08 히다치 가세고교 가부시끼가이샤 광전기 혼재기판 및 전자기기
JP5684460B2 (ja) * 2009-04-06 2015-03-11 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
KR101090996B1 (ko) * 2009-10-06 2011-12-08 삼성전기주식회사 연성 광기판 및 그 제조방법
TWI495915B (zh) 2009-10-21 2015-08-11 Hitachi Chemical Co Ltd Optical waveguide substrate having a positioning structure, a method of manufacturing the same, and a method of manufacturing the photoelectric hybrid substrate
KR101067793B1 (ko) 2009-11-13 2011-09-27 삼성전기주식회사 연성 광기판 및 그 제조방법
US9146348B2 (en) * 2011-01-07 2015-09-29 Panasonic Intellectual Property Management Co., Ltd. Optical-electrical composite flexible circuit substrate including optical circuit and electrical circuit
JP5840411B2 (ja) 2011-08-05 2016-01-06 日本メクトロン株式会社 光電気混載可撓性プリント配線板及びその受発光素子実装方法
JP5877756B2 (ja) * 2012-05-08 2016-03-08 日東電工株式会社 光電気混載基板およびその製法
JP5964143B2 (ja) * 2012-05-31 2016-08-03 日本メクトロン株式会社 光電気混載フレキシブルプリント配線板の製造方法
JP6080155B2 (ja) * 2012-11-08 2017-02-15 日東電工株式会社 光電気混載基板
JP2015114390A (ja) * 2013-12-09 2015-06-22 住友ベークライト株式会社 接着シート、接着シート付き光導波路、光電気混載基板、光電気混載基板の製造方法、光モジュールおよび電子機器
JP6898066B2 (ja) * 2016-05-09 2021-07-07 日東電工株式会社 光回路基板シートおよびそれを備えた光電気混載基板シート
JP6658945B1 (ja) * 2019-04-26 2020-03-04 住友ベークライト株式会社 光導波路、光モジュールおよび電子機器
CN113009625B (zh) * 2021-03-09 2022-06-10 中国电子科技集团公司第五十四研究所 一种集成光波导的多层lcp光传输模块的制造方法
WO2023038132A1 (ja) * 2021-09-13 2023-03-16 京セラ株式会社 光回路基板およびそれを用いた光学部品実装構造体

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JP2007108228A (ja) * 2005-10-11 2007-04-26 Nitto Denko Corp 光電気混載基板およびその製造方法

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Also Published As

Publication number Publication date
JP2009058923A (ja) 2009-03-19
CN101669053B (zh) 2012-08-08
CN101669053A (zh) 2010-03-10
US20100119191A1 (en) 2010-05-13
TW200848814A (en) 2008-12-16
US8244080B2 (en) 2012-08-14
KR20100015794A (ko) 2010-02-12

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